CN206553623U - Magnetron sputtering plating source and its device - Google Patents

Abstract

The utility model is related to material deposition technique field, and in particular to magnetron sputtering plating source and its device.Magnetron sputtering plating source includes the cylindricality the first filming component positioned at workpiece homonymy being oppositely arranged, second plating membrane module and the magnetic force generating elements for being respectively arranged at its inside, the first filming component central axis plates membrane module centerline axis parallel and contour relative to workpiece with second, magnetic force generating elements in the first filming component towards its center axis be the first magnetic pole, magnetic force generating elements in the second plating membrane module towards its center axis is the second magnetic pole, and first magnetic pole is opposite with the second magnetic pole.Magnetic control sputtering film plating device uses magnetic control film coating sputtering source, the electronics of overheat or other anions for carrying energy can be strapped between two plating membrane modules by magnetic field, it so as to greatly reduce the chance of bombardment workpiece, and can effectively suppress technological temperature rising, realize low temperature plated film.

Description

Magnetron sputtering plating source and its device

【Technical field】

The utility model is related to material deposition technique field, more particularly to magnetron sputtering plating source and its device.

【Background technology】

Magnetic control sputtering device has been widely used in the plated film fields such as various electronics, decoration as a kind of coating apparatus, its Have the advantages that plated film speed is fast, pollution-free.

The magnetron sputtering plating source used at present in the manufacturing industry such as semiconductor, panel display screen, sensor mainly has flat Face type and column are rotary-type.In common coating process, ion plasma can produce hot electron or other anions, plane It can often make hot electron or other negative ion bombardments to the surface of workpiece to be plated with the rotary-type magnetron sputtering plating source of column so that Workpiece and the technological temperature for plating film are too high.

In actual applications, there is the workpiece material (such as macromolecule) compared with multiple types, or prepared in preceding working procedure Device can not bear too high technological temperature.Therefore, above-mentioned conventional magnetic control sputtering film plating device can usually limit device and set The selection of technique when meter or manufacture.

【Utility model content】

To overcome the problem of technological temperature of existing film is too high, the utility model provide a kind of magnetron sputtering plating source and Its device.

The technical scheme that the utility model solves technical problem is to provide a kind of magnetron sputtering plating source, and it includes relative set The cylindricality the first filming component positioned at workpiece homonymy put, the second plating membrane module and magnetic force generation for being respectively arranged at its inside Part, the first filming component central axis plates membrane module centerline axis parallel and contour relative to workpiece with second, first It is the first magnetic pole towards its center axis to plate the magnetic force generating elements in membrane module, and the magnetic force generating elements in membrane module is plated second It is the second magnetic pole towards its center axis, first magnetic pole is opposite with the second magnetic pole.

Preferably, each plating membrane module includes multiple magnetic force generating elements, and multiple magnetic force generating elements are towards the plated film group The polarity of the central axis of part is identical, and is formed in parallel with two rows of the plating membrane module central axis.

Preferably, each plating membrane module includes multiple magnetic force generating elements, and multiple magnetic force generating elements are towards the plated film group The polarity of the central axis of part is identical, and the magnetic force in multiple magnetic force generating elements formation closed hoop body or each plating membrane module Generating elements is a ring bodies magnetic force generating elements.

Preferably, the central axis upright of the central axis and plating membrane module of the ring bodies in each plating membrane module.

Preferably, the magnetic force generating elements in the first filming component is disposed in proximity to the second plating membrane module side region, Magnetic force generating elements in second plating membrane module is disposed in proximity to the side region of the first filming component one.

Preferably, each plating membrane module includes sputtering target stand, and the magnetic force generating elements is arranged in sputtering target stand, institute State magnetic force generating elements not rotate, the sputtering target stand can rotate around the central axis of plating membrane module.

Preferably, each plating membrane module radial cross-sectional shape is ellipse or polygon.

Another technical scheme that the utility model solves technical problem is to provide magnetic control sputtering film plating device, and it is included as above The magnetron sputtering plating source.

Preferably, the magnetic control sputtering film plating device includes multiple magnetron sputtering plating sources and objective table, the multiple magnetic Control sputtering film coating source is arranged at the same side of objective table, and the objective table can be with respect to plated film component movement, and the direction of motion is vertical The straight central axis in multiple plating membrane modules.

