JPS63275051A - Production of optical recording medium - Google Patents

Production of optical recording medium

Info

Publication number
JPS63275051A
JPS63275051A JP62109750A JP10975087A JPS63275051A JP S63275051 A JPS63275051 A JP S63275051A JP 62109750 A JP62109750 A JP 62109750A JP 10975087 A JP10975087 A JP 10975087A JP S63275051 A JPS63275051 A JP S63275051A
Authority
JP
Japan
Prior art keywords
substrate
adhesive
optical recording
recording medium
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62109750A
Other languages
Japanese (ja)
Inventor
Takeshi Santo
剛 三東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP62109750A priority Critical patent/JPS63275051A/en
Publication of JPS63275051A publication Critical patent/JPS63275051A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1464Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators
    • B29C65/1467Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406Ultraviolet [UV] radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1448Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface radiating the edges of the parts to be joined, e.g. for curing a layer of adhesive placed between two flat parts to be joined, e.g. for making CDs or DVDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845Radiation curing adhesives, e.g. UV light curing adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45Joining of substantially the whole surface of the articles
    • B29C66/452Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs
    • B29L2017/005CD''s, DVD''s

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To improve an operability and to attain an efficiency by projecting an ultraviolet ray vertically to a substrate face and further projecting the ultra violet ray externally of the endface of the substrate. CONSTITUTION:The two disk substrates 2 having at least one on which a recording layer 1 for recording information by laser light are bonded by an ultraviolet ray cured-type bonding agent 3 by holding a spacer or no spacer so as to place internally the recording layer 1. At the time of bonding the substrates 2, ultraviolet ray light sources 4' are placed respectively at the internal and the external sides of a surface vertical to the bonding surface of the substrate at the external periphery end of the substrate 2 to project the ultraviolet ray. Thereby, the ultraviolet ray cured-type bonding agent layer disposed on the disk substrate is cured to the end part of the substrate without a space to completely seal the recording layer and the high efficiency and the operability is improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は光学的記録媒体の製造方法さらに詳しくは2枚
の基板の貼合せ構造である記録媒体の貼合せ時に紫外線
硬化型接着剤を使用して実装する光学的記録媒体の製造
方法に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing an optical recording medium, and more specifically, to a method for manufacturing an optical recording medium, and more specifically, an ultraviolet curable adhesive is used when bonding a recording medium that has a structure of bonding two substrates. The present invention relates to a method of manufacturing an optical recording medium that is mounted by using a method of manufacturing an optical recording medium.

〔従来の技術〕[Conventional technology]

従来より透明な基板上に希土類−遷移金属の合金薄膜、
非晶質から結晶質への相転移を利用したカルコゲン化合
物などの還元性酸化物薄膜ヒートモードの記録媒体薄n
qなどの光メモリ材料を成膜し、この記録媒体2枚を記
録層が対向するように接着した貼合せ構造や記録媒体に
スペーサーを挟み込んで接着したエアーサンドイッチ構
造の光記録媒体が提案されている。
Rare earth-transition metal alloy thin film on a transparent substrate,
Reducing oxide thin film heat mode recording medium thin n such as chalcogen compound that utilizes phase transition from amorphous to crystalline
Optical recording media have been proposed, such as a laminated structure in which an optical memory material such as q is formed into a film and two recording media are bonded together so that the recording layers face each other, or an air sandwich structure in which the recording medium is bonded with a spacer sandwiched between the two recording media. .

この記録媒体の接着には従来、熱峡化型、二液常温硬化
型、紫外線硬化型等の接着剤が用いられていた。しかし
、加熱硬化型の接着剤は硬化時の熱で記録層の特性が劣
化してしまうような媒体には使用できない。また、基板
材料にプラスチックを使用した場合、接着剤の硬化温度
と基板材料の熱変形温度の関係から基板が変形したり、
記録層と基板の熱膨張率の違いから股にクラックが発生
したりする。
Conventionally, adhesives such as a heat curing type, a two-component room temperature curing type, and an ultraviolet curing type have been used for adhering the recording medium. However, heat-curable adhesives cannot be used for media where the properties of the recording layer deteriorate due to the heat during curing. In addition, when plastic is used as the substrate material, the substrate may deform due to the relationship between the curing temperature of the adhesive and the thermal deformation temperature of the substrate material.
Cracks may occur at the crotch due to the difference in thermal expansion coefficient between the recording layer and the substrate.

