JPS63266826A - Semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE:To obtain optimum conditions even when a plasma processing is altered by eccentrically displacing a magnet element attached to a sliding base, adjusting a distance between the element and a sample electrode, and eccentrically rotating the element. CONSTITUTION:A vacuum vessel is reduced under pressure to be evacuated to a predetermined pressure, and power is supplied between a counter electrodes 4 and a sample electrode 2 to generate a plasma of gas to be processed between the electrodes, thereby plasma processing a wafer 3. In this case, a strong plasma is generated by the operations of a magnetic field of a permanent magnet 5 and an electric field between the electrodes, the magnet 5 is eccentrically rotated to form a uniform plasma. Since the power applied between the electrodes is varied according to the film seed or the like of the wafer 3 to be processed, the magnet 5 is moved axially of a rotary shaft 11 in coincidence with the intensity of the electric field. In order to eccentrically displace the magnet 5 with respect to the center of the shaft 11, an eccentric motor 22 is driven to rotate a threaded shaft 21. In order to eccentrically rotate the magnet 5, a rotary motor 23 is driven to rotate the shaft 11. The distance between the magnet 5 and the electrode 2 is adjusted by rotating a threaded shaft 25 by driving an elevation motor 27.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor manufacturing apparatus, and is a semiconductor manufacturing apparatus suitable for plasma processing using the effects of an electric field and a magnetic field.

[Conventional technology]

A conventional apparatus, for example, as described in Japanese Patent Application Laid-open No. 59-18638, consists of a vacuum container, a holder held in the vacuum container with a workpiece attached to one surface, and the holder. It is equipped with magnets placed opposite to each other on one side, and a rice-driving structure that rotates the magnet eccentrically in a plane parallel to the holder and then revolves around it. Some devices are designed to apply a sufficiently uniform magnetic field to the holder so that a workpiece attached to the holder can be etched with high precision.

[Problem that the invention seeks to solve]

The above conventional technology does not take into account the need to perform etching with high precision when the etching conditions change, and when there is a change in the material to be etched or a change in the process, the etching process cannot be performed under optimal conditions. In order to perform the etching process, it is necessary to change the position of the magnet. It only revolves around itself with a preset amount of eccentricity. There is a problem in that it is not possible to obtain optimal conditions when the cutting conditions change.

An object of the present invention is to provide a semiconductor manufacturing apparatus that can obtain optimal conditions even when plasma processing is changed.

[Means for solving the problem] The above purpose is to provide a vacuum container to which a processing gas is supplied and which is evacuated to a predetermined pressure, a sample electrode provided in the vacuum container to place a sample, and an atmosphere inside the vacuum container. A counter electrode that faces the contact sample electrode, a magnet element provided with a gap on the opposite sample electrode side of the counter electrode, a slide base with a cornerstone element attached, and a slide base that is movable in the plane direction of the magnet element. A rotating base to support, a rotating shaft mounted on the rotating base concentrically with the center of rotation of the rotating base, a rotating means for rotating the rotating shaft, and a boss provided movably in the axial direction of the rotating shaft; The rods are tilted with respect to the central axis of the rotating shaft, and one end is a boss and the other end is a slide bar. This is achieved by comprising a moving means and a second moving means for moving the rotating shaft in the axial direction.

[For production]

The boss is moved in the direction of movement of the rotating shaft by the first moving means, and the slide base is moved along the guide of the rotating base via the rod, thereby decentering the magnetic element attached to the slide base. The rotation axis is moved axially by the second displacement means, thereby adjusting the distance interval between the magnet element and the sample electrode. Rotating the rotating shaft by the rotating means,
This causes the magnet element to rotate eccentrically. By causing the magnetic element to perform these operations, the plasma generated between the sample electrode and the counter electrode can be brought into an optimal state in accordance with the processing conditions of the sample to be processed within the vacuum container.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.

In this case, the vacuum container is as shown in Figure 1.

Chamber 1 and counter electrode 4 provided at the top of chamber 1
A sample electrode 2 on which a wafer 3 as a sample is placed is attached to the lower part of the chamber 1. A gas supply path 6 is provided in the counter electrode 4 to connect to a processing gas supply source (not shown) and to introduce the processing gas into the vacuum container. An exhaust system (not shown) is connected to the lower part of the chamber 1. Note that the sample electrode 2 and the counter electrode 4 are attached via an insulator.

