KR100317313B1 - device for turning wafer during semiconductor manufacture process - Google Patents
device for turning wafer during semiconductor manufacture process Download PDFInfo
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- KR100317313B1 KR100317313B1 KR1019980054854A KR19980054854A KR100317313B1 KR 100317313 B1 KR100317313 B1 KR 100317313B1 KR 1019980054854 A KR1019980054854 A KR 1019980054854A KR 19980054854 A KR19980054854 A KR 19980054854A KR 100317313 B1 KR100317313 B1 KR 100317313B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Abstract
본 발명은 반도체 제조공정중 웨이퍼 회전장치에 관한 것으로 웨이퍼를 뒤집는 구조를 변경하여 상기 웨이퍼를 견고하게 고정지지하며 상기 고정지지된 상태에서 웨이퍼를 원활하게 뒤집음과 동시에 상기 웨이퍼를 뒤집는 시퀀스시간을 줄이므로 상기 웨이퍼를 뒤집는 작업성이 향상되도록 한 것이다.The present invention relates to a wafer rotating device during a semiconductor manufacturing process. The structure in which a wafer is flipped is changed to firmly support the wafer, and to smoothly flip the wafer in the fixed support state and at the same time reduce the sequence time of flipping the wafer. Therefore, the workability of flipping the wafer is improved.
이를 위해, 본 발명은 웨이퍼(7)가 얹혀짐과 함께 상기 웨이퍼(7)를 고정지지하기 위해 웨이퍼(7)를 중심으로 하여 상부에 위치하는 상부 핀 지지대(101a) 및 하부에 위치하는 하부 핀 지지대(101b)와; 상기 각 핀 지지대(101)에 연결되어 각 핀 지지대(101)를 상하로 각각 이동시키도록 구동력이 발생되는 상하구동부(102)와; 상기 각 핀 지지대(101)에 결합되어 웨이퍼(7)가 고정지지된 각 핀 지지대(101)를 동시에 회전시키도록 구동력이 발생되는 회전모터부(103)로 구성된 것이다.To this end, according to the present invention, the upper pin support 101a positioned above the wafer 7 and the lower pin positioned below the wafer 7 are fixed to support the wafer 7 with the wafer 7 mounted thereon. A support 101b; A vertical driving part 102 connected to each pin support 101 to generate driving force to move each pin support 101 up and down; The rotary motor unit 103 is coupled to each pin support 101 and generates a driving force to simultaneously rotate each pin support 101 on which the wafer 7 is fixed.
Description
본 발명은 반도체 제조공정에 관한 것으로써, 좀 더 구체적으로는 반도체 제조공정중 웨이퍼를 뒤집기 위한 반도체 제조공정 중 웨이퍼 회전장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing process, and more particularly, to a wafer rotating apparatus during a semiconductor manufacturing process for flipping a wafer during a semiconductor manufacturing process.
종래 반도체 제조공정 중 웨이퍼 회전장치는 도 1 내지 도 3에서 도시한 바와 같이, 로봇 아암에 의해 이송되는 웨이퍼(7)가 올려지는 핀 지지대(1)와, 상기 핀 지지대(1)의 상면에 형성되어 웨이퍼(7)를 지지하는 복수개의 핀(2)과, 상기 웨이퍼(7)의 외측에 설치되어 웨이퍼(7)의 외주연부를 잡거나 놓아주도록 복수개로 분할된 핀세트(pincette)(3)와, 상기 핀세트(3)의 내주연부에 형성되어 각 핀(2)과의 접촉을 방지하도록 각 핀(2)이 각각 삽입되는 복수개의 삽입홈(3a)과, 상기 핀세트(3)에 연결되어 웨이퍼(7)를 뒤집기 위해 웨이퍼(7)를 잡고있는 핀세트(3)를 회전시키도록 구동력이 발생되는 회전(revolving)모터부(5)와, 상기 핀세트(3)에 연결되어 핀세트(3)를 벌렸다 오무렸다 하면서 핀세트(3)가 웨이퍼(7)를 잡거나 놓아주도록 작동되는 에어 실린더(6)와, 상기 핀 지지대(1)에 연결되어 핀 지지대(1)를 상하로 이동시키도록 구동력이 발생되는 상하구동부(4)로 구성되어 있다.In the conventional semiconductor manufacturing process, the wafer rotating apparatus is formed on the pin support 1 on which the wafer 7 transported by the robot arm is mounted, and the upper surface of the pin support 1, as shown in FIGS. A plurality of pins 2 for supporting the wafer 7, and a pincette 3 divided into a plurality of pins 3 disposed outside the wafer 7 to hold or release the outer periphery of the wafer 7; And a plurality of insertion grooves 3a formed in the inner periphery of the tweezers 3, each of which pins 2 are inserted to prevent contact with each pin 2, and connected to the tweezers 3. And a revolving motor portion 5 in which a driving force is generated to rotate the tweezers 3 holding the wafers 7 so as to overturn the wafers 7, and the tweezers connected to the tweezers 3. An air cylinder 6 which is operated to hold or release the wafer 7 while the pinset 3 is opened and closed; Is connected to the tray (1) it consists of a pin support (1) up and down driving section 4, which is the driving force generated to move up and down.
