JPS6326352A - Method for feeding evaporating source - Google Patents
Method for feeding evaporating sourceInfo
- Publication number
- JPS6326352A JPS6326352A JP16812986A JP16812986A JPS6326352A JP S6326352 A JPS6326352 A JP S6326352A JP 16812986 A JP16812986 A JP 16812986A JP 16812986 A JP16812986 A JP 16812986A JP S6326352 A JPS6326352 A JP S6326352A
- Authority
- JP
- Japan
- Prior art keywords
- evaporation source
- source material
- wire
- substance
- evaporation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001704 evaporation Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims abstract description 52
- 238000007747 plating Methods 0.000 claims abstract description 5
- 230000008020 evaporation Effects 0.000 claims description 53
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 11
- 238000010894 electron beam technology Methods 0.000 abstract description 10
- 239000002184 metal Substances 0.000 description 11
- 238000007738 vacuum evaporation Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005422 blasting Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、イオンブレーティング、真空蒸着により、金
属ストリップなどの被処理物をドライプレーティングす
るに際し、蒸発物質を均一に蒸着させるための蒸発源供
給方法に関するものである。Detailed Description of the Invention (Industrial Application Field) The present invention provides an evaporation source for uniformly depositing an evaporated substance when dry plating a workpiece such as a metal strip by ion blating or vacuum evaporation. This concerns the supply method.
〈従来の技術とその問題点）
真空蒸着、イオンブレーティングにより、金属ストリッ
プなどの非処理物に蒸発物質を均一に蒸着するためには
、蒸発物質を常に同じ条件で供給しな（プればないない
。この蒸発源物質としては、塊状の蒸発源物質とワイヤ
状の蒸発源物質とがあり、蒸発源物質は塊状或いはワイ
ヤ状として供給される。しかし、蒸発源物質を塊状の状
態で供給すると、溶融しない蒸発源物質の細片が、溶融
した蒸発源物質が入っている容器内に落下してスプラッ
シュが発生し、金属ストリップなどの被処理物に蒸着物
質を均一に蒸着できなくなる。このスプラッシュを防止
するために、蒸発源物質をワイヤで供給しようとする場
合も次のような問題が生じる。<Prior art and its problems] In order to uniformly deposit an evaporated substance onto an unprocessed object such as a metal strip using vacuum evaporation or ion blating, it is necessary to always supply the evaporated substance under the same conditions. No. There are two types of evaporation source material: lump-like evaporation source material and wire-like evaporation source material. The evaporation source material is supplied in the form of a lump or wire. However, the evaporation source material is supplied in the form of a lump. Then, the unmelted pieces of the evaporation source material fall into the container containing the molten evaporation source material, creating a splash, which prevents the deposition material from being evenly deposited on the workpiece, such as a metal strip. The following problem also occurs when attempting to supply the evaporation source material with a wire to prevent splashing.
一例として、ホローカソード型電子ビームを用いてイオ
ンブレーティングするに際して、ワイヤ状の蒸発源物質
の溶融と蒸発を一台のホローカソードガンで行う場合、
ボローカソードガンから照射される電子ビームの径が比
較的小さいために、蒸発源物質のワイヤの径が電子ビー
ムの径によって制限される。即ち、第１図に示すように
蒸発源物質のワイヤ１の径が、ホローカソードガン２か
ら照射される電子ビーム３の径より大きいので、蒸発源
物質のワイヤ１の側部は溶融されずに残っている。この
溶融されずに残っているワイψ１の残部は切れて、るつ
ぼ４内の溶融した蒸発源物質中に落下してスプラッシュ
が生じる。このため、金属ストリップなどの被処理物５
の表面に形成される蒸着物質の膜が不均一となる原因と
なるので、蒸着源物質のワイヤ１は細線であることが好
ましいが、蒸発源物質のワイヤを細線化することは、非
常にコスト高となる。As an example, when melting and evaporating a wire-shaped evaporation source material with a single hollow cathode gun when performing ion blating using a hollow cathode electron beam,
Since the diameter of the electron beam emitted from the borrow cathode gun is relatively small, the diameter of the wire of the evaporation source material is limited by the diameter of the electron beam. That is, as shown in FIG. 1, since the diameter of the wire 1 of the evaporation source material is larger than the diameter of the electron beam 3 irradiated from the hollow cathode gun 2, the side part of the wire 1 of the evaporation source material is not melted. Remaining. The remainder of the wire ψ1 remaining unmelted is cut and falls into the melted evaporation source material in the crucible 4, creating a splash. For this reason, the workpiece 5 such as a metal strip
It is preferable that the wire 1 of the evaporation source material be a thin wire because it causes the film of the evaporation material formed on the surface of the evaporation material to be non-uniform. However, making the wire 1 of the evaporation source material thinner is extremely costly Becomes high.
