JPS6325276B2 - - Google Patents
Info
- Publication number
- JPS6325276B2 JPS6325276B2 JP60098440A JP9844085A JPS6325276B2 JP S6325276 B2 JPS6325276 B2 JP S6325276B2 JP 60098440 A JP60098440 A JP 60098440A JP 9844085 A JP9844085 A JP 9844085A JP S6325276 B2 JPS6325276 B2 JP S6325276B2
- Authority
- JP
- Japan
- Prior art keywords
- shelf board
- heat
- grooves
- firing
- inorganic fibers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010304 firing Methods 0.000 claims description 36
- 239000012784 inorganic fiber Substances 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 9
- 239000000835 fiber Substances 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 230000008602 contraction Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000011449 brick Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000008107 starch Substances 0.000 description 2
- 235000019698 starch Nutrition 0.000 description 2
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 241001122767 Theaceae Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 239000008279 sol Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Landscapes
- Furnace Charging Or Discharging (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はセラミツク製品、特に粘土質成形品で
ある茶碗、タイル、皿、カツプ等の焼成用として
用いられる棚板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a shelf board used for firing ceramic products, particularly clay molded products such as tea bowls, tiles, plates, and cups.
以下は、役物タイルを焼成する場合の実施例に
基づいて説明する。 The following will be described based on an example in which accessory tiles are fired.
第５図は、焼成炉の一例を示すスレツドキルン
１の部分縦断面図である。同図に示す如く、スレ
ツドキルン１は、焼成炉（図示せず）を貫通して
敷設された案内レール２，２上を台車３が摺動で
きるようになつている。台車３は、案内レール
２，２上にスライドプレート４，４を介して載置
された台板９と、該台板９上に敷並べられた耐火
断熱レンガ５とよりなる。このスレツドキルン１
でのタイルの焼成は、タイルが通常の平物タイル
６である場合には、前記耐火断熱レンガ５上にそ
のまま平物タイル６を載置し、炉内を通過させる
ことで行つている。またタイルが役物タイル７で
ある場合には、耐火断熱レンガ５上に棚板８を載
置し、該棚板８上に役物タイル７を載せて炉内を
通過させることで行つている。これは、役物タイ
ル７をそのまま耐火断熱レンガ５上に載置して焼
成すると、焼成時に軟化し、自重により変形する
ためである。
FIG. 5 is a partial longitudinal sectional view of a thread kiln 1 showing an example of a firing furnace. As shown in the figure, the thread kiln 1 is constructed such that a cart 3 can slide on guide rails 2, 2 which are laid through a kiln (not shown). The truck 3 consists of a base plate 9 placed on the guide rails 2, 2 via slide plates 4, 4, and fireproof insulation bricks 5 laid on the base plate 9. This thread kiln 1
When the tiles are ordinary flat tiles 6, the firing of the tiles is carried out by placing the flat tiles 6 as they are on the fireproof and insulating bricks 5 and passing them through a furnace. In addition, when the tiles are accessory tiles 7, a shelf board 8 is placed on the fireproof insulation brick 5, and the accessory tile 7 is placed on the shelf board 8 and passed through the furnace. . This is because if the accessory tile 7 is placed directly on the fireproof insulation brick 5 and fired, it will soften during firing and deform due to its own weight.
前記棚板８は、通常炭化珪素と窒化珪素及びア
ルミナ等の１種又は２種以上の混合物を主成分と
する耐熱原料の粉末を、板状に成形して高温で焼
成することにより製造している。また前記耐熱原
料の粉末にステンレス鋼繊維を容積率で0.5〜４
％混入して板状に成形し、焼成したものもある。
更には耐熱性のある軽量で高強度の棚板８とし
て、耐熱性無機繊維（一般にはセラミツクフアイ
バー）を無機結合剤と共に成形するものもある。 The shelf board 8 is usually manufactured by forming a powder of a heat-resistant raw material mainly composed of one or a mixture of two or more of silicon carbide, silicon nitride, alumina, etc. into a plate shape and firing it at a high temperature. There is. In addition, stainless steel fibers are added to the heat-resistant raw material powder at a volume ratio of 0.5 to 4.
There are also products that are mixed with 20% of the total amount of carbon dioxide, molded into a plate shape, and fired.