이러한 구조의 반도체 제조공정 중 웨이퍼 회전장치는 로봇 아암에 의해 이송되는 웨이퍼(7)는 핀 지지대(1)에 형성된 복수개의 핀(2) 위에 올려지고, 상기각 핀(2) 위에 올려진 웨이퍼(7)는 다음 공정을 하기 위해 뒤집는다.In the semiconductor manufacturing process of such a structure, the wafer rotating device is a wafer (7) conveyed by a robot arm is mounted on a plurality of pins (2) formed on the pin support (1), the wafer (on each of the pins (2) 7) flip over to the next process.
상기 웨이퍼(7)를 뒤집기 위해서는 상기 핀 지지대(1)의 각 핀(2) 위에 올려진 웨이퍼(7)의 외측에는 복수개로 분할된 핀세트(3)가 위치하고 있으므로 상기 분할된 핀세트(3)는 에어 실린더(6)에 의해 오므려지면서 상기 웨이퍼(7)의 외주연부를 잡게 된다.In order to flip the wafer 7, a plurality of divided pinsets 3 are located outside the wafer 7 placed on each pin 2 of the pin support 1, so that the divided pinsets 3 Is held by the air cylinder 6 to catch the outer periphery of the wafer 7.
즉, 에어 실린더(6)에 의해 핀세트(3)가 오므려질 때 상기 핀세트(3)의 내주연부에 형성되어 각 핀(2)과의 접촉을 방지하기 위한 복수개의 삽입홈(3a)에 상기 각 핀(2)이 삽입됨과 함께 상기 핀세트(3)의 내주연부와 웨이퍼(7)의 외주연부 즉, 웨이퍼(7)의 에지(edge)부분이 접촉되므로 인하여 상기 웨이퍼(7)는 핀세트(3)에 의해 잡혀 고정지지된다.That is, when the tweezers 3 are retracted by the air cylinder 6, they are formed in the inner circumference of the tweezers 3 and inserted into the plurality of insertion grooves 3a for preventing contact with the fins 2. The wafer 7 is pinned because the pins 2 are inserted and the inner periphery of the tweezers 3 and the outer periphery of the wafer 7, that is, the edges of the wafer 7 are in contact with each other. It is held by the set 3 and fixedly supported.
상기와 같이, 웨이퍼(7)가 핀세트(3)에 의해 잡혀 고정지지되면 상기 핀세트(3)에 의해 고정지지되는 웨이퍼(7)는 그대로 있는 상태에서 상기 핀 지지대(1)에 연결된 상하구동부(4)의 구동력에 의해 핀 지지대(1)가 도면상 하부로 이동된다.As described above, when the wafer 7 is held and fixed by the tweezers 3, the upper and lower driving parts connected to the pin support 1 while the wafer 7 is held and fixed by the tweezers 3 remain unchanged. The pin support 1 is moved downward in the drawing by the driving force of (4).
