JPS63259979A - Connection structure between oxide superconductor and normal conductor - Google Patents
Connection structure between oxide superconductor and normal conductorInfo
- Publication number
- JPS63259979A JPS63259979A JP9280787A JP9280787A JPS63259979A JP S63259979 A JPS63259979 A JP S63259979A JP 9280787 A JP9280787 A JP 9280787A JP 9280787 A JP9280787 A JP 9280787A JP S63259979 A JPS63259979 A JP S63259979A
- Authority
- JP
- Japan
- Prior art keywords
- superconductor
- base
- cushion layer
- oxide
- oxide superconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002887 superconductor Substances 0.000 title claims abstract description 62
- 239000004020 conductor Substances 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000005219 brazing Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 3
- 229910052727 yttrium Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910020012 Nb—Ti Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Superconductors And Manufacturing Methods Therefor (AREA)
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
この発明は、超電導マグネットコイルなどに利用される
、超電導体と金属などの常電導体とを接合してなる接合
体における接合構造に係わり、特に超電導体として酸化
物系超電導体を用いたものに関する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" This invention relates to a bonding structure in a bonded body formed by bonding a superconductor and a normal conductor such as a metal, which is used in a superconducting magnet coil or the like. In particular, it relates to those using oxide-based superconductors as superconductors.
「従来の技術」
従来より、例えば、超電導マグネットコイルに利用され
る金属などの常電導体でつくられた基体上に超電導体を
接合して構成された接合体を作成するには、Nb−Ti
合金などの合金系超電導材料やNb5Snなどの化合物
系超電導材料を、金属などの常電導材料で作られた基体
上に、ハンダ等を用いて接合する方法が知られている。``Prior art'' Conventionally, for example, in order to create a bonded body composed of a superconductor bonded to a base made of a normal conductor such as a metal used in a superconducting magnet coil, Nb-Ti
A method is known in which an alloy-based superconducting material such as an alloy or a compound-based superconducting material such as Nb5Sn is bonded onto a base made of a normal-conducting material such as a metal using solder or the like.
この接合体は、超電導体に機械的研削やエツチング処理
を施すことにより、基体上に螺旋状の超電導コイルを形
成してディスク状超電導シートコイルとされ、更にこの
ディスク状超電導シートコイルを多数枚積層し、かつ各
々を接続することによって超電導マグネットコイルが形
成される。This bonded body is made by mechanically grinding and etching the superconductor to form a spiral superconducting coil on the base to form a disk-shaped superconducting sheet coil, and then stacking a large number of these disk-shaped superconducting sheet coils. A superconducting magnet coil is formed by connecting them.
ところで、近来、臨界温度が50に以上のL a−Ba
−Cu−0系、Y −B a−Cu−0系等のいわゆる
A −B −Cu−0系(ただし、AはLa;Sc、Y
等のma族金属元素、BはBa、Sr、Be等のアルカ
リ土類金属元素を示す)の酸化物系超電導材料が種々発
見されつつある。これら酸化物系超電導材料は、上記の
合金系あるいは化合物系超電導材料に比べて臨界温度が
高く、液体窒素温度以上で超電導材料とされるなどの優
れた特性を有することから、この酸化物系超電導材料を
利用した超電導マグネットなどへの応用が期待されてい
る。By the way, in recent years, L a-Ba with a critical temperature of 50 or higher has been developed.
-Cu-0 series, Y-B a-Cu-0 series, etc., so-called A-B-Cu-0 series (A is La; Sc, Y
Various oxide-based superconducting materials are being discovered. These oxide-based superconducting materials have superior properties such as a higher critical temperature than the alloy-based or compound-based superconducting materials mentioned above, and are considered superconducting materials above the liquid nitrogen temperature. Applications such as superconducting magnets using this material are expected.
「発明が解決しようとする問題点」
しかしながら、これら酸化物系超電導体と金属製基体と
を接合させた場合、この酸化物系超電導体の熱膨張係数
(α、)と、基体金属の熱膨張係数(α、)とが、
−5X 10−’≦α、−α1≦ fox 10−7の
範囲を超えるものでは、温度変化によって基体と酸化物
系超電導体との間に大きな応力が発生してしまう。した
がって基体上に酸化物系超電導体を接合しても、接合操
作の時などに加わるヒートショックによって剥離を生じ
たり、この接合体を超電導マグネットコイルと°して使
用する際に、臨界温度までの冷却で生じる温度変化によ
って酸化物系超電導体に歪みが生じる問題がある。"Problems to be Solved by the Invention" However, when these oxide-based superconductors and metal substrates are joined, the thermal expansion coefficient (α, ) of the oxide-based superconductors and the thermal expansion of the base metal If the coefficient (α, ) exceeds the range of -5X 10-'≦α, -α1≦fox 10-7, large stress is generated between the substrate and the oxide superconductor due to temperature changes. Put it away. Therefore, even if an oxide-based superconductor is bonded to a substrate, it may peel off due to heat shock applied during the bonding operation, or when using this bonded body as a superconducting magnet coil, temperatures up to the critical temperature may occur. There is a problem in that oxide-based superconductors become distorted due to temperature changes caused by cooling.
