JPS63252798A - Sheathing structure of ic card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an assembly structure of an exterior main body used for an IC card.

[Conventional technology]

FIG. 7 shows a cross-sectional view of a conventional IC card main body packaged, where 1a is a first main body, 4a is a second main body, and 2a is a dividing surface.

As shown in FIG. 7, in the conventional IC card pancage, the dividing surface 2a of the first main body 1a and the second main body 4a is formed flat, and the adhesion between them is limited to the first main body 1a and the second main body 4a.
．． Adhesive was applied to one or both of the split surfaces of the second main body to bond them together. Or, with the first and second bodies together, split surface 2a
The method used was to apply adhesive from the outside and allow it to penetrate.

[Problem that the invention seeks to solve]

As described above, in the conventional IC card package, the first body 1a and the second body 4a have a flat dividing surface 2.
It is glued with a. Here, in the method of applying adhesive to either one or both of the flat divided surfaces 2a,
Although the required amount of adhesive can be sufficiently applied, the adhesive sometimes protrudes into the main body or outside the split surface, which poses problems in terms of reliability and design. Also, the first
゜In the method of bonding by applying an adhesive from the outside to the divided surface 2a with the second main body put together, there is variation in the application and penetration of the adhesive, the bonding is not uniform, and the bonding work is difficult. There were problems such as it took a lot of time and the outer periphery was stained by the adhesive after bonding.

This invention was made in order to solve the above-mentioned problems, and it is possible to strengthen the bond and improve reliability, make it easier to apply the adhesive, shorten the bonding work time, and further improve the bonding time after bonding. To obtain an exterior structure of an IC card that does not stain an outer circumferential dividing surface serving as a design surface.

[Means for Solving the Problems] In the exterior structure of the IC card according to the present invention, a groove for applying adhesive is provided on the cut surface of the first body, and a groove for applying adhesive is provided on the cut surface of the second body. A convex portion is provided at a position corresponding to the concave groove of the first body, and the concave groove and the convex portion are fitted together to form the first body.
The second main body is bonded.

[Effect]

In this invention, by providing a concave groove on the divided surface of the first body, adhesive can be applied to the concave groove in advance, and when the second body is combined, the convex portion provided on the divided surface of the second body By fitting into the recessed groove, the adhesive reliably fills the divided surface and is bonded uniformly and firmly, reducing working time and preventing staining the outer circumferential surface.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

In Figures 1 to 4, 1 is the first main body, 2 is the dividing surface of this first main body 1, 3 is a groove provided in the dividing surface 2, 4 is the second main body, and 5 is this main body. a dividing surface of the second body 4;
6 is a convex portion provided on the dividing surface 5 and engages with the groove 3 of the first body 1; 7 is a connector holding portion formed when the first and second bodies 1.4 are combined; 8; Similarly, is a board mounting portion formed when the two main bodies 1.4 are combined.

FIG. 6 shows an exploded perspective view of the IC card, and in the figure,
9 is a connector, and 10 is a board.

In this embodiment having such a configuration, when bonding the first and second bodies, an adhesive is first applied to the groove 3 of the first body 1. Next, connect the connector 9 and the board 10 to the connector holding part 7 and the board mounting part 8 of the first main body 1, respectively.
In this state, the second main body 4 is fitted to the first main body 1. By doing this, as shown in FIG. 5, the concave groove 3 of the first body 1 and the convex part 6 of the second body 4 fit together, and at this time, the adhesive is applied to the gap between the concave grooves 3. It is possible to firmly bond the two bodies without filling up and protruding from the dividing surface of the two bodies.

Therefore, in this embodiment, the amount of adhesive applied can be kept constant, and the adhesion can be made uniform and strong, thereby improving reliability. It also makes it easier to apply adhesive,
The positioning of both bodies is also grooved.

Since this can be done easily by using the convex portion, the working time for bonding can be shortened. Furthermore, after bonding, the outer periphery will not be contaminated by the adhesive.

In the above embodiment, the present invention was applied to the outer package of an IC card, but the present invention can also be applied to the structure of containers made of plastic, etc., and to the joining of boards etc. to improve reliability. Highly strong adhesion can be achieved.

〔Effect of the invention〕

As described above, according to the present invention, the first. A concave groove and a convex portion are provided on the divided surface of the second body, and when bonding the two bodies, adhesive is applied inside the concave groove of the divided surface and the concave groove and the convex portion are used for positioning. Therefore, the two main bodies can be bonded together reliably and easily, reliability is improved, and staining of the outer peripheral portion after bonding can be prevented.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a first body of an IC card package according to an embodiment of the present invention, FIG. 2 is a cross-sectional side view thereof, and FIG.
Figure 4 is a plan view of the second main body of the IC card package, Figure 4 is a cross-sectional side view thereof, Figure 5 is a cross-sectional configuration diagram of the IC card package, and Figure 6 shows the assembly relationship of the IC card according to the present invention. The exploded perspective view shown in FIG. 7 is a cross-sectional configuration diagram of a conventional IC card. DESCRIPTION OF SYMBOLS 1... 1st main body, 2, 5... Dividing surface, 3... Concave groove, 4... 2nd main body, 6... Convex part, 7... Connector holding part, 8 ... Board mounting section. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] (1) The package forming the exterior is a first body and a second body.
In the exterior structure of an IC card formed by being divided into two by a main body, the first main body is provided with a connector holding part and a board mounting part, and a groove is provided in the outer peripheral divided surface thereof, The second main body is provided with a connector holding part and a board mounting part at locations corresponding to the connector holding part and the board mounting part of the first main body, and a convex part is provided on the outer circumferential dividing surface, An IC card characterized in that the first main body and the second main body are fitted together and bonded by applying an adhesive to the grooves of the first body, using the grooves and the protrusions for positioning. exterior structure.