JPH0422693A - Ic card - Google Patents

Ic card

Info

Publication number
JPH0422693A
JPH0422693A JP2127771A JP12777190A JPH0422693A JP H0422693 A JPH0422693 A JP H0422693A JP 2127771 A JP2127771 A JP 2127771A JP 12777190 A JP12777190 A JP 12777190A JP H0422693 A JPH0422693 A JP H0422693A
Authority
JP
Japan
Prior art keywords
frame
card
frames
lateral direction
enhanced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2127771A
Other languages
Japanese (ja)
Other versions
JP2672880B2 (en
Inventor
Takeshi Kaminaka
上仲 健
Atsushi Obuchi
大渕 淳
Shigeo Onoda
小野田 重雄
Hajime Maeda
前田 甫
Toru Tachikawa
立川 透
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ryoden Kasei Co Ltd
Mitsubishi Electric Corp
Original Assignee
Ryoden Kasei Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ryoden Kasei Co Ltd, Mitsubishi Electric Corp filed Critical Ryoden Kasei Co Ltd
Priority to JP2127771A priority Critical patent/JP2672880B2/en
Publication of JPH0422693A publication Critical patent/JPH0422693A/en
Application granted granted Critical
Publication of JP2672880B2 publication Critical patent/JP2672880B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To enhance the mechanical strength of a frame body and to prevent the deformation of the second frame by providing the projection part to either one of the first and second frames at the intermediate part in the lateral direction thereof so as to engage with the other one of the first and second frames. CONSTITUTION:The pin 11 as the projection part vertically provided to the intermediate part of the first frame l in the lateral direction thereof toward the second frame 4 pierces the through-hole 21 provided to a substrate 2 to be fitted in the fitting part 41 provided to the intermediate part of the second frame 4 in the lateral direction thereof. The fitting part 41 is bonded to a panel 7 by an adhesive 9. Therefore, the mechanical strength of an IC card in the thickness direction at the intermediate part of a frame body 5 in the lateral direction thereof is enhanced and the bending deformation of the second frame 4 is prevented. Therefore, trouble such as the contact inferiority at the part of a connection terminal 6a is eliminated and the quality of the IC card is enhanced as a whole and reliability is enhanced. The damage of appearance due to the bending of the second frame 4 is also prevented.

Description

【発明の詳細な説明】 [産業上の利用分野1 この発明は、ICカード、特に電子部品が実装されてい
る基板、及びこの基板を外部装置に接続するためのコネ
クタを有するICカードに関するものである。
[Detailed Description of the Invention] [Industrial Application Field 1] The present invention relates to an IC card, particularly an IC card having a board on which electronic components are mounted and a connector for connecting this board to an external device. be.

[従来の技術] 第3図は従来のICカードの一例の外観を示す斜視図、
第4図は第3図の内部を示す斜視ダ、第5図は第3図の
V−V線に沿う矢視断面図である。
[Prior Art] FIG. 3 is a perspective view showing the appearance of an example of a conventional IC card;
4 is a perspective view showing the inside of FIG. 3, and FIG. 5 is a sectional view taken along the line V--V in FIG. 3.

図において、符号(1)は第1のフレーム、(2)は第
1のフレームく1)内に設けられている基板であり、こ
の基板(2)には、IC等の複数個の電子部品(3)が
実装されている。
In the figure, reference numeral (1) is a first frame, and (2) is a board provided in the first frame (1), and this board (2) has multiple electronic components such as ICs. (3) has been implemented.

(4)は幅方向端部で第1のフレーム(1)に接合され
ているとともに、幅方向中間部で第1のフレーム(1)
に対向している第2のフレーl5、(5)は第1のフレ
ーム(1)と第2のフレーム(4)とからなる枠体、(
6)は幅方向両端部の突起部(図示せず)が第1及び第
2のフレーム(1)、(4)間に挟持されることにより
枠体(5)に固定されている外部装置接続用のコネクタ
であり、このコネクタ(6)は、その接続端子(6a)
が基板(2)上に電気的に接続(はんだ付け)されてい
る。
(4) is joined to the first frame (1) at the end in the width direction, and is connected to the first frame (1) at the middle part in the width direction.
The second frame l5 (5) facing the is a frame body consisting of the first frame (1) and the second frame (4), (
6) is an external device connection in which protrusions (not shown) at both ends in the width direction are held between the first and second frames (1) and (4) to be fixed to the frame (5). This connector (6) has its connection terminal (6a)
is electrically connected (soldered) onto the substrate (2).