Furthermore, as a heat-resistant, lightweight and high-strength shelf board 8, heat-resistant inorganic fibers (generally ceramic fibers) are molded together with an inorganic binder.
ところが、炭化珪素と窒化珪素及びアルミナ等
の１種又は２種以上の混合物を主成分とする棚板
８は、耐熱性が優れているとはいえず、焼成時に
亀裂を発生し、寿命が短いという欠点があつた。
また炭化珪素と窒化珪素及びアルミナ等の１種又
は２種以上の混合物を主成分とする耐熱原料の粉
末に、ステンレス鋼繊維を混入して焼成した棚板
８では、嵩密度が1.0ｇ／cm3以上もあり、かなり
重いので取扱い作業が不便であり、運搬装置が大
型化する等の欠点があつた。また嵩密度が大きい
ために、蓄熱量が大きくなり、焼成時にタイル裏
面７ｂ側の焼成熱を奪い、表面７ａ側との間に焼
けムラを発生させ、タイル自体に反りを発生させ
るという欠点があつた。更にまた耐熱性無機繊維
を主体とする混合物で製造した棚板８は、該棚板
８の表面はガラス化されるが、裏面はガラス化の
程度が小さいため、焼成時にその表面８ａ側と裏
面８ｂ側との熱膨張収縮する度合が大きく異な
り、反り等の大きな変形を生じ、これが軟化状態
の役物タイル７へ影響を及ぼして該役物タイル７
に反り等の変形を発生させるという欠点があつ
た。
However, the shelf board 8 whose main component is one or more mixtures of silicon carbide, silicon nitride, alumina, etc. cannot be said to have excellent heat resistance, cracks occur during firing, and the lifespan is short. There was a drawback.
In addition, the shelf board 8 which is made by mixing stainless steel fibers into heat-resistant raw material powder whose main component is one or more mixtures of silicon carbide, silicon nitride, alumina, etc., has a bulk density of 1.0 g/cm. 3 or more, it is quite heavy, making it inconvenient to handle, and has drawbacks such as increasing the size of the transport device. In addition, since the bulk density is large, the amount of heat stored becomes large, and during firing, the firing heat is taken away from the back side 7b of the tile, causing uneven baking between it and the front side 7a, and causing the tile itself to warp. Ta. Furthermore, in the shelf board 8 manufactured from a mixture mainly composed of heat-resistant inorganic fibers, the front surface of the shelf board 8 is vitrified, but the degree of vitrification is small on the back surface, so that the front surface 8a side and the back surface are The degree of thermal expansion and contraction from the 8b side is greatly different, causing large deformations such as warping, which affects the softened accessory tile 7, causing the accessory tile 7 to
The disadvantage was that it caused deformation such as warping.
また従来の棚板８にあつては、その上面８ａが
フラツトであるため、役物タイル７の裏面７ｂと
密着し、焼成熱が該裏面７ｂへ伝達され難いとい
う問題があつた。このため、役物タイル７の表面
７ａと裏面７ｂとの焼成温度が不均一となり、焼
けムラの発生原因となつていた。焼けムラは役物
タイル７に反り等の変形を生じさせるものであ
る。 Further, in the case of the conventional shelf board 8, since its upper surface 8a is flat, it comes into close contact with the back surface 7b of the accessory tile 7, and there is a problem in that firing heat is difficult to be transmitted to the back surface 7b. For this reason, the firing temperature between the front surface 7a and the back surface 7b of the accessory tile 7 was non-uniform, causing uneven baking. The uneven burning causes deformation such as warping in the accessory tile 7.
要するに、従来の棚板８はそれ自身の焼成時の
熱膨張収縮による変形の問題と取扱い上の問題及
び役物タイル７の表面７ａ及び裏面７ｂとの間に
焼けムラを発生させるという問題があり、役物タ
イル７が反り等によつて変形する欠点があつた。 In short, the conventional shelf board 8 has problems with its own deformation due to thermal expansion and contraction during firing, problems with handling, and the problem of causing uneven baking between the front surface 7a and the back surface 7b of the accessory tile 7. However, there was a drawback that the accessory tile 7 was deformed due to warping or the like.