상기 하부로 핀 지지대(1)의 이동이 완료되면 상기 핀세트(3)에 연결된 회전모터부(5)에서 발생되는 구동력에 따라 핀세트(3)가 회전됨에 따라 상기 웨이퍼(7)는 뒤집어진다.When the movement of the pin support 1 to the lower part is completed, the wafer 7 is turned over as the tweezers 3 are rotated according to the driving force generated by the rotary motor unit 5 connected to the tweezers 3. .
이와 같이, 상기 웨이퍼(7)가 뒤집어지면 상하구동부(4)의 구동력에 따라 핀 지지대(1)가 도면상 상부로 이동되고, 상기 상부로 이동된 핀 지지대(1)의 각 핀(2)과 웨이퍼(7)가 접촉되면 상기 핀 지지대(1)의 이동은 멈춰짐과 동시에 상기에어 실린더(6)에 의해 핀세트(3)가 벌어져 핀세트(3)가 웨이퍼(7)를 놓음으로써 상기 웨이퍼(7)는 핀 지지대(1)의 각 핀(2) 위에 뒤집어진 상태로 얹혀지게 되는 것이다.As such, when the wafer 7 is turned upside down, the pin support 1 is moved upward in the drawing according to the driving force of the up-and-down drive unit 4, and each pin 2 of the pin support 1 moved upwardly and When the wafer 7 is in contact, the movement of the pin support 1 is stopped and at the same time, the tweezers 3 are opened by the air cylinder 6 so that the tweezers 3 release the wafers 7. (7) is to be placed upside down on each pin (2) of the pin support (1).
그리고, 상기 각 핀(2) 위에 웨이퍼(7)가 얹혀지면 로봇 아암이 웨이퍼(7)측으로 이동하여 뒤집어진 웨이퍼(7)를 잡고 다음 공정으로 이송한다.Then, when the wafer 7 is placed on each of the pins 2, the robot arm moves to the wafer 7 side to hold the flipped wafer 7 and transfer it to the next process.
그러나, 이러한 종래 반도체 제조공정 중 웨이퍼 회전장치는 복수개로 분할된 핀세트(3)의 수평위치(leveling)를 웨이퍼(7)가 올려지는 각 핀(2)과 정밀하게 일치시키기 어려울 뿐만 아니라 상기 분할된 핀세트(3)를 벌렸다 오무렸다 하도록 작동되는 에어 실린더(6)의 구동 불량으로 인하여 상기 핀세트(3)가 웨이퍼(7)를 불완전하게 잡은 상태에서 핀세트(3)를 회전시키게 되면 상기 웨이퍼(7)를 떨어뜨리게 되는 문제점이 있었다.However, in such a conventional semiconductor manufacturing process, the wafer rotating device is difficult to precisely match the horizontal leveling of the plurality of divided pinsets 3 with the pins 2 on which the wafers 7 are placed, as well as the division. When the tweezers 3 are rotated while the tweezers 3 incompletely grasp the wafer 7 due to a poor driving of the air cylinder 6 operated to open and close the tweezers 3, the wafer (7) There was a problem of dropping.
또한, 웨이퍼(7)를 핀 지지대(1)의 각 핀(2) 위에 올려놓고 나서 상기 웨이퍼(7)를 핀세트(3)로 고정지지한 다음 상기 핀 지지대(1)를 하부로 내리고 나서 핀세트(3)를 회전시켜 웨이퍼(7)를 뒤집어야 하므로 상기 웨이퍼(7)를 뒤집기 위한 시퀀스(sequence)시간이 길다.In addition, the wafer 7 is placed on each pin 2 of the pin support 1, and then the wafer 7 is fixed with the pin set 3, and then the pin support 1 is lowered to the bottom. Since the set 3 has to be rotated to turn the wafer 7 upside down, the sequence time for turning the wafer 7 up is long.
그리고, 핀 지지대(1)의 각 핀(2) 위에 올려진 웨이퍼(7)와 핀세트(3)간의 접촉면적이 넓음에 따라 에어 실린더(6)의 작동에 따라 핀세트(3)가 벌렸다 오무렸다 하면서 웨이퍼(7)를 잡았다 놓을 때 상기 핀세트(3)에 의해 웨이퍼(7)가 파손될 수 있는 문제점도 있었다.Then, as the contact area between the wafer 7 and the pinset 3 placed on each pin 2 of the pin support 1 is wide, the pinset 3 is opened and closed in accordance with the operation of the air cylinder 6. While holding and releasing the wafer 7, there is a problem that the wafer 7 may be damaged by the tweezers 3.
