JPS63266090A - Equipment for electroplating strip - Google Patents
Equipment for electroplating stripInfo
- Publication number
- JPS63266090A JPS63266090A JP9850087A JP9850087A JPS63266090A JP S63266090 A JPS63266090 A JP S63266090A JP 9850087 A JP9850087 A JP 9850087A JP 9850087 A JP9850087 A JP 9850087A JP S63266090 A JPS63266090 A JP S63266090A
- Authority
- JP
- Japan
- Prior art keywords
- strip
- plating
- traveling direction
- electrode
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims description 8
- 238000007747 plating Methods 0.000 claims abstract description 72
- 239000007788 liquid Substances 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 6
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000014347 soups Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は、ストリップの電気めっき設備に関し、とく
に高速かつ高電流密度でのめっき処理を有利に実現しよ
うとするものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to strip electroplating equipment, and particularly aims to advantageously realize plating processing at high speed and high current density.
(従来の技術)
ストリップとくに鋼帯に対する電気めっきとしては、缶
用鋼板に対するSnめっきおよびCrめっき、自動車や
家電製品用鋼板に対するZnめっきおよびZn系合金め
っきなどが従来から広く利用されている。かかるめっき
処理において、設備をコンパクト化するためには、高電
流密度での操業が不可欠であり、そのため従来から種々
の工夫が施されている。(Prior Art) As electroplating for strips, particularly steel strips, Sn plating and Cr plating for steel sheets for cans, Zn plating and Zn-based alloy plating for steel sheets for automobiles and home appliances, etc. have been widely used. In such plating processing, operation at high current density is essential in order to make the equipment more compact, and for this reason various efforts have been made to date.
高電流密度操業を行う場合、電極とストリップとの間の
距離が大きいとめっき電圧が高くなり電力使用量が増大
するため、電極−ストリップ間距離をいかに小さくする
かが大きなポイントとなる。When performing high current density operation, a large distance between the electrode and the strip increases the plating voltage and increases the amount of power used, so how to reduce the distance between the electrode and the strip is an important point.
高電流密度を達成するためのもう一つの重要なポイント
は、ストリップ表面へのめっき金属イオンの供給すなわ
ちめっき液の供給を促進して限界電流密度を高めること
である。Another important point in achieving a high current density is to increase the limiting current density by promoting the supply of plating metal ions, ie, the plating solution, to the strip surface.
上記のような要請を満足するものとして、第3図に示す
ように、ストリップlをめっき浴2中に浸漬させた通板
用回転ドラム3の外周に巻き付け、該ドラム3の回転と
同期して温浸通板させるものとし、この巻き付けられた
ストリップlに対し一定のギャップを隔てる姿勢にて円
弧状電極4を設置し、かつ該ギャップにストリップ1の
進行方向とは逆向きにめっき液噴流ノズル5からめっき
流を噴射しつつめっき処理を施す方法(特開昭56−1
42893号公報参照)が提案されている。なお図中6
はコンダクタ−ロール、7は押えロールである。In order to satisfy the above-mentioned requirements, as shown in FIG. An arcuate electrode 4 is installed in a position that separates a certain gap from the wound strip l, and a plating solution jet nozzle is installed in the gap in the opposite direction to the traveling direction of the strip 1. A method of performing plating treatment while spraying a plating flow from 5 (Japanese Patent Application Laid-Open No. 56-1
42893) has been proposed. Note that 6 in the figure
7 is a conductor roll, and 7 is a presser roll.
(発明が解決しようとする問題点)
しかしながら上記の方法には、以下に述べるような問題
があった。(Problems to be Solved by the Invention) However, the above method has the following problems.
まず第1に、電極を円弧状に精度良く加工することは極
めて難しく、また電極を設置するに当っても極間距離の
調節が難しいことから、ストリップの幅方向におけるめ
っき付着量分布に偏差が生じ易い点が挙げられる。First of all, it is extremely difficult to precisely process the electrodes into an arc shape, and it is also difficult to adjust the distance between the electrodes when installing them, so there is a deviation in the plating weight distribution in the width direction of the strip. Here are some points that are likely to occur.
