JPS63286543A - Copper alloy for spring - Google Patents
Copper alloy for springInfo
- Publication number
- JPS63286543A JPS63286543A JP12166387A JP12166387A JPS63286543A JP S63286543 A JPS63286543 A JP S63286543A JP 12166387 A JP12166387 A JP 12166387A JP 12166387 A JP12166387 A JP 12166387A JP S63286543 A JPS63286543 A JP S63286543A
- Authority
- JP
- Japan
- Prior art keywords
- phosphor bronze
- grain size
- spring
- crystal grain
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910000906 Bronze Inorganic materials 0.000 claims abstract description 17
- 239000010974 bronze Substances 0.000 claims abstract description 17
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000013078 crystal Substances 0.000 claims abstract description 17
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 15
- 239000000956 alloy Substances 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 15
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000137 annealing Methods 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 229910021529 ammonia Inorganic materials 0.000 abstract description 2
- 238000000354 decomposition reaction Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は電気、電子部品用ばね材料として用いる燐青
銅に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to phosphor bronze used as a spring material for electrical and electronic parts.
電気、電子部品用はね材料として、従来よりはね限界値
（以下Ｋｌ）値）が高く、加工性に優れた燐青銅が多く
用いられている。該燐青銅において錫はＫｂ値を上昇せ
しめる為の添加元素として極めて有用な元素であるが、
高価であること、又導電性の低下が大きいことから、近
年燐青銅の錫の含有量の低減が求められている。錫を低
減させる目的で、ニッケルなどの元素を添加し結晶粒を
微細化して、錫量の低減を図った燐青銅が登場してきて
いるが、添加元素量が少ないものは結晶粒を微細化して
もＫｂ値の上昇が充分でなく、一方添加元素量を多くし
たものは高いＫｂ値を示すが、添加元素によるコスト上
昇が大きくなり、且つ導電性の低下が大きくなって錫量
減少の利点が相殺されるという問題があった。Phosphor bronze, which has a higher splash limit value (hereinafter referred to as Kl value) and excellent workability, is often used as a splash material for electrical and electronic parts. In the phosphor bronze, tin is an extremely useful element as an additive element to increase the Kb value.
In recent years, there has been a demand for a reduction in the tin content of phosphor bronze because of its high cost and large decrease in conductivity. In order to reduce the amount of tin, phosphor bronzes with a reduced amount of tin have been introduced by adding elements such as nickel to make the crystal grains finer. However, the increase in the Kb value is not sufficient, and on the other hand, the increase in the amount of added elements shows a high Kb value, but the cost increase due to the added elements becomes large, and the decrease in conductivity becomes large, so that the advantage of reducing the amount of tin is lost. There was a problem of being canceled out.
又、これらの合金を工業上利用する際には、上記のよう
にニッケル等の添加元素を含有している為スクラップの
回収が困難になるという問題があった。Furthermore, when these alloys are used industrially, there is a problem in that, as mentioned above, they contain additional elements such as nickel, making it difficult to collect scraps.
本発明の目的は上記の問題点を解消し、ニッケルを添加
することなしに錫量を低減しても充分に高いＫｂ値を有
する燐青銅を提供することにある。An object of the present invention is to solve the above-mentioned problems and to provide a phosphor bronze having a sufficiently high Kb value even when the amount of tin is reduced without adding nickel.
この目的を達成Ｔるために、０ｕ−３ｎ−Ｐの組成から
なる燐青銅の結晶粒径を５μｍ以下に微細化することに
より、Ｋｂ値が少量のニッケルを含む同一結晶粒径で同
程度の錫を含む燐青銅や、同程度の錫を含有する従来の
燐青銅以上の高い値を示Ｔことを見出し本発明に到達し
たものである。In order to achieve this objective, by refining the crystal grain size of phosphor bronze with a composition of 0u-3n-P to 5 μm or less, the Kb value is similar to that of the same grain size containing a small amount of nickel. The present invention was achieved by discovering that this material exhibits a higher value of T than phosphor bronze containing tin or conventional phosphor bronze containing the same amount of tin.