본 발명은 상기의 제반 문제점을 해결하기 위해 안출한 것으로서, 웨이퍼를 뒤집는 구조를 변경하여 상기 웨이퍼를 견고하게 고정지지하며 상기 고정지지된 상태에서 웨이퍼를 원활하게 뒤집음과 동시에 상기 웨이퍼를 뒤집는 시퀀스시간을 줄임으로써 웨이퍼를 뒤집는 작업성이 향상되도록 하는데 그 목적이 있다.The present invention has been made to solve the above problems, the sequence time of flipping the wafer at the same time while flipping the wafer smoothly while holding the wafer firmly fixed by changing the structure of flipping the wafer The purpose is to improve the workability of flipping the wafer by reducing the
도 1은 종래 반도체 제조공정 중 웨이퍼 회전장치를 나타낸 사시도.1 is a perspective view showing a wafer rotating apparatus in a conventional semiconductor manufacturing process.
도 2a와 도 2b는 종래 웨이퍼 회전장치에 의해 웨이퍼가 고정 지지되는 상태를 나타낸 평면도 및 측면도.2A and 2B are a plan view and a side view showing a state in which a wafer is fixedly supported by a conventional wafer rotating apparatus.
도 3은 종래 고정 지지된 웨이퍼가 웨이퍼 회전장치에 의해 회전되는 상태를 나타낸 정면도.3 is a front view showing a state in which a conventional fixed support wafer is rotated by a wafer rotating device.
도 4는 본 발명 반도체 제조공정 중 웨이퍼 회전장치를 나타낸 사시도.Figure 4 is a perspective view showing a wafer rotating apparatus of the present invention semiconductor manufacturing process.
도 5는 본 발명 웨이퍼 회전장치의 하부 핀 지지대에 웨이퍼가 얹혀진 상태를 나타낸 평면도.Figure 5 is a plan view showing a state in which the wafer is placed on the lower pin support of the wafer rotating apparatus of the present invention.
도 6a와 도 6b는 본 발명 웨이퍼 회전장치에 의해 웨이퍼가 고정 지지되는 상태를 나타낸 정면도 및 측면도.6A and 6B are front and side views showing a state in which a wafer is fixedly supported by the wafer rotating apparatus of the present invention.
도 7은 본 발명 고정 지지된 웨이퍼가 웨이퍼 회전장치에 의해 회전되는 상태를 나타낸 정면도.Figure 7 is a front view showing a state in which the fixed support wafer of the present invention is rotated by a wafer rotating device.
도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings
101: 핀 지지대 102: 상하구동부101: pin support 102: up and down drive
103: 회전모터부 104: 핀103: rotary motor unit 104: pin
104a: 단턱104a: step
상기와 같은 목적을 달성하기 위하여 본 발명은, 웨이퍼의 에지(edge)부분이 얹혀져 지지되도록 소정 높이의 단턱이 형성된 복수개의 핀을 구비하며, 개별적으로 상하 이동가능하게 설치된 하부 핀 지지대와; 상기 하부 핀 지지대의 상부에 개별적으로 상하 이동가능하도록 대향되게 설치되고, 상기 하부 핀 지지대의 핀과 상응하여 결합하도록 형성되어 상기 하부 핀 지지대의 핀 상에 안착된 웨이퍼의 에지부분을 상측에서 해제가능하게 지지하는 복수개의 핀을 구비하는 상부 핀 지지대와; 상기 상부 핀 지지대 및 하부 핀 지지대와 결합되어 상,하부 핀 지지대 각각을 상하로 선별적으로 이동시키도록 구동력을 발생시키는 상하구동부와; 상기 상부 핀 지지대 및 하부 핀 지지대와 결합되어 웨이퍼가 상,하부 핀지지대 사이에 고정 지지된 상태에서 상기 하부 핀 지지대 및 상부 핀 지지대를 동시에 회전시키도록 구동력을 발생시키는 회전모터부로 구성된 반도체 제조공정 중 웨이퍼 회전장치를 제공한다.In order to achieve the above object, the present invention includes a lower pin support having a plurality of pins having a stepped height of a predetermined height so that the edge portion of the wafer is mounted thereon, and individually movable up and down; It is installed so as to be movable up and down individually on the upper portion of the lower pin support, and formed to engage corresponding to the pin of the lower pin support to release the edge portion of the wafer seated on the pin of the lower pin support from above An upper pin support having a plurality of pins; An upper and lower driving part coupled to the upper pin support and the lower pin support to generate a driving force to selectively move the upper and lower pin supports respectively up and down; In the semiconductor manufacturing process consisting of a rotary motor unit coupled to the upper pin support and the lower pin support to generate a driving force to rotate the lower pin support and the upper pin support at the same time while the wafer is fixed between the upper and lower pin support Provided is a wafer rotating device.