本発明は従来の棚板の上記欠点に鑑みてこれを
改良除去したものであつて、セラミツク製品の表
面と裏面との焼成温度を可及的に均一にすること
ができ、且つ棚板自身に変形の生じないものを提
供せんとするものである。 The present invention improves and eliminates the above-mentioned drawbacks of conventional shelf boards, and makes it possible to make the firing temperature on the front and back surfaces of ceramic products as uniform as possible, and to make the shelf board itself as uniform as possible. The aim is to provide products that do not undergo deformation.
本発明の問題点を解決するための手段は、実質
的に耐熱性無機繊維と無機結合剤とからなり嵩密
度が0.2〜0.5ｇ／cm3のポーラスな繊維質成形板で
あつて、少なくとも一つの表面にアルミナ、シリ
カ、アルミナ−シリカ、ジルコニア等を主体とす
る無機コーテイング剤を塗布すると共に複数の直
線状溝を前記耐熱性無機繊維の配向方向に対して
縦横に設けている。そして、前記溝の深さは前記
溝形成面に垂直な方向の繊維質成形板の寸法に対
して５〜50％の範囲とし、また各溝相互間の間隔
は前記耐熱性無機繊維の配向方向について20〜50
mmとし且つ耐熱性無機繊維の配向方向と直交する
方向について50〜100mmとしている。
Means for solving the problems of the present invention is a porous fibrous molded plate consisting essentially of heat-resistant inorganic fibers and an inorganic binder and having a bulk density of 0.2 to 0.5 g/cm 3 . An inorganic coating agent mainly composed of alumina, silica, alumina-silica, zirconia, etc. is applied to the surface of each fiber, and a plurality of linear grooves are provided in both directions in the direction of orientation of the heat-resistant inorganic fibers. The depth of the grooves is in the range of 5 to 50% of the dimension of the fibrous molded plate in the direction perpendicular to the groove forming surface, and the interval between each groove is in the orientation direction of the heat-resistant inorganic fibers. About 20~50
mm, and 50 to 100 mm in the direction orthogonal to the orientation direction of the heat-resistant inorganic fibers.
本発明の作用は、第１図乃至第４図の実施例で
明らかな如く、棚板１０の表面１０ａに直線状の
溝１１及び１２を形成することにより、焼成時に
棚板１０に発生する熱膨張収縮が耐熱性無機繊維
の配向方向及び該方向と直交する方向の双方向で
溝１１，１２により分散され、棚板１０の反り等
の変形が防止される。また棚板１０は嵩密度が低
いことから取扱いが便利であり、更には熱の通り
がよく、該棚板１０の熱伝導を通じて役物タイル
１５の裏面へ焼成熱が効率よく伝達される。しか
も、所定深さｈとした溝１１，１２を通じて役物
タイル１５の裏面１５ｂ側へ炉内雰囲気が効率よ
く伝達され、役物タイル１５の表面１５ａと裏面
１５ｂとの均一焼成が可能である。従つて、役物
タイル１５自体の焼けムラがなく、これに起因す
る反り等の変形がない。
As is clear from the embodiments shown in FIGS. 1 to 4, the function of the present invention is that by forming linear grooves 11 and 12 on the surface 10a of the shelf board 10, the heat generated in the shelf board 10 during firing is reduced. Expansion and contraction are dispersed by the grooves 11 and 12 both in the orientation direction of the heat-resistant inorganic fibers and in a direction perpendicular to the orientation direction, thereby preventing deformation such as warping of the shelf board 10. In addition, the shelf board 10 has a low bulk density, so it is convenient to handle, and furthermore, heat conduction is good, and firing heat is efficiently transferred to the back surface of the accessory tile 15 through heat conduction of the shelf board 10. Moreover, the furnace atmosphere is efficiently transmitted to the back surface 15b of the accessory tile 15 through the grooves 11 and 12 having a predetermined depth h, and uniform firing of the front surface 15a and back surface 15b of the accessory tile 15 is possible. Therefore, there is no uneven burning of the accessory tile 15 itself, and there is no deformation such as warping caused by this.
以下に本発明の構成を図面に示す実施例に基づ
いて説明すると次の通りである。 The configuration of the present invention will be explained below based on the embodiments shown in the drawings.
