JPS63265491A - Manufacture of breakable electrical metallic substrate material - Google Patents
Manufacture of breakable electrical metallic substrate materialInfo
- Publication number
- JPS63265491A JPS63265491A JP964587A JP964587A JPS63265491A JP S63265491 A JPS63265491 A JP S63265491A JP 964587 A JP964587 A JP 964587A JP 964587 A JP964587 A JP 964587A JP S63265491 A JPS63265491 A JP S63265491A
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- substrate material
- thickness
- electrical metal
- breaking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 81
- 239000000463 material Substances 0.000 title claims description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000002184 metal Substances 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000012212 insulator Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims description 15
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract description 4
- 239000011810 insulating material Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ハイブリッ）ＩＣ・金属基板ＩＣカード等の
製造に使用する折り割り可能な電気用金属基板材に関す
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a breakable electrical metal substrate material used for manufacturing hybrid IC/metal substrate IC cards and the like.
（従来の技術）
従来、ハイブリッ）ＩＣ等の製造に使用する素子基板と
してはセラミック板や琺瑯板が使用されていたが、近時
は、多量の素子基板を品質のばらつきを少なくして比較
的安定して供給でき、かつ製造コストの低い金属製の基
板材が使用されている。(Conventional technology) Conventionally, ceramic plates and enamel plates have been used as element substrates used in the manufacture of hybrid ICs, etc., but recently, large quantities of element substrates have been manufactured with relatively low quality variations. Metal substrate materials are used, which can be stably supplied and have low manufacturing costs.
ところで、従来、金属基板材を切断して複数の素子基板
を形成する、いわゆる多数取りを行う場合、回路を作成
するために金属基板材に絶縁物をコーテング加工した後
、プレス装置、高速カッター、レーザー切断器によって
各素子基板毎に切断するか、あるいは絶縁物をコーテン
グ加工する前に各素子基板を連結する機部を残して切断
スリットを形成し、絶縁物のコーテング加工後に該機部
を上記プレス装置などによって切断することが行われて
いた。By the way, conventionally, when cutting a metal substrate material to form a plurality of element substrates, so-called multi-cutting, after coating the metal substrate material with an insulator to create a circuit, a press machine, a high-speed cutter, Either each element substrate is cut with a laser cutter, or a cutting slit is formed by leaving a machine part that connects each element substrate before coating with an insulator, and after coating with an insulator, the machine part is cut as above. Cutting was performed using a press device or the like.
一方、従来、ＩＣカードはプラスチックカード本体に半
導体メモリーなどの集積回路を内臓して構成され、この
集積回路の内蔵ははめ込み型とラミネート型の２種類が
ある。On the other hand, conventionally, an IC card is constructed by having an integrated circuit such as a semiconductor memory built into a plastic card body, and there are two types of built-in integrated circuits: a built-in type and a laminated type.
（従来技術の問題点）
上述の絶縁物のコーテング加工後に金属基板材を切断す
る方法においては、コーテングされた絶縁物、特に絶縁
物の切断境界部の縁部が剥離する問題があった。また、
絶縁物をコーテング加工した金属基板材に大きな力の掛
かる切断加工をなすことは、傷等による素子基板の良品
率を低める原因となっていた。(Problems with the Prior Art) In the above-described method of cutting a metal substrate material after coating with an insulator, there is a problem that the coated insulator, especially the edge of the cutting boundary of the insulator, peels off. Also,
Cutting a metal substrate coated with an insulator that requires a large amount of force causes scratches and the like, which lowers the yield rate of element substrates.
また、上述の従来のＩＣカードにおいては、ＩＣカード
に内臓された集積回路が静電気に対して弱く、例えば化
学繊維の衣服を着用したＩＣカード利用者が金属片に触
れた時に放電が生じ、ＩＣカード内蔵の集積メモリーが
破壊されてしまうという問題がある。さらに、プラスチ
ックカード本体からなるＩＣカードは機械的強度が弱（
、熱に対しても弱い欠点があった。そして、これらの欠
点を除くためプラスチックカード本体の表面にカーボン
材料の層を設けたり、金属箔を貼付することが提案され
ているが、これはＩＣカードの構造を複雑にし、製造コ
ストを高める問題がある。In addition, in the conventional IC cards mentioned above, the integrated circuit built into the IC card is susceptible to static electricity, and when an IC card user wearing chemical fiber clothing touches a metal piece, for example, an electric discharge occurs, causing the IC card to There is a problem in that the integrated memory built into the card is destroyed. Furthermore, IC cards made of plastic card bodies have low mechanical strength (
However, it also had the disadvantage of being weak against heat. In order to eliminate these drawbacks, it has been proposed to provide a layer of carbon material on the surface of the plastic card body or paste metal foil, but this has the problem of complicating the structure of the IC card and increasing manufacturing costs. There is.
