JPS632688A - Carrying arm - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] It is related to the system.

Conventional technology In the assembly process of semiconductor devices, the conventional pellet bonder, which attaches semiconductor elements to predetermined positions on lead frames,
This will be explained with reference to FIGS. 2 to 4.

As shown in FIG. 3, the lead frame 18 is sequentially conveyed in the longitudinal direction through a conveyance path of a heating device 19, which is composed of a heating table 7 containing a heater 8, etc., and is heated to a temperature required for pellet bonding, i.e., gold-silicon. Approximately 45% above the crystal temperature
Heated to 0°C.

The semiconductor elements formed in the silicon wafer in the previous process of sea urchin wafer are divided into individual semiconductor elements 3 using a dicing saw or the like and placed on a wafer stand 2.

The conveyor arm 1 holding the suction nozzle 4 has a 9° cam and a cam roller 11. With the rotation of the cam 9, the semiconductor element 3 is attracted to the suction nozzle 4 at the suction position (a), and heated to a predetermined temperature by the heating device 19. The semiconductor element 3 is transported to a predetermined position on the heated lead frame 18, and pellet pounding is performed at the bonding position (b).
Because it is located above the heating device 19, the heat (radiation, conduction) is generated.

The lower surface of the transfer arm 1 (heating device 1
9), the temperature rises to about 100-odd degrees.

The tip of the suction nozzle 4 that performs pellet bonding is placed so that the open angle side of the suction nozzle 4 is brought into contact with two opposing edges of the semiconductor element 3, as shown in FIG. 2, so as not to damage the surface of the semiconductor element 3. However, in such a method, the relative position between the suction nozzle 4 and the semiconductor element 3 must be positioned very accurately to about 30 μm or less, and the relative position must be Misalignment causes scratches and chips in the semiconductor element.

Problems to be Solved by the Invention In the conventional pellet bonder as described above, the transfer arm that holds the suction nozzle is heated to over 100 degrees by the heat of the heating device, and the transfer arm is subject to elongation or thermal distortion due to thermal expansion. There have been problems in that the reproducibility of the movement position of the suction nozzle is impaired and the semiconductor element is scratched or chipped, resulting in a decrease in the yield of semiconductor devices.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a flow path for cooling fluid in a transfer arm having a suction nozzle at its tip.

Effects The present invention has the above-described configuration, which allows the cooling fluid to flow through the flow path provided in the transfer arm to prevent the temperature of the transfer arm from rising.
This prevents deformation of the transfer arm due to thermal expansion or thermal distortion, and improves the reproducibility of the movement position of the suction nozzle.

Embodiment An embodiment of the transport arm according to the present invention will be described with reference to FIGS. 1 to 3. FIG.

1A and 1B are diagrams explaining the structure of the transfer arm according to the embodiment, FIG. 1B is a side view, FIG. 1A is a sectional view of the transfer arm, and FIG. 2 is a suction arm. FIG. 3 is a diagram showing the positional relationship between a nozzle and a semiconductor element, and FIG. 3 is a cross-sectional view showing an outline of the pellet bonder.

As shown in FIG. 1B, the suction nozzle 4 is held by a holder 6a via a bearing 12 so as to be able to move up and down, and the holder 5a is attached to the transfer arm 1a so as to hold the tip of the transfer arm 1a. It is being

As shown in FIG. 1A, the transfer arm 1 has an outer tube 13 made of stainless steel or the like with an outer diameter of about 10, whose tip on the side of the suction nozzle 4 is closed with a blind lid 14 to prevent leakage, and the inside is made of stainless steel or the like. An inner tube 15 with an outer diameter of several diameters is provided, one end of the inner tube 16 is disposed near the suction nozzle side of the outer tube 13,
The other end projects outward from the other end of the outer tube 13 (lever 1o side shown in FIG. 3), and the lever 10 side end of the outer tube 13 passes through the inner tube 15 and cools the cooling fluid inside the outer tube 13. It is closed with a lid 16 fitted with a discharge pipe 17 serving as an outflow port.

Inner tube 15 from the part of inner tube 16 that protrudes outside of outer tube 13
When cooling water is allowed to flow inside, the cooling water flows in the direction of the arrow in FIG. 1A, thereby cooling the outer tube 13.

Normal tap water (temperature: approx. 15%
℃), the temperature at the outer periphery of the transfer arm 1 is
Despite the thermal influence of the heating device 19 shown in the figure,
The temperature hardly rises and remains almost constant at 20° C. to 25° C., so that the transfer arm 1 does not undergo deformation due to thermal expansion or thermal distortion as described above, and the position of the suction nozzle does not change.

Effects of the Invention The present invention prevents deformation such as thermal expansion or thermal distortion of the transfer arm disposed above the heating device, prevents variations in the reproducibility of the position of the suction nozzle, and prevents damage caused by scratches and chips on semiconductor elements. Improve the yield of semiconductor devices.

[Brief explanation of the drawing]

1A and 1B are a sectional view and a side view, respectively, illustrating an embodiment of a transfer arm according to the present invention, and FIG. 2 is a sectional view showing the positional relationship between a suction nozzle and a semiconductor element, and 3
The figure is a sectional view showing an outline of a pellet bonder, and FIG. 4 is a side view showing the structure of a conventional transfer arm. 1a, 1...transport arm, 3...semiconductor element, 4...suction nozzle, 13...
Outer tube, 15 Inner tube, 19 Heating device, 2 Wafer stand, 5, 6a Holder, 7 River Heating stand , 8. River... Heater, 9.
...Cam, 10...Lever, 11...
...Cam roller, 12...Bearing, 13...
... Outer tube, 14 ... Blind lid, 15 ...
...Inner pipe, 16...Lid, 17...Discharge pipe, 18...Lead frame, 19.Heating device, (A)...・Suction position, (b)・
...Bonding position. Name of agent: Patent attorney Toshio Nakao (1 person)
゛-Sky hair 7-m+--Ichiran 1 Uminosu L tj-Itta L]ζ 14・-φ〈, 1 Fig. 2

Claims (2)

[Claims] (1) A transfer arm having a nozzle at its tip for adsorbing an object to be transferred, and a flow path for cooling fluid inside. (2) The transport arm according to claim 1, wherein the object to be transported is a semiconductor element, and the transport arm has a heating device for a lead frame that fuses the semiconductor element directly below.