第2は、とくに高ラインスピード操業時に顕著な現象で
あるが、めっき液噴流ノズルからの液の流れが、ストリ
ップの移動と液の粘性とによって生じる液流に妨げられ
て円弧状電極片間のすき間から逃げてしまう結果、電極
のストリップ入側の方まで噴流効果が及びにくいという
点である。The second phenomenon, which is particularly noticeable during high line speed operation, is that the flow of liquid from the plating liquid jet nozzle is blocked by the liquid flow caused by the movement of the strip and the viscosity of the liquid. As a result of escaping through the gap, it is difficult for the jet effect to reach the strip entry side of the electrode.
すなわち限界電流密度は、めっき流の相対流速が最も遅
い領域に支配されるため、上記したように噴流効果が電
極のストリップ入側まで及ばない場合には、噴流ノズル
による限界電極密度向上効果が十分には発揮されないこ
とになる。In other words, the critical current density is governed by the region where the relative flow velocity of the plating flow is the slowest, so if the jet effect does not extend to the strip entrance side of the electrode as described above, the critical electrode density improvement effect by the jet nozzle may not be sufficient. This means that it will not be fully demonstrated.
この発明は、上記の問題をを利に解決するもので、電極
の加工や設置が簡便で、しかも電極面全域にわたって効
果的な噴流効果が得られ、ひいては高速かつ高電流密度
でのめっき処理が可能なストリップの電気めっき設備を
提案することを目的とする。This invention advantageously solves the above-mentioned problems. It is easy to process and install the electrode, and an effective jet effect can be obtained over the entire electrode surface, making it possible to perform plating at high speed and high current density. The purpose is to propose a possible strip electroplating equipment.
(問題点を解決するための手段)
すなわちこの発明は、めっき浴中に浸漬させた通板用回
転ドラムの外周に接しその回転と同期して走行するスト
リップを、このストリップに対し半径方向のギャップを
隔てて配置した陽極との間で、該ギャップ内のめっき液
を介して通電してめっき処理を行うめっき設備において
、陽極として、ストリップの進行方向に対し4〜10個
に分割した不溶性の平板状電極を配置すると共に、分割
した平板状電極それぞれのストリップの進行方向出側に
、該ストリップの進行方向とは逆向きに開口するめっき
液噴流ノズルを配設し、ときにはさらに分割した平板状
電極それぞれのストリップ進行方向入側にめっき液吸引
ノズルを配設したことから成る、ストリップの電気めっ
き設備である。(Means for Solving the Problems) That is, the present invention provides a strip that is in contact with the outer periphery of a rotating drum for threading that is immersed in a plating bath and runs in synchronization with the rotation of the drum. In plating equipment that conducts plating by applying electricity through the plating solution in the gap between the anode and the anode arranged in the gap, an insoluble flat plate divided into 4 to 10 pieces in the direction of travel of the strip is used as the anode. At the same time, a plating solution jet nozzle that opens in the opposite direction to the traveling direction of the strip is arranged on the exit side of each divided flat electrode in the traveling direction of the strip. This strip electroplating equipment consists of a plating solution suction nozzle arranged on the inlet side of each strip in the direction of travel.
以下この発明を具体的に説明する。This invention will be specifically explained below.
第1図a、bにそれぞれ、この発明に従うめっき設備の
好適例を模式で示す。構成の骨子は第3図に示した従来
例と共通するので同一の番号を符して示し、図中番号8
が不溶性の平板状電極、9がめつき液吸引ノズルであり
、これらの例では電極を4つに分割した場合について示
しである。FIGS. 1a and 1b schematically show preferred examples of plating equipment according to the present invention. The gist of the configuration is the same as the conventional example shown in Figure 3, so the same numbers are used, and number 8 in the figure is used.
9 is an insoluble flat plate electrode, and 9 is a plating liquid suction nozzle. In these examples, the electrode is divided into four parts.