本発明は、従来の金属基板材から素子基板を形成する方
法及びＩＣカードに関する上述の問題に鑑みなされたも
のであって、素子基板における絶縁物の剥離の恐れが少
なく、かつ実質上絶縁物コーテング加工後の素子基板の
機械加工がなく、良品率の高い素子基板を形成できる電
気用金属基板材の製造方法を提供することを目的とする
。The present invention has been made in view of the above-mentioned problems regarding the conventional method of forming an element substrate from a metal substrate material and an IC card. It is an object of the present invention to provide a method for manufacturing an electrical metal substrate material that does not require machining of the element substrate after processing and can form an element substrate with a high yield rate.
本発明は、また、絶縁物コーテング加”工後に折り割り
という簡易な作業により切断可能であって、かつ金属基
板材としての取り扱いに不便を来さない程度に形状維持
が可能な剛性を有する折り割り可能な電気用金属基板材
の製造方法を提供することを目的とする。The present invention also provides a foldable material that can be cut by a simple process of folding after being coated with an insulating material, and that has rigidity that allows it to maintain its shape to the extent that handling as a metal substrate material is not inconvenient. The object of the present invention is to provide a method for manufacturing a splittable electrical metal substrate material.
本発明によれば、さらに、素子基板における絶縁物の剥
離の恐れが少なく、集積回路を形成後に素子基板になす
機械加工がなく、良品率が高い金属基板材であって、カ
ーボン材料の層を設けたり、金属箔の貼付なしに十分な
耐静電性、機械的強度、そして耐熱性を有するＩＣカー
ドを簡易構造・低コストで製造可能な電気用金属基板材
を製造することができる利点を有する。According to the present invention, the metal substrate material is further characterized in that there is less risk of peeling of insulators on the element substrate, there is no machining of the element substrate after forming an integrated circuit, and the yield rate is high. The advantage of this technology is that it is possible to manufacture electrical metal substrate materials that have a simple structure and low cost and can produce IC cards with sufficient electrostatic resistance, mechanical strength, and heat resistance without the need for mounting or attaching metal foil. have
（発明の構成）
上述の目的を達成する本発明の構成上の特徴とするとこ
ろは、複数の素子基板を形成するための厚さが２ｆ１未
満、好ましくは１１ｍ未満の電気用金属基板材に、絶縁
物をコーテング加工する前に、所定位置に残留厚さが１
／２０ないし３ ／ ４ ＋＋ｎの折り割り溝を設ける
ことを特徴とする折り割り可能な電気用金属基板材の製
造方法である。ここで、折り割りとは、あるものの両端
を指で挟んで割ることをいうものとする。(Structure of the Invention) The structural feature of the present invention that achieves the above-mentioned object is that an electrical metal substrate material having a thickness of less than 2 f1, preferably less than 11 m, for forming a plurality of element substrates, Before coating the insulation, there should be a residual thickness of 1 mm in place.
This is a method for manufacturing a breakable electrical metal substrate material, characterized in that a break groove of /20 to 3/4 ++n is provided. Here, folding refers to breaking something by holding both ends of something between your fingers.
本発明の他の構成上の特徴とするところは、複数の素子
基板を形成するための厚さが０．４鰭以上２ｍｍ未満、
好ましくは１鰭以上の電気用金属基板材に、絶縁物をコ
ーテング加工する前に、素子基板間に切断スリットを設
け、１ないし１０ｍｍの連結機を形成し、さらに該連結
機に残留厚さが１／２０ないし３／４龍の折り割り溝を
設けることを特徴とする折り割り可能な電気用金属基板
材の製造方法である。Other structural features of the present invention include a thickness of 0.4 fins or more and less than 2 mm for forming a plurality of element substrates;
Preferably, before coating the electric metal substrate material of one or more fins with an insulating material, a cutting slit is provided between the element substrates to form a connector of 1 to 10 mm, and the connector has a residual thickness. This is a method for manufacturing a breakable electrical metal substrate material, which is characterized by providing a break groove of 1/20 to 3/4 length.
