JPS63266857A - Electronic component - Google Patents
Electronic componentInfo
- Publication number
- JPS63266857A JPS63266857A JP62099717A JP9971787A JPS63266857A JP S63266857 A JPS63266857 A JP S63266857A JP 62099717 A JP62099717 A JP 62099717A JP 9971787 A JP9971787 A JP 9971787A JP S63266857 A JPS63266857 A JP S63266857A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- heat
- outer frame
- circuit
- lsi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000003754 machining Methods 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 13
- 229910052751 metal Inorganic materials 0.000 abstract description 13
- 239000004020 conductor Substances 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000012212 insulator Substances 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はｔ子計算機等に使用される電子部品の。[Detailed description of the invention] [Industrial application field] The present invention relates to electronic components used in child computers and the like.
冷却構造体に係り、特にショート事故防止に好適な電子
部品に関する。 １゜〔従来の
技術〕
集積回路用の冷却装置とじτ、たとえば特公唄６１−５
２８Ａ９号にみられるような（し歯構造のものが知られ
℃おり、これはＣｗ 、Ａｌのような金属を用いて加工
されている。 ご（）〔発明
が解決しようとする間島点〕
従来技術は、くし歯状部品を機械加工する際に発生する
金属（す（パリ）や、組立使用する特発。The present invention relates to a cooling structure, and particularly to an electronic component suitable for preventing short-circuit accidents. 1゜ [Prior art] Cooling device for integrated circuits τ, for example, Tokuko Uta 61-5
28A9 is known, which has a toothed structure and is processed using metals such as Cw and Al. The technology is to use the metal that is generated when machining comb tooth-shaped parts and the special metal that is used in assembly.
生する金属（ずに対して配慮がなされていなかっ。No consideration was given to the raw metal.
た。この為電子部品内部回路でショート発生の問題があ
った。Ta. For this reason, there was a problem of short circuits occurring in the internal circuits of electronic components.
本発明の目的はこの金属くずが発生しない電子。The purpose of the present invention is to create electrons that do not generate metal scraps.
部品を得ることにある。It's about getting the parts.
上記目的は、放熱用＜口面状部品の材質を絶鴨、。 The above purpose is for heat dissipation.
物でかつ熱伝導性と機械加工特性の良好な材料に。material with good thermal conductivity and machining properties.
することにより達成される。This is achieved by
絶縁物で熱伝導性と機械加工％性の良好な材料。 An insulating material with good thermal conductivity and machinability.
とじてセラミックがある。セラミックとして絶帆破壊電
圧４０ＫＶ／ｍｍ 、熱伝導率１５ｏｗ７ｒｎ、ｘ Ｏ
＆ 度ノｕ料もすでに実現している。There is a ceramic closure. As a ceramic, the breakdown voltage is 40KV/mm, the thermal conductivity is 15ow7rn, xO
& Prescription fees have already been realized.
不発明は、（上歯状部品をセラミックで構成したから、
機械加工によって金属（すが発生し、を品の内部回路で
ショートが発生することかない。、。The non-invention is (because the upper tooth-shaped part is made of ceramic,
The machining process will not generate metal chips and short circuits in the product's internal circuits.
以下、本発明の一実施例を第１０により説明す。 A tenth embodiment of the present invention will be described below.
る。回些を構成する基板５に設けられた導体パラ。Ru. A conductor plate provided on the board 5 constituting the circuit board.
ド２に外部回路と電気接続を目的としたピン１が。Pin 1 is on pin 2 for electrical connection to an external circuit.
接合されている。基板３上の導体パッド４によっ。It is joined. By the conductor pad 4 on the substrate 3.
て構成される回路パターン上に配置されたＬＳｍｇはん
だ５を介して電気回路を形成している。第１゜図全体の
電子部品を電気的に動作させると発熱体。An electric circuit is formed through the LSmg solder 5 placed on the circuit pattern. Figure 1: When all the electronic components in Figure 1 are operated electrically, it becomes a heating element.
素子であるＬＳＩ６が発熱する。この熱をくし歯状の。The LSI 6, which is an element, generates heat. Comb this heat.
放熱材７と電子部品外枠８へ更に冷却構造体９”ｔ。A cooling structure 9''t is further attached to the heat dissipation material 7 and the electronic component outer frame 8.