めっき浴中に浸漬される通板用回転ドラム3は、電極−
ストリップ間距離を小さくするのに不可欠な要件である
ストリップパスの安定化を効果的に達成するためのもの
である。この通板用回転ドラム3に対するストリップ1
の巻き付は角は、と引に規制されることはないが、90
°〜270°程度が好適である。The rotating drum 3 for passing the plate is immersed in the plating bath.
This is to effectively achieve strip path stabilization, which is an essential requirement for reducing the distance between strips. Strip 1 for this rotating drum 3 for threading
Although there is no restriction on the wrapping of corners,
A range of about 270° is suitable.
ストリップ1へ給電するに当っては、第1図に示したよ
うに回転ドラム3は非通電性とし、めっき浴外にコンダ
クタ−ロール6を設置しても良いし、また回転ドラム3
の中央部(ストリップによって被われる部分)に通電性
をもたせるようにしても良い。In order to supply power to the strip 1, the rotating drum 3 may be non-conducting as shown in FIG. 1, and a conductor roll 6 may be installed outside the plating bath.
The center portion (the portion covered by the strip) may be made conductive.
また回転ドラム3に巻付けられたストリップ1に対し半
径方向のギャップを隔てて配置される平板状電極8の個
数は、巻き付は角やめっき液の種類などに応じて適宜に
選択すればよいが、巻き付は角が小さい場合でも少なく
とも4つに分割しないと満足いく程の噴流効果が得難く
、有効電極長が十分にとれないので、分割数は4個を下
限とした。一方、通常用いることの多い180°程度以
上の巻き付は角の場合、電極の分割数を多くすればする
ほど噴流効果およびパルスめっき効果が大きくなるが、
あまりに数多く分割すると、噴流ノズルの占めるスペー
スが大きくなって有効電力長が短くなる不利が生じるほ
か、給電装置およびめっき液噴流供給系統が複雑になっ
て設備費が商く不利も加わるので、分割数の上限は10
個とした。Further, the number of flat electrodes 8 disposed with a gap in the radial direction from the strip 1 wound around the rotating drum 3 may be appropriately selected depending on the angle of the winding, the type of plating solution, etc. However, even when the corner is small, it is difficult to obtain a satisfactory jet effect unless the coil is divided into at least four parts, and a sufficient effective electrode length cannot be obtained, so the number of divisions is set to four as the lower limit. On the other hand, in the case of a corner winding of about 180° or more, which is often used, the jet effect and pulse plating effect become larger as the number of electrode divisions increases.
If the number of divisions is too large, the space occupied by the jet nozzle becomes large and the effective power length becomes short, which is a disadvantage.In addition, the power supply device and the plating solution jet supply system become complicated, which increases equipment costs. The upper limit is 10
It was made into pieces.
この発明では、陽極を4〜10個に分割したことの他、
電極片を平板状としたところに大きな特徴がある。とい
うのは平板状電極としたことによって、電極自体の精度
ならびに設置精度が高まるだけでなく、電流密度の脈流
効果によってめっき密着性の向上も図り得るからである
。In this invention, in addition to dividing the anode into 4 to 10 pieces,
A major feature is that the electrode piece is flat. This is because by using a flat electrode, not only the accuracy of the electrode itself and the installation accuracy can be improved, but also the plating adhesion can be improved due to the pulsating current density effect.
ここに電流密度の脈流効果とは、第2図に示したように
、平板状電極(イ)を用いた場合は、円弧状電極(ロ)
を用いた場合に比べて、ストリップの電流密度が大きく
脈動する現象のことを意味し、かような脈流効果によっ
て電着結晶の緻密化がもたらされるのである。Here, the ripple effect of current density means that, as shown in Figure 2, when a flat electrode (a) is used, an arcuate electrode (b) is used.
This refers to a phenomenon in which the current density in the strip pulsates more greatly than in the case where the electrodeposited crystal is densified by such a pulsating current effect.
平板状電極の材質は特に規制されることはないが、Pb
−Sn合金、過酸他船および酸化イリジウムなどが好適
である。The material of the flat electrode is not particularly regulated, but Pb
-Sn alloys, peroxides, iridium oxide, and the like are preferred.