Preferably, the magnetic control sputtering film plating device also includes auxiliary electrode, and the auxiliary electrode is arranged at magnetron sputtering On the outside of coating source.

Compared with prior art, the utility model magnetron sputtering plating source has advantages below：

The magnetic control sputtering film plating device uses above-mentioned magnetron sputtering plating source, can produce the magnetic force in the first filming component The magnetic line of force that raw part is produced crosses the second plating membrane module, in coating process, can control electronics or other carryings of overheat The anion of energy is strapped between two plating membrane modules by magnetic field, so as to greatly reduce the chance of bombardment workpiece, so as to have Effect ground suppresses technological temperature and risen, and is less than or equal to 100 DEG C with controlling reaction temperature.

【Brief description of the drawings】

Fig. 1 is the utility model magnetic control sputtering film plating device structural representation, and magnetic control sputtering film plating device splashes including magnetic control Penetrate coating source.

Fig. 2 is the main structure diagram of cooperation workpiece in magnetron sputtering plating source in Fig. 1.

Fig. 3 is a pair of plating membrane module dimensional structure diagrams in magnetron sputtering plating source.

Fig. 3 a are that plane A where the central axis of a pair of plating membrane modules of the utility model becomes with the first of location of workpiece relation Shape structural representation.

Fig. 3 b are that plane A where the central axis of a pair of plating membrane modules of the utility model becomes with the second of location of workpiece relation Shape structural representation.

Fig. 3 c are that plane A where the central axis of a pair of plating membrane modules of the utility model becomes with the second of location of workpiece relation Shape structural representation.

Fig. 3 d are the magnetic force generating elements enlarged diagram in magnetron sputtering plating source in Fig. 3

Fig. 4 is the utility model magnetic control sputtering film plating device the first distressed structure schematic diagram.

Fig. 5 a are the utility model magnetic control sputtering film plating device the second distressed structure schematic diagrames.

Fig. 5 b are the distressed structure schematic diagrames of the utility model magnetic control sputtering film plating device the 3rd.

Fig. 6 is the process flow diagram of the utility model magnetron sputtering coating method.

【Embodiment】

In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only to solve The utility model is released, is not used to limit the utility model.

Also referring to Fig. 1 and Fig. 2, the utility model first embodiment provides magnetic control sputtering film plating device 1, and it includes one Magnetron sputtering plating source 10.The magnetron sputtering plating source 10 includes a pair of rotatable plating membrane modules 100 and is arranged at plated film group Magnetic force generating elements 103 inside part 100.The magnetron sputtering plating source 10 is used to be the plated film of workpiece 200.

Preferably, the magnetic control sputtering film plating device 1 also includes preparing chamber 300, adapter cavity 400, vacuum mechanism 500 and valve Door 600.The magnetron sputtering plating source 10 is oppositely arranged with workpiece 200, and is placed in and is prepared in chamber 300.Adapter cavity 400 is set It is placed in and prepares the side of chamber 300 and connected with preparing chamber 300.Vacuum mechanism 500 is connected with preparing the inside of chamber 300, is specifically directly connected Connect and prepare chamber 300 or chamber 300 is prepared by connections such as airway tubes.Vacuum mechanism 500 is also connected with vavuum pump or air bleeding valve, thinks system Standby chamber 300 is vacuumized.Adapter cavity 400 prepares chamber 300 and external environment for isolation, it is to avoid external environment breaks ring and prepares chamber 300 Internal atmosphere, adapter cavity 400 and prepares valve 600 is set between chamber 300.

