JPS63269503A - Transfer device of electronic component - Google Patents

Abstract

PURPOSE:To transfer an electronic component stably and continuously after its formation by a method wherein a belt for body transfer use is added to a belt for lead-wire transfer use, a stuck foreign substance is removed by sliding a plate brought into contact with a side of a metal mold forward and backward after each lead formation process and a lead wire is pushed out surely. CONSTITUTION:A lead of an electronic component 4 which is transferred inside a device by a lead-wire transfer belt 3 and an electronic component body transfer belt 6 is formed by using a lead-wire cutter 1 moving upward and downward in a forming position, a lead-forming pin 2 and a forming metal mold 5. When the component is transferred from the forming position, a plate 7 which is interlinked synchronously with a lever 10a and a wire 9 is moved in a transfer direction of the electronic component 4, removes a stuck foreign substance (a residuary substance of a solder) and pushes out a lead wire. After completion of this operation, the plate 7 is returned to its former position by a compression spring 8.

Description

[Detailed description of the invention] Industrial applications The present invention performs lead forming of electronic components.

It relates to a continuous conveyance device.

BACKGROUND ART Conventionally, as shown in FIG. 3, an electronic component 4C before lead forming is transferred to a forming position of a forming mold 6 by a lead wire conveying belt 3, as shown in FIG. There is a method of pushing out the electronic components 4a, 4b after forming when they are transported to
1, the method was to take it out by blowing air.

Problems to be Solved by the Invention According to these methods, the resistance to transport electronic components increases due to the solder plating on the surface of the lead wires that adheres to the side of the mold during lead forming, making the transport of electronic components unstable. At the same time, the lead wires became tangled during forming, making it difficult to reliably transport and remove them. In addition to the above-mentioned problem, the method of taking out the electronic parts by blowing air has the disadvantage that the electronic parts are scattered.

An object of the present invention is to solve the above-mentioned problems and to enable stable and continuous transportation of electronic components after forming.

Means for solving the problem In order to achieve this object, the present invention adds a belt for conveying the electronic component body to the conventional lead wire conveying belt. It is equipped with a mechanism that slides the plate back and forth to remove foreign matter attached to the lead wires and to reliably push out the lead wires of electronic components.

With this configuration, even if foreign matter adheres to the side of the mold during lead forming, it will be removed by the plate, and the lead wire after forming will be pushed out by the plate, allowing smooth transportation of electronic components. be able to.

EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 and 2. The electronic component 4 is conveyed within the unit by the lead wire conveyor belt 3 and the electronic component body conveyor belt 6, and the lead wire cutter 1 moves up and down at the forming position. When the lead is formed by the lead forming pin 2 and the forming mold 6 and transported from the forming position, the plate 7 connected to the lever 1Oa and the wire 9 operates in the transport direction of the electronic component 4, and removes foreign matter ( Remove solder scum) and extrude lead wires.

After the operation is completed, the compression spring 8 returns the plate 7 to its original position.

Effects of the Invention As described above, according to the present invention, the following effects can be obtained.

■ After 7 ohminks, electronic components can be aligned and transported.
It is also useful for counting work in the next section.

■ Foreign matter (solder scum) attached to the side of the forming mold
By being able to remove this, the frequency of removing the mold from the unit can be halved, and product dimensional accuracy can also be improved.

■ Reliable transport and removal from the forming mold eliminates lead wire entanglement that occurs during lead forming.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a conveying device according to an embodiment of the present invention, FIG. 2 is a schematic view of its main parts, and FIG. 3 is a perspective view showing a conventional example. 3-...Lead wire conveyor belt, 4...Electronic parts, 6...Forming mold, 6...
Electronic component body 1 General feed belt, 7...Plate. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 3
figure

Claims (1)

[Claims] As a conveyor belt for electronic components, it has a belt that conveys the body part, and a mechanism that synchronizes with the belt after forming to push out the lead wires of the formed electronic components and remove foreign matter that adheres to the forming mold. A conveying device for electronic parts, characterized by the following features: