JPS63266849A - Positioning device for solid state element - Google Patents

Abstract

PURPOSE:To obtain a positioning device for multiple types of solid state elements by attracting the elements to an attraction base, sequentially closing X- and Y-axis holders by a cam to hold the elements, stepwisely centering the elements in Xand Y-axis directions, and opening or closing a pair of holders by an interlocking mechanism in the X- and Y-axis directions. CONSTITUTION:When a chip 2 is placed on an attraction base 31, a discharge pump is operated, the chip 2 is held at the base 31, and cam 51 is rotated counterclockwise. The cam 51 releases pressing of Y-axis holders 35, 36 to a cam follower 53 by the rotation at this angle alpha, the Y-axis holders are closed by the spring 55 of an interlocking mechanism 38 to hold the chip 2, thereby centering it in the Y-axis direction. Then, the cam 51 releases pressing of X-axis holders 33, 34 to a cam follower 53 by the rotation at the angle beta, the X-axis holders are closed by the spring 54 of an interlocking mechanism 37 to hold the chip 2, thereby centering it in the X-axis direction. As a result, the chip 2 is centered and positioned in both X- and Y-axis directions.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a positioning device for a solid state element, and includes, for example, a positioning device for a solid state element.
Surface wave equipment, can type semiconductor equipment, etc.! In lj construction, it relates to a device used when mounting a chip (pellet)-shaped solid element such as a surface wave element or a semiconductor element on a mount base such as a stem.

(Prior Art) In general, as shown in FIG. 6, in a surface wave device Yacan type semiconductor device, a surface wave device or a semiconductor device chip as a solid element is placed at a predetermined position on a stem 1 which serves as a mount base. However, it is not possible to mount a large chip 2 such as a surface wave device or a can-type semiconductor device.
When the target is a chip 2 of an unusual shape, it is mounted as follows.

That is, in the mounting device, as shown in FIG. 7, the chips 2 are divided from the wafer by dicing, transferred to a tray 3, arranged in a row, and set on an XY stage. A transfer device takes out the depths 2 one by one from the tray 3 set on the X-Y stage, transfers them to the positioning device 4 located at an intermediate position between the positioned stem 1, and performs this positioning. Device 4
After positioning the depth 2, the chip 2 is transferred and mounted at a predetermined position on the stem 1 by a transfer device.

Therefore, the positional relationship between the stem 1 and the chip 2 is important, and the positioning device 4 for the depth 2 is essential for mounting work.

Here, a conventional positioning device 4 for the depth 2 will be explained.

First, in the case shown in FIGS. 8 and 9, a pedestal 11 having the same shape and size as the target chip 2 is placed in the center of the substrate 10.
The chip 2 is supported on the pedestal 11, and a pair of clamping bodies 12, 13, 14° 15 are arranged around the chip 2 in the orthogonal X-axis direction and the y-axis direction.
The pair of jaws 12.13.14.15 is closed by a spring 16.17 and advanced towards the chip 2 and the cradle 11, thereby moving the chip 2 and the cradle 11 to the jaws 12.13.14.1.
5 from all sides, position the chip 2 with the clamping body 12.13.14.15 based on the dedicated pedestal 11, and then open the clamping body 12.13.14.15 with another driving body. The chip 2 and the pedestal 11 are moved back.

Furthermore, in the case shown in FIGS. 10 and 11, the substrate 20
A pedestal 21 is placed in the center of the top, the chip 2 is supported on the pedestal 21, and a pair of clamping bodies 22 and 23 corresponding to the shape and dimensions of the target depth 2 are placed around it. Then, the pair of clamping bodies 22 and 23 are closed by the spring 24 and moved forward toward the chip 2 and the pedestal 21, whereby the chip 2
The corner of the corner and the pedestal 21 are held between the holding bodies 22 and 23,
The chip 2 is positioned using a dedicated clamping body 22.23 with reference to the pedestal 21, and then the clamping body 22.23 is opened by another driving body and retreated from the chip 2 and the pedestal 21.

Such a device uses a dedicated pedestal 11 and a dedicated clamping body 22, 23 corresponding to the shape and dimensions of the chip 2, so it is possible to position one type of chip 2, but it is not applicable to multiple types. However, surface wave devices and semiconductor devices do not have the first
As shown in Fig. 2 and Fig. 13, there are many chips 2 with different shapes and dimensions, so it is necessary to prepare a large number of positioning devices dedicated to one type for switching, or to use dedicated parts for each type (cradle 11).
It took a lot of time and manpower to replace the clamping bodies 22 and 23).