In the present embodiment, each plating membrane module 100 is cylindricality, and it includes sputtering target stand 101, magnetic force generating elements 103 And make sputtering target stand 101 around the drive component 106 of the rotation of magnetic force generating elements 103.The sputtering target stand 101 is tubular, the magnetic Force generating member 103 and drive component 106 are arranged inside sputtering target stand 101.The magnetic force generating elements 103 produces the magnetic line of force 1034.Multiple magnetic force generating elements 103 are set in each plating membrane module 100, and the multiple magnetic force generating elements 103 is along correspondence plating Membrane module 100 be radially arranged and the magnetic force generating elements 103 to be disposed radially polarity identical, namely each plating membrane module 100 Interior magnetic force generating elements 103 is identical towards the polarity of the central axis of plating membrane module 100.Magnetic force production in difference plating membrane module 100 Raw part 103 is each plated towards it to be oppositely arranged in opposite polarity of central axis of membrane module 100, namely different plating membrane modules 100 Magnetic force generating elements 103 opposite polarity, a pair plate membrane modules 100 in, the magnetic force generating elements in a plated film group 100 can be made 103 magnetic lines of force 1034 produced are crossed out of this plating membrane module 100 in another plating membrane module 100.Wherein, in coating process, Plating membrane module 100 can be around its center axis rotation, and the position of magnetic force generating elements 103 keeps constant.Specifically, sputtering target stand 101 Around the plating central axis rotation of membrane module 100, and the position of magnetic force generating elements 103 keeps constant.

Also referring to Fig. 2 and Fig. 3, the pair of plating membrane module 100 includes the column the first filming component that flat shape is set The 100a and plating membrane module of column second 100b.The plating membrane modules of the first filming component 100a and second 100b surface spacing is 20- 500mm, preferably 20-300mm, it is further preferred that between the two away from for 200mm, to ensure in the first filming component 100a The magnetic line of force 1034 that magnetic force generating elements 103 is produced is crossed out of the plating membrane module 100a is oppositely arranged the second plating membrane module 100b.The plating membrane modules of the first filming component 100a and second 100b is located at the homonymy of workpiece 200.The first filming component 100a defines central axis O1O2, the second plating membrane module 100b define central axis O3O4, the first filming component 100a with Second plating membrane module 100b parallel fingers are exactly that the first filming component 100a central axis O1O2 and second plates membrane module 100b Central axis O3O4 it is parallel and contour relative to workpiece 200.Central axis O1O2 and O3O4 can it is parallel relative to workpiece 200 or Tilt.As plane A where Fig. 3 a, 3b and 3c central axis O1O2 and O3O4 is parallel with workpiece 200 or inclines to for workpiece 200 Tiltedly.The first filming component 100a is oppositely arranged with the second plating membrane module 100b.Relative to wherein in the first filming component 100a Produced in the plating membrane modules of heart axes O 1O2 and second 100b in the magnetic force set relative to its center axis O3O4 corresponding positions The opposite polarity of part 103, namely the first filming component 100a and the second plating membrane module 100b are interior towards its corresponding central axis The opposite polarity of magnetic force generating elements.Specifically it see in Fig. 2, the first filming component 100a, magnetic force generating elements 103 is towards its center Axes O 1O2 polarity is all S, and in the second plating membrane module 100b, and magnetic force generating elements 103 is towards its center axis O3O4 pole Property be all N, thus, the magnetic force generating elements 103 of the relative orientation in the platings of the first filming component 100a and second membrane module 100b Polarity is respectively then N and S, opposite polarity.

Preferably, plating membrane module 100 radial cross-section is rule or irregularly closes linear etc..Further, it is described It is ellipse or polygon to plate the radial cross-sectional shape of membrane module 100, it will be understood that circle is special one kind ellipse, three Angular is polygonal one kind.Preferably described plating membrane module 100 radial cross-sectional shape is circle, i.e., described plating in the present embodiment Membrane module 100 is cylinder.

The sputtering target stand 101 includes inwall 1013 and outer wall 1011, and the magnetic force generating elements 103 is fixed and is placed in sputtering In target stand 101, and it is radially arranged, but is not contacted with inwall 1013 along inwall 1013.For example, can be in the plating membrane module 100 Fixture is set to be used to fix magnetic force generating elements 103 along central axis.The central axis namely sputtering target of the plating membrane module 100 The central axis of seat 101 and inwall 1013.In coating process, the magnetic force generating elements 103 is fixed, and the sputtering Central axis rotation of the target stand 101 around the plating membrane module 100.The surface of outer wall 1011 is used to set sputtering target material 107, institute State the outer wall 1011 of the size of the sputtering target material 107 matching sputtering target stand 101, namely laminating outer wall 1011 completely.Wherein, it is described The distance of sputtering target material 107 to workpiece 200 is 20-80mm, it is preferable that distance is 40-50mm.In coating process, the sputtering Central axis of the target 107 around the plating membrane module 100 together with sputtering target stand 101 rotates.

