JPS62219594A - Connection of large size flexible printed circuit - Google Patents
Connection of large size flexible printed circuitInfo
- Publication number
- JPS62219594A JPS62219594A JP61061572A JP6157286A JPS62219594A JP S62219594 A JPS62219594 A JP S62219594A JP 61061572 A JP61061572 A JP 61061572A JP 6157286 A JP6157286 A JP 6157286A JP S62219594 A JPS62219594 A JP S62219594A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- flexible printed
- printed circuit
- large size
- size flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、大型フレキシブル配線板の半田づけ接続方法
に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for soldering and connecting large-sized flexible wiring boards.
（従来の技術とその問題点）
フレキシブル配線板（以下ＦＰＣと略称）は、軽薄短小
の特徴を持つために各種業界に使用されているが、反面
大型サイズ（５００ｍｍＸ５００關以上）のフレキシブ
ル配ｌ１Ｆｉｌ板は製作上の間顯、用途の状況などから
一般に製作さｎていなかった。その中の一つの問題点と
して大型ＦＰＣ同士！接続する際に接続部を半田付で行
なっていた。しかし、この方法ではＦＰＣの柔軟性のた
め取り扱いの際にはがｌｒしたり、また、半田の信頼性
の問題で接続が不備であったりした。(Conventional technology and its problems) Flexible wiring boards (hereinafter abbreviated as FPC) are used in various industries because they are light, thin, short and small. Generally, these were not manufactured due to the manufacturing time and usage conditions. One of the problems is between large FPCs! When connecting, the connection part was soldered. However, with this method, due to the flexibility of the FPC, it may come loose during handling, and the connection may be defective due to problems with the reliability of the solder.
一般には、超大型サイズ（１０００ｍｍＸ１０ＱＱａ＋
ｍ）の場合には、製造工程の限界から５００ｘ５００サ
イズンつ（す、端子部同士で接続して製作していたに過
き゛なかった。Generally, super large size (1000mmX10QQa+
In the case of (m), due to the limitations of the manufacturing process, the terminals were only manufactured in 500 x 500 sizes, with the terminals connected to each other.
大型サイズＦＰＣの製造方法は基本的には従来のＩＪ造
方法と同じである。異なる点は、印刷工程においてスキ
どの版な大きくするために印刷条件が太き（変わってく
る点と、外形加工工程においては金型では対応が限界で
あるため刃型を用いている点である。大型ＦＰＣは単品
では印刷の版の大ぎさ、プレスの有効面積の間和から最
大６０ Ｏｎ＋ｍＸ ６００ｍｍが限界である。これ以
上の大型サイズについては何枚かのＰＮに分割して半田
付にて端子部同士を接続していた。The manufacturing method of large size FPC is basically the same as the conventional IJ manufacturing method. The difference is that in the printing process, the printing conditions are changed to increase the size of the gap, and in the contour processing process, there is a limit to what a mold can do, so a blade mold is used. .The maximum size of a large FPC is 60 On + m x 600 mm due to the size of the printing plate and the effective area of the press.For larger sizes, it must be divided into several PN sheets and soldered. The terminals were connected together.
（問題点を解決するための手段）
本発明は、大型ＦＰＣの半田付は接続の問題点にかんが
み、太へ’ＩＦＰＣ同士を接続する時に、直径ｌＸＬ５
ｍｍ以上１．０闘以下で適当の長さの銅線を接続端子部
上に載せ、その上から半田盛りをして半田付は接続する
。(Means for Solving the Problems) The present invention takes into account the connection problems in soldering large FPCs, and provides a method for connecting large FPCs with a diameter of lXL5.
Place a copper wire of an appropriate length (mm or more and 1.0 mm or less) on the connection terminal, apply solder on top of it, and connect by soldering.
本発明の詳細な説明図を図１、図２に示す。Detailed explanatory diagrams of the present invention are shown in FIGS. 1 and 2.
（発明の効果）
従来、間顯であった大型ＦＰＣの半田による端子接続方
法を銅線仲介として用いることで、半田接続の信頼性を
増し取り・扱いにおいても不備がなくなった。(Effects of the Invention) By using the conventional method of connecting terminals using solder for large FPCs as a copper wire intermediary, the reliability of the solder connections has been increased and there are no defects in handling and handling.