く7)は枠体(5)の表裏両面に接着剤(8)により接
着され、基板(2ンや電子部品(3)を保護するパネル
である。
7) is a panel that is adhered to both the front and back sides of the frame body (5) with an adhesive (8) and protects the circuit board (2) and electronic components (3).

上記のような従来のICカードにおいては、外部装置に
挿入されることにより、基板(2)がコネクタ(6)を
介して外部装置に電気的に接続される。
In the conventional IC card as described above, when the IC card is inserted into an external device, the board (2) is electrically connected to the external device via the connector (6).

[発明が解決しようとする課題] 上記のように構成された従来のICカードにおいては、
枠体く5)内の幅方向中間部、即ち接続端子(6a)の
まわりが空洞になっているため、その部分の枠体(5)
の機械的強度が弱く、特に第2のフレーム(4)の幅方
向中間部が外力に対して撓み易く、これにより第2のフ
レーム(4)が接続端子(6a)に接触して接触不良が
生じることがあるとともに、外観を損なうなどの問題点
があった。
[Problem to be solved by the invention] In the conventional IC card configured as described above,
Since the middle part in the width direction of the frame (5), that is, around the connection terminal (6a), is hollow, that part of the frame (5)
The mechanical strength of the second frame (4) is weak, and the middle part of the second frame (4) in the width direction is susceptible to bending due to external forces. In addition, there were problems such as damage to the appearance.

この発明は、上記のような問題点を解決することを課題
としてなされたちのてあり、枠体の機械的強度を高め、
第2のフレームの変形を防止し、これにより外観上の不
具合が生じるのを防止し、かつ接触不良などのトラブル
を防止して、品質を向上させるとともに、信頼性を高め
ることができるICカードを得ることを目的とする。
This invention was made with the aim of solving the above-mentioned problems, and by increasing the mechanical strength of the frame,
An IC card that prevents deformation of the second frame, prevents appearance defects, and prevents troubles such as poor contact, thereby improving quality and reliability. The purpose is to obtain.

[課題を解決するための手段] この発明に係るICカードは、第1及び第2のフレーム
の少なくともいずれか一方の幅方向中間部に、第1及び
第2のフレームの他方に係合する突起部を設けたもので
ある。
[Means for Solving the Problems] An IC card according to the present invention includes a protrusion that engages with the other of the first and second frames, in a widthwise intermediate portion of at least one of the first and second frames. It has a section.

[作用] この発明においては、第1及び第2のフレームの間に介
在する突起部を設けることにより、枠体の幅方向中間部
における機械的強度を高くする。
[Operation] In the present invention, the mechanical strength of the intermediate portion in the width direction of the frame is increased by providing the protrusion interposed between the first and second frames.

[実施例] 以下、この発明の実施例を図について説明する。[Example] Embodiments of the present invention will be described below with reference to the drawings.

第1図はこの発明の一実施例によるICカードのパネル
取付前の状態を示す斜視図、第2図は第1図のICカー
ドのパネル取付後の状態を示す第1図の■−■線に沿う
矢視断面図であり、第3図ないし第5図と同−又は相当
部分には同一符号を付し、その説明を省略する。
FIG. 1 is a perspective view showing the state of the IC card according to an embodiment of the present invention before it is attached to the panel, and FIG. 2 is a perspective view showing the state of the IC card of FIG. 1 after it is attached to the panel. It is a sectional view taken along arrows, and the same or equivalent parts as in FIGS. 3 to 5 are given the same reference numerals, and their explanations will be omitted.