Preferably, the plating membrane module 100 also includes cooling bath 105.The cooling bath 105 is inside sputtering target stand 101 Cavity, for being passed through coolant, such as water, to be controlled to the technological temperature in coating process.Continue into cooling bath 105 Coolant is passed through, and keeps coolant to be full of whole cooling bath 105, so as to being preferably the sputtering of rotation in coating process Target 107 cools.Preferably, the plating membrane module 100 sets the water pipe of both ends open along central axis, and one end is in plating membrane module 100 is outer for being passed through coolant, and one end is located inside plating membrane module 100, the coolant being passed through directly is flowed from water pipe Into whole cooling bath 105.Preferably, the magnetic force generating elements 103 and the coating of the surface of drive component 106 anti-corrosion or isolation etc. Coating, to completely cut off coolant, the extension plating service life of membrane module 100.

Preferably, further referring to Fig. 1, auxiliary electrode 800, i.e. magnetron sputtering are set in the outside of plating membrane module 100 The outside of film source 10 sets auxiliary electrode 800.In coating process, what it is due to the plating implementation of membrane module 100 is back bias voltage, passes through auxiliary Electrode 800 implements positive bias, and voltage difference is 5-100V between auxiliary electrode 800 and plating membrane module 100 as described, utilizes different in nature phase The principle of suction, is adsorbed onto the surface of auxiliary electrode 800 by the hot electron produced in sputter procedure or other anion electronics, subtracts The few bombardment of hot electron or other anions to the surface of workpiece 200, so that the temperature rise of workpiece 200 is further reduced, so that real Existing long-time low temperature plated film.Preferably, the voltage difference is 10-99V, 20-90V, 30-80V, 30-60V, 40-90V, 40- 50V, 45-60V, 40-80V or 50-90V.

Magnetic force generating elements 103 in each plating membrane module 100 is identical towards the polarity of the central axis of inwall 1013, no With magnetic force generating elements 103 in plating membrane module 100 towards the opposite polarity of its correspondence central axis, namely different plating membrane module 100 The opposite polarity of the magnetic force generating elements 103 of interior relative orientation.

The workpiece 200 is that glass substrate, ceramic substrate, silicon chip, sheet metal, titanium deoxid film or heatproof are relatively low Macromolecule substrate etc. it is therein any one.

Referring again to Fig. 1, described prepare also sets up supporting mechanism 301 and loading mechanism 303 in chamber 300.Magnetron sputtering Film source 10 is fixed on supporting mechanism 301.The supporting mechanism 301 includes the internal electric field organization of supply 3011 set, described Electric field organization of supply 3011 connects sputtering target material 107, to coordinate with magnetic force generating elements 103, so as to be sputtering in coating process Target 107 provides electromagnetic field.The loading mechanism 303 includes drive mechanism 3031, for supporting and driving workpiece 200 to move. In the utility model some embodiments, the loading mechanism 303 also includes objective table 3033, the objective table 3033 and plating Membrane module 100 is separated by a distance.Objective table 3033 is used to carry workpiece 200.Preferably, the objective table 3033 is transmission Band, mobile dish, movable plate or round roller etc..Drive mechanism 3031 connects objective table 3033, with driving objective table 3033 with respect to plated film Component 100 is moved, and the direction of motion of the objective table is perpendicular to multiple central axis for plating membrane modules 100.In different plated film groups In part 100, relative to the height identical position of objective table 3033, the opposite polarity of relative orientation is each symmetrically arranged with Magnetic force generating elements 103.

Provided with biography piece component 401 in the adapter cavity 400.The biography piece component 401 includes manipulator, driving wheel or hand Casing etc., is prepared in chamber 300 for workpiece 200 to be sent to.

The valve 600, which is arranged at, to be prepared between chamber 300 and adapter cavity 400, for facilitating conveying work pieces 200, and every From chamber 300 is prepared, prevent destruction during conveying work pieces 200 from preparing the reaction atmosphere in the coating process of chamber 300.

Please refer to Fig. 2, Fig. 3 and Fig. 3 d in the lump again, plating membrane module 100 can include multiple magnetic force generating elements 103.The magnetic The specific set location of force generating member 103 is：Magnetic force generating elements 103 in the first filming component 100a is disposed in proximity to the second plated film Magnetic force generating elements 103 in the side regions of component 100b mono-, the second plating membrane module 100b is disposed in proximity to the first filming component 100a One side region, and it is close to the setting of the side region of objective table 3,033 1.