이하, 본 발명의 일 실시예를 첨부도면 도 4 내지 도 7을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 4 to 7.
반도체 제조공정 중 웨이퍼 회전장치는 종래의 구성에서 언급한 바 있으므로중복되는 부분은 그 설명을 생략하고, 동일한 구조에 한해서는 종래와 동일한 부호를 부여키로 한다.In the semiconductor manufacturing process, the wafer rotating apparatus has been mentioned in the conventional configuration, and thus, the overlapping portions will be omitted, and the same reference numerals will be used for the same structure.
도 4는 본 발명 반도체 제조공정 중 웨이퍼 회전장치를 나타낸 사시도이고, 도 5는 본 발명 웨이퍼 회전장치의 하부 핀 지지대에 웨이퍼가 얹혀진 상태를 나타낸 평면도이고, 도 6a와 도 6b는 본 발명 웨이퍼 회전장치에 의해 웨이퍼가 고정 지지되는 상태를 나타낸 정면도 및 측면도이고, 도 7은 본 발명 고정 지지된 웨이퍼가 웨이퍼 회전장치에 의해 회전되는 상태를 나타낸 정면도이다.Figure 4 is a perspective view showing a wafer rotating apparatus of the semiconductor manufacturing process of the present invention, Figure 5 is a plan view showing a state that the wafer is placed on the lower pin support of the wafer rotating apparatus of the present invention, Figure 6a and Figure 6b is a wafer rotating apparatus of the present invention The front view and the side view which showed the state by which the wafer is fixedly supported by this, and FIG. 7 is the front view which shows the state in which the fixed-supported wafer of this invention is rotated by the wafer rotating apparatus.
본 발명은 웨이퍼(7)가 얹혀짐과 함께 상기 웨이퍼(7)를 고정지지하기 위해 웨이퍼(7)를 중심으로 하여 상, 하부에 각각 위치하는 핀 지지대(101)가 설치되어 있고, 상기 각 핀 지지대(101)는 각 핀 지지대(101)를 상하로 선별적으로 이동시키도록 구동력을 발생시키는 상하구동부(102)와 결합됨과 더불어, 각 핀 지지대(101)에 의해 웨이퍼(7)가 고정지지된 상태에서 각 핀 지지대(101)를 동시에 회전시키도록 구동력을 발생시키는 회전모터부(103)와도 결합되어 있다.In the present invention, in order to fix the wafer 7 on which the wafer 7 is placed, pin supporters 101 positioned at upper and lower sides of the wafer 7 are provided. Support 101 is coupled with the vertical drive unit 102 for generating a driving force to selectively move each pin support 101 up and down, and the wafer 7 is fixed by the pin support 101 It is also coupled to the rotary motor unit 103 for generating a driving force to rotate each pin support 101 at the same time in the state.
상기 핀 지지대(101)는 상부 핀 지지대(101a)와 하부 핀 지지대(101b)로 형성되어 있고, 상기 상, 하부 핀 지지대(101a)(101b)는 회전모터부(103)의 구동력에 의해 한 번 회전할 때마다 상, 하부의 역할이 계속해서 바뀌게된다.The pin supporter 101 is formed of an upper pin supporter 101a and a lower pin supporter 101b, and the upper and lower pin supporters 101a and 101b are once driven by a driving force of the rotating motor unit 103. Each time it rotates, the roles of the upper and lower parts change continuously.