また、二液常温硬化型の接着剤の場合には主剤と硬化剤
の混合工程が必要であり、硬化時間が長いなどの理由に
より量産性が悪いという欠点があった。
Furthermore, in the case of a two-component room-temperature curing adhesive, a step of mixing the main ingredient and a curing agent is required, and the curing time is long, resulting in poor mass production.

一方、紫外線硬化型の接着剤の場合には萌述したような
欠点がなく、常温で、しかも短時間で硬化ができるとい
う長所があるため、作業性、生産性の面で非常に有利で
ある。
On the other hand, UV-curable adhesives do not have the disadvantages mentioned above and have the advantage of being able to cure at room temperature in a short time, making them very advantageous in terms of workability and productivity. .

従来、第2図に示すように記録層1を設けたディスク基
板2を紫外線硬化型接着剤3によって他の基板と貼合せ
る際は紫外線光源4および反射板5を通常基板の上方に
位置させて照射を行なっていた。しかしながらこのよう
にして光学的記録媒体を製造すると基板の内外周の端面
、特に外周端面部6の接着剤が非常に硬化し難いことが
問題となってきた。これは外周端面部に光が効率よく照
射されないことに原因がある。特に第3図に示すような
特開昭59−168947に開示のプラスチックやガラ
ス等の粒径のそろった粒状部材7を紫外線硬化型接着剤
中に分散させてスペーサーとして用いるエアーサンドイ
ッチ構造の場合は、例えば直径11hmのディスクでは
標準化の規格から粒状部材7の粒径は0.3〜0.5+
am程度が望ましく、これにともなって紫外線硬化型接
着剤3の塗布厚みも厚いものとなり硬化剤が非常に硬化
し難くいわゆるベタつきが発生する。
Conventionally, as shown in FIG. 2, when a disk substrate 2 provided with a recording layer 1 is bonded to another substrate using an ultraviolet curing adhesive 3, an ultraviolet light source 4 and a reflecting plate 5 are usually positioned above the substrate. Irradiation was being carried out. However, when optical recording media are manufactured in this manner, a problem has arisen in that the adhesive on the inner and outer peripheral end surfaces of the substrate, particularly on the outer peripheral end surface 6, is extremely difficult to cure. This is caused by the fact that light is not efficiently irradiated onto the outer peripheral end face. In particular, in the case of an air sandwich structure in which granular members 7 made of plastic, glass, etc. with uniform particle sizes are dispersed in an ultraviolet curable adhesive and used as a spacer as disclosed in JP-A-59-168947 as shown in FIG. For example, in a disk with a diameter of 11 hm, the particle size of the granular member 7 is 0.3 to 0.5+ according to the standardization specification.
The coating thickness of the ultraviolet curable adhesive 3 is desirably about am, and accordingly, the coating thickness of the ultraviolet curable adhesive 3 becomes thick, making it very difficult for the curing agent to cure, resulting in so-called stickiness.

このように紫外線硬化型接着剤3の硬化が不充分である
と外観上の問題だけでなく、すきまから湿分やチリの接
着面及び中空部分への侵入による記録層1の経時安定性
低下問題、接着剤中の残留上ツマ−による記録層1など
への影響、あるいは接着強度が不充分となるため基板の
変形、剥離、など実用上の問題も起ってくる。
In this way, insufficient curing of the ultraviolet curable adhesive 3 not only causes problems in appearance, but also reduces the stability of the recording layer 1 over time due to moisture and dust entering the adhesive surface and hollow portions through the gaps. Practical problems also occur, such as the influence of residual upper layer in the adhesive on the recording layer 1 and the like, or deformation and peeling of the substrate due to insufficient adhesive strength.

また、硬化を完全にするためには紫外線の照射時間を長
くする必要があり、紫外線硬化型接着剤のもつ短時間硬
化のメリットが失われていた。
In addition, in order to completely cure the adhesive, it is necessary to extend the irradiation time with ultraviolet rays, which eliminates the short-time curing advantage of ultraviolet curable adhesives.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

本発明は上記の問題点を解決すべく成されたものであり
、その目的はディスク基板に設けられた紫外線硬化型接
着剤層がすきまなく基板端部まで硬化して記録層が完全
に密閉され、しかも高効率で作業性の良い光学記録媒体
の製造方法を提供す゛ることにある。
The present invention was made to solve the above problems, and its purpose is to cure the ultraviolet curable adhesive layer provided on the disk substrate to the edge of the substrate without any gaps, so that the recording layer is completely sealed. Moreover, it is an object of the present invention to provide a method for manufacturing an optical recording medium that is highly efficient and has good workability.