本発明の目的は、金属ストリップなどの被処理物にドラ
イプレーティング、即ち真空蒸着またはイオンブレーテ
ィングをする際に、任意の形状の蒸発源物質をホローカ
ソードガンにより溶融、蒸発させることにより、金属ス
トリップなどの表面に蒸発物質の膜を均一に蒸着させる
ことにある。An object of the present invention is to melt and evaporate an evaporation source material of any shape with a hollow cathode gun when performing dry plating, that is, vacuum deposition or ion blating, on a workpiece such as a metal strip. The purpose of this method is to uniformly deposit a film of an evaporated substance on the surface of the
（問題点を解決するための手段）
本発明では、ホローカソードガンにより蒸発源物質を溶
融、蒸発させてドライプレーティングするに当り、前記
蒸発源物質を回転させつつ送ることを特徴とする蒸発源
供給方法、とすることで前述した問題点を解決した。(Means for Solving the Problems) In the present invention, when the evaporation source material is melted, evaporated and dry plated using a hollow cathode gun, the evaporation source material is fed while being rotated. The above-mentioned problems were solved by using this method.
以下に本発明の一実施例を、イオンブレーティングを例
にとり第２図に基き説明する。An embodiment of the present invention will be described below with reference to FIG. 2, taking ion blating as an example.
蒸発源物質のワイヤ１を巻いであるワイヤストッカ６は
、電動機７に連結された軸８により軸支されて、軸８を
中心に回転可能となっている。更に、ワイヤストッカ６
は支持金具９を中心に回転自在に支持されており、蒸発
源物質のワイヤ１は、ワイヤストッカ６の前方に設けた
一対のフィードロール１０．１０のフィード機構および
ガイドバイブ１１により、るつぼ４上に導かれる。この
ガイドバイブは、蒸発源物質のワイヤ１をるつぼ４の設
定位置に案内する役目を果している。A wire stocker 6 in which a wire 1 of an evaporation source substance is wound is supported by a shaft 8 connected to an electric motor 7, and is rotatable around the shaft 8. Furthermore, wire stocker 6
is rotatably supported around a support fitting 9, and the wire 1 of the evaporation source material is transferred onto the crucible 4 by a feed mechanism of a pair of feed rolls 10 and 10 provided in front of the wire stocker 6 and a guide vibrator 11. guided by. This guide vibe serves to guide the wire 1 of the evaporation source material to a set position in the crucible 4.
上述したようにワイヤストッカ６は、電動機７により軸
８を中心に回転しており、蒸発源物質のワイヤ１はワイ
ヤ１を送る方向を軸として回転しつつ、フィールドロー
ル１０．１０によりガイドバイブ１１を通過し、るつぼ
４上に回転した状態で供給される。この回転している蒸
発源物質のワイヤ１上にはホローカソードガン２が設け
られており、ホローカソードガン２からの電子ビーム３
の一部が蒸発源物質のワイヤ１の先端を覆うように照射
される。この照射される電子ビームにより、回転＝３−
している蒸発源物質のワイヤ１の周囲から蒸発源物質の
ワイヤを完全に溶融することが可能となる。As described above, the wire stocker 6 is rotated around the shaft 8 by the electric motor 7, and the wire 1 of the evaporation source material is rotated around the direction in which the wire 1 is sent as the axis, and the wire stocker 6 is rotated around the guide vibe 11 by the field roll 10.10. and is supplied onto the crucible 4 in a rotated state. A hollow cathode gun 2 is provided on the rotating wire 1 of the evaporation source material, and an electron beam 3 is emitted from the hollow cathode gun 2.
is irradiated so as to cover the tip of the wire 1 of the evaporation source material. This irradiated electron beam makes it possible to completely melt the evaporation source material wire from around the rotating evaporation source material wire 1.
また、電子ビームの一部は、るつぼ４中の蒸発源物質に
照射され、蒸発物質は一部イオン化して、被処理物の金
属ストリップ５上に均一な蒸発物質の膜を形成する。Further, a part of the electron beam is irradiated onto the evaporation source material in the crucible 4, and the evaporation material is partially ionized to form a uniform film of the evaporation material on the metal strip 5 of the object to be processed.
更に、本発明の他の実施例について、第３図に基ぎ説明
する。Further, another embodiment of the present invention will be explained based on FIG.