Magnetic force generating elements 103 can select the magnets such as magnet steel, soft magnetic bodies.Set one or more in each sputtering target stand 101 Magnetic force generating elements 103, and the quantity of magnetic force generating elements 103 set is identical.Preferably, set in each sputtering target stand 101 Multiple magnetic force generating elements 103.Wherein, in each plating membrane module 100, multiple magnetic force generating elements 103 are arranged to and inwall 1013 Two rows of centerline axis parallel, more preferably, multiple magnetic force generating elements 103 form closed hoop body, tool along the inner side of inwall 1013 Body is as shown in Figure 3 d.Central axis upright of the central axis of each ring bodies with each plating membrane module 100.The magnetic force is produced Part 103 has the opposite polarity of the first magnetic pole 1031 and the second magnetic pole 1033, the first magnetic pole 1031 and the second magnetic pole 1033.Such as Shown in Fig. 3 d, in every plating membrane module 100, pole polarity phase of multiple magnetic force generating elements 103 towards the side of inwall 1013 is set Together, and two rows of the central axis of plating membrane module 100 are formed in parallel with, that is, set towards the production of central axis O1O2 (O3O4) magnetic force The pole polarity of raw part 103 is identical.Specifically：Magnetic force generating elements 103 is set in the first filming component 100a towards central shaft Line O1O2 sides are the first magnetic pole 1031, then set magnetic force generating elements 103 towards central shaft in the second plating membrane module 100b Line O3O4 sides are the second magnetic pole 1033.Magnetic force generating elements 103 is either set in the first filming component 100a in Heart axes O 1O2 sides are the second magnetic pole 1033, then set magnetic force generating elements 103 in the second plating membrane module 100b Heart axes O 3O4 sides are the first magnetic pole 1031.Magnetic force generating elements 103 i.e. in the first filming component 100a is towards wherein Heart axes O 1O2 polarity is identical, and the magnetic force generating elements 103 in the second plating membrane module 100b is towards its center axis O3O4's Polarity is identical.Namely the magnetic force generating elements 103 in the first filming component 100a, the second plating membrane module 100b is towards respective central shaft The opposite polarity of the magnetic force generating elements 103 of relative orientation in the opposite polarity of line, namely different plating membrane modules 100.Described first Plate the interior height identical places to objective table 3033 of the plating membrane modules of membrane module 100a and second 100b and respectively symmetrically set relative The opposite polarity magnetic force generating elements 103 of direction.It can also be expected that the magnetic force generating elements 103 in described two plating membrane modules 100 It is specular in set location, but opposite polarity.

By being arranged on polarity phase of the magnetic force generating elements 103 in the first filming component 100a towards its center axis O1O2 Together, the magnetic force generating elements 103 in the second plating membrane module 100b is identical towards its center axis O3O4 polarity, and the first filming The opposite polarity of the magnetic force generating elements 103 of relative orientation in component 100a, the second plating membrane module 100b, so that the first filming component The magnetic line of force 1034 that magnetic force generating elements 103 is produced in 100a crosses the second plated film being oppositely arranged from the first filming component 100a Component 100b.

Preferably, soft magnetic bodies or other magnetic line of force closed components, the soft magnetism are set in each plating membrane module 100 Body or other magnetic line of force closed components matching magnetic force generating elements 103 are set, so that magnetic force generating elements in single plating membrane module 100 103 magnetic lines of force 1034 produced only cross another plating membrane module 100 being oppositely arranged from the plating membrane module 100, so that more preferably Constraint coating process in hot electron or other anions distribution.

Magnetic force generating elements 103 is so set so that the magnetic line of force that magnetic force generating elements 103 is produced in a plating membrane module 100 1034 only cross another plating membrane module 100 being oppositely arranged from the plating membrane module 100 so that overheat electronics or other take Anion with energy is strapped between two plating membrane modules 100 by magnetic field, and is distributed in limited area 700, greatly reduces bombardment The chance on the surface of workpiece 200, so that it is too high effectively to suppress technological temperature.Therefore in coating process, workpiece can be efficiently controlled 200 and technological temperature be less than or equal to 100 DEG C.Preferably, in coating process, workpiece 200 and technique can also be efficiently controlled Temperature is less than or equal to 70 DEG C.

