JPS6327044U - - Google Patents

Info

Publication number
JPS6327044U
JPS6327044U JP12120986U JP12120986U JPS6327044U JP S6327044 U JPS6327044 U JP S6327044U JP 12120986 U JP12120986 U JP 12120986U JP 12120986 U JP12120986 U JP 12120986U JP S6327044 U JPS6327044 U JP S6327044U
Authority
JP
Japan
Prior art keywords
lead frame
lead
mount
block
heat block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12120986U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0244520Y2 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986121209U priority Critical patent/JPH0244520Y2/ja
Publication of JPS6327044U publication Critical patent/JPS6327044U/ja
Application granted granted Critical
Publication of JPH0244520Y2 publication Critical patent/JPH0244520Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP1986121209U 1986-08-07 1986-08-07 Expired JPH0244520Y2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986121209U JPH0244520Y2 (zh) 1986-08-07 1986-08-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986121209U JPH0244520Y2 (zh) 1986-08-07 1986-08-07

Publications (2)

Publication Number Publication Date
JPS6327044U true JPS6327044U (zh) 1988-02-22
JPH0244520Y2 JPH0244520Y2 (zh) 1990-11-27

Family

ID=31010263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986121209U Expired JPH0244520Y2 (zh) 1986-08-07 1986-08-07

Country Status (1)

Country Link
JP (1) JPH0244520Y2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012654A (ja) * 1996-06-27 1998-01-16 Nec Yamaguchi Ltd ボンディング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291039A (ja) * 1986-06-10 1987-12-17 Shinkawa Ltd ボンデイング装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291039A (ja) * 1986-06-10 1987-12-17 Shinkawa Ltd ボンデイング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012654A (ja) * 1996-06-27 1998-01-16 Nec Yamaguchi Ltd ボンディング装置

Also Published As

Publication number Publication date
JPH0244520Y2 (zh) 1990-11-27

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