JPS63249065A - Hydraulic type heat shock testing apparatus - Google Patents

Abstract

PURPOSE:To reduce the running cost of the title apparatus and to enhance the safety thereof, by heating the heating medium of a low temp. tank using the emitting gas on the high temp. side of the two refrigerant cycle. CONSTITUTION:The cooling medium gas emitted from the first compressor 21 of the first refrigerating cycle A radiates heat to the open air or cooling water in a condenser 22 to be condensed. This condensate is reduced in pressure by the first expansion valve 23 to flow in a cascade heat exchanger 8 and the cooling medium gas emitted from the second compressor 7 of the second refrigerating cycle B radiates heat to the first refrigerating cycle A in the cascade heat exchanger 8 to be cooled and condensed. This condensate flows in a post-evaporator 6 by the second expansion valve 9 and allows the heating medium of a low temp. tank to cool and evaporate to return to the second compressor 7. At this time, a control valve 31 is subjected to ON-OFF or proportional control in order to prevent the excessive cooling of the low temp. tank 5 and the cooling medium gas from the first compressor 21 is allowed to flow in a heater 10 to heat a heating medium 2 so as to control the temp. thereof. Since temp. is controlled without using an electric heater as mentioned above, running cost is lowered.

Description

[Detailed Description of the Invention] [Industrial Use of Heat] The present invention relates to a thermal shock testing device that performs repeated cooling and heating tests on semiconductors, etc.! ! ! The structure is related to reducing the running cost of the cryostat and improving the safety performance of the equipment.

(Prior art) In conventional equipment, the temperature of the cryostat is controlled by a cooler and a heater, as described in IC No. 60-129658, but the effect on the heat medium of the heater is No consideration was given to the impact, running costs, safety, etc.

(Interval point to be solved by the invention) In the above conventional technology, when the cold side of the low temperature chamber is heated with a cooler and then heated with an electric heater, the number of electric power types increases accordingly.
There is a problem that the running cost of the device becomes high. In addition, the heat medium used in cryostat 1 has a low pour point but also a low boiling point, so if an electric heater or the like is used, the surface temperature will be 200°.
If the temperature exceeds C and the liquid level is extremely lowered, there is a problem that the heat medium will decompose and gases that are harmful to the human body will be generated, which requires complicated liquid level control.

(Means for Solving the Problems) The above object is achieved by heating the heat medium in the low temperature chamber using the discharge gas from the high temperature side of the binary refrigeration cycle.

[Effect]

The refrigerant gas discharged from the first compressor 21 of the first refrigeration cycle A radiates heat to the outside air or cooling water and condenses at condensation@22. This condensed liquid is depressurized by the first expansion valve 28 and flows into the cascade heat exchanger 8, where it evaporates through heat exchange with the second refrigeration cycle B and returns to the first compressor 21. The refrigerant gas discharged from the second compression @7 of the second refrigeration cycle B is cooled by radiating heat to the first refrigeration cycle A in the cascade heat exchanger 8, and is condensed.This condensed liquid is transferred to the second expansion valve. At 9, the heat transfer medium flows into the evaporator 6, where it is cooled and evaporated, and returns to the second compressor 7. At this time, the cryostat 5
In order to prevent the inside from being too cooled, the control valve 81 of the hot gas outgoing path system 29A is controlled (ON-OFF or proportional control) by a signal from a temperature sensor (not shown) installed in the low temperature chamber 5, and the first compression Refrigerant gas from the machine 21 is made to flow into the heater 10 to heat the heat medium 2 and adjust its temperature.