The utility model some preferably in embodiment, sputtered at one in target stand 101, a magnetic force generating elements be set 103, the magnetic force generating elements 103 is closed hoop body, and its two surface radially is main surface, two main surface institutes Band opposite polarity.

In coating process, sputtering target stand 101 is set to rotate, to improve the uniformity coefficient of the etching of sputtering target material 107, so that The utilization rate of sputtering target material 107 is improved, and the chance of the particulates such as film pin hole generation is greatly decreased.Wherein, multiple plating membrane modules 100 sputtering target stand 101 can individually drive rotation by multiple drive components 106, can also be by a driving group The driving simultaneous rotation of part 106.

As the first deformation, the utility model some preferably in embodiment, the magnetic control sputtering film plating device 1 includes Multipair plating membrane module 100.Referring to Fig. 4, the magnetic control sputtering film plating device 1 includes four pairs of plating membrane modules 100.

Preferably, multipair plating membrane module 100 is linearly arranged, and is arranged at the same side of objective table 3033, in multipair plating In membrane module 100, the central axis of each plating membrane module 100 is each parallel to objective table 3033.In coating process, the objective table 3033 relative plating membrane modules 100 are moved, and the direction of motion of objective table 3033 is perpendicular to the central axis of multiple plating membrane modules 100.

Fig. 5 a are referred to, as the second deformation, the magnetic control sputtering film plating device 1 can be straight tunnel formula framework.I.e. The magnetic control sputtering film plating device 1 at least two adapter cavities 400, prepare chamber 300 and are disposed therein between two adapter cavities 400.Prepare Chamber 300 sets at least magnetron sputtering coating source 10.Preferably, two adapter cavities 400 are set.The both sides of adapter cavity 400 are all provided with Valve 600 is put, specifically, chamber 300 and adapter cavity 400 are prepared for isolation close to the side valve 600 of chamber 300 is prepared, with convenient Conveying work pieces 200；It is used as atmospheric vacuum away from the valve 600 for preparing the side of chamber 300 and exchanges valve, with isolated vacuum environment and greatly Compression ring border, it is to avoid the reaction atmosphere destroyed during conveying work pieces 200 during magnetron sputtering plating.During magnetron sputtering plating, First enter piece, that is, open the adapter cavity 400 being sequentially arranged and prepare the valve 600 between chamber 300, pass piece component 401 by workpiece 200 are sent to and prepare chamber 300；Drive mechanism 3031 continues to transmit；Slice again, that is, open be sequentially arranged prepare chamber 300 with Valve 600 between adapter cavity 400, the workpiece 200 after the completion of thin-film-coating is sent out and prepares chamber 300.By setting magnetic Control Sputting film-plating apparatus 1 to be straight tunnel formula framework so that multigroup different materials can be coated with, and the controllable film layer that obtains is folded Structure, component and thickness etc., are carried out in order while entering piece with slice, and simple to operate, easily realize production line operation.

Fig. 5 b are referred to, as the 3rd deformation, the magnetic control sputtering film plating device 1 can also be cluster type framework, and it is wrapped Include a center and pass piece vacuum chamber 40, the center, which passes piece vacuum chamber 40 and can correspond at least two and prepare chamber 300, to be set.The center is true Empty pass sheet chamber 40 includes passing piece component 401.The biography piece component 401 includes manipulator, driving wheel or glove box etc., for inciting somebody to action Workpiece 200, which is sent to, prepares chamber 300, and the workpiece 200 that plated film is completed is carried back into Central Vacuum pass sheet chamber 40.In coating process In, first enter piece, that is, open Central Vacuum pass sheet chamber 40 and prepare the valve 600 between chamber 300, pass piece component 401 by workpiece 200 are sent to and prepare chamber 300；The driving objective table 3033 of drive mechanism 3031 comes and goes fortune back and forth to drive in the small distance of workpiece 200 It is dynamic；After slice, i.e. plated film are complete again, opening prepares the valve 600 between chamber 300 and Central Vacuum pass sheet chamber 40, will be coated with Workpiece 200 after, which is carried out, prepares chamber 300.By setting magnetic control sputtering film plating device 1 to be cluster type framework, it can save Device space-consuming.By controlling the back and forth movement back and forth in 5mm-200mm small distances of workpiece 200, production efficiency can be improved. Setting a center to pass piece vacuum chamber 40 simultaneously correspondingly at least two can prepare chamber 300, be greatly improved production capacity.