第１図乃至第４図は、本発明に係る棚板１０の
一実施例を示すものである。この棚板１０はその
表面１０ａ側にあつて、耐熱性無機繊維の配列方
向に棚板１０の短辺方向と平行な直線状の溝１１
を４個形成し、耐熱性無機繊維の配向方向の直交
する方向に棚板１０の長辺方向と平行な直線状の
溝１２を１個形成している。
1 to 4 show an embodiment of a shelf board 10 according to the present invention. This shelf board 10 has a linear groove 11 on its surface 10a side that is parallel to the short side direction of the shelf board 10 in the direction in which the heat-resistant inorganic fibers are arranged.
One linear groove 12 parallel to the long side direction of the shelf board 10 is formed in a direction perpendicular to the orientation direction of the heat-resistant inorganic fibers.
ところで、この棚板１０は役物タイル裏面１５
ｂの焼成温度を可及的に表面１５ａ側の焼成温度
と等しくするために、該役物タイル１５の原料と
溝１１，１２の形状及び間隔を下記の如く選択し
ている。すなわち、原料にあつては耐熱性無機繊
維と無機結合剤を主体とし、その嵩密度を低く抑
えてポーラスなものとしている。嵩密度の範囲
は、0.2〜0.5ｇ／cm2が適当である。耐熱性無機繊
維としては、セラミツクフアイバー、シリカフア
イバー、アルミナ、ムライト結晶質フアイバー等
が適当であり、少なくとも１種類が使用される。
無機結合剤としては、シリカゾル、アルミナゾ
ル、ベントナイト、カオリン、モンモリロナイト
等の通常用いられるものが使用可能である。 By the way, this shelf board 10 has the back side 15 of the accessory tile.
In order to make the firing temperature of b as equal as possible to the firing temperature of the surface 15a, the raw material of the accessory tile 15 and the shape and spacing of the grooves 11 and 12 are selected as follows. That is, the raw materials are mainly heat-resistant inorganic fibers and inorganic binders, and their bulk density is kept low to make them porous. The appropriate bulk density range is 0.2 to 0.5 g/cm 2 . As the heat-resistant inorganic fiber, ceramic fiber, silica fiber, alumina, mullite crystal fiber, etc. are suitable, and at least one of them is used.
As the inorganic binder, commonly used ones such as silica sol, alumina sol, bentonite, kaolin, montmorillonite, etc. can be used.
嵩密度を限定した理由は、これが0.2ｇ／cm3未
満であると、棚板１０自体の強度が弱くなり、重
量の比較的重たいタイルの載せ台としての使用に
耐え得ないからである。また嵩密度が0.5ｇ／cm3
を越えると、棚板１０自体の重量が重くなり過
ぎ、その取扱いに不便を生じ、更には棚板１０自
体の蓄熱量が大きくなつて熱効率が悪くなるから
である。 The reason for limiting the bulk density is that if it is less than 0.2 g/cm 3 , the strength of the shelf board 10 itself becomes weak and cannot withstand use as a platform for placing relatively heavy tiles. Also, the bulk density is 0.5g/cm 3
If it exceeds the weight, the weight of the shelf board 10 itself becomes too heavy, causing inconvenience in its handling, and furthermore, the amount of heat stored in the shelf board 10 itself increases, resulting in poor thermal efficiency.
嵩密度が前記範囲にあるときは、棚板１０は強
度及び熱効率に優れたものとなり、また取扱いが
便利である。しかもポーラスなものであり、熱の
通りが良い。この結果、焼成時にあつて該棚板１
０から役物タイル１５の裏面１５ｂ側へ熱の通り
が良くなり、前記タイル表裏面の焼成温度を可及
的に均一にする働きをする。 When the bulk density is within the above range, the shelf board 10 has excellent strength and thermal efficiency, and is convenient to handle. Moreover, it is porous and allows heat to pass through easily. As a result, when firing, the shelf board 1
0 to the back surface 15b side of the accessory tile 15, and the firing temperature on the front and back surfaces of the tile is made as uniform as possible.