この発明は、前記問題に鑑みてなされたもので、耐久性
の優れた基体と酸化物系超電導体との接合体を堤供する
ことを目的としたものである。This invention was made in view of the above problem, and aims to provide a bonded body of a base and an oxide superconductor that has excellent durability.
「問題点を解決するだめの手段」
この発明は、常電導体からなる基体上に酸化物系超電導
体を接合した接合構造であって、上記基体と上記酸化物
系超電導体との間に、熱膨張係数の値が上記基体の熱膨
張係数の値よりも上記酸化物系超電導体の熱膨張係数の
値に近い+材料からなるクッション層を介在させたこと
を問題解決の手段とした。"Means for Solving Problems" The present invention provides a bonded structure in which an oxide superconductor is bonded to a base made of a normal conductor, and between the base and the oxide superconductor, The problem was solved by interposing a cushion layer made of a material whose coefficient of thermal expansion was closer to that of the oxide superconductor than that of the base.
「作用 」
常電導体からなる基体と酸化物系超電導体との間に設け
たクッション層が温度変化による基体と被覆体との間の
応力発生を防止し、被覆体の剥離や歪みの発生を防止す
る。"Function" The cushion layer provided between the base made of a normal conductor and the oxide superconductor prevents the generation of stress between the base and the coating due to temperature changes, and prevents the occurrence of peeling or distortion of the coating. To prevent.
「実施例」
第1図はこの発明の一実施例を示す図であって、符号l
は接合体である。この接合体lは、常電導体で作られた
基体2と超電導体3とこれらの間に介在されたクッショ
ン層4とを接合して構成されている。超電導体3の材料
としてはA −B −Cu−0系(ただし、AはLa、
Ce、Y、Sc、Yb、Pr、Nd。"Embodiment" FIG. 1 is a diagram showing an embodiment of the present invention, and is denoted by l
is a zygote. This joined body 1 is constructed by joining together a base 2 made of a normal conductor, a superconductor 3, and a cushion layer 4 interposed between them. The material of the superconductor 3 is A-B-Cu-0 (where A is La,
Ce, Y, Sc, Yb, Pr, Nd.
Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、T
m、Lu等のIIIa族金属元素、BはS r、Ba、
Ca、T3e、Ra、Mg等のアルカリ土類金属元素を
示す)などの酸化物系超電導材料が使用される。また上
記基体2は、銅、アルミニウム、ステンレスなどの常電
導性金属材料で作られている。また上記クッション層4
は、基体2の熱膨張係数の値よりも超電導体3の材料と
なる酸化物系超電導材料の熱膨張係数の値に近い熱膨張
係数を有する材料を適宜選択して用いることができ、例
えば超電導体3として上記A −B −Cu−0系の超
電導材料を用いる場合には、ニオブ、モリブデン、タン
グステン、プラチナ、タンタル等の単体金属やコバール
(F e−N i−Co系合金)、F e−N i系合
金等の合金やジュメット、銅クラツドコバール等の複合
材などλく使用される。上記基体2とクッション層4と
の間およびクッション層4と超電導体3との間には、各
々ろう剤5.6が介在されており、基体2とクッション
層4およびクッション層4と超電導体3とをろう骨接合
し、全体として基体2上にクッション層・1と超電導体
3とか積層された接合体lを構成している。Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, T
m, Group IIIa metal elements such as Lu, B is S r, Ba,
Oxide-based superconducting materials such as alkaline earth metal elements such as Ca, T3e, Ra, and Mg are used. Further, the base body 2 is made of a normally conductive metal material such as copper, aluminum, or stainless steel. In addition, the cushion layer 4
For example, a material having a coefficient of thermal expansion closer to that of the oxide superconducting material that is the material of the superconductor 3 than that of the base 2 can be appropriately selected and used. When using the above A-B-Cu-0-based superconducting material as the body 3, single metals such as niobium, molybdenum, tungsten, platinum, and tantalum, Kovar (Fe-Ni-Co-based alloy), Fe -Ni alloys such as alloys and composite materials such as Dumet and copper-clad Kovar are widely used. A brazing agent 5 and 6 is interposed between the base body 2 and the cushion layer 4 and between the cushion layer 4 and the superconductor 3, respectively. The two are bonded to each other with wax bone, and the entire structure constitutes a bonded body 1 in which a cushion layer 1 and a superconductor 3 are laminated on a base 2.
