JPS6325013B2 - - Google Patents
Info
- Publication number
- JPS6325013B2 JPS6325013B2 JP60198536A JP19853685A JPS6325013B2 JP S6325013 B2 JPS6325013 B2 JP S6325013B2 JP 60198536 A JP60198536 A JP 60198536A JP 19853685 A JP19853685 A JP 19853685A JP S6325013 B2 JPS6325013 B2 JP S6325013B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- less
- ppm
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60198536A JPS6259627A (ja) | 1985-09-10 | 1985-09-10 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60198536A JPS6259627A (ja) | 1985-09-10 | 1985-09-10 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6259627A JPS6259627A (ja) | 1987-03-16 |
| JPS6325013B2 true JPS6325013B2 (enExample) | 1988-05-24 |
Family
ID=16392782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60198536A Granted JPS6259627A (ja) | 1985-09-10 | 1985-09-10 | エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6259627A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4110219A1 (de) * | 1991-03-28 | 1992-10-01 | Huels Troisdorf | Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz |
-
1985
- 1985-09-10 JP JP60198536A patent/JPS6259627A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6259627A (ja) | 1987-03-16 |
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