また本実施例は、前記溝１１，１２の深さｈを
下記の如く限定している。すなわち、該溝１１，
１２の深さｈを、棚板１０の高さＨに対して５〜
50％の範囲とし、好ましくは25〜40％の範囲とし
ている。５％未満であると、本発明の直接目的と
する焼成時の棚板１０自体の熱膨張収縮による変
形を防止すること及び役物タイル１５の表面１５
ａと裏面１５ｂとの焼成温度の不均一をなくす効
果が得られないからである。このことについては
後述する。また前記深さｈの割合が50％を越える
と、棚板１０自体の強度が弱くなり、欠けや割れ
等が発生するからである。 Further, in this embodiment, the depth h of the grooves 11 and 12 is limited as follows. That is, the groove 11,
The depth h of 12 is 5 to 5 to the height H of the shelf board 10.
The range is 50%, preferably 25 to 40%. If it is less than 5%, the direct objective of the present invention is to prevent deformation of the shelf board 10 itself due to thermal expansion and contraction during firing, and to prevent the surface 15 of the accessory tile 15.
This is because the effect of eliminating non-uniformity in firing temperature between a and the back surface 15b cannot be obtained. This will be discussed later. Moreover, if the ratio of the depth h exceeds 50%, the strength of the shelf board 10 itself will be weakened, and chipping, cracking, etc. will occur.
更にまた前記直線状の各溝１１及び１２相互間
の間隔ｌ、Ｌは、耐熱性無機繊維の配向方向につ
いてのｌを20〜50mmとし、耐熱性無機繊維の配向
方向と直交する方向についてのＬを50〜100mmと
している。配向方向のものと配向方向に直交する
方向のものとにおいて、各溝１１と溝１２相互間
の間隔ｌ、Ｌを変えたのは、両方向において棚板
１０の収縮率が異なるからであり、収縮率の大き
い配向方向ではその間隔ｌを短くすることで、棚
板１０の反り等の変形を効率良く分散させて吸収
緩和している。而して、配向方向についてのｌを
20〜50mmとしたのは、20mm未満であると表面の凹
凸が軟化状態の役物タイルに影響して役物タイル
に変形を生じさせる虞れがあるからであり、また
50mmを越えると棚板１０自体の収縮を緩和できな
いからである。数値限定の理由は、配向方向と直
交する方向についてのＬも同じである。 Furthermore, the distances l and L between the linear grooves 11 and 12 are such that l in the orientation direction of the heat-resistant inorganic fibers is 20 to 50 mm, and L in the direction orthogonal to the orientation direction of the heat-resistant inorganic fibers. is set to 50 to 100 mm. The reason why the intervals l and L between the grooves 11 and 12 are changed in the orientation direction and in the direction orthogonal to the orientation direction is that the shrinkage rate of the shelf board 10 is different in both directions. By shortening the interval l in the direction of orientation where the ratio is large, deformations such as warpage of the shelf board 10 are efficiently dispersed and absorbed and relaxed. Therefore, l regarding the orientation direction is
The reason for setting it to 20 to 50 mm is that if it is less than 20 mm, the unevenness of the surface may affect the softened accessory tile and cause deformation of the accessory tile.
This is because if it exceeds 50 mm, the shrinkage of the shelf board 10 itself cannot be alleviated. The reason for limiting the numerical value is the same for L in the direction orthogonal to the orientation direction.
棚板１０の製造は、上述の材料の中から適宜の
材料を選択して公知の抄造法又はプレス法等で所
定形状に成形すればよい。この場合、必要に応じ
て有機結合剤（澱粉、ラテツクス、アクリル樹脂
等）、有機繊維（パルプ等）及び増粘剤（CMC、
アルギン酸ソーダ等）を添加する。有機結合剤
は、棚板１０の成形時から焼成時までの保形性を
確保するためである。 The shelf board 10 may be manufactured by selecting an appropriate material from the above-mentioned materials and forming it into a predetermined shape by a known paper forming method, pressing method, or the like. In this case, organic binders (starch, latex, acrylic resin, etc.), organic fibers (pulp, etc.) and thickeners (CMC,
(sodium alginate, etc.). The purpose of the organic binder is to ensure shape retention of the shelf board 10 from the time of molding to the time of firing.