(問題点を解決するための手段) すなわち本発明は、少なくとも1枚にはレーザー光によ
り情報記録を行なう記録層が形成された2枚のディスク
基板が、記録層が内側となるように紫外線硬化型接着剤
によりスペーサーを挟みまたは挟まずして接着して構成
される光学的記録媒体の製造方法において、基板の貼合
せ時に基板の外周端において基板の接着面に垂直な面の
内側および外側にそれぞれ少なくとも1個の紫外線光源
を置き、紫外線を照射することを特徴とする光学的記録
媒体の製造方法である。以下、本発明を図面に従って説
明する。
(Means for Solving the Problems) That is, the present invention provides two disk substrates, at least one of which has a recording layer for recording information using a laser beam, which is cured by ultraviolet light so that the recording layer is on the inside. In a method for manufacturing an optical recording medium that is formed by adhering with or without a spacer using a mold adhesive, when bonding the substrates, there is a This method of manufacturing an optical recording medium is characterized in that at least one ultraviolet light source is provided in each case and ultraviolet rays are irradiated. The present invention will be explained below with reference to the drawings.

第1図は本発明による光学的記録媒体の製造方法の一例
を示す模式図である。
FIG. 1 is a schematic diagram showing an example of a method for manufacturing an optical recording medium according to the present invention.

本発明によって製造される光学的記録媒体は第2図に示
した断面となるように記録層1を形成したディスク基板
2を紫外線硬化型接着剤3によりベタ貼りして構成され
るか、あるいは第3図に示すように粒径のそろったプラ
スチックやガラスなどの粒状部材7をスペンサーとし、
それを分散した紫外線硬化型接着剤により接着されエア
ーサンドイッチ構造となるように構成されるか、または
不図示のドーナツ状のスペーサーを挟んで紫外線硬化型
接着剤により接着され、エアーサンドイッチ構造となる
ように構成される。基板2の材質としてはなんら制限さ
れることはなくこの分野で知られたもの、例えばポリカ
ーボネート、ポリエステル、アクリル樹脂、ポリオレフ
ィン樹脂、フェノール樹脂、エポキシ樹脂、ポリアミド
、ポリイミドなどのプラスチック、ガラス、セラミック
ス、あるいは金属類などを用いることができる。
The optical recording medium manufactured according to the present invention is constructed by adhesively bonding a disk substrate 2 on which a recording layer 1 is formed with an ultraviolet curing adhesive 3 so as to have the cross section shown in FIG. As shown in Figure 3, a granular member 7 made of plastic or glass with uniform particle size is used as a spencer,
It can be bonded with a UV-curable adhesive dispersed therein to form an air sandwich structure, or it can be bonded with a UV-curable adhesive with a donut-shaped spacer (not shown) in between to form an air sandwich structure. It is composed of The material of the substrate 2 is not limited in any way and may be any material known in this field, such as plastics such as polycarbonate, polyester, acrylic resin, polyolefin resin, phenol resin, epoxy resin, polyamide, polyimide, glass, ceramics, or Metals etc. can be used.

