JPS6327044U - - Google Patents
Info
- Publication number
- JPS6327044U JPS6327044U JP1986121209U JP12120986U JPS6327044U JP S6327044 U JPS6327044 U JP S6327044U JP 1986121209 U JP1986121209 U JP 1986121209U JP 12120986 U JP12120986 U JP 12120986U JP S6327044 U JPS6327044 U JP S6327044U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- mount
- block
- heat block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986121209U JPH0244520Y2 (cg-RX-API-DMAC10.html) | 1986-08-07 | 1986-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986121209U JPH0244520Y2 (cg-RX-API-DMAC10.html) | 1986-08-07 | 1986-08-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6327044U true JPS6327044U (cg-RX-API-DMAC10.html) | 1988-02-22 |
| JPH0244520Y2 JPH0244520Y2 (cg-RX-API-DMAC10.html) | 1990-11-27 |
Family
ID=31010263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986121209U Expired JPH0244520Y2 (cg-RX-API-DMAC10.html) | 1986-08-07 | 1986-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244520Y2 (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1012654A (ja) * | 1996-06-27 | 1998-01-16 | Nec Yamaguchi Ltd | ボンディング装置 |
| JP2023121542A (ja) * | 2022-02-21 | 2023-08-31 | 三菱電機株式会社 | 半導体製造装置及び半導体製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291039A (ja) * | 1986-06-10 | 1987-12-17 | Shinkawa Ltd | ボンデイング装置 |
-
1986
- 1986-08-07 JP JP1986121209U patent/JPH0244520Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291039A (ja) * | 1986-06-10 | 1987-12-17 | Shinkawa Ltd | ボンデイング装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1012654A (ja) * | 1996-06-27 | 1998-01-16 | Nec Yamaguchi Ltd | ボンディング装置 |
| JP2023121542A (ja) * | 2022-02-21 | 2023-08-31 | 三菱電機株式会社 | 半導体製造装置及び半導体製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0244520Y2 (cg-RX-API-DMAC10.html) | 1990-11-27 |