また各平板状電極のストリップ出側に設置されるめっき
液噴流ノズルとしては、ストリップの幅方向にほぼ均一
な液流速を与え得る構造とすることが好ましい。Furthermore, the plating solution jet nozzle installed on the strip exit side of each flat electrode preferably has a structure that can provide a substantially uniform solution flow rate in the width direction of the strip.
この発明では、電極がストリップの長手方向に比較的短
いサイズに分割されているので、電極のストリップ出側
に噴流供給用ノズルを設置するだけで大きな噴流効果が
得られるが、この効果をさらに大きくするためには各電
極のストリップ入側にめっき液吸引用のノズルを設置す
ることは有利である。In this invention, since the electrode is divided into relatively short sizes in the longitudinal direction of the strip, a large jet effect can be obtained simply by installing a jet flow supply nozzle on the strip exit side of the electrode. In order to do this, it is advantageous to install a plating solution suction nozzle on the strip entry side of each electrode.
(作 用)
この発明に従い、不溶性陽極をストリップの進行方向に
多数に分割すると共に、分割された電極のストリップ進
行方向出側それぞれにストリップの進行方向とは逆向き
にめっき液を噴流させるノズルさらにはストリップの進
行方向入側それぞれにめっき液の吸引用ノズルを配設し
たことによって、噴流効果が高まるだけでなくパルスめ
っき効果も加わり、ひいては限界電流密度の向上を図り
得る。(Function) According to the present invention, an insoluble anode is divided into a large number of parts in the direction in which the strip travels, and a nozzle is provided which jets a plating solution in the direction opposite to the direction in which the strip travels on each of the exit sides of the divided electrodes in the direction in which the strip travels. By arranging a plating solution suction nozzle on each inlet side of the strip in the advancing direction, not only the jet effect is enhanced but also the pulse plating effect is added, thereby improving the critical current density.
また電極を平板状としたことにより、電極自体の精度お
よび設置精度が高まるので、ストリップ幅方向にわたる
めっき付着量も均一となる。Further, by forming the electrode into a flat plate, the precision and installation precision of the electrode itself are improved, so that the amount of plating deposited across the width of the strip becomes uniform.
さらに、パルスめっき効果および平板状電極を用いたこ
とによる電流密度の脈流効果によって、電着結晶の緻密
化も併せて達成でき、ひいては耐食性の向上も図り得る
。Furthermore, due to the pulse plating effect and the pulsating current density effect due to the use of the flat plate electrode, it is possible to achieve densification of the electrodeposited crystals, and as a result, it is possible to improve the corrosion resistance.
(実施例)
裏施開土
第1図aに示しためっき設備、さらには電極の分割数を
6および8に変更しためっき設備を用いて、下記の条件
・めっき浴組成 :無水クロム酸140g/ 1 、硫
酸0.5g/ 41! 、けいふっ化ナトリウム5g/
2、
・浴 温 :40℃、
・ラインスピード7300mpm、
の下でクロムめっきを行った。(Example) Using the plating equipment shown in Fig. 1a, and further using plating equipment in which the number of electrode divisions was changed to 6 and 8, the following conditions and plating bath composition: 140 g of chromic anhydride/ 1. Sulfuric acid 0.5g/41! , Sodium fluoride 5g/
2. Chrome plating was performed under the following conditions: - Bath temperature: 40°C, - Line speed of 7300 mpm.
かようなめっき処理における、ストリップの幅方向にわ
たるめっき付着量の均一性、■セル当りの投入可能電流
およびめっき板の耐さび性について調べた結果を表1に
示す。Table 1 shows the results of an investigation into the uniformity of the amount of plating deposited across the width of the strip, (1) the current that can be applied per cell, and the rust resistance of the plated plate in such a plating process.
なお表1には、比較のため、第3図に示した従来設備お
よび第4図に示したような同じ4分割とはいえ円弧状電
極を4分割しためっき設備を用いて、同様なりロムめっ
き処理を施した場合における調査結果も併せて示す。For comparison, Table 1 shows similar ROM plating using the conventional equipment shown in Fig. 3 and the plating equipment in which the arc-shaped electrode is divided into four parts as shown in Fig. 4. The results of the investigation when the treatment was applied are also shown.
傘1 付着量均一性:目標付着量7軸gets”とした
サンプルについて、板幅方向10〇−間隔の付着量分布
測定における最大値と最小値の差。Umbrella 1 Coating amount uniformity: Difference between the maximum value and the minimum value in the coating amount distribution measurement at 100-intervals in the board width direction for a sample with a target coating amount of 7 axes.
本2 vaax 電流 :めっき効率の低下、外観
の劣化の発生しない、1セル当りの最大電流値。Book 2 VAAX current: Maximum current value per cell that does not cause a decrease in plating efficiency or deterioration of appearance.
傘3 耐さび性 f金属クロム?On+g/*”目標、
酸化クロム量10mg/a+”目標で作成したサンプル
について、湿潤試験(50℃、95χR11)で の赤
さび発生時間。Umbrella 3 Rust resistance f metal chrome? On+g/*”goal,
Red rust generation time in a wet test (50℃, 95χR11) for a sample prepared with a target of 10mg/a+'' of chromium oxide.
実画I汁λ
第1図aに示しためっき設備において、各平板状電極の
ストリップ入側にめっき液吸引ノズルを配置した設備、
すなわち第1図すに示しためつき設備を用いて、実施例
1と同様の条件でクロムめっきを行った。Actual image I soup λ In the plating equipment shown in Figure 1a, equipment in which a plating solution suction nozzle is arranged on the strip entry side of each flat electrode,
That is, chromium plating was carried out under the same conditions as in Example 1 using the plating equipment shown in FIG.
その結果、付着量均一性および耐さび性については実施
例1の適合例1と変わらなかったけれども、1セル当り
の投入可能電流(ffIax電流)は20.000Aま
で向上した。As a result, although the coating amount uniformity and rust resistance were not different from Compatible Example 1 of Example 1, the current that could be applied per cell (ffIax current) was improved to 20.000 A.
(発明の効果)
かくしてこの発明によれば、電気めっきを高速かつ高電
流密度の下で実施でき、しかも得られためっき層は付着
量均一性のみならず耐さび性にも優れている。(Effects of the Invention) Thus, according to the present invention, electroplating can be performed at high speed and under high current density, and the resulting plating layer has excellent not only uniformity of coating amount but also rust resistance.
第1図a、bはそれぞれ、この発明の好適例を示す模式
図、
第2図aは、平板状電極および円弧状電極の通板用回転
ドラムに対する設置姿勢を示した図、同図すは、通電部
位と電流密度との関係を示したグラフ、
第3図は、従来のめっき設備の模式図、第4図は、円弧
状電極を4分割しためっき設備の模式図である。
l・・・ストリップ 2・・・めっき浴3・・・
通板用回転ドラム 4・・・円弧状電極5・・・めっき
液噴流ノズル
6・・・コンダクタ−ロール
7・・・押えロール 8・・・平板状電極9・・
・めっき液吸引ノズル
特許出願人 川崎製鉄株式会社
代理人弁理士 杉 村 暁 秀同 弁理
士 杉 村 興 作第2図
<a) (b)
第3図
4・−日張杖1ノ
!;:I
−N (Y)噴1a and 1b are schematic diagrams showing preferred examples of the present invention, and FIG. FIG. 3 is a schematic diagram of a conventional plating equipment, and FIG. 4 is a schematic diagram of a plating equipment in which an arcuate electrode is divided into four parts. l...Strip 2...Plating bath 3...
Rotating drum for threading 4... Arc-shaped electrode 5... Plating liquid jet nozzle 6... Conductor roll 7... Presser roll 8... Flat electrode 9...