この光学的記録媒体は接着剤3あるいは粒状部材7を分
散した接着剤をいずれか一方のディスク基板の上に所定
の塗布法(例えばディスペンサー塗布、印刷法等)によ
って塗布した後、他方の基板を爪ね合わせてから紫外線
を照射し接着剤を硬化させることにより形成することが
できる。この際基板端面の接着剤の硬化がし難いので硬
化を促進するため、第1図に示すように基板の外周端に
おいて基板に対して垂直な面の外側(斜線部A)に紫外
線光源4′を少なくとも1個備える。紫外線光源として
は高圧水銀灯、キセノンランプなどが用いられる光源4
′の位置はその光源の指向性によっても変るが、その最
も近い基板面の外周端の接着部6に対する仰角αが好ま
しくは45°以下、さらに好ましくは30°以下、最も
好ましいのは0°であり、基板および記録層が熱により
変形、分解等の影響を受けない範囲で前記接着部6に近
い距離にあることが望ましい。αが45°以上では照射
効率が非常に悪くなるため望ましくない。赤外線カット
フィルタを併用するとさらに近づけられるために好適で
ある。光源4′は光源の強さにもよるが照射時間を短縮
するために多数個備えるのが望ましいが1個でも構わな
い。紫外線を照射させる際は、基板上面及び端面が均等
に先を受けられるように基板をその中心軸を中心に回転
させるのが望ましい。もちろん基板を固定して光源の方
を移動させてもよいし、双方を動かしてもよい。また外
周部端面の他に内周部軸受けの端面部も硬化し難い場合
には上記の硬化操作についでさらに外周により位置合わ
せをして基板を回転させながら内周部端面に小型の光源
により紫外線を照射することもできる。基板回転中は基
板を−・定の均一な圧力で保持しているのが基板間の間
隔の精度を保つ上で望ましい。接着剤としてはエポキシ
アクリレート、ウレタンアクリレート、変性アクリレー
トなどのアクリレート系ラジカル重合型接着剤およびエ
ポキシ系イオン重合型接着剤を用いることができる。な
お紫外線硬化型接着剤は、塗布または印刷に適した一般
的な粘度(約1500〜100000cps)と、適度
のチクソ性(チクソトロピー)とを保持しているのが望
ましい。スペーサーとして接着剤中に粒状部材を分散さ
せて用いる場合には、粒状部材の材料としては例えば、
ガラス、シリカ、金属酸化物(MgO,A!20s )
などの無機化合物の多孔質体若しくは非多孔質体または
中空体や、ポリスチレン、ポリエチレン、ポリプロピレ
ン、ポリエステル、ポリアクリル、ナイロン、シリコン
樹脂などのプラスチック類などが挙゛げられる。ただし
、接着剤に対し溶解ないし膨潤するものは好ましくない
This optical recording medium is manufactured by applying an adhesive 3 or an adhesive in which granular members 7 are dispersed onto one of the disk substrates by a predetermined coating method (for example, dispenser coating, printing method, etc.), and then applying the adhesive to the other substrate. It can be formed by folding the nails together and then irradiating the adhesive with ultraviolet light to harden the adhesive. At this time, it is difficult to cure the adhesive on the edge of the substrate, so in order to accelerate the curing, an ultraviolet light source 4' At least one. Light source 4: A high-pressure mercury lamp, a xenon lamp, etc. are used as the ultraviolet light source.
Although the position of ′ varies depending on the directivity of the light source, the elevation angle α of the outer peripheral edge of the substrate surface closest to the adhesive portion 6 is preferably 45° or less, more preferably 30° or less, and most preferably 0°. It is desirable that the substrate and the recording layer be located close to the adhesive portion 6 so that they are not affected by deformation, decomposition, etc. due to heat. If α is 45° or more, the irradiation efficiency becomes extremely poor, which is not desirable. It is preferable to use an infrared cut filter in combination because it can bring the object even closer. Depending on the intensity of the light source, it is desirable to have a large number of light sources 4' in order to shorten the irradiation time, but one light source 4' may also be provided. When irradiating ultraviolet rays, it is desirable to rotate the substrate around its central axis so that the top and end surfaces of the substrate receive the ultraviolet rays evenly. Of course, the substrate may be fixed and the light source may be moved, or both may be moved. In addition, if it is difficult to harden the end face of the inner peripheral bearing in addition to the outer peripheral end face, after the above curing operation, the board is further aligned by the outer periphery, and while the board is rotated, the inner peripheral end face is exposed to ultraviolet light from a small light source. It is also possible to irradiate. While the substrates are being rotated, it is desirable to hold the substrates under a constant and uniform pressure in order to maintain the accuracy of the spacing between the substrates. As the adhesive, acrylate radical polymerizable adhesives such as epoxy acrylate, urethane acrylate, and modified acrylate, and epoxy ionic polymerizable adhesives can be used. Note that the ultraviolet curable adhesive desirably has a general viscosity (about 1,500 to 100,000 cps) suitable for coating or printing and has appropriate thixotropy. When using a granular member dispersed in an adhesive as a spacer, examples of the material for the granular member include:
Glass, silica, metal oxide (MgO, A!20s)
Porous bodies, non-porous bodies, or hollow bodies of inorganic compounds such as the like, and plastics such as polystyrene, polyethylene, polypropylene, polyester, polyacrylic, nylon, and silicone resins may be mentioned. However, those that dissolve or swell in the adhesive are not preferred.