図において、符号(11)は第1のフレーム(1)の幅
方向中間部に第2のフレーム(4)へ向けて垂直に設け
られている突起部としてのビンであり、このビン(11
)は、基板(2)に設けられている貫通孔(21)を貫
通して、第2のフレーム(4)の幅方向中間部に設けら
れている嵌合#(41ンに嵌合している。また、嵌合部
(41)は、接着剤(9)によりパネルく8)に接着さ
れている。
In the figure, reference numeral (11) is a bottle as a protrusion provided perpendicularly toward the second frame (4) at the middle part in the width direction of the first frame (1).
) passes through the through hole (21) provided in the substrate (2) and fits into the fitting # (41) provided at the middle part in the width direction of the second frame (4). Further, the fitting portion (41) is bonded to the panel 8) with an adhesive (9).

このようなICカードにおいては、枠体(5)内のコネ
クタ(6)側端部、即ち接続端子(6a)のまわりが、
従来と同様に空洞になっているが。
In such an IC card, the edge of the connector (6) in the frame (5), that is, around the connection terminal (6a),
Although it is hollow like before.

第1及び第2のフレーム(1)、(4)の間の幅方向中
間部にビン(11)が介在しているため、枠体(5)の
幅方向中間部におけるICカードの厚さ方向への機械的
強度が従来より高くなり、第2のフレーム(4)の撓み
変形は防止される。このため、接続端子(6a)の部分
の接触不良などのトラブルがなくなり、ICカード全体
の品質が向上するとともに、信頼性が高くなる。また、
第2のフレーム(4)の撓みにより外観が損なわれるの
が防止される。
Since the bottle (11) is interposed in the middle part in the width direction between the first and second frames (1) and (4), the thickness direction of the IC card in the middle part in the width direction of the frame (5) The mechanical strength of the second frame (4) is higher than before, and bending deformation of the second frame (4) is prevented. Therefore, troubles such as poor contact at the connection terminal (6a) are eliminated, and the overall quality of the IC card is improved, as is its reliability. Also,
Deterioration of the appearance due to deflection of the second frame (4) is prevented.

また、ビン(11)が基板〈2)を貫通することにより
、基板(2)の位置決めが確実になる。
Further, since the pin (11) passes through the substrate (2), the positioning of the substrate (2) is ensured.

さらに、上記実施例ではビン(11)の先端部を第2の
フレーム(4)に係合させるだけでなく、第2のフレー
ム(4)に嵌合部(41)を設けて嵌合させたので、第
2のフレーム(4)の位置決めも確実になる。
Furthermore, in the above embodiment, not only the tip of the bottle (11) is engaged with the second frame (4), but also a fitting part (41) is provided on the second frame (4) to make it fit. Therefore, the positioning of the second frame (4) is also ensured.

なお、上記実施例では突起部としてビン(II)を示し
たが、突起部の形状や大きさなどは上記実施例に限定さ
れない。また、突起部は複数設けてもよい。
In addition, although the bottle (II) was shown as a protrusion part in the said Example, the shape, size, etc. of a protrusion part are not limited to the said Example. Further, a plurality of protrusions may be provided.

また、上記実施例では第2のフレーム(4ンに嵌合部(
41)を設けたが5嵌合部(41)等の係合部は特に設
ける必要はなく、ビン(11)の先端を第2のフレーム
(4)に直接当接させるだけでもよい。
In addition, in the above embodiment, the fitting part (
41), but there is no particular need to provide an engaging part such as the 5 fitting part (41), and it is sufficient to simply bring the tip of the bottle (11) into direct contact with the second frame (4).

さらに、上記実施例では突起部であるビン(11)を第
1のフレーム(1)側に設けたが、第2のフレーム(4
)側に設けてもよく、また両方に設けてもよい。
Furthermore, in the above embodiment, the bottle (11), which is a protrusion, was provided on the first frame (1) side, but the second frame (4
) side or both sides.

さらにまた、突起部はフレームに一体成形したものでも
、別体を取り付けたものでもよい。
Furthermore, the protrusion may be integrally molded with the frame or may be attached separately.

また、枠体く5)とパネル(7)とが別になっているも
のを示したが、枠体(5)とパネル(7)とが一体にな
っているものでもよい。
Further, although the frame body 5) and the panel (7) are shown as being separate, the frame body (5) and the panel (7) may be integrated.

