JPS6327061U - - Google Patents

Info

Publication number
JPS6327061U
JPS6327061U JP1986120136U JP12013686U JPS6327061U JP S6327061 U JPS6327061 U JP S6327061U JP 1986120136 U JP1986120136 U JP 1986120136U JP 12013686 U JP12013686 U JP 12013686U JP S6327061 U JPS6327061 U JP S6327061U
Authority
JP
Japan
Prior art keywords
conductivity type
type region
metal layer
electrode
electrode metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986120136U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0526770Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986120136U priority Critical patent/JPH0526770Y2/ja
Publication of JPS6327061U publication Critical patent/JPS6327061U/ja
Application granted granted Critical
Publication of JPH0526770Y2 publication Critical patent/JPH0526770Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Thyristors (AREA)
  • Wire Bonding (AREA)
JP1986120136U 1986-08-05 1986-08-05 Expired - Lifetime JPH0526770Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986120136U JPH0526770Y2 (cg-RX-API-DMAC7.html) 1986-08-05 1986-08-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986120136U JPH0526770Y2 (cg-RX-API-DMAC7.html) 1986-08-05 1986-08-05

Publications (2)

Publication Number Publication Date
JPS6327061U true JPS6327061U (cg-RX-API-DMAC7.html) 1988-02-22
JPH0526770Y2 JPH0526770Y2 (cg-RX-API-DMAC7.html) 1993-07-07

Family

ID=31008172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986120136U Expired - Lifetime JPH0526770Y2 (cg-RX-API-DMAC7.html) 1986-08-05 1986-08-05

Country Status (1)

Country Link
JP (1) JPH0526770Y2 (cg-RX-API-DMAC7.html)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5468162A (en) * 1977-11-11 1979-06-01 Hitachi Ltd Semiconductor device
JPS5866654U (ja) * 1981-10-29 1983-05-06 日本電気株式会社 ガラスパツシベ−シヨン型半導体装置
JPS5895865A (ja) * 1981-12-02 1983-06-07 Hitachi Ltd ゲ−トタ−ンオフサイリスタ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5468162A (en) * 1977-11-11 1979-06-01 Hitachi Ltd Semiconductor device
JPS5866654U (ja) * 1981-10-29 1983-05-06 日本電気株式会社 ガラスパツシベ−シヨン型半導体装置
JPS5895865A (ja) * 1981-12-02 1983-06-07 Hitachi Ltd ゲ−トタ−ンオフサイリスタ

Also Published As

Publication number Publication date
JPH0526770Y2 (cg-RX-API-DMAC7.html) 1993-07-07

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