粒状部材の形状としては1球状に限らず6面体や4面体
柱でもよいが、基板の間にスペーサーとして一定の間隔
を保持できるように均一な大きさをもつものが好ましい
The shape of the granular member is not limited to a spherical shape, but may be a hexahedron or a tetrahedral column, but it is preferable that the granular member has a uniform size so that a constant distance can be maintained as a spacer between the substrates.

粒状部材の大きさは通常は基板の間隔と実質的に同じ大
きさとすればよい。即ち、基板の間隔として一般にはt
og〜1000μに保持することが多いが、例えば40
0μの球状体をスペーサーとして用いると基板間の厚み
もほぼ400μになるよう制御できるからである。接着
剤中の粒状部材の含量は接着強度を考慮すると粒状部材
の比重にもよるが接着剤に対して重量比0.5%〜80
%が好ましい。
The size of the granular elements is usually substantially the same as the spacing between the substrates. That is, the distance between the substrates is generally t
It is often kept at og~1000μ, for example 40
This is because if a 0μ spherical body is used as a spacer, the thickness between the substrates can be controlled to approximately 400μ. Considering adhesive strength, the content of the granular material in the adhesive is 0.5% to 80% by weight relative to the adhesive, depending on the specific gravity of the granular material.
% is preferred.

次に基板端面部が硬化し難い粒状部材をスペーサーとし
て用いたエアーサンドイッチ構造の光学的記録媒体を製
造する実施例およびその比較例に従って本発明をさらに
説明する。
Next, the present invention will be further explained with reference to an example of manufacturing an optical recording medium with an air sandwich structure in which a granular member whose substrate end face is difficult to harden is used as a spacer, and a comparative example thereof.

〔実施例〕〔Example〕

実施例1 外径130+*+m 、内径15mm、厚さ1.2mm
のドーナツ状、透明ポリカーボネート製ディスク基板上
に波長830μ付近に吸収ピークを有するポリメチン系
染料を750人の厚さにスピンナー塗布して記録層とし
た。
Example 1 Outer diameter 130 + * + m, inner diameter 15 mm, thickness 1.2 mm
A recording layer was prepared by coating a donut-shaped, transparent polycarbonate disk substrate with a polymethine dye having an absorption peak around a wavelength of 830 μm using a spinner to a thickness of 750 μm.

一方紫外線硬化型ウレタンアクリレート系接着剤(スリ
ーボンド■製3033)にスペーサ一部材として球状で
粒径440〜490−に分級した架橋アクリル樹脂ビー
ズをffi量比3%となるように添加混合した。
On the other hand, spherical cross-linked acrylic resin beads classified into particle sizes of 440-490- were added and mixed as a spacer material to an ultraviolet curable urethane acrylate adhesive (3033 manufactured by Three Bond ■) so that the ffi amount ratio was 3%.

上記のビーズが分散している接着剤をディスペンサーに
よりこの基板の内周端及び外周端付近にリング状に塗布
した。
The adhesive in which the beads were dispersed was applied in a ring shape to the vicinity of the inner and outer peripheral edges of this substrate using a dispenser.

接着剤の塗布巾約2mm、高さは約lamで塗布された
接着剤の断面形状はほぼ半円形であった。
The applied adhesive had a width of approximately 2 mm, a height of approximately lam, and the cross-sectional shape of the applied adhesive was approximately semicircular.

この基板にト述の記録層を形成した基板を記録層が内側
となり且つ中心穴が一致するように位置合わせして爪ね
、基板全面に500gの荷重を加え貼合せた。
This substrate, on which the recording layer described above was formed, was aligned so that the recording layer was on the inside and the center holes coincided with each other, and a load of 500 g was applied to the entire surface of the substrate using a nail.

ついで基板に荷B[500gを加え、荷重を保持したま
ま基板を20rpmのスピードで回転させながら80m
w/cm2の紫外線を基板軸の上方約25c+aの光源
から30秒間照射した。この時同時に基板の外周端面部
に基板面に対して真横(α=0°)から周囲に90度お
きに設置した4つの高圧水銀灯により1個当り100m
w /cra’の紫外線を照射し、接着剤を硬化させた
Next, load B (500 g) was added to the board, and the board was rotated for 80 m while holding the load at a speed of 20 rpm.
Ultraviolet light of w/cm 2 was irradiated for 30 seconds from a light source approximately 25 c+a above the axis of the substrate. At this time, at the same time, four high-pressure mercury lamps were installed on the outer peripheral edge of the board at intervals of 90 degrees from just horizontal to the board surface (α = 0°) to a distance of 100 m per unit.
The adhesive was cured by irradiation with ultraviolet light of w/cra'.