この接合体1を作成するには、まず超電導体3の原料粉
末を薄板状に圧粉成形して成形体とし、次いでこの成形
体に熱処理を施して超電導性を何する薄板状の超電導体
3を作成する。この原料粉末は、例えば超電導体3とし
て上記A −B −Cu−0系超電導体を用いる場合に
は、L a、 Ce、 Y 、 Y b。To create this bonded body 1, first, the raw material powder of the superconductor 3 is compacted into a thin plate shape to form a compact, and then this compact is heat-treated to change the superconductivity of the thin plate-shaped superconductor 3. Create. For example, when the above A-B-Cu-0 based superconductor is used as the superconductor 3, the raw material powder includes La, Ce, Y, and Yb.
Sc等のl1la族金属元素またはその化合物と、Sr
。I1la group metal element such as Sc or its compound, and Sr
.
I3a等のアルカリ土類金属元素またはその化合物と、
銅またはその化合物などを使用する。これら各々の金属
元素の化合物としては、酸化物、塩化物、フッ化物、臭
化物、硫化物等が使用できる。an alkaline earth metal element such as I3a or a compound thereof;
Use copper or its compounds. As compounds of each of these metal elements, oxides, chlorides, fluorides, bromides, sulfides, etc. can be used.
しかし、この発明はこれに限定されるものではなく、上
記 A −B −Cu−0系以外の酸化物系超電導体を
用いて構成しても良い。また超電導体3に八−B −C
u−0系超電導付料を用いる場合、上記熱処理は800
〜1100℃で1時間〜300時間行なうのが望ましい
。However, the present invention is not limited thereto, and may be constructed using oxide-based superconductors other than the above-mentioned A-B-Cu-0-based superconductors. Also, superconductor 3 has 8-B-C
When using a u-0 superconducting additive, the above heat treatment is performed at a temperature of 800
It is desirable to carry out the heating at ~1100°C for 1 hour ~ 300 hours.
次に、先のように作成した超電導体3と板状のクッショ
ン層4およびこのクッション層4と銅などの板状の金属
製基体2の各々の間をろう付接合する。これによって基
体2とクッション層4と超電導体3とが順に積層され、
各々が接合された状態のディスク状の接合体lが作成さ
れる。この接合体lを用いて、例えば超電導マグネット
コイルを作成するには、この接合体lの超電導体3を機
械的研削等の手段を施すことにより、基体2あるいはク
ッション層4上に螺旋状の超電導コイルを形成してディ
スク状超電導コイルとし、更にこのディスク状超電導コ
イルを多数枚積層し、かつ各々を接続することによって
超電導マグネットコイルとする。Next, the superconductor 3 and the plate-shaped cushion layer 4 and the cushion layer 4 and the plate-shaped metal substrate 2 made of copper or the like are joined by brazing. As a result, the base 2, the cushion layer 4, and the superconductor 3 are laminated in this order.
A disc-shaped joined body l is created in which each member is joined together. In order to create, for example, a superconducting magnet coil using this bonded body 1, the superconductor 3 of this bonded body 1 is subjected to mechanical grinding or the like to form a spiral superconducting magnet on the base 2 or the cushion layer 4. A coil is formed into a disk-shaped superconducting coil, and a large number of disk-shaped superconducting coils are further stacked and connected to each other to form a superconducting magnet coil.
この接合体lは、金属製の基体2と超電導体3との間に
、熱膨張係数の値が基体2の熱膨張係数の値よりも超電
導体3の熱膨張係数の値に近い材料からなるクッション
層4を介在させたので、熱膨張係数の異なる基体2と超
電導体3とを用いて接合体lを構成しても、温度変化に
よって基体2と超電導体3との間に応力が加わることが
なく、接合操作の際などで加わるヒートショックにより
超電導体3か剥離する等の不良をなくすことができる。This joined body 1 is made of a material whose coefficient of thermal expansion is closer to that of the superconductor 3 than that of the base 2 between the metal base 2 and the superconductor 3. Since the cushion layer 4 is interposed, stress will not be applied between the base 2 and the superconductor 3 due to temperature changes even if the bonded body 1 is constructed using the base 2 and the superconductor 3 having different coefficients of thermal expansion. This eliminates defects such as peeling of the superconductor 3 due to heat shock applied during bonding operations.