このようにして製造された棚板１０の使用方法
は、第２図に示す如く、役物タイル１５を載置し
て焼成に備える。この載置状態は従来と変わると
ころはない。而して、この第２図に示す状態の棚
板１０をスレツドキルン１における台車３上に載
置（第５図参照）して役物タイル１５を焼成する
と、棚板１０の表面１０ａ側は炉内雰囲気に曝さ
れており、その裏面１０ｂ側は耐火断熱レンガ５
と接合しているので、表面１０ａ側と裏面１０ｂ
側との間に温度差を生じる。このため、表面１０
ａ側が裏面１０ｂ側に比較してより多く収縮し、
変形しようとする。然しながら、本棚板１０にあ
つては、両方向の各溝１１及び１２により表面１
０ａ側の収縮が分断され、更には第３図に示す如
く、該溝１１と１２自体のそれぞれの溝幅が増え
ることによつて前記収縮を吸収緩和するようにな
る。ここにおいて、収縮率の大きい耐熱性無機繊
維の配向方向では、４個の溝１１がこれを分担す
ることで、各溝１１が分担する収縮の度合と、収
縮率の小さい配向方向と直交する方向での溝１２
が分担する収縮度合とが等しくなるようにしてい
る。従つて、棚板１０の表面１０ａ側全体が収縮
する度合は従来の場合に比較して著しく減少し、
表面１０ａの平坦度は殆ど変わらない。つまり、
この棚板１０にあつては、棚板１０自体の焼成時
の変形を防止することが可能であり、軟化状態の
役物タイル１５に反り等の変形を与えることがな
い。 The method of using the shelf board 10 manufactured in this manner is as shown in FIG. 2, in which accessory tiles 15 are placed thereon and the shelf board 10 is prepared for firing. This placement condition is no different from the conventional one. When the shelf board 10 in the state shown in FIG. 2 is placed on the cart 3 in the thread kiln 1 (see FIG. 5) and the accessory tile 15 is fired, the surface 10a side of the shelf board 10 is It is exposed to the internal atmosphere, and the back side 10b is covered with fireproof insulation brick 5.
Since it is joined to the front side 10a and the back side 10b
This creates a temperature difference between the two sides. For this reason, the surface 10
The a side contracts more than the back side 10b side,
Trying to transform. However, in the case of the bookshelf board 10, the surface 1 is
The shrinkage on the 0a side is divided, and as shown in FIG. 3, the groove widths of the grooves 11 and 12 themselves increase, thereby absorbing and relaxing the shrinkage. Here, in the orientation direction of the heat-resistant inorganic fibers having a large shrinkage rate, the four grooves 11 share this, so that the degree of shrinkage shared by each groove 11 is different from the direction perpendicular to the orientation direction having a small shrinkage rate. Groove 12
The degree of contraction shared by both is made equal. Therefore, the degree of shrinkage of the entire surface 10a side of the shelf board 10 is significantly reduced compared to the conventional case.
The flatness of the surface 10a remains almost unchanged. In other words,
This shelf board 10 can prevent deformation of the shelf board 10 itself during firing, and will not cause deformation such as warping to the softened accessory tile 15.
また前記溝１１，１２は、第４図に示す如く、
炉内雰囲気を直接役物タイル１５の裏面１５ｂ側
へ案内する通路として作用し、焼成時のタイル表
面１５ａ及び１５ｂの焼成温度を可及的に均一に
する。つまり、役物タイル１５の表面１５ａ側と
裏面１５ｂ側との焼けムラを防止することが可能
である。 Further, the grooves 11 and 12 are as shown in FIG.
It acts as a passage that directly guides the atmosphere in the furnace to the back surface 15b side of the accessory tile 15, and makes the firing temperature as uniform as possible on the tile surfaces 15a and 15b during firing. That is, it is possible to prevent uneven burning between the front surface 15a side and the back surface 15b side of the accessory tile 15.