The utility model second embodiment provides the magnetron sputtering coating method using above-mentioned magnetic control sputtering film plating device 1, It comprises the following steps：Step S1：Sputtering target material 107 is respectively arranged on a pair of plating membrane modules 100, step S2：By workpiece 200 are placed on objective table 3033, rotate a pair of plating membrane modules 100 so that sputtering target material 107 is deposited on workpiece 200, Concrete technology flow process is as follows：

Step S1 is specially：Above-mentioned magnetic control sputtering film plating device 1 is provided, at least one pair of plating membrane module 100 is installed (100a, 100b) is on supporting mechanism 301.The arrangement position of magnetic force generating elements 103 in regulation plating membrane module 100, so that first The magnetic line of force 1034 that magnetic force generating elements 103 in plating membrane module 100a is produced crosses relative set from the first filming component 100a Put the second plating membrane module 100b magnetic force generating elements 103.The power of electric field organization of supply 3011 is set, valve 600 is closed and right Prepare chamber 300 and adapter cavity 400 (or Central Vacuum pass sheet chamber 40) is vacuumized, be evacuated to 10^-5Pa-10Pa, is then continuing Inert gas is passed through while vacuumizing, the present embodiment is preferably argon gas so that air pressure inside is maintained in the range of 0.1-10Pa. Electric field organization of supply 3011 is adjusted to required power, the rotating speed for setting plating membrane module 100 is 0.1-1200r/min, and this practicality is new Type embodiment is preferably 10-50r/min.It is continually fed into flowing cooling water.The shifting of the drive workpiece 200 of drive mechanism 3031 is set Dynamic speed is 5mm/s-200mm/s.

The second plating membrane module 100b is oppositely arranged because the first filming component 100a of the magnetic line of force 1034 is crossed, can be controlled The electronics of overheat or other anions for carrying energy are strapped between two cylindricality magnetic control sputtering film coating sources 10 by magnetic field, so that Greatly reduce the chance of bombardment workpiece, so that control prepares the reaction temperature of chamber 300 less than or equal to 100 DEG C.Preferably, it can control Reaction temperature is less than or equal to 70 DEG C

Sputtering target material 107 to be sputtered is separately mounted on the outer wall 1011 of a pair of sputter coating components, and opens electricity Field organization of supply 3011.Workpiece 200 is carried out by plasma pretreatment using plasma washing equipment, biography is transferred to after drying On the correct position of piece component 401.The workpiece 200 used of the utility model embodiment magnetic control sputtering device 1 can be big chi Small rigid workpiece on very little workpiece, coiled strip workpiece or coiled strip carrier.For large-size workpiece, coiled strip workpiece or coiled strip carrier its Length is unrestricted, and width can be 200mm-2000mm, and thickness is 0.1mm-10mm.The sputtering target material 107 can be selected Multiple small workpieces are stitched together to form tubular or single cylindrical work pieces, and the size matching sputtering outer wall 1011 of target stand 101.Selection Large-size workpiece, coiled strip workpiece or coiled strip carrier, can quickly and consistently produce the film of large scale or large area, shorten production Time, be conducive to efficiently batch production.

Step S2 is specially：Startup program, passes piece component 401 and workpiece 200 is placed on objective table 3033, open electricity Field organization of supply 3011 and drive mechanism 3031, rotatable sputtering target 107 start plated film.Wherein regulation plating membrane module 100 revolves Turn, control workpiece 200 in one direction or make back and forth movement back and forth.Needed in coating process by controlling plating membrane module 100 Rotary speed and the rate travel of workpiece 200 adjust deposit thickness.The speed of rotation is slower, and workpiece 200 moves slower, sinks Product thickness is thicker.