不定の形状の蒸発源物質１は、蒸発源物質の挿入方向の
軸を中心に回転するチャック１２により固定され、るつ
ぼ４上に回転した状態で供給される。The evaporation source material 1 having an irregular shape is fixed by a chuck 12 that rotates around an axis in the insertion direction of the evaporation source material, and is supplied onto the crucible 4 in a rotated state.
ホローカソードガン２から照射される電子ご−ム３の一
部により、蒸発源物質１は常に完全に溶融させた。また
、電子ビーム３の一部は、るつぼ４中の蒸発源物質に照
射され、被処理物の金属ストリップ５上に均一な蒸発物
質の膜が形成される。The evaporation source material 1 was always completely melted by a portion of the electron beam 3 irradiated from the hollow cathode gun 2. Further, a part of the electron beam 3 is irradiated onto the evaporation source material in the crucible 4, and a uniform film of the evaporation material is formed on the metal strip 5 of the object to be processed.
以上の例は、金属ストリップなどの被処理物をイオンブ
レーティングする場合であるが、真空蒸着により金属ス
トリップなどの被処理物に蒸発物質の膜を形成する際に
、蒸発源物質を供給する場合にも適用できる。The above example is a case where a workpiece such as a metal strip is ion-blated, but when an evaporation source material is supplied when forming a film of evaporation material on a workpiece such as a metal strip by vacuum evaporation. It can also be applied to
（発明の効果）
以上説明したように本発明法によれば、任意の形状の蒸
発源物質でも蒸発源物質を完全に溶融することが可能と
なり、未溶融の蒸発源物質が切れて、溶融状態の蒸発源
物質が入っている容器中に落下して生じるスプラッシュ
を防止できるため、金属ストリップなどの表面に蒸発物
質の均一な膜が形成できる。また、−台のホローカソー
ドガンを設ければ、蒸発源物質の溶融と蒸発が可能とな
り、イオンブレーティングまたは真空蒸着で能率良く金
属ストリップなどの被処理物に蒸発物質の膜を形成でき
る。(Effects of the Invention) As explained above, according to the method of the present invention, it is possible to completely melt the evaporation source material even if it has an arbitrary shape, and the unmelted evaporation source material is cut off and brought into a molten state. This prevents the splash caused by the evaporation source material falling into the container containing the evaporation source material, so that a uniform film of the evaporation material can be formed on the surface of the metal strip or the like. Furthermore, if two hollow cathode guns are provided, it becomes possible to melt and evaporate the evaporation source material, and a film of the evaporation material can be efficiently formed on the object to be processed, such as a metal strip, by ion blasting or vacuum evaporation.
第１図は、従来法による蒸発源物質のワイヤを溶融する
状態を示す図である。
第２図は、本発明法による蒸発源物質のワイヤの供給と
その溶融状態を示す図である。
第３図は、本発明法による不定形状の蒸発源物質の供給
とその溶融状態を示す他の例である。
１・・・蒸発源物質のワイヤ
２・・・ホローカソードガンFIG. 1 is a diagram showing a state in which a wire of an evaporation source material is melted according to a conventional method. FIG. 2 is a diagram showing the wire supply of the evaporation source material and its molten state according to the method of the present invention. FIG. 3 is another example showing the supply of an irregularly shaped evaporation source material and its molten state according to the method of the present invention. 1... Wire of evaporation source material 2... Hollow cathode gun
Claims (1)
させてドライプレーティングするに当り、前記蒸発源物
質を回転させつつ送ることを特徴とする蒸発源供給方法
。1. An evaporation source supply method characterized by rotating and feeding the evaporation source material when melting and evaporating the evaporation source material using a hollow cathode gun for dry plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16812986A JPS6326352A (en) | 1986-07-18 | 1986-07-18 | Method for feeding evaporating source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16812986A JPS6326352A (en) | 1986-07-18 | 1986-07-18 | Method for feeding evaporating source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6326352A true JPS6326352A (en) | 1988-02-03 |
Family
ID=15862376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16812986A Pending JPS6326352A (en) | 1986-07-18 | 1986-07-18 | Method for feeding evaporating source |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6326352A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0320462A (en) * | 1989-06-19 | 1991-01-29 | Matsushita Electric Ind Co Ltd | Method and device for supplying material for vapor deposition |
-
1986
- 1986-07-18 JP JP16812986A patent/JPS6326352A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0320462A (en) * | 1989-06-19 | 1991-01-29 | Matsushita Electric Ind Co Ltd | Method and device for supplying material for vapor deposition |
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