伝達することにより、ＬＳＩ６を冷却する。放熱材７゜
と電子部品外枠８とは非常に狭いすき間を有して。By transmitting the signal, the LSI 6 is cooled. There is a very narrow gap between the heat dissipation material 7° and the electronic component outer frame 8.
おりこのすき間を含めた電子部品外枠８の内部に。Inside the electronic component outer frame 8, including the gap between cages.
は空気またはガス（Ｈｇ等）が満たされている。こ。is filled with air or gas (such as Hg). child.
の電子部品構造において、放熱材７．電子部品外。In the electronic component structure of 7. Outside electronic parts.
枠８をＭやＣｕ等の金属で構成すると、これらを。If the frame 8 is made of metal such as M or Cu, these.
機械加工する時発生する金属（ずの混入あるいは。Contamination with metal (or metal) generated during machining.
組み立て使用中に発生する金属（ずが隣接する導。Metals generated during assembly and use (adjacent conductors).
体パッド４同志間へ落下し電気回路をショートさ。Body pad 4 fell between comrades and shorted out the electrical circuit.
せてしまう恐れがある、しかし放熱材７．電子雌。However, heat dissipation material 7. electronic female.
品外枠８をセラミックで構成すると、これらの間。When the outer frame 8 is made of ceramic, the space between these.
照点な解決することができる。It is possible to solve the problem.
本発明によれば、電子部品の回路内部に金属く。 According to the present invention, a metal layer is placed inside the circuit of an electronic component.
ず混入を防止できるので、電子部品ショート事故。This prevents the contamination of electronic components, thereby preventing short-circuit accidents.
をなくす効果がある。It has the effect of eliminating
また従来のＭやＣ１Ｌを用いた構造の場合、パリ。Also, in the case of a structure using conventional M or C1L, Paris.
取りおよびパリの検査工程が発生し、品質を保圧するの
に多大な工数が発生する。本発明はこれら。A large amount of man-hours are required to ensure quality due to the removal and parity inspection processes. The present invention covers these.
の工程や工数を不要とする効果がある。 １゜This has the effect of eliminating the need for additional processes and man-hours. 1゜
第１図は本発明の一実施例の縦断面図である。。
４・・・導体パッド
６・・・発熱体素子
７・・・放熱材 １１．８・
・・電子部品外枠
９・・・冷却構造体FIG. 1 is a longitudinal sectional view of an embodiment of the present invention. . 4... Conductor pad 6... Heating element 7... Heat dissipation material 11.8.
...Electronic component outer frame 9...Cooling structure
Claims (1)
熱が間隙を介して外枠に伝達放熱されるように構成した
電子部品において、前記放熱材および前記外枠を絶縁物
でかつ熱伝導性と機械加工特性の良好なる材料で構成し
たことを特徴とする電子部品。1. In an electronic component configured such that a heat dissipating material is arranged on a heat generating element (LSI) and the heat of the heat dissipating material is transferred and radiated to an outer frame through a gap, the heat dissipating material and the outer frame are formed of an insulating material. An electronic component characterized by being made of a material that is large in size and has good thermal conductivity and machining characteristics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62099717A JPS63266857A (en) | 1987-04-24 | 1987-04-24 | Electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62099717A JPS63266857A (en) | 1987-04-24 | 1987-04-24 | Electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63266857A true JPS63266857A (en) | 1988-11-02 |
Family
ID=14254826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62099717A Pending JPS63266857A (en) | 1987-04-24 | 1987-04-24 | Electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63266857A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6138748A (en) * | 1996-07-01 | 2000-10-31 | Digital Equipment Corporation | Interleaved-fin thermal connector |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60239049A (en) * | 1984-05-11 | 1985-11-27 | Hitachi Ltd | Heat conductive cooling module device |
-
1987
- 1987-04-24 JP JP62099717A patent/JPS63266857A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60239049A (en) * | 1984-05-11 | 1985-11-27 | Hitachi Ltd | Heat conductive cooling module device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6138748A (en) * | 1996-07-01 | 2000-10-31 | Digital Equipment Corporation | Interleaved-fin thermal connector |
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