第１図はＦＰＣ端子上に鉋線馨のせ半田付けをした部分
断面図、第２図は大型ＦＰＣ接続笑施例である。
１・・・・・・半田、２・・・・・・＠線、３・・・・
・・カバーレイフィルム、４・・・・・・回路、５・・
・・・・基材（ポリイミド又はポリエステル２ィルム）
、６・・・・・・補強板接着剤、７・・・・・・補強板
フィルム、８・・・・・・大ｍＦＰＣ１第２図Fig. 1 is a partial cross-sectional view of a plane wire placed on an FPC terminal and soldered, and Fig. 2 is an example of connection to a large FPC. 1...Solder, 2...@ line, 3...
...Coverlay film, 4...Circuit, 5...
...Base material (polyimide or polyester 2 film)
, 6...Reinforcement plate adhesive, 7...Reinforcement plate film, 8...Large mFPC1 Fig. 2
Claims (1)
続する場合に、端子接続部上に直径０．５〜１．０ｍｍ
の銅線を載せ、さらにその上から半田盛りをして半田付
け端子接続を行うことを特徴とする大型フレキシブル配
線板の接続方法。1. When connecting a large-sized flexible printed wiring board with a terminal, a diameter of 0.5 to 1.0 mm is placed on the terminal connection part.
A method for connecting a large flexible wiring board, which is characterized by placing a copper wire on top of the copper wire, applying solder on top of the copper wire, and connecting the solder terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61061572A JPS62219594A (en) | 1986-03-19 | 1986-03-19 | Connection of large size flexible printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61061572A JPS62219594A (en) | 1986-03-19 | 1986-03-19 | Connection of large size flexible printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62219594A true JPS62219594A (en) | 1987-09-26 |
Family
ID=13174968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61061572A Pending JPS62219594A (en) | 1986-03-19 | 1986-03-19 | Connection of large size flexible printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62219594A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141660A (en) * | 2000-10-31 | 2002-05-17 | Fujikura Ltd | Method for connecting flexible printed board to each other |
-
1986
- 1986-03-19 JP JP61061572A patent/JPS62219594A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141660A (en) * | 2000-10-31 | 2002-05-17 | Fujikura Ltd | Method for connecting flexible printed board to each other |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4593342A (en) | Heat sink assembly for protecting pins of electronic devices | |
| US3704515A (en) | Method for mounting connectors on printed circuit boards | |
| US6223973B1 (en) | Apparatus and method for connecting printed circuit boards through soldered lap joints | |
| JPS61148706A (en) | Flexible cable assembly | |
| JPS62219594A (en) | Connection of large size flexible printed circuit | |
| JP2000165034A (en) | Flexible printed wiring board and its connecting method | |
| JPH08116147A (en) | Connection structure of rigid substrate | |
| JPH08298361A (en) | Printed board and its discriminating method | |
| JP2606981B2 (en) | Three-dimensional mounted printed wiring board and method of manufacturing the same | |
| JPH0815717A (en) | Liquid crystal display device | |
| JPH05206603A (en) | Flexible printed wiring board | |
| JPS6294970A (en) | Film carrier lsi | |
| JPS60201692A (en) | Wiring circuit device | |
| JPH0210790A (en) | Flexible printed wiring board and parts mounting method | |
| JPH11145373A (en) | Tape carrier package, and liquid crystal display using the tape carrier package | |
| JPS58220490A (en) | Method of connecting printed board | |
| JPS62266856A (en) | Manufacture of hybrid ic | |
| JPS63155790A (en) | Method of applying adhesive for chip parts | |
| JPH03268388A (en) | Connecting method of circuit boards | |
| JPS5810897A (en) | Method of connecting package for integrated circuit | |
| JPH051231U (en) | Structure of FPC board | |
| JPH03280368A (en) | Surface mounted connector for circuit board | |
| JPS6355999A (en) | Method of mounting electronic circuit | |
| JPH0661413A (en) | Substrate for hybrid ic and manufacture of hybrid ic using it | |
| JPS62120100A (en) | Method of mounting chip parts on printed wiring board |