The magnetron sputtering coating method uses above-mentioned magnetic control sputtering film plating device 1, by setting at least magnetron sputtering Coating source 10, and the arrangement position of regulation magnetic force generating elements 103, so that the magnetic force generating elements in the first filming component 100a 103 magnetic lines of force 1034 produced are crossed from the first filming component 100a is oppositely arranged the second plating membrane module 100b, can be in plating In membrane process, the electronics or other anions for carrying energy of overheat is controlled to be strapped in two cylindricalitys by magnetic field and plate membrane module 100 Between, thus greatly reduce bombardment workpiece chance, and can effectively suppress technological temperature rising, and control less than or equal to 100℃.Control sputtering target material 107 to rotate simultaneously, the etching homogeneity of sputtering target material 107 can be improved, so as to improve sputtering target material 107 utilization rate.

Compared with prior art, the utility model magnetron sputtering plating source has advantages below：

The magnetic control sputtering film plating device uses above-mentioned magnetron sputtering plating source, can produce the magnetic force in the first filming component The magnetic line of force that raw part is produced crosses the second plating membrane module, in coating process, can control electronics or other carryings of overheat The anion of energy is strapped between two plating membrane modules by magnetic field, so as to greatly reduce the chance of bombardment workpiece, so as to have Effect ground suppresses technological temperature and risen, and is less than or equal to 100 DEG C with controlling reaction temperature.

The utility model preferred embodiment is the foregoing is only, it is all in this reality not to limit the utility model With any modification made within new principle, equivalent substitution and improve etc. all should comprising protection domain of the present utility model it It is interior.

Claims (10)

1. a kind of magnetron sputtering plating source, for for workpiece plated film, it is characterised in that：It is same that what it included being oppositely arranged is located at workpiece The cylindricality the first filming component of side, the second plating membrane module and the magnetic force generating elements for being respectively arranged at its inside, the first filming Component central axis and the second plating membrane module centerline axis parallel and, magnetic force the first filming component in contour relative to workpiece Generating elements is the first magnetic pole towards its center axis, and the magnetic force generating elements in the second plating membrane module is towards its center axis For the second magnetic pole, first magnetic pole is opposite with the second magnetic pole.

2. magnetron sputtering plating source as described in claim 1, it is characterised in that：Each plating membrane module includes multiple magnetic Force generating member, the polarity of central axis of multiple magnetic force generating elements towards the plating membrane module is identical, and is formed in parallel with the plated film Two rows of component central axis.

3. magnetron sputtering plating source as described in claim 1, it is characterised in that：Each plating membrane module includes multiple magnetic Force generating member, the polarity of central axis of multiple magnetic force generating elements towards the plating membrane module is identical, and multiple magnetic force generating elements shapes It is a ring bodies magnetic force generating elements into the magnetic force generating elements in closed hoop body or each plating membrane module.

4. magnetron sputtering plating source as described in claim 3, it is characterised in that：Ring bodies in each plating membrane module Central axis with plating membrane module central axis upright.

5. magnetron sputtering plating source as described in claim 1, it is characterised in that：Magnetic force production in the first filming component The magnetic force generating elements that raw part is disposed in proximity in the second plating membrane module side region, the second plating membrane module is disposed in proximity to the first plating The side region of membrane module one.

6. the magnetron sputtering plating source as described in claim any one of 1-5, it is characterised in that：Each plating membrane module includes Target stand is sputtered, the magnetic force generating elements is arranged in sputtering target stand, and the magnetic force generating elements is not rotated, the sputtering target stand can be around Plate the central axis rotation of membrane module.

7. the magnetron sputtering plating source as described in claim any one of 1-5, it is characterised in that：Each plating membrane module is radially Shape of cross section is ellipse or polygon.

8. a kind of magnetic control sputtering film plating device, it is characterised in that：It includes the magnetron sputtering as described in claim any one of 1-5 Coating source.

9. magnetic control sputtering film plating device as described in claim 8, it is characterised in that：The magnetic control sputtering film plating device includes Multiple magnetron sputtering plating sources and objective table, the multiple magnetron sputtering plating source are arranged at the same side of objective table, the load Thing platform can be with respect to plated film component movement, and the direction of motion is perpendicular to the central axis of multiple plating membrane modules.

10. magnetic control sputtering film plating device as described in claim 9, it is characterised in that：The magnetic control sputtering film plating device is also Including auxiliary electrode, the auxiliary electrode is arranged on the outside of magnetron sputtering plating source.