상기 각 핀 지지대(101)에는 웨이퍼(7)가 얹혀지는 복수개의 핀(104)이 형성되어 있고, 상기 각 핀(104)의 상부에는 각 핀 지지대(101)의 각 핀(104)이 접촉되어 웨이퍼(7)를 고정지지할 때 상기 웨이퍼(7)가 각 핀(104) 사이에서 유동될 수 있도록 하는 일정높이(h)의 단턱(104a)이 형성되어 있다.Each pin support 101 is formed with a plurality of pins 104 on which a wafer 7 is placed, and each pin 104 of each pin support 101 is in contact with an upper portion of each pin 104. The stepped portion 104a of a predetermined height h is formed to allow the wafer 7 to flow between the pins 104 when the wafer 7 is fixedly supported.
상기 단턱(104a)의 높이(h)는 웨이퍼(7) 두께(t)의 2/3로 형성되어 있으며, 상기 단턱(104a)의 높이(h)가 웨이퍼(7) 두께(t)의 2/3보다 낮으면 상기 각 핀(104)의 상면이 웨이퍼(7)와 접촉될 때 상기 웨이퍼(7)를 눌러주게 됨에 따라 상기 누르는 각 핀(104)의 힘에 의해 웨이퍼(7)의 파손될 수 있는 문제가 있고, 상기 단턱(104a)의 높이(h)가 웨이퍼(7) 두께(t)의 2/3보다 높으면 상기 각 핀(104)이 접촉되어 웨이퍼(7)를 고정지지할 때 상기 각 핀(104) 사이에 형성된 공간부가 넓어 웨이퍼(7)를 뒤집을 때 상기 웨이퍼(7)의 유동이 심하게 일어나 소음이 커질 뿐만 아니라 상기 웨이퍼(7)가 파손되는 문제가 있다.The height h of the step 104a is formed to be 2/3 of the thickness t of the wafer 7, and the height h of the step 104a is 2 / t of the thickness t of the wafer 7. If it is lower than 3, the wafer 7 may be broken by the force of each pressing pin 104 as the upper surface of each pin 104 is pressed against the wafer 7 when the upper surface of the pin 104 is in contact with the wafer 7. There is a problem, and if the height h of the step 104a is higher than 2/3 of the thickness t of the wafer 7, each of the pins 104 is in contact with each other to fix the wafer 7. As the space formed between the 104 is wide, when the wafer 7 is flipped over, the flow of the wafer 7 is severely generated, resulting in a noise and a problem in that the wafer 7 is broken.
상기 단턱(104a)은 웨이퍼(7)를 각 핀(104)에 원활하게 얹혀져 고정지지될 수 있도록 평면에서 볼 때 웨이퍼(7)의 외주연부 곡률과 동일하게 형성되어 있다.The stepped portion 104a is formed in the same manner as the curvature of the outer periphery of the wafer 7 in plan view so that the wafer 7 can be smoothly mounted on and fixed to the pins 104.
이와 같이 구성된 본 발명의 작용은 다음과 같다.The operation of the present invention configured as described above is as follows.
먼저, 로봇 아암에 의해 이송되는 웨이퍼(7)는 상, 하부에 위치하는 핀 지지대(101) 사이 즉, 상부 핀 지지대(101a)와 하부 핀 지지대(101b) 사이에 위치되고, 상기 핀 지지대(101) 사이에 위치된 웨이퍼(7)는 로봇 아암에서 떨어져 상기 하부 핀 지지대(101b)에 형성된 복수개의 핀(104) 위에 올려진다.First, the wafer 7 transported by the robot arm is located between the pin supports 101 located above and below, that is, between the upper pin support 101a and the lower pin support 101b, and the pin support 101 The wafers 7 positioned between the two are lifted off the robot arm and placed on the plurality of pins 104 formed on the lower pin support 101b.