(Problems to be Solved by the Invention) As mentioned above, in the conventional solid state element positioning device,
Since it is not possible to handle a wide variety of products, there are problems in that a large number of positioning devices dedicated to one product type must be prepared and switched, and a large amount of time and manpower is required to replace dedicated parts for each product type.

The present invention has been made in view of these points, and it is an object of the present invention to provide a positioning device for solid-state devices that can be used for a wide variety of types.

[Structure of the invention]

(Means for Solving the Problems) The solid-state element positioning device of the present invention is provided with a suction table that suction-holds the solid-state element, and a pair of clamping bodies in the X-axis direction are held against the solid-state element on the suction table. In addition to being provided so that it can be opened and closed,
An interlocking mechanism in the X-axis direction is provided to interlock the opening and closing of the pair of clamping bodies in the X-axis direction, and the pair of clamping bodies in the y-axis direction are connected to the pair of clamping bodies in the X-axis direction with respect to the solid element on the suction table. In addition, an interlocking mechanism in the y-axis direction is provided to open and close the pair of y-axis direction clamping bodies in conjunction with each other, and the above-mentioned pair of It is equipped with a cam that closes the clamping body in a stepwise manner.

(Function) The solid element positioning device of the present invention first uses a cam to move one of a pair of X-axis clamping bodies and a pair of Y-axis clamping bodies with the solid element being sucked onto a suction table. By closing and sandwiching the solid element while interlocked by the interlocking mechanism, centering in one of the X-axis and y-axis directions is performed, and then the pair of X-axis
The axial clamping body and the other of the pair of y-axis clamping bodies,
By closing and sandwiching the solid element while interlocked by the interlocking mechanism, centering in the other direction of the X-axis and the y-axis is performed, and as a result, the solid-state element is centered in both the It is centered and positioned.

-〇- (Example) An example of the solid state device positioning device of the present invention will be described with reference to Figs. 1 to 5.

In FIGS. 1 and 2, 30 is a substrate, and this substrate 3
A suction table 31 is provided at the center of the top of the suction table 31.
A suction hole 32 is formed in the center of the suction hole 32, and this suction hole 32 is connected to an exhaust pump (not shown).

The substrate 3 is located around the suction table 31.
A pair of clamping bodies 33, 34, 35, and 36 are provided movably in the X-axis direction and the y-axis direction, which are perpendicular to the top of the 0.
．． 34 is interlocked by an interlocking mechanism $37 and moved at circumferential speed in opposite directions to open and close, and a pair of clamping bodies 35 and 36 that are movable in the y-axis direction are interlocked by an interlocking mechanism 38 and moved in opposite directions. It opens and closes by moving at circumferential speed.

That is, the multiple pairs of clamping bodies 33.34.35.36 have two pairs of L-shaped levers 43.44.45.46 that are symmetrically supported in pairs by support shafts 41.42. One end of each pair of levers 43, 44, 45, 46 is connected via a connecting rod 47, and the other end of each pair of levers 43, 44, 45, 46 is connected to one engagement groove 48 and the engagement shaft 49 in use. The pair of clamping bodies 33 and 34 in the X-axis direction are connected to each other by a lever 43.
．． It opens and closes in conjunction with an interlocking mechanism 37 consisting of 44, etc.
A pair of clamping bodies 35.36 in the y-axis direction are connected to a lever 45.4.
It opens and closes in conjunction with an interlocking mechanism 38 consisting of 6 etc.

Further, an annular cam 51 is rotatably installed (pulled) on the upper substrate 30 via a plurality of guides 52 consisting of rollers, located on the upper part of the holding body 33, 34, 35, 36.
A cam follower 53 consisting of a roller facing the outer periphery of this cam 51 is provided on the upper part of each clamping body 33, 34, 35, 36, and multiple pairs of levers 4 of the interlocking mechanism 37, 38 are provided.
3.44.45.46 clamping body 33.34.35.36
A spring 54.55 is tensioned between the ends of the sides, and each spring 54.55 causes each lever 43.44.45.4
Each clamping body 33, 34 in the X-axis direction and the y-axis direction via 6
．． 35° 36 is biased in the closing direction, and each clamping body 33.
A cam follower 53 of 34.35°36 is in contact with the outer periphery of the cam 51.

The cam 51, as shown in FIG. The position of the slope that releases the pushing motion by the section is the position of each clamping body 33, 34 relative to the cam follower 53 in the X-axis direction, and the position of the cam follower 53 of each clamping body 35, 36 in the Y-axis direction.
The position is shifted by a predetermined angle α.

Further, the cam 51 is rotated by a lever 58 or the like.

Then, in this solid state element positioning apparatus, in the state shown in FIG. The depth 2 as solid elements taken out one by one is transferred.