こうして得られた光学的記録媒体は基板間隔が約500
uで厚みムラがなく基板端面部の接着剤のベタつきがな
く、完全に中空部を密閉することができた。
The optical recording medium thus obtained has a substrate spacing of about 500
With U, there was no thickness unevenness, there was no stickiness of the adhesive on the edge of the board, and the hollow part could be completely sealed.

ついでこの工程を連続的にくり返し100枚の本発明方
法による光学的記録媒体を作成したが、すべて端部のへ
夕つきはなく実質的に均一な品質のものが得られた。こ
れらの光学的記録媒体を温度60℃、関係湿度90%の
条件で2000時間にわたる環境試験(保存性試験)を
行なったが接着剤がはがれたものは1つもなかった。
This process was then repeated continuously to produce 100 optical recording media according to the method of the present invention, and all of them were of substantially uniform quality with no dull edges. These optical recording media were subjected to an environmental test (storage test) for 2,000 hours at a temperature of 60° C. and a relative humidity of 90%, but none of them had the adhesive peeled off.

比較例1 実施例1で用いた基板真横の高圧水銀灯による照射をの
ぞいたほかは実施例1と同様の方法で光学記録媒体を作
製した。
Comparative Example 1 An optical recording medium was produced in the same manner as in Example 1, except for the irradiation with the high-pressure mercury lamp right next to the substrate used in Example 1.

こうして得られた光学記録媒体は厚みムラはなかったが
、基板端部の接着剤に若干のベタつきが認めらねた。つ
いで同様にして100枚の光学記録媒体を連続作製し、
温度60℃、関係湿度90%の条件で2000時間環境
試験を行なったところ、完全剥離は認めら−れなかった
が接着剤の一部分がはがれて浮いたものが122枚発生
た。また同じ光源で基板端部のベタつきがなくなるのに
必要な照射時間は2分間であり、実施例1の4倍の時間
を要した。
The optical recording medium thus obtained had no uneven thickness, but some stickiness was not observed in the adhesive at the edge of the substrate. Then, 100 optical recording media were successively produced in the same manner.
When an environmental test was carried out for 2,000 hours at a temperature of 60 DEG C. and relative humidity of 90%, no complete peeling was observed, but 122 pieces of adhesive were partially peeled off and floated. Further, the irradiation time required to eliminate stickiness at the edge of the substrate using the same light source was 2 minutes, which was four times longer than in Example 1.

比較例2 実施例1で用いた基板真横(α=0)の高圧水銀灯によ
る照射のかわりに同じ光源を基板上方仰角60°の位置
に周囲に90度おきに4つの設置し同様に照射する以外
は実施例1と同様の方法で光学記録媒体を作製した。
Comparative Example 2 Instead of irradiating with a high-pressure mercury lamp right next to the substrate (α = 0) used in Example 1, four of the same light sources were installed at 90-degree intervals around the board at a position above the substrate at an elevation angle of 60 degrees, and the same irradiation was performed. An optical recording medium was produced in the same manner as in Example 1.

こうして得られた光学記録媒体は厚みムラはなかったが
基板端部の接着剤に若干のベタつきが認゛められた。つ
いで同様にして100枚の光学記録媒体を連続して作製
し温度60℃、関係湿度90%の条件で2000時間環
境試験を行なったところ完全21111Iは認められな
かったが接着剤の一部分がはがれて浮いたものが5枚発
生した。同じ状態の光源でベタつきがなくなるのに必要
な照射時間は1分間であり、実施例1の2倍の時間を要
した。
The optical recording medium thus obtained had no uneven thickness, but some stickiness was observed in the adhesive at the edge of the substrate. Next, 100 optical recording media were produced in a similar manner and subjected to an environmental test for 2000 hours at a temperature of 60°C and relative humidity of 90%. Although complete 21111I was not observed, a portion of the adhesive peeled off. There were 5 floating items. The irradiation time required to eliminate stickiness using the same light source was 1 minute, which was twice as long as in Example 1.