이 때, 상기 각 핀(104)의 상부에는 단턱(104a)이 형성되어 있고, 상기 각 단턱(104a)은 평면에서 볼 때 웨이퍼(7)의 외주연부 곡률과 동일하게 형성되어 있으므로 상기 웨이퍼(7)의 외주연부는 각 단턱(104a)과 접촉되면서 각 핀(104)의 상부에 얹혀지게 된다.At this time, the stepped portion 104a is formed on the upper portion of each of the pins 104, and the stepped portion 104a is formed to be equal to the outer periphery curvature of the wafer 7 in plan view. The outer circumferential portion of the) is placed on the upper portion of each pin 104 while being in contact with each step 104a.
상기 하부 핀 지지대(101b)의 각 핀(104) 상부에 웨이퍼(7)가 얹혀지면 상기핀 지지대(101)중 상부에 위치되는 상부 핀 지지대(101a)는 상기 핀 지지대(101)와 연결되어 구동력이 발생되는 상하구동부(102)에 의해 도면상 하방 즉, 하부 핀 지지대(101b)측으로 이동된다.When the wafer 7 is placed on each pin 104 of the lower pin support 101b, the upper pin support 101a positioned above the pin support 101 is connected to the pin support 101 to drive a driving force. It is moved downward in the figure, that is, the lower pin support (101b) side by the generated up and down drive unit (102).
상기 하부로 이동되는 상부 핀 지지대(101a)의 각 핀(104)은 하부 핀 지지대(101b)에 형성된 복수개의 핀(104)과 서로 맞닿도록 접촉되므로 인하여 상기 상, 하부 핀 지지대(101a)(101b)에 의해 웨이퍼(7)는 고정지지됨과 동시에 상하구동부(102)의 작동은 멈춰지게 된다.Each pin 104 of the upper pin support (101a) is moved to the lower contact with the plurality of pins 104 formed in the lower pin support (101b) to abut each other, the upper and lower pin supports (101a) (101b) At the same time, the wafer 7 is fixedly supported and the operation of the vertical drive unit 102 is stopped.
이 때, 각 핀(104)의 단턱(104a)은 웨이퍼(7) 두께(t)의 2/3정도의 높이(h)로 형성되어 있으므로 상기 각 핀 지지대(101)의 각 핀(104)이 서로 맞닿으면서 웨이퍼(7)를 잡아 고정지지할 때 상기 웨이퍼(7)의 두께(t)보다 높아 즉, 웨이퍼(7) 두께(t)의 약 1/3정도의 공간이 형성됨에 따라 상기 웨이퍼(7)는 각 핀(104)에 의해 고정지지됨과 함께 상기 각 핀(104)이 웨이퍼(7)를 눌러주지 않으므로 인하여 상기 웨이퍼(7)의 파손이 방지된다.At this time, since the step 104a of each pin 104 is formed at a height h of about 2/3 of the thickness t of the wafer 7, each pin 104 of the pin support 101 is When the wafer 7 is held in contact with and fixed to each other, the wafer is formed to have a thickness higher than the thickness t of the wafer 7, that is, about 1/3 of the thickness t of the wafer 7. The 7 is fixed by the pins 104 and the pins 104 do not press the wafers 7, thereby preventing damage to the wafers 7.
상기와 같이, 각 핀 지지대(101)의 각 핀(104)에 의해 웨이퍼(7)가 고정지지되면 상기 각 핀 지지대(101)를 회전시키도록 구동력이 발생되는 회전모터부(103)에 의해 각 핀 지지대(101)가 동시에 회전되므로 인하여 상기 웨이퍼(7)는 뒤집어지게 된다.As described above, when the wafer 7 is fixed and supported by each pin 104 of each pin support 101, each of the rotary motors 103 generates a driving force to rotate the pin support 101. Since the pin support 101 is rotated at the same time, the wafer 7 is turned over.
이 때, 상부에 위치된 핀 지지대(101)는 하부에 위치되고, 상기 하부에 위치된 핀 지지대(101)는 상부에 위치하게 되는데, 이는 회전모터부(103)가 한 번 회전될 때마다 각 핀 지지대(101)는 즉, 상부 핀 지지대(101a)와 하부 핀 지지대(101b)의 역할이 바뀌게 된다.At this time, the upper pin support 101 is located at the bottom, the lower pin support 101 is located at the top, which is rotated each time the rotary motor 103 is rotated once The pin support 101 is changed, that is, the role of the upper pin support 101a and the lower pin support 101b.