即ち、１〜９重量％の錫、０．０３〜０．３５重量％の
燐を含み、残部が銅及び不可避不純物からなる燐青銅で
、結晶粒径が５μｍ以下であることを特徴とするばね用
銅合金を発明とするものである。That is, a spring characterized in that it is phosphor bronze containing 1 to 9% by weight of tin, 0.03 to 0.35% by weight of phosphorus, the balance being copper and unavoidable impurities, and having a crystal grain size of 5 μm or less. The invention is a copper alloy for use in copper alloys.
本発明において、各添加元素の成分範囲を上記のように
限定したのは次の理由による。In the present invention, the component range of each additive element is limited as described above for the following reason.
錫及び燐は通常の燐青銅を構成する元素であり１このう
ち錫はＫｂ値の上昇に極めて効果のある元素であるが、
その量が１重量％未満では加工硬化の程度が小さく、ば
ね材として満足なＫｂ値が得られないからで、逆に錫量
が９重量％を超えると導電率の低下が著しく、且つ価格
が高くなることによる。又、燐は溶湯の強力な脱酸剤で
あり、ばね性の向上、機械的強度及び耐摩耗性の改善に
効果があるが、その添加量が０．０３重量％未満では溶
湯の脱酸が充分でなく、ばね性、機械的強度、耐摩耗性
に対する効果が薄くなるためであり、逆に燐添加量が０
．３５重量％を超えると加工性を阻害することと導電率
の低下が著しくなる為である。Tin and phosphorus are the elements that make up ordinary phosphor bronze. Among these, tin is an element that is extremely effective in increasing the Kb value.
If the amount of tin is less than 1% by weight, the degree of work hardening will be small and a satisfactory Kb value for a spring material cannot be obtained.On the other hand, if the amount of tin exceeds 9% by weight, the electrical conductivity will drop significantly and the price will decrease. Due to being expensive. In addition, phosphorus is a strong deoxidizing agent for molten metal, and is effective in improving spring properties, mechanical strength, and wear resistance, but if the amount added is less than 0.03% by weight, the molten metal will not be deoxidized. This is because the effect on spring properties, mechanical strength, and wear resistance becomes weaker if the amount of phosphorus added is 0.
．． This is because if it exceeds 35% by weight, processability will be inhibited and the electrical conductivity will drop significantly.
本発明において結晶粒径を５μｍ以下と限定したのは結
晶粒径が５μｍを超えるとＫｂ値の上昇が殆ど詔められ
なくなるからである。In the present invention, the crystal grain size is limited to 5 μm or less because if the crystal grain size exceeds 5 μm, the Kb value will hardly increase.
こ＼で、結晶粒径はＪ工Ｓ Ｈ０５０１の伸銅品結晶粒
度試験方法における比較法、切断法などに従い測定すれ
ば良いが、本発明においては任意の場所で採取した試料
を、これらの方法により測定したうち最も小さい測定値
を結晶粒径と定義する。Here, the crystal grain size may be measured according to the comparison method, cutting method, etc. in the method for testing the crystal grain size of rolled copper products in J.Eng. The smallest measured value among the measured values is defined as the crystal grain size.
例えば、結晶粒が楕円状に伸長している場合にはその短
径が本発明における結晶粒径となる。For example, when crystal grains are elongated in an elliptical shape, the short axis thereof becomes the crystal grain size in the present invention.
又、使用する原料中に含まれるか製造工程で不可避的に
入る不純物としてＧま、鉛、鉄、亜鉛等が挙げられる。In addition, impurities contained in the raw materials used or unavoidably introduced during the manufacturing process include G, lead, iron, zinc, etc.
次に本発明を実施例により説明する。 Next, the present invention will be explained by examples.
高周波溶解炉を使用して電気銅と高純度銅、及び銅−１
５％・鷹・母合金を大気中で溶解し、第１表に示す各種
成分組成で、寸法が、長さ２００朋、幅１００關、厚さ
４０順の鋳塊を得た。Electrolytic copper and high purity copper using high frequency melting furnace, and copper-1
A 5% molten metal master alloy was melted in the atmosphere to obtain ingots having various component compositions shown in Table 1 and having dimensions of 200 mm in length, 100 mm in width, and 40 mm in thickness.
次に該合金鋳塊をアンモニア分解ガス雰囲気中で８００
０，３時間の均質化処理を行ない、室温まで徐冷し、切
断、面削して１０Ｉ＋ＩＩＢ厚とし、次に冷間圧延によ
り０．５朋厚の板材とした。該板材に４００〜６００
Ｃ１１０分から１時間の中間焼鈍を施し、結晶粒径の調
整を行なった。その後、０．３１１１ｓ厚まで冷間圧延
を行ない、２００Ｃ，１時間の低温焼鈍を実施した。Next, the alloy ingot was heated to 800°C in an ammonia decomposition gas atmosphere.
The material was homogenized for 0.3 hours, slowly cooled to room temperature, cut and faceted to a thickness of 10I+IIB, and then cold rolled to form a plate material of 0.5mm thickness. 400 to 600 to the plate material
Intermediate annealing was performed from C110 minutes to 1 hour to adjust the crystal grain size. Thereafter, cold rolling was performed to a thickness of 0.3111s, and low temperature annealing was performed at 200C for 1 hour.
上記製造方法により得られた各板材の評価として、Ｋｂ
値は繰返したわみ式試験からばね限界値（ＫｂＯ，１値
）を求めて評価した。強度、加工性については引張試験
におけるす１張強さ、破断伸びによって評価した。導電
性は導電率によって示した。As an evaluation of each plate material obtained by the above manufacturing method, Kb
The value was evaluated by determining the spring limit value (KbO, 1 value) from repeated deflection type tests. Strength and workability were evaluated by tensile strength and elongation at break in a tensile test. Electrical conductivity was indicated by electrical conductivity.
結晶粒径は板厚方向においてＪ工Ｓ Ｈ０５０１切断法
にて求めた。The crystal grain size was determined in the plate thickness direction using the J Engineering SH0501 cutting method.
第 １ 表
第１表における実施例から明らかなように、本発明合金
の煮１と従来合金の＆１２を比較すると本発明合金は同
量の錫を含み、且つ同じ結晶粒径を有する０、２重量％
ニッケル添加合金に比べ高いＫｂ値を示すことが判る。Table 1 As is clear from the examples in Table 1, when comparing the alloy of the present invention, 1, and the conventional alloy, &12, the alloy of the present invention contains the same amount of tin and has the same crystal grain size. weight%
It can be seen that the alloy exhibits a higher Kb value than the nickel-added alloy.
又、本発明合金Ａ１と従来合金７！１９、同じ＜ Ａ
３．４と屋１０の比較、或いは屋５とＡｌｌとを比較す
ると明らかなように、本発明合金は錫含有量が約２重量
％多い従来合金にほぼ匹敵するＫｌ）値を示す。Moreover, the present invention alloy A1 and the conventional alloy 7!19 have the same <A
As is clear from a comparison between No. 3.4 and No. 10, or No. 5 and All, the alloy of the present invention exhibits a Kl) value that is almost comparable to the conventional alloy, which has a tin content about 2% higher.
以上から明らかなように、本発明合金に合金元素を添加
することなしに錫量を低減しても優れたばね限界値、強
度、加工性を得ることができ、廉価な電気、電子部品用
ばね材料を提供できる。As is clear from the above, it is possible to obtain excellent spring limit values, strength, and workability even if the amount of tin is reduced without adding alloying elements to the alloy of the present invention, and it is an inexpensive spring material for electrical and electronic components. can be provided.