When the chip 2 is transferred, the exhaust pump connected to the suction hole 32 is activated, and the chip 2 is suctioned and held on the suction table 31. Then, the cam 51 is moved by an external driving force via the lever 58, etc. Rotate counterclockwise.

At this time, due to the rotation of the initial angle α, the cam 51
releases the pressing force of each clamping body 35, 36 in the y-axis direction relative to the cam follower 53, and as shown in FIG. The spring 55 closes the chip 2, clamps the chip 2 in the y-axis direction, and performs centering in the y-axis direction.The cam 51 then pushes each clamping body 33, 34 against the cam follower 53 in the X-axis direction by rotating by an angle β. is released, and as shown in FIG.
7 and closed by a spring 54, the tip 2 is held in the X-axis direction and centered in the X-axis direction, and as a result, the depth 2 is centered in both the X-axis direction and the y-axis direction. Positioned.

Then, the positioned chip 2 is released from suction holding by stopping the exhaust pump connected to the suction hole 32, and is moved against the springs 54 and 55 by the clockwise rotation of the cam 51 to each clamping member. 33, 34, 35, and 36 are opened and unclamped, and mounted at a predetermined position on the stem 1 as explained in FIG. 7.

Here, as mentioned above, the chip 2 is placed on the suction table 31.
After holding the tip by suction, the chip 2 is centered in the y-axis direction by the respective clamping bodies 35 and 36 in the y-axis direction, and the depth 2 is centered in the X-axis direction by the respective clamping bodies 33 and 34 in the X-axis direction, in order. , a suction table 31 using an exhaust pump
Each clamping body 35.3 by the spring 55
In addition, the clamping force of each clamping body 33, 34 by the spring 54 is made stronger than the clamping force of each clamping body 35, 36 by this spring 55.

And multiple pairs of clamping bodies 33.3 in the X-axis direction and the y-axis direction.
In order to center the chips 2 of different shapes and sizes by equalizing the moving speeds of 4.35. The relationships between the two are made equal.

Therefore, as long as the stroke of each clamping body 33, 34, 35, 36 is within the range of the height (stroke) difference of the outer circumference of the cam 51, the depth 2 can be moved in the The chip 2 can be centered and positioned in both directions, and as a result, the chip 2 can be mounted at a predetermined position on the stem 1.

〔Effect of the invention〕

As described above, according to the present invention, with the solid element adsorbed on the suction table, the cam sequentially closes the clamping body in the X-axis direction and the clamping body in the y-axis direction in stages to remove the solid element. Because of the clamping, centering of the solid-state element in the X-axis direction and the y-axis direction is performed stepwise in order, and as a result, the solid-state element is centered and positioned in both the X-axis direction and the y-axis direction. Since the pair of clamping bodies in the X-axis direction and the pair of clamping bodies in the Y-axis direction are opened and closed in conjunction with each other by their respective interlocking mechanisms, it is possible to position a wide variety of solid elements having different shapes and sizes. Therefore, special parts corresponding to the type of solid-state element are not required, and replacing the special parts does not require time and manpower. Furthermore, since the solid-state element is self-centering, the positioning accuracy of the solid-state element is improved.

[Brief explanation of the drawing]

1 to 5 show an embodiment of the solid state element positioning device of the present invention, in which FIG. 1 is a plan view thereof, FIG. 2 is a vertical sectional view thereof, and FIG. 3 is a plan view of the cam, and FIG. Figures 4 and 5 are partial plan views for explaining the operation, respectively.
6(c) and (2) are a plan view and a side view of a semiconductor device using a solid-state element, FIG. 7 is an explanatory diagram of a method of assembling a semiconductor device, and FIG. 8 is a diagram of a conventional solid-state element. 10 is a plan view of another conventional positioning device for solid-state elements, FIG. 11 is a longitudinal sectional view thereof, and FIGS. 12 and 13 are The figures each show a chip as a solid-state element, with the figure being a plan view and the figure being a side view.
．． 34.35.36...Holding body, 37.38...Interlocking I
II, 51...cam.

Claims (1)

[Claims] (1) A suction table that holds the solid element by suction, a pair of clamping bodies in the x-axis direction that can be opened and closed with respect to the solid-state element on the suction table, and an x that opens and closes the pair of clamping bodies in the x-axis direction in conjunction with each other. an interlocking mechanism in the axial direction; a pair of clamping bodies in the y-axis direction that can be opened and closed with respect to the solid element on the suction table in a direction intersecting the pair of clamping bodies in the x-axis direction; and a cam that sequentially closes the pair of x-axis clamping bodies and the pair of y-axis clamping bodies in a stepwise manner. Characteristic solid-state element positioning device.