여기서, 회전모터부(103)의 회전에 의해 각 핀 지지대(101)가 회전됨에 따라 웨이퍼(7)가 뒤집어지면 상기 하부에 위치된 핀 지지대(101)는 상하구동부(102)의 구동력에 따라 웨이퍼(7)가 얹혀진 상태로 하부로 이동된다.Here, when the pin support 101 is rotated as the pin support 101 is rotated by the rotation of the rotary motor unit 103, the pin support 101 positioned at the lower portion is the wafer according to the driving force of the vertical drive unit 102. (7) is moved to the lower state in the state.
그리고 나면, 상기 웨이퍼(7)측으로 로봇 아암이 이동되어 상기 로봇 아암이 핀 지지대(101)에 의해 뒤집어져 하부에 위치된 핀 지지대(101)의 각 핀(104)에 얹혀진 웨이퍼(7)를 잡고 상기 각 핀(104) 위에서 웨이퍼(7)를 내리므로 상기 각 핀(104) 위에서 내려진 웨이퍼(7)는 로봇 아암에 의해 다음 공정으로 이송된다.Then, the robot arm is moved to the wafer 7 side so that the robot arm is turned over by the pin support 101 to hold the wafer 7 placed on each pin 104 of the pin support 101 located below. Since the wafer 7 is lowered on each pin 104, the wafer 7 lowered on each pin 104 is transferred to the next process by the robot arm.
이상에서와 같이, 본 발명은 상, 하부로 분리된 핀 지지대에 의해 웨이퍼가 견고하게 잡혀져 고정지지됨에 따라 상기 웨이퍼를 회전시킬 때 웨이퍼가 떨어지는 것이 방지되는 효과가 있다.As described above, the present invention has an effect that the wafer is prevented from falling when the wafer is rotated as the wafer is firmly held and fixed by the pin support separated into upper and lower portions.
또한, 하부 핀 지지대에 웨이퍼가 얹혀진 상태에서 상부 핀 지지대가 하부로 이동되어 상기 하부 핀 지지대와 접촉되면서 웨이퍼를 잡아주고, 상기 상, 하부 핀 지지대를 동시에 회전시켜 웨이퍼를 뒤집으므로 인하여 상기 웨이퍼를 뒤집는 시퀀스 시간이 절감되어 작업성이 향상되는 효과도 있다.In addition, while the wafer is placed on the lower pin support, the upper pin support is moved downward to hold the wafer while contacting the lower pin support, and the upper and lower pin supports are rotated at the same time to flip the wafer, thereby inverting the wafer. In addition, the sequence time is reduced, thereby improving workability.
그리고, 핀 지지대의 각 핀 상부에 형성된 단턱을 일정높이로 형성하고, 상기 각 단턱의 전면을 웨이퍼의 외주연부 곡률과 동일하게 형성함으로써, 상기 각 핀의 상면과 웨이퍼간의 접촉면적이 적으므로 인하여 상기 각 핀에 의한 웨이퍼의 파손을 방지하는 효과도 있다.And, by forming a step formed on the upper side of each pin of the pin support to a certain height, and by forming the front surface of each step equal to the curvature of the outer periphery of the wafer, because the contact area between the upper surface of the pin and the wafer is small There is also an effect of preventing breakage of the wafer by each pin.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980054854A KR100317313B1 (en) | 1998-12-14 | 1998-12-14 | device for turning wafer during semiconductor manufacture process |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1019980054854A KR100317313B1 (en) | 1998-12-14 | 1998-12-14 | device for turning wafer during semiconductor manufacture process |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0817893A (en) * | 1994-06-24 | 1996-01-19 | Nippon Steel Corp | Transfer device of wafer |
| JPH09321005A (en) * | 1996-05-30 | 1997-12-12 | Shibaura Eng Works Co Ltd | Spin cleaning processing unit |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0817893A (en) * | 1994-06-24 | 1996-01-19 | Nippon Steel Corp | Transfer device of wafer |
| JPH09321005A (en) * | 1996-05-30 | 1997-12-12 | Shibaura Eng Works Co Ltd | Spin cleaning processing unit |
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