(発明の効果) 本発明の方法すなわち基板面に対し垂直方向から紫外線
を照射するとともに基板端面の外側からさらに紫外線を
照射することによって、基板に設けられた紫外線硬化型
接着剤層が短時間ですきまなく基板端部まで硬化して、
記録層が完全に密閉された品質の高い光学的記録媒体を
作業性よく高効率で製造することが可能となる。
(Effects of the Invention) By the method of the present invention, that is, by irradiating ultraviolet rays from a direction perpendicular to the substrate surface and further irradiating ultraviolet rays from the outside of the edge surface of the substrate, the ultraviolet curable adhesive layer provided on the substrate can be cured in a short time. It hardens evenly to the edge of the board,
It becomes possible to manufacture high-quality optical recording media in which the recording layer is completely sealed with good workability and high efficiency.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の方法の一例を示す模式図、第2図は従
来の方法を示す模式図、第3図はエアーサンドイッチ構
造の一例を示す模式図である。 1−−−−−記録層、   2・・・・・・基板、3・
・・・・・紫外線硬化型接着剤。 4.4’−・・光源、  5−−−−一光反射板、6・
・・・・・外周端面部、7・・・・・・粒状部材。
FIG. 1 is a schematic diagram showing an example of the method of the present invention, FIG. 2 is a schematic diagram showing a conventional method, and FIG. 3 is a schematic diagram showing an example of an air sandwich structure. 1---Recording layer, 2...Substrate, 3.
...UV curing adhesive. 4.4'--Light source, 5----One light reflector, 6.
. . . Outer peripheral end surface portion, 7 . . . Granular member.

Claims (1)

【特許請求の範囲】 1、少なくとも1枚にはレーザー光により情報記録を行
なう記録層が形成された2枚のディスク基板が、記録層
が内側となるように紫外線硬化型接着剤によりスペーサ
ーを挟みまたは挟まずして接着して構成される光学的記
録媒体の製造方法において、基板の貼合せ時に、基板の
外周端において基板の接着面に垂直な面の内側および外
側にそれぞれ少なくとも1個の紫外線光源を置き、紫外
線を照射することを特徴とする光学的記録媒体の製造方
法。 2、該基板の接着面に垂直な面の外側の光源の、その最
も近い外周端の接着部に対する仰角が45°以下である
特許請求の範囲第1項記載の光学的記録媒体の製造方法
。 3、紫外線硬化型接着剤中に、粒状部材が分散されてい
る特許請求の範囲第1項または第2項記載の光学的記録
媒体の製造方法。
[Claims] 1. Two disk substrates, each of which has a recording layer on which information is recorded using a laser beam, are sandwiched by a spacer with an ultraviolet curing adhesive so that the recording layer is on the inside. Alternatively, in a method for manufacturing an optical recording medium configured by bonding without sandwiching, when bonding the substrates, at least one ultraviolet ray is applied to the inside and outside of a plane perpendicular to the bonding surface of the substrates at the outer peripheral edge of the substrates. A method for producing an optical recording medium, which comprises placing a light source and irradiating it with ultraviolet rays. 2. The method for manufacturing an optical recording medium according to claim 1, wherein the angle of elevation of the light source outside the plane perpendicular to the bonding surface of the substrate with respect to the bonding portion at the nearest outer peripheral edge thereof is 45° or less. 3. The method for manufacturing an optical recording medium according to claim 1 or 2, wherein granular members are dispersed in the ultraviolet curable adhesive.
JP62109750A 1987-05-07 1987-05-07 Production of optical recording medium Pending JPS63275051A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62109750A JPS63275051A (en) 1987-05-07 1987-05-07 Production of optical recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62109750A JPS63275051A (en) 1987-05-07 1987-05-07 Production of optical recording medium

Publications (1)

Publication Number Publication Date
JPS63275051A true JPS63275051A (en) 1988-11-11

Family

ID=14518304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62109750A Pending JPS63275051A (en) 1987-05-07 1987-05-07 Production of optical recording medium

Country Status (1)

Country Link
JP (1) JPS63275051A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999024977A1 (en) * 1997-11-12 1999-05-20 First Light Technology, Inc. System and method of forming bonded storage disks with low power light assembly
US6352612B1 (en) 1998-05-19 2002-03-05 Steag Hamatech, Inc. System for forming bonded storage disks with low power light assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999024977A1 (en) * 1997-11-12 1999-05-20 First Light Technology, Inc. System and method of forming bonded storage disks with low power light assembly
US6352612B1 (en) 1998-05-19 2002-03-05 Steag Hamatech, Inc. System for forming bonded storage disks with low power light assembly
US6500297B1 (en) 1998-05-19 2002-12-31 Steag Hamatech, Inc. Method of forming bonded storage disks with low power light assembly

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