このように本実施例にあつては、溝１１及び１
２を設けることで棚板１０自体の変形を防止し、
また役物タイル１５の表裏面の焼成温度を均一に
することで焼けムラに起因するタイル自体の変形
をも防止している。このことは、次に説明する実
験結果においても明らかである。実験は、先ず耐
熱性無機繊維としてのセラミツクフアイバー（商
品名：イビウール）を85wt％準備し、これに無
機結合剤としてのシリカゾルを10wt％、有機結
合剤としての澱粉を5wt％混合した。次いで、該
混合物を抄造法により大きさ200mm×100mm×30mm
で嵩密度が0.3ｇ／cm3の棚板１０を成形し、その
表面１０ａ側に市販の帯ノコで幅２mm、深さ10mm
の溝１１及び１２を成形し、1300〜1400℃の温度
で焼成した。溝１１どうしの間隔ｌは40mm、棚板
側面から溝１２までの幅（溝１２を複数個設ける
場合は各溝１２相互間の間隔となる）Ｌは50mmで
ある。このようにして製造されたセラミツク焼成
用の棚板１０を使用して役物タイル１５を1200℃
で焼成した実験では、棚板１０及び役物タイル１
５の双方に反り等の変形は全く見られなかつた。 As described above, in this embodiment, the grooves 11 and 1
2 prevents deformation of the shelf board 10 itself,
Furthermore, by making the baking temperature uniform on the front and back surfaces of the accessory tile 15, deformation of the tile itself due to uneven baking is also prevented. This is also clear from the experimental results described below. In the experiment, first, 85 wt% of ceramic fiber (trade name: Ibiwool) was prepared as a heat-resistant inorganic fiber, and 10 wt% of silica sol as an inorganic binder and 5 wt% of starch as an organic binder were mixed with this. Next, the mixture was made into a size of 200mm x 100mm x 30mm by a papermaking method.
A shelf board 10 with a bulk density of 0.3 g/cm 3 is formed, and the surface 10a is 2 mm wide and 10 mm deep with a commercially available band saw.
Grooves 11 and 12 were formed and fired at a temperature of 1300 to 1400°C. The distance l between the grooves 11 is 40 mm, and the width L from the side surface of the shelf board to the grooves 12 (if a plurality of grooves 12 are provided, the distance between each groove 12) is 50 mm. Using the shelf board 10 for ceramic firing manufactured in this way, the accessory tile 15 is heated to 1200°C.
In the experiment, the shelf board 10 and accessory tile 1
No deformation such as warpage was observed in either of the samples.
ところで、本発明は上記実施例に限定されるも
のではなく、適宜の変更が可能である。例えば、
溝１１及び１２は棚板１０の強度が許す範囲内に
おいてその側面及び裏面等へ形成してもよい。ま
た溝１１及び１２の数等は、棚板１０の各方向で
の収縮率を勘案して適宜に設定すればよい。更
に、上述の実施例は、役物タイル焼成用の棚板に
ついて説明したが、その他のセラミツク製品の焼
成用として使用できることは言うまでもない。 By the way, the present invention is not limited to the above-described embodiments, and can be modified as appropriate. for example,
The grooves 11 and 12 may be formed on the side and back surfaces of the shelf board 10 within a range permitted by its strength. Further, the number of grooves 11 and 12, etc. may be appropriately set in consideration of the shrinkage rate in each direction of the shelf board 10. Furthermore, although the above-mentioned embodiments have been described as shelf boards for firing accessory tiles, it goes without saying that the shelf board can be used for firing other ceramic products.
以上説明したように本発明にあつては、棚板表
面に溝を形成することにより、焼成時の棚板表裏
面の熱膨張収縮差を吸収緩和することができ、反
り等の変形を防止することができる。このため、
棚板がセラミツク焼成物に変形を与える等の悪影
響は全くない。また棚板表面の溝を通して炉内雰
囲気がセラミツク焼成物の裏面へ導入され、該溝
へ導入された炉内雰囲気及び棚板自体の熱伝導を
通じてセラミツク焼成物の裏面を加熱焼成するこ
とができるので、セラミツク焼成物表裏面の焼成
温度を可及的に均一にすることが可能である。従
つて、焼けムラの発生が皆無となり、優れた品質
のセラミツク製品を焼成できる。更には本発明の
棚板は嵩密度が低く、軽量であるため取扱いが非
常に便利であり、運搬装置の小型化が可能であ
る。
As explained above, in the present invention, by forming grooves on the surface of the shelf board, the difference in thermal expansion and contraction between the front and back surfaces of the shelf board during firing can be absorbed and alleviated, thereby preventing deformation such as warping. be able to. For this reason,
The shelf board does not have any adverse effects such as deforming the ceramic fired product. In addition, the furnace atmosphere is introduced to the back side of the ceramic fired product through the grooves on the surface of the shelf board, and the back side of the ceramic fired product can be heated and fired through the heat conduction of the furnace atmosphere introduced into the grooves and the shelf board itself. , it is possible to make the firing temperature on the front and back surfaces of the ceramic fired product as uniform as possible. Therefore, there is no occurrence of uneven firing, and ceramic products of excellent quality can be fired. Furthermore, since the shelf board of the present invention has a low bulk density and is lightweight, it is very convenient to handle, and it is possible to downsize the transportation device.