[発明の効果] 以上説明したように、この発明のICカードは、第1及
び第2のフレームの少なくともいずれか一方の幅方向中
間部に、基板を貫通して第1及び第2のフレームの他方
に係合する突起部を設けなので、枠体の機械的強度を高
めることができ、これにより第2のフレー11の変形が
防止でき、この結果、外観上の不具合が生じるのを防止
でき、かつ接触不良などのトラブルを防止して、品質を
向上させるとともに、信頼性を高めることができるなど
の効果を奏する。
[Effects of the Invention] As explained above, the IC card of the present invention has a structure that penetrates the substrate in the middle part of at least one of the first and second frames in the width direction. Since the protrusion that engages with the other side is provided, the mechanical strength of the frame can be increased, thereby preventing deformation of the second fly 11, and as a result, preventing appearance defects. Moreover, problems such as poor contact can be prevented, quality can be improved, and reliability can be increased.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例を示す斜視図、第2図は第
1図の断面図、第3図は従来のICカードの斜視図、第
4図は第3図の内部を示す斜視図、第5図は第3図の断
面図である。 図において、(1)は第1のフレーム、(2)は基板、
(3)は電子部品、(4)は第2のフし−ム、(5)は
枠体、(6)はコネクタ、(11)はビン(突起部)で
ある。 なお、各図中、同一符号は同−又は相当部分を示す。
Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is a sectional view of Fig. 1, Fig. 3 is a perspective view of a conventional IC card, and Fig. 4 is a perspective view showing the inside of Fig. 3. FIG. 5 is a sectional view of FIG. 3. In the figure, (1) is the first frame, (2) is the substrate,
(3) is an electronic component, (4) is a second frame, (5) is a frame, (6) is a connector, and (11) is a bottle (protrusion). In each figure, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims]  幅方向端部で互いに接合されているとともに、幅方向
中間部で互いに対向している第1及び第2のフレームを
有する枠体と、この枠体内に設けられているとともに、
電子部品が実装されている基板と、前記枠体に固定され
ているとともに、前記基板に電気的に接続されている外
部装置接続用のコネクタとを備えているICカードにお
いて、前記第1及び第2のフレームの少なくともいずれ
か一方の幅方向中間部に突起部が設けられており、かつ
この突起部が前記基板を貫通して前記第1及び第2のフ
レームの他方に係合していることを特徴とするICカー
ド。
A frame body having first and second frames that are joined to each other at widthwise ends and facing each other at a widthwise middle part, and provided within the frame body,
An IC card comprising: a board on which electronic components are mounted; and a connector for connecting an external device, which is fixed to the frame and electrically connected to the board; A protrusion is provided at a widthwise intermediate portion of at least one of the second frames, and the protrusion penetrates the substrate and engages with the other of the first and second frames. An IC card featuring
JP2127771A 1990-05-17 1990-05-17 IC card Expired - Fee Related JP2672880B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2127771A JP2672880B2 (en) 1990-05-17 1990-05-17 IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2127771A JP2672880B2 (en) 1990-05-17 1990-05-17 IC card

Publications (2)

Publication Number Publication Date
JPH0422693A true JPH0422693A (en) 1992-01-27
JP2672880B2 JP2672880B2 (en) 1997-11-05

Family

ID=14968290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2127771A Expired - Fee Related JP2672880B2 (en) 1990-05-17 1990-05-17 IC card

Country Status (1)

Country Link
JP (1) JP2672880B2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63252798A (en) * 1987-04-09 1988-10-19 三菱電機株式会社 Sheathing structure of ic card
JPH01288490A (en) * 1988-05-17 1989-11-20 Hitachi Maxell Ltd Memory card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63252798A (en) * 1987-04-09 1988-10-19 三菱電機株式会社 Sheathing structure of ic card
JPH01288490A (en) * 1988-05-17 1989-11-20 Hitachi Maxell Ltd Memory card

Also Published As

Publication number Publication date
JP2672880B2 (en) 1997-11-05

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