また、この接合体lは、例えば超電導マグネットコイル
などとして使用する際に、このコイルを臨界温度に冷却
しても基体2と超電導体3との間に応力が発生すること
がほとんどないので、使用中にコイルの超電導特性の劣
化を防止できる。Furthermore, when this joined body 1 is used, for example, as a superconducting magnet coil, stress is hardly generated between the base body 2 and the superconductor 3 even when the coil is cooled to a critical temperature. During this process, deterioration of the superconducting properties of the coil can be prevented.
なお、先の実施例では、基体2とクッション層4との間
およびクッション層4と超電導体3との間の各々にろう
剤5.6を介在し、基体2とクッション層4およびクッ
ション層と超電導体3の各々をろう付接合して接合体1
としたが、この発明はこれに限定されろことなく、例え
ば、基体2上にクッション層をろう付やクラブキング等
で一体接合し、このクッション層4上に超電導体3の原
料粉末あるいは原料粉末の圧粉成形体を積層し、これに
熱処理を施すことによってクッション層4上に超電導体
3を接合させた乙のであっても良い。In the previous embodiment, the brazing agent 5.6 was interposed between the base 2 and the cushion layer 4 and between the cushion layer 4 and the superconductor 3, and the base 2, the cushion layer 4, and the cushion layer Each of the superconductors 3 is joined by brazing to form a joined body 1
However, the present invention is not limited thereto; for example, a cushion layer is integrally joined on the base 2 by brazing, clubking, etc., and the raw material powder or raw material powder of the superconductor 3 is placed on the cushion layer 4. Alternatively, the superconductor 3 may be bonded onto the cushion layer 4 by laminating the powder compacts and subjecting them to heat treatment.
この接合体では、基体2とクッション層4と超電導体3
との各々をろう付接合する必要がなく、先の実施例より
も製造工程を簡略化することができる。In this bonded body, a base 2, a cushion layer 4, and a superconductor 3
There is no need to braze and join each other, and the manufacturing process can be simplified compared to the previous embodiment.
また、先の実施例では接合体lの形状がディスク状であ
ったが、接合体の形状はこれに限定されることなく、例
えばパイプ状の基体2の外面にクッション層4と超電導
体3を接合したバイブ状の接合体であっても良い。Further, in the previous embodiment, the shape of the bonded body l was disk-shaped, but the shape of the bonded body is not limited to this. For example, the cushion layer 4 and the superconductor 3 are formed on the outer surface of the pipe-shaped base body 2. It may be a joined body in the form of a vibrator.
また、クッション層4を膨張率の異なるものの多層構造
にしてもよい。Further, the cushion layer 4 may have a multilayer structure having different expansion coefficients.
「発明の効果」
以上説明したように、この発明によれば、常電導体から
なる基体と酸化物系超電導体との間に、熱膨張係数の値
が基体の熱膨張係数の値よりも酸化物系超電導体の熱膨
張係数の値に近い材料からなるクッション層を介在させ
たので、熱膨張係数の異なる基体と酸化物系超電導体と
を用いて接合体を構成してら、温度変化によって基体と
酸化物系超電導体との間に応力が加わることがほとんど
なくなり、接合操作の際などでの加わるヒートショック
により酸化物系超電導体が剥離する等の不良をなくすこ
とができる。"Effects of the Invention" As explained above, according to the present invention, the thermal expansion coefficient between the base made of a normal conductor and the oxide superconductor is lower than that of the base due to oxidation. Since a cushion layer made of a material with a thermal expansion coefficient close to that of the physical superconductor is interposed, if a bonded body is constructed using a substrate and an oxide superconductor with different thermal expansion coefficients, the substrate will change due to temperature changes. Almost no stress is applied between the oxide-based superconductor and the oxide-based superconductor, and defects such as peeling of the oxide-based superconductor due to heat shock applied during bonding operations can be eliminated.
また、この接合体は、例えば超電導マグネットコイルな
どとして使用する際に、このコイルを臨界温度に冷却し
ても基体と酸化物系超電導体との間に応力を発生するこ
とがほとんどないので、使用中にコイルの超電導特性の
劣化を防止できる。In addition, when this bonded body is used as a superconducting magnet coil, for example, even if the coil is cooled to a critical temperature, there is almost no stress generated between the base and the oxide superconductor. During this process, deterioration of the superconducting properties of the coil can be prevented.