Claims (1)
燐を含有し残部が銅及び不可避不純物からなる燐青銅で
、該燐青銅の平均結晶粒径が５μｍ以下であることを特
徴とするばね用銅合金。(1) Phosphor bronze containing 1 to 9% by weight of tin, 0.03 to 0.35% by weight of phosphorus, and the balance consisting of copper and unavoidable impurities, and the average crystal grain size of the phosphor bronze is 5 μm or less. A copper alloy for springs characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12166387A JPH0788547B2 (en) | 1987-05-19 | 1987-05-19 | Copper alloy for spring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12166387A JPH0788547B2 (en) | 1987-05-19 | 1987-05-19 | Copper alloy for spring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63286543A true JPS63286543A (en) | 1988-11-24 |
| JPH0788547B2 JPH0788547B2 (en) | 1995-09-27 |
Family
ID=14816818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12166387A Expired - Lifetime JPH0788547B2 (en) | 1987-05-19 | 1987-05-19 | Copper alloy for spring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0788547B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111394610A (en) * | 2020-04-29 | 2020-07-10 | 福建紫金铜业有限公司 | Production process of copper plate and strip materials of VC (polyvinyl chloride) uniform-temperature plates for 5G |
-
1987
- 1987-05-19 JP JP12166387A patent/JPH0788547B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111394610A (en) * | 2020-04-29 | 2020-07-10 | 福建紫金铜业有限公司 | Production process of copper plate and strip materials of VC (polyvinyl chloride) uniform-temperature plates for 5G |
| CN111394610B (en) * | 2020-04-29 | 2021-03-23 | 福建紫金铜业有限公司 | Production process of copper plate and strip materials of VC (polyvinyl chloride) uniform-temperature plates for 5G |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0788547B2 (en) | 1995-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5847987B2 (en) | Copper alloy containing silver | |
| KR101667812B1 (en) | Copper alloy plate and method for producing same | |
| EP0175183B1 (en) | Copper alloys having an improved combination of strength and conductivity | |
| KR100968717B1 (en) | ??-??-??-??-?? based copper alloy for electronic material and method for production thereof | |
| TWI475119B (en) | Cu-Zn-Sn-Ni-P alloy | |
| JP2002180165A (en) | Copper based alloy having excellent press blanking property and its production method | |
| JP4177104B2 (en) | High-strength copper alloy excellent in bending workability, manufacturing method thereof, and terminal / connector using the same | |
| JP2007126739A (en) | Copper alloy for electronic material | |
| JP3717321B2 (en) | Copper alloy for semiconductor lead frames | |
| JPH111735A (en) | High strength cu alloy with excellent press blankability and corrosion resistance | |
| JP2001049369A (en) | Copper alloy for electronic material and its production | |
| JP4754930B2 (en) | Cu-Ni-Si based copper alloy for electronic materials | |
| JPH0718355A (en) | Copper alloy for electronic appliance and its production | |
| JPH0987814A (en) | Production of copper alloy for electronic equipment | |
| JPS63286543A (en) | Copper alloy for spring | |
| KR100878165B1 (en) | Copper-nickel-silicon based copper alloy for electronic material, wrought copper and copper alloy using thereof and electronic device part using therof | |
| US3816109A (en) | Copper base alloy | |
| US4606889A (en) | Copper-titanium-beryllium alloy | |
| JPH01165733A (en) | High strength and high electric conductive copper alloy | |
| JPH0819504B2 (en) | Zinc alloy for casting, dimensional change-free, cast parts and heat treatment method for cast parts | |
| JP3779830B2 (en) | Copper alloy for semiconductor lead frames | |
| WO2023140314A1 (en) | Copper alloy sheet material and method for manufacturing same | |
| JPH0456755A (en) | Manufacture of phosphor bronze excellent in bendability | |
| JPH0832935B2 (en) | High strength and high toughness Cu alloy with little characteristic anisotropy | |
| JPS6141751A (en) | Manufacture of copper alloy material for lead frame |