（発明の効果）
本発明よれば、上述したように金属基板材に絶縁物をコ
ーテング加工する前に最適の残留強度の折り割り溝を設
けてなるから、分離された素子基板における絶縁物の剥
離の恐れが少なく、かつ実質上絶縁物コーテング加工後
の素子基板の機械加工がなく素子基板の良品率を高く維
持することができる利点を有する。(Effects of the Invention) According to the present invention, as described above, since the crease grooves with the optimum residual strength are provided before coating the metal substrate material with the insulating material, the insulating material on the separated element substrates is not peeled off. This method has the advantage that there is little fear of this, and there is virtually no machining of the device substrate after the insulator coating process, and a high yield rate of device substrates can be maintained.
本発明によれば、また、金属基板材は絶縁物コーテング
加工後に折り割りという簡易な作業により切断分離可能
であって、かつ金属基板材としての取り扱いに不便を来
さない程度に形状維持可能な剛性を有するこ゛とができ
る利点を有する。According to the present invention, the metal substrate material can be cut and separated by a simple operation of folding after being coated with an insulator, and the shape can be maintained to the extent that handling as a metal substrate material is not inconvenient. It has the advantage of being rigid.
（実施例）
以下、本発明による折り割り可能な電気用金属基板材の
製造方法の実施例を図に基づいて説明する。第１実施例
は、第１図に示すように、例えば、厚さが０．６ ｍｍ
の金属基板材１に４枚の素子基板４を形成するための折
り割り溝２を設ける。折り割り溝２は、プレス加工ある
いはレーザー加工により両側壁が直角をなすように形成
される。折り割り溝２は、金属基板材１の片面に形成さ
れる場合、第２図に示され、その深さが０．２１０１１
１であり、また、金属基板材１０両面に形成される場合
、第３図に示され、その深さがそれぞれ０．１順である
。このように形成された金属基板材４には、絶縁物のコ
ーテング加工がなされ、後に折り割りがなされ各素子基
板４が形成される。(Example) Hereinafter, an example of the method for manufacturing a breakable electrical metal substrate material according to the present invention will be described based on the drawings. The first embodiment, as shown in FIG. 1, has a thickness of, for example, 0.6 mm.
Folding grooves 2 for forming four element substrates 4 are provided in a metal substrate material 1. The split groove 2 is formed by press processing or laser processing so that both side walls form a right angle. When the crease groove 2 is formed on one side of the metal substrate material 1, it is shown in FIG. 2, and its depth is 0.21011 mm.
1, and when formed on both sides of the metal substrate material 10, as shown in FIG. 3, the depths are in the order of 0.1. The metal substrate material 4 formed in this manner is coated with an insulating material, and is later folded to form each element substrate 4.
第１実施例において、金属基板材１としてステンレス板
を使用した場合の実験例を第１表に示す。Table 1 shows an experimental example in which a stainless steel plate was used as the metal substrate material 1 in the first embodiment.
第１表において、金属基板材の剛性（形状維持性）とは
金属基板材を取り扱うときに折り割り溝で折り曲がった
りして不都合であるか否かを示し、折り割り縁部の形状
はそこにパリ等が残っているか否かを示し、さらに、◎
は好適であることを、○は実用可能であることを、Ｘは
実用不可であることを示す。実験番号１２．１３．１４
．１７ないし１９は本発明によるものである。In Table 1, the rigidity (shape retention) of the metal substrate material indicates whether or not it is inconvenient to bend the metal substrate material at the crease groove when handling it, and the shape of the crease edge is determined by the shape of the crease edge. Indicates whether Paris, etc. remains in , and furthermore, ◎
indicates that it is suitable, ○ indicates that it is practical, and X indicates that it is not practical. Experiment number 12.13.14
．． 17 to 19 are according to the present invention.
第２実施例は、第４図に示すように、厚さ１．２ｍｍの
金属基板材ｌに、最初に、切断線１０に沿って切断スリ
ット１２を設けて機部１４を形成し、この機部１４上に
折り割り溝１６を設ける。In the second embodiment, as shown in FIG. 4, a cutting slit 12 is first provided along a cutting line 10 in a metal substrate material l having a thickness of 1.2 mm to form a machine part 14. A split groove 16 is provided on the portion 14.