第1図はこの発明の一実施例を示す図であって、接合体
の側断面図である。
2・・・基体、3・・・被覆体、4・・・クッション層
。FIG. 1 is a diagram showing one embodiment of the present invention, and is a side sectional view of a joined body. 2... Base body, 3... Covering body, 4... Cushion layer.
Claims (1)
接合構造であって、 上記基体と上記酸化物系超電導体との間に、熱膨張係数
の値が上記基体の熱膨張係数の値よりも上記酸化物系超
電導体の熱膨張係数の値に近い材料からなるクッション
層を介在させてなることを特徴とする酸化物系超電導体
と常電導体との接合構造。[Scope of Claims] A bonded structure in which an oxide superconductor is bonded to a base made of a normal conductor, wherein the value of the thermal expansion coefficient between the base and the oxide superconductor is such that the value of the coefficient of thermal expansion of the base is A bonding structure between an oxide superconductor and a normal conductor, characterized by interposing a cushion layer made of a material whose coefficient of thermal expansion is closer to that of the oxide superconductor than that of the oxide superconductor. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9280787A JP2551579B2 (en) | 1987-04-15 | 1987-04-15 | Bonding structure of oxide-based superconductor and normal conductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9280787A JP2551579B2 (en) | 1987-04-15 | 1987-04-15 | Bonding structure of oxide-based superconductor and normal conductor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63259979A true JPS63259979A (en) | 1988-10-27 |
JP2551579B2 JP2551579B2 (en) | 1996-11-06 |
Family
ID=14064683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9280787A Expired - Fee Related JP2551579B2 (en) | 1987-04-15 | 1987-04-15 | Bonding structure of oxide-based superconductor and normal conductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2551579B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4929864A (en) * | 1987-12-02 | 1990-05-29 | Zenith Electronics Corporation | NI-based FTM shadow masks having a nickel phosphide black layer |
-
1987
- 1987-04-15 JP JP9280787A patent/JP2551579B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4929864A (en) * | 1987-12-02 | 1990-05-29 | Zenith Electronics Corporation | NI-based FTM shadow masks having a nickel phosphide black layer |
Also Published As
Publication number | Publication date |
---|---|
JP2551579B2 (en) | 1996-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5100740A (en) | Direct bonded symmetric-metallic-laminate/substrate structures | |
EP0556837B1 (en) | Method of joining superconducting wire using oxide high-temperature superconductor | |
US5135878A (en) | Schottky diode | |
CN107112108B (en) | Oxide superconducting block magnet | |
JPH09306256A (en) | Bulk oxide superconductor, and production of wire rod and plate thereof | |
JP4995284B2 (en) | Joining method of oxide superconductor tube and superconducting joint | |
EP0545608A2 (en) | Superconducting joint for oxide superconductor tape | |
US4835065A (en) | Composite alumina-aluminum nitride circuit substrate | |
JPS63259979A (en) | Connection structure between oxide superconductor and normal conductor | |
EP1406317B1 (en) | Metal-ceramic high temperature superconductor composite and process for bonding a ceramic high temperature superconductor to a metal | |
JPH08102570A (en) | Ceramic circuit board | |
JPH05152616A (en) | Manufacture of chip of semiconductor element forming material and its thermoelectric conversion module | |
JP2003332637A (en) | Thermoelectric material and thermoelectric module using the same | |
EP0431725A2 (en) | Direct bonded metal-substrate structures | |
JP2851881B2 (en) | Jointed body of alumina ceramics and iron-nickel alloy and joining method thereof | |
JPH0797277A (en) | Method for joining oxide superconductor | |
JP2503778B2 (en) | Substrate for semiconductor device | |
JP2639961B2 (en) | Superconducting element manufacturing method | |
JP2002203993A (en) | Substrate for thermoelectric modules and thermoelectric module using the substrate | |
JP2961240B2 (en) | Oxide superconductor / High strength ceramic laminated current lead | |
JP3150718B2 (en) | Superconductor lamination substrate and superconducting laminate using the same | |
JP2519773B2 (en) | Superconducting material | |
JP2503779B2 (en) | Substrate for semiconductor device | |
JPH01118435A (en) | Composite material of aluminum and molybdenum and manufacture thereof | |
JP3194006B2 (en) | Method for producing yttrium-based superconductor by oriented grain growth |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |