JPS63273390A - Assembling apparatus for substrate - Google Patents

Abstract

PURPOSE:To eliminate auxiliary parts, such as a connecting tool and a clamping tool by composing a metal base material of one continuous substrate continuously bent in a wave shape. CONSTITUTION:Electronic component group 3 is soldered to a metal base substrate before bending. Both ends are grasped by a movable clamp 7, and its center is clamped by a stationary clamp 6. The center between the clamps 6 and 7 is lifted vertically by cutting edges 4, 5, the clamp 7 is simultaneously moved horizontally to the clamp 6 at the same speed to form a wave shape. The clamps are removed to complete a bent metal base substrate 2b. Since auxiliary parts are not required, an effective mounting area is increased, and since a connector between the substrates is eliminated, its connecting reliability is enhanced.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a board assembly apparatus.

[Conventional technology]

FIG. 5 is a side view showing a conventional method for assembling and storing printed circuit boards. In the figure, 1 is a board storage space, 7a
, 7b, 7C17d are printed circuit boards; 3I is a group of electronic components mounted on the printed circuit boards 7a to 7d; 8 is a fixture for holding the printed circuit boards 7a to 7d at appropriate intervals; 9 is the printed circuit board. Connectors 7a to 7d are attached, and reference numeral 10 is a connecting conductor that connects the printed circuit boards 7a to 7d.

As described above, conventionally, when storing a predetermined electric circuit as a printed circuit, the printed circuit is appropriately divided into a plurality of parts according to the storage space 1, for example, printed circuit boards 7a to 7a.
7d), and electrical connections were made between each printed circuit board via a connector 9 using a connecting conductor 10 such as a conductive wire or a flexible board. Further, if necessary, fixtures 8 such as bolts and spacers (not shown) are used to maintain the spacing between the printed circuit boards 7a and 7b.

Furthermore, since an epoxy resin insulating material is used as the base material of the printed circuit boards 7a to 7d, the heat dissipation property of the heat generated from electronic components is low, and there are restrictions on component mounting density and heat dissipation fins that promote heat dissipation. (not shown) or auxiliary rotating fan (
(not shown) were installed.

[Problem that the invention seeks to solve]

Conventional printed circuit board assemblies are constructed as described above, so auxiliary parts such as fixtures, connectors, and connection conductors are required to hold and connect the board, and the heat dissipation of the boxy resin base material is low. Furthermore, there were other problems such as the need to consider the reliability of connections between boards.

This invention was made to solve the above-mentioned problems, and aims to provide an assembly device that does not require any auxiliary parts, has excellent heat dissipation, and does not cause problems with connection reliability.

[Means for solving problems]

The board assembly apparatus according to the present invention uses a metal base material as the board material, bends this into a continuous waveform, and mounts a group of electronic components thereon.

[Effect]

Since the board assembly according to the present invention is constructed from one continuous board by bending the metal base material into a continuous waveform, auxiliary parts such as connectors and fixtures are not required.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, 1 is a board storage space, 2b is a bent metal base board that is bent into a waveform to fit the storage space 1, and 3 is a group of electronic components mounted on this bent metal base board 2b.

2 and 3 are explanatory diagrams showing the manufacturing process of the bent metal base substrate 2b, in which 4 and 5 are blades for pushing up, and 6 is a fixed clamp that grips the flat metal base substrate 28. , 7 are movable clamps that grip both ends of the metal base substrate 2a.

First, in FIG. 2, a group of electronic components 3 such as chip components are flow soldered to a metal base substrate 2a before being bent. In this case, no components are mounted on the bent portion, and only the conductor pattern is used. Metal base board 2 after mounting components
A is held at both ends by movable clamps 7 as shown in FIGS. 2 and 3, and the center between the movable clamps is fixed with a fixed clamp 6.

Further, the blades 4 and 5 are used to push up each center 7 (there are two locations) vertically upwards between the movable clamp 7 and the fixed clamp 6, and at the same time move the movable clamp 7 in the opposite direction (toward the fixed clamp 6) at the same speed. Move horizontally. After the two waveform shapes are completed, the fixed clamp 6 and the movable clamp 7 are released, and the bent metal base substrate 2b shown in FIG. 1 is obtained.

In addition, in the above bending processing example, the fixed clamp 6 was fixed and the movable clamp 7 was moved horizontally, but the fourth
The movable clamp 7 may be fixed as shown in the figure, and the fixed clamp 6 may be moved horizontally as shown by the arrow. Blade 4 at that time
For example, with only one set of fixed clamps 6 for the blade 4, the same operation can be repeated to perform a plurality of wave-shaped bending processes.

〔Effect of the invention〕

As described above, according to the present invention, since the metal base board is bent and formed into a continuous waveform, a single board can be formed, and therefore, auxiliary parts such as connectors for connecting boards, connection conductors, and spacing fixtures are not required. This increases the effective area for mounting components and reduces costs.Furthermore, since there is no connection between boards, there are no concerns about connection reliability, and a highly reliable product can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a side view showing an embodiment of the present invention, FIGS. 2, 3, and 4 are side views showing a manufacturing method thereof, and FIG. 5 is a side view showing a conventional printed circuit board assembly method. It is a diagram. In the figure, 1 is a storage space, 2b is a bent metal base board,
3 is a group of electronic components. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] A board assembly device characterized in that a group of electronic components is mounted and housed on a bent metal base board formed by continuously bending a single metal base board in a waveform.