機部１４および折り割り溝１６は、プレス加工あるいは
レーザー加工により形成される。折り割り溝１６の両側
壁は直角をなすように形成され、機部１４の切断スリッ
トの長さ方向の幅は４．０器である。折り割り溝１６は
、金属基板材１の片面に形成される場合、第５図に示さ
れ、その深さが０、２ ｍｍであり、また、金属基板材
１の両面に形成される場合、第６図に示され、その深さ
がそれぞれ０．１順である。このように形成された金属
基板材１には、絶縁物のコーテング加工がなされる。The machine part 14 and the crease groove 16 are formed by press processing or laser processing. Both side walls of the split groove 16 are formed to form a right angle, and the width of the cutting slit in the machine part 14 in the longitudinal direction is 4.0 mm. When the crease groove 16 is formed on one side of the metal substrate material 1, as shown in FIG. 5, its depth is 0.2 mm, and when it is formed on both sides of the metal substrate material 1, The depths are shown in FIG. 6 in order of 0.1. The metal substrate material 1 thus formed is coated with an insulating material.
第２実施例において、金属基板材１としてステンレス板
を使用した場合の実験例を、第１表と同様の第２表に示
す、実験番号３３ないし３６は本発明によるものである
。In the second embodiment, experimental examples in which a stainless steel plate was used as the metal substrate material 1 are shown in Table 2, which is similar to Table 1, and experiment numbers 33 to 36 are according to the present invention.
本発明の第３実施例は、電気用金属基板材をＩＣカード
の基板のために使用するものであって、第１実施例と同
様に製造された金属基板材にＩＣカードとして必要な集
積回路を形成し、折り割りによりＩＣカードとしての寸
法の基盤を製造する。In the third embodiment of the present invention, an electrical metal substrate material is used for the substrate of an IC card, and the metal substrate material manufactured in the same manner as in the first embodiment has integrated circuits necessary for the IC card. A base having the dimensions of an IC card is manufactured by folding and cutting.
このようにして形成された基板には端子窓を設けた金属
板を貼付して、耐静電性、機械的強度そして耐熱性をよ
り高めることも可能である。また、この金属板の貼付は
、金属基板材に集積回路を形成後であって折り割り前に
、折り割りを設けた該金属板を貼付し、金属基板材と該
金属板を同時に折り割るようにすることにより能率的に
行うことができる。It is also possible to attach a metal plate provided with a terminal window to the substrate formed in this manner to further enhance the electrostatic resistance, mechanical strength, and heat resistance. In addition, this metal plate is pasted after the integrated circuit is formed on the metal substrate material, but before the folding, the metal plate with the creases is pasted, and the metal substrate material and the metal plate are folded at the same time. This can be done efficiently by doing this.
第 １ 表 第 ２ 表Chapter 1 Table Table 2
第１図は本発明の第１実施例の金属基板材の平面図、第
２図および第３図は第１図の線■−■（ＩＩＩ −ＩＩ
Ｉ）に沿った部分側面図、第４図は本発明の第２実施例
の金属基板材の平面図、第５図および第６図は第４図の
線Ｖ−Ｖ （ＶＩ−Ｖｌ）に沿った部分断面図である。
１・・・・・・金属基板材、
２．１６・・・・・・折り割り溝、
４・・・・・・素子基板、
１０・・・・・・切断線、
１２・・・・・・切断スリット。
２・発明０名称 ｌ七夏能な電気用金属基板材３．補
正をする者
事件との関係 出願人
名称 日本金属株式会社
４、代理人FIG. 1 is a plan view of a metal substrate material according to a first embodiment of the present invention, and FIGS. 2 and 3 are lines shown in FIG.
I), FIG. 4 is a plan view of the metal substrate material of the second embodiment of the present invention, and FIGS. 5 and 6 are taken along the line V-V (VI-Vl) in FIG. FIG. 1...Metal substrate material, 2.16...Break groove, 4...Element substrate, 10...Cutting line, 12... - Cutting slit. 2. Title of invention l Seven-day functional electrical metal substrate material 3. Relationship with the case of the person making the amendment Applicant name Nippon Kinzoku Co., Ltd. 4, agent
Claims (4)
未満の電気用金属基板材に、絶縁物をコーテング加工す
る前に、所定位置に残留厚さが１／２０ないし３／４ｍ
ｍの折り割り溝を設けることを特徴とする折り割り可能
な電気用金属基板材の製造方法。(1) 2mm thickness for forming multiple element substrates
Electrical metal substrates with a thickness of 1/20 to 3/4 m in place before coating with insulators
A method for manufacturing a breakable electrical metal substrate material, the method comprising providing a break groove of m.