, 4.

On the back surface of the counter electrode 4, a magnet element having a surface parallel to the sample electrode 2 with a gap so as not to contact the counter electrode 4;
In this case, a permanent magnet 5 is provided, and the permanent magnet 5 is attached to the lower surface of the slide base 9.

As shown in FIGS. 1 and 2, the slide base 9 is attached via a linear bearing 10 to a linear guide 7 provided on the lower surface of a rotating base 8 provided above, and the sample mold 8! It is possible to move in a direction parallel to 2.

As shown in FIG. 1, a rotating shaft 11 is attached to the center of the rotating base 8. The upper part of the rotating shaft 11 is supported by the upper and lower bases 13 via a bearing 12, and the lower part is eccentrically supported via a bearing 18. It is supported by a base 19. The bearing 18 is the boss 16
and supports the rotating shaft 11 via a bearing 17.

The boss 16 is movable in the axial direction of the rotating shaft 11 via a bearing 17, and between the boss 16 and the slide base 9 are inclined rod ends at both ends, as shown in FIGS. 2 and 3. A rod 15 is provided which is swingably attached to the boss 16 and the slide base 9 by bearings 14, respectively, and the slide base 9 can be interlocked with the movement of the boss 16 via the rod 15.

A rotation motor n provided on the upper and lower bases 13 is attached to the upper part of the rotation shaft 11 via a coupling. In this case, the rotation means for rotating the rotation shaft 11 is a rotation motor.

The upper and lower bases 13 are movably supported in the axial direction of the rotating shaft 11 by guides (not shown) attached to fixed bases provided above the vacuum container, and nuts provided on the upper and lower bases 13 are attached to the fixed bases. The screw shaft 251 is engaged, and the upper and lower bases 13 are positioned. The screw shaft 5 is supported at its upper and lower parts by bearings on the fixed base, and its upper end is connected to the vertical motor 4 attached to the fixed base through a coupling. The second moving means for moving the rotating shaft 11 in the axial direction is the upper and lower bases 13 . It consists of a nut or screw shaft and a vertical motor.

The eccentric base 19 is provided with a nut, which engages a screw shaft 21 whose upper and lower parts are supported by the fixed base 1 and the upper and lower bases 13 through bearings and 4, respectively.
An eccentric base 19 is positioned in the axial direction of the rotating shaft 11. The upper end of the screw shaft is connected to the upper and lower bases 13 via a coupling.
This is connected to the eccentric motor 221 attached to the.

A first means for moving the boss 16 in the axial direction of the rotary shaft 11 consists of the eccentric base 19, the nut nod, the screw shaft 21, and the eccentric motor n.

With the apparatus configured as described above, a processing gas supplied by a processing gas supply device (not shown) is introduced into the vacuum container via the gas supply path 6, and is evacuated to a predetermined pressure by an exhaust device (not shown). Electric power is supplied between the sample electrode 2 and the sample electrode 2 by a power supply device (not shown) to generate plasma of a processing gas between the electrodes, and the sea urchin/13 is plasma-treated.

At this time, strong plasma is generated by the action of the magnetic field of the permanent magnet 5 and the electric field between the electrodes, and the permanent magnet 5 is eccentrically rotated to form a uniform plasma shape. In addition, the power applied between the electrodes changes depending on the film type of the wafer 3 to be processed, and therefore the strength of the electric field also changes.
in the axial direction to obtain the optimum electric field relationship.

First, in order to make the permanent magnet 5 eccentric with respect to the center of the rotating shaft 11, the eccentric motor n is driven and the screw shaft 21 is rotated. The eccentric base 19 moves upward or downward to move the boss 16 in the axial direction of the rotating shaft 11. For example, if the boss 16 is moved upward, the upper part of the obliquely attached rod 15 will be pulled upward, causing the load 15 to move upward.
is pulled toward the center of the rotating shaft 11, thereby moving the slide base 9 in a direction perpendicular to the axial direction of the rotating shaft 11, that is, in a plane parallel to the E material electrode 2, and the permanent magnet 5 moves toward the center of the rotating shaft 11. The movement jiL is eccentric with respect to the center of 11. In addition.