第１図乃至第４図は役物タイルを焼成する棚板
に適用した本発明の実施例を示すものであり、第
１図は溝を形成した棚板を示す斜視図、第２図は
該棚板に役物タイルを載置した状態を示す斜視
図、第３図は焼成時の棚板の熱変形を示す側面
図、第４図は焼成時の炉内雰囲気が溝を通じて役
物タイル裏面へ導入される状態を示す斜視図、第
５図はスレツドキルンの縦断面図である。
１５……役物タイル、１０……棚板、１１，１
２……溝。
1 to 4 show an embodiment of the present invention applied to a shelf board for firing accessory tiles, FIG. 1 is a perspective view showing a shelf board with grooves formed therein, and FIG. Figure 3 is a side view showing the thermal deformation of the shelf board during firing. Figure 4 is a perspective view showing the state in which the accessory tile is placed on the shelf board. Figure 4 is a side view showing the thermal deformation of the shelf board during firing. FIG. 5 is a longitudinal sectional view of the thread kiln. 15... Accessory tile, 10... Shelf board, 11,1
2...Groove.
Claims (1)
なり嵩密度が0.2〜0.5ｇ／cm3のポーラスな繊維質
成形板であつて、少なくとも一つの表面に複数の
直線状溝を前記耐熱性無機繊維の配向方向に対し
て縦横に設けてなり、該溝の深さは前記溝形成面
に垂直な方向の繊維質成形板の寸法に対して５〜
50％の範囲であり、また各溝相互間の間隔は前記
耐熱性無機繊維の配向方向について20〜50mmとし
且つ耐熱性無機繊維の配向方向と直交する方向に
ついて50〜100mmとしたことを特徴とするセラミ
ツク焼成用棚板。1 A porous fibrous molded plate substantially composed of heat-resistant inorganic fibers and an inorganic binder and having a bulk density of 0.2 to 0.5 g/cm 3 , wherein at least one surface is provided with a plurality of linear grooves. The grooves are provided vertically and horizontally with respect to the orientation direction of the inorganic fibers, and the depth of the grooves is 5 to 50 mm with respect to the dimension of the fibrous molded plate in the direction perpendicular to the groove forming surface.
50%, and the distance between each groove is 20 to 50 mm in the orientation direction of the heat resistant inorganic fibers and 50 to 100 mm in the direction orthogonal to the orientation direction of the heat resistant inorganic fibers. Ceramic firing shelf board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9844085A JPS61256184A (en) | 1985-05-09 | 1985-05-09 | Shelf plate for baking ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9844085A JPS61256184A (en) | 1985-05-09 | 1985-05-09 | Shelf plate for baking ceramic |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61256184A JPS61256184A (en) | 1986-11-13 |
| JPS6325276B2 true JPS6325276B2 (en) | 1988-05-24 |
Family
ID=14219829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9844085A Granted JPS61256184A (en) | 1985-05-09 | 1985-05-09 | Shelf plate for baking ceramic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61256184A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02149337A (en) * | 1988-11-30 | 1990-06-07 | Shin Etsu Chem Co Ltd | Gas-solid phase reaction container |
| CN107935615A (en) * | 2017-12-10 | 2018-04-20 | 湖南仁海科技材料发展有限公司 | A kind of light porous load bearing board and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5627563A (en) * | 1979-08-14 | 1981-03-17 | Tokyo Electric Power Co Inc:The | Writing, picture paper storing method |
| JPS58172270A (en) * | 1982-03-31 | 1983-10-11 | 松下電器産業株式会社 | Ceramic baking method |
-
1985
- 1985-05-09 JP JP9844085A patent/JPS61256184A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5627563A (en) * | 1979-08-14 | 1981-03-17 | Tokyo Electric Power Co Inc:The | Writing, picture paper storing method |
| JPS58172270A (en) * | 1982-03-31 | 1983-10-11 | 松下電器産業株式会社 | Ceramic baking method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61256184A (en) | 1986-11-13 |
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