請求の範囲第（１）項に記載の電気用金属基板の製造方
法。(2) The method for manufacturing an electrical metal substrate according to claim (1), wherein the electrical metal substrate material is a stainless steel plate.
ｎ以上２ｍｍ未満の電気用金属基板材に、絶縁物をコー
テング加工する前に、素子基板間に切断スリットを設け
て幅が１ないし１０ｍｍの連結機を形成し、さらに該連
結機に残留厚さが１／２０ないし３／４ｍｍの折り割り
溝を設けることを特徴とする折り割り可能な電気用金属
基板材の製造方法。(3) Thickness of 0, 4 for forming multiple element substrates
Before coating an electrical metal substrate material with a thickness of n or more and less than 2 mm with an insulator, a cutting slit is provided between the element substrates to form a connector with a width of 1 to 10 mm, and a residual thickness is added to the connector. A method for manufacturing a breakable electrical metal substrate material, characterized in that a break groove is provided with a width of 1/20 to 3/4 mm.
請求の範囲第（３）項に記載の電気用金属基板材の製造
方法。(4) The method for manufacturing an electrical metal substrate material according to claim (3), wherein the electrical metal substrate material is a stainless steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62009645A JPH0777292B2 (en) | 1986-12-10 | 1987-01-19 | Method for manufacturing foldable metal substrate material for electric use |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61-293889 | 1986-12-10 | ||
| JP29388986 | 1986-12-10 | ||
| JP62009645A JPH0777292B2 (en) | 1986-12-10 | 1987-01-19 | Method for manufacturing foldable metal substrate material for electric use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63265491A true JPS63265491A (en) | 1988-11-01 |
| JPH0777292B2 JPH0777292B2 (en) | 1995-08-16 |
Family
ID=26344404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62009645A Expired - Fee Related JPH0777292B2 (en) | 1986-12-10 | 1987-01-19 | Method for manufacturing foldable metal substrate material for electric use |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0777292B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007201085A (en) * | 2006-01-25 | 2007-08-09 | Nitto Denko Corp | Wiring circuit board assembly sheet |
| JP2008103131A (en) * | 2006-10-18 | 2008-05-01 | Matsushita Electric Ind Co Ltd | Non-aqueous electrolyte secondary battery and its manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4896250B2 (en) * | 2010-05-19 | 2012-03-14 | 日本発條株式会社 | Metal base circuit board chain forming method and metal base circuit board chain product |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5480566A (en) * | 1977-12-12 | 1979-06-27 | Hitachi Ltd | Method of making core printed board |
| JPS602870U (en) * | 1983-06-20 | 1985-01-10 | 松下電器産業株式会社 | Printed circuit board for division |
| JPS60124058U (en) * | 1984-01-31 | 1985-08-21 | 赤井電機株式会社 | metal paced printed circuit board |
| JPS60153565U (en) * | 1984-03-21 | 1985-10-12 | 日本ビクター株式会社 | printed wiring board |
| JPS60262638A (en) * | 1984-06-11 | 1985-12-26 | 松下電工株式会社 | Metallic-base laminated board |
-
1987
- 1987-01-19 JP JP62009645A patent/JPH0777292B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5480566A (en) * | 1977-12-12 | 1979-06-27 | Hitachi Ltd | Method of making core printed board |
| JPS602870U (en) * | 1983-06-20 | 1985-01-10 | 松下電器産業株式会社 | Printed circuit board for division |
| JPS60124058U (en) * | 1984-01-31 | 1985-08-21 | 赤井電機株式会社 | metal paced printed circuit board |
| JPS60153565U (en) * | 1984-03-21 | 1985-10-12 | 日本ビクター株式会社 | printed wiring board |
| JPS60262638A (en) * | 1984-06-11 | 1985-12-26 | 松下電工株式会社 | Metallic-base laminated board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007201085A (en) * | 2006-01-25 | 2007-08-09 | Nitto Denko Corp | Wiring circuit board assembly sheet |
| JP2008103131A (en) * | 2006-10-18 | 2008-05-01 | Matsushita Electric Ind Co Ltd | Non-aqueous electrolyte secondary battery and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0777292B2 (en) | 1995-08-16 |
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