In this case, by raising the boss 16, the permanent magnet 5
8, by lowering the boss 16, pushing out the lower part of the rod 15, and moving the slide base 9.

The permanent magnet 5 may be eccentric.

Further, in order to eccentrically rotate the permanent magnet 5, the eccentric motor n is driven to eccentrically rotate the permanent magnet 5 as described above, and the rotating shaft 11 is rotated by driving the rotation motor Z. As a result, the rotating base 8 and the slide base 9 rotate, and the permanent magnet 5 rotates eccentrically.

Further, the distance between the permanent grinding stone 5 and the sample electrode 2 can be adjusted by driving the vertical motor n and rotating the screw shaft 6, so that the nut provided on the vertical base 13 is rotated in the axial direction of the screw shaft 5. The upper and lower bases I3 move upward or downward, moving the fixed shaft 11 in the axial direction, and moving the permanent magnets 5 within the range of the moving amount H.

adjust.

Note that even when the permanent magnet 5 is moved in the axial direction of the rotary shaft 11, that is, even when the vertical base 13 is moved up and down, the screw shaft 21 connected to the eccentric motor B is rotated at the bearing 29. Since the screw shaft 21 is shifted from the fixed base, the screw shaft 21 is aligned with the rotation shaft 11 along with the upper and lower bases 13.
The slide base 9 is moved in the axial direction without causing eccentricity of the slide base 9.

As described above, according to the tree embodiment, the permanent magnet 5 can be eccentrically rotated arbitrarily with respect to the sample electrode 2, and
Furthermore, since the permanent magnet 5 can be moved in a direction perpendicular to the surface of the sample electrode 2, there is an advantage that even if the object to be treated or the process conditions change, optimal conditions can be created.

In addition, in this embodiment, the upper and lower bases 3 and the eccentric base 1
Although the vertical movement of 9 is obtained by rotating the screw shaft using a motor, it is also possible to connect a cylinder or the like that directly provides linear movement. Although there is no particular mention of how to connect a power source to generate an electric field between the electrode 4 and the sample electrode 2, the power source may be connected to the sample electrode 2, or the power source may be connected to the counter electrode [i2]. . This can be done by changing the connections depending on the object to be processed.

Furthermore, although the shape of the permanent magnet 5 is not described in the tree embodiment, various shapes are possible since it can rotate eccentrically and provide uniformity of the magnetic field.

〔Effect of the invention〕

According to the present invention, it is possible to obtain optimal conditions even if the plasma treatment is changed in the heat.

[Brief explanation of the drawing]

FIG. 1 is a vertical cross-sectional view showing a semiconductor manufacturing apparatus according to an embodiment of the present invention, FIG. 2 is an external view of the rotating base part in FIG. 1, and FIG. FIG. l...Chamber, 2...Sample electrode,
4...Counter electrode, 5...Permanent magnet, 8
... Rotating base, 9 ... Slide base, 11 ... Rotating shaft, I3 ... Upper and lower base, 15 ... Rod, 16. ...boss, 19...eccentric base, nod, 26...
Natsu, 2], 25...screw shaft, 2il brutal second flash 3 figure

Claims (1)

[Claims] 1. A vacuum container to which a processing gas is supplied and which is evacuated to a predetermined pressure; a sample electrode provided in the vacuum container and on which a sample is placed; and a sample electrode in contact with the atmosphere in the vacuum container. A counter electrode facing the counter electrode, a magnet element provided with a gap on the opposite side of the sample electrode of the counter electrode, a slide base to which the magnet element is attached, and the slide base is movable in a plane direction of the magnet element. a rotating base supported on the rotating base; a rotating shaft attached to the rotating base and provided concentrically with the center of rotation of the rotating base; a rotating means for applying rotation to the rotating shaft; and a rotating means provided movably in the axial direction of the rotating shaft. a boss; a rod that is inclined with respect to the central axis of the rotational shaft and has one end connected to the boss and the other end swingably connected to the slide base; and a rod for moving the boss in the axial direction of the rotational shaft. A semiconductor manufacturing apparatus comprising: a first moving means; and a second moving means for moving the rotating shaft in the axial direction.