・Plating solution suction nozzle patent applicant Kawasaki Steel Co., Ltd. Representative Patent Attorney Akatsuki Sugimura Hidetoshi Patent Attorney Oki Sugimura Figure 2<a) (b) Figure 3 4--Niphari Cane 1 No! ;:I -N (Y) injection
Claims (1)
接しその回転と同期して走行するストリップを、このス
トリップに対し半径方向のギャップを隔てて配置した陽
極との間で、該ギャップ内のめっき液を介して通電して
めっき処理を行うめっき設備において、 陽極として、ストリップの進行方向に対し 4〜10個に分割した不溶性の平板状電極を配置すると
共に、 分割した平板状電極それぞれのストリップ の進行方向出側に、該ストリップの進行方向とは逆向き
に開口するめっき液噴流ノズルを配設したことを特徴と
する、ストリップの電気めっき設備。 2、めっき浴中に浸漬させた通板用回転ドラムの外周に
接しその回転と同期して走行するストリップを、このス
トリップに対し半径方向のギャップを隔てて配置した陽
極との間で、該ギャップ内のめっき液を介して通電して
めっき処理を行うめっき設備において、 陽極として、ストリップの進行方向に対し 4〜10個に分割した不溶性の平板状電極を配置すると
共に、 分割した平板状電極それぞれのストリップ の進行方向出側に、該ストリップの進行方向とは逆向き
に開口するメッキ液噴流ノズル、ならびに同じく分割し
た平板状電極それぞれのストリップ進行方向入側にめっ
き液吸引ノズルを配設したことを特徴とする、ストリッ
プの電気めっき設備。[Claims] 1. A strip that is in contact with the outer periphery of a rotating drum for threading that is immersed in a plating bath and runs in synchronization with its rotation, and an anode and an anode that are arranged with a gap in the radial direction from the strip. In a plating equipment that conducts plating by applying electricity through the plating solution in the gap, an insoluble flat electrode divided into 4 to 10 pieces in the traveling direction of the strip is arranged as an anode, and 1. Strip electroplating equipment, characterized in that a plating solution jet nozzle that opens in the opposite direction to the traveling direction of the strip is disposed on the exit side of each divided flat electrode in the traveling direction of the strip. 2. A strip that is in contact with the outer periphery of the rotating drum for threading and runs in synchronization with the rotation of the rotating drum immersed in the plating bath is connected to an anode that is placed across a radial gap from the strip. In plating equipment that conducts plating by applying electricity through the plating solution inside, an insoluble flat electrode divided into 4 to 10 pieces is arranged in the direction of strip movement as an anode, and each divided flat electrode is A plating liquid jet nozzle that opens in the opposite direction to the traveling direction of the strip is provided on the exit side of the strip in the traveling direction of the strip, and a plating solution suction nozzle is provided on the inlet side of each of the divided flat electrodes in the strip traveling direction. Strip electroplating equipment featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9850087A JPS63266090A (en) | 1987-04-23 | 1987-04-23 | Equipment for electroplating strip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9850087A JPS63266090A (en) | 1987-04-23 | 1987-04-23 | Equipment for electroplating strip |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63266090A true JPS63266090A (en) | 1988-11-02 |
Family
ID=14221359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9850087A Pending JPS63266090A (en) | 1987-04-23 | 1987-04-23 | Equipment for electroplating strip |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63266090A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5094733A (en) * | 1989-03-14 | 1992-03-10 | Fuji Photo Co., Ltd. | Electrolytic treatment apparatus |
KR101630980B1 (en) * | 2014-12-12 | 2016-06-16 | 주식회사 포스코 | Apparatus for continuous electroforming |
JP2016125122A (en) * | 2015-01-08 | 2016-07-11 | Jfeスチール株式会社 | Electroplating device |
-
1987
- 1987-04-23 JP JP9850087A patent/JPS63266090A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5094733A (en) * | 1989-03-14 | 1992-03-10 | Fuji Photo Co., Ltd. | Electrolytic treatment apparatus |
KR101630980B1 (en) * | 2014-12-12 | 2016-06-16 | 주식회사 포스코 | Apparatus for continuous electroforming |
JP2016125122A (en) * | 2015-01-08 | 2016-07-11 | Jfeスチール株式会社 | Electroplating device |
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