In this way, since the temperature of the heat medium in the low 12iR11S can be controlled without using an electric heater, the running cost +t- can be reduced. Furthermore, since the temperature ri of the medium gas is around 100° C., the surface temperature of the heater does not become extremely high and the heat medium is not thermally decomposed. Additionally, safety is improved because the number of locations where electric heaters are used is reduced.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2E. FIG. 1 is a system diagram showing the configuration of equipment in the liquid thermal shock testing apparatus of the present invention, and FIG. 2 is a system diagram of a low temperature chamber and a refrigeration cycle. Reference numeral 16 denotes the main body of the apparatus, and the internal f is a high-temperature tank 1 and a low-temperature tank 5, which are appropriately arranged. It is equipped with a stirrer 8 for this purpose. Further, a water reservoir 18 is connected to the high temperature tank 1 by piping to replenish the heat medium 2 which decreases due to evaporation or the like during the test. On the other hand, in the cryostat 5.

Evaporator 6 for lowering the heat medium 2 to a predetermined low m content
．． It is equipped with a heater 10 for controlling and maintaining the temperature, and a stirrer 11 for stirring the inside of the low temperature bath 5. A 7t-jm2 compressor is connected to the evaporator 6 by the pipe 1, and a second expansion valve 9 and a cascade heat exchanger 1S8 are connected in series by an arrangement U to form a second refrigeration cycle. There is. Further, the heater 10 is connected in series with a first refrigeration cycle composed of a first compressor 21, a condenser 22, a first expansion valve 28, and a cascade heat exchanger 8 through piping. It is configured to allow discharge gas from to flow in therein. When performing a thermal shock test, the high temperature bath 1 heats the heat medium 2 with the electric heater 4.

The heat medium 2 is maintained at a predetermined high temperature, and the cryostat 5 performs a refrigeration cycle operation to cool the heat medium 2 with an evaporator 6, and when it reaches a predetermined low temperature, the temperature is maintained by a heater 10#. Next, a sample is placed in the sample 115 and driven by the drive device 14, and is alternately taken in and out of the low temperature bath 5 or the high temperature bath 1 to perform a low temperature test and a high temperature test. At this time, the temperature inside the cryostat 5 is controlled as shown in FIG. The hot gas from the first pressure a@21 is controlled by opening and closing the control valve 81. Control valve opening/closing force method ri Highly accurate AT-17 trawl is possible by performing 0N-OF'F, proportional control, etc. using a signal from a temperature sensor (not shown) installed inside the low-low tank 5. becomes. According to this embodiment, the temperature of the heat medium 2 in the low temperature chamber 5 can be controlled without using an electric heater, so running costs can be reduced. Additionally, safety is improved because the number of locations where electric heaters are used is reduced. In addition, it can be used in a way that matches the physical properties of the heating medium, and does not generate harmful gases, improving safety. Furthermore, if the temperature is controlled using the III-IN valve 81 as in this embodiment, highly accurate temperature control is also possible.

(Effects of the Invention) According to the present invention, the temperature of the cryostat can be controlled without using an electric heater, so the running cost of the device can be reduced, and the number of places where the electric heater is used is reduced, so safety is improved. It gets expensive.

[Brief explanation of the drawing]

FIG. 1 is a structural diagram of equipment of a thermal shock test apparatus according to an embodiment of the present invention, and FIG. 2 is a diagram showing a low temperature chamber and a refrigeration cycle system. l...High temperature tank 5...Low temperature tank 14...Drive device 15...Sample t'$1 Figure +1

Claims (1)

[Scope of Claims] 1. A low-temperature chamber that maintains a liquid heat medium at a low temperature by a cooling means and a heating means, and a high-temperature bath that maintains a liquid heat medium at a high temperature by a heating means are appropriately arranged, and the test article is moved by a moving means. In the liquid type thermal shock test device that alternately takes in and out of each tank, the first refrigeration cycle and the second compressor are composed of a first compressor, a condenser, a first expansion valve, and a cascade heat exchanger, and A second refrigeration cycle composed of an exchanger, a second expansion valve, and an evaporator, and a heater,
A liquid thermal shock test characterized in that the evaporator of the second refrigeration cycle and the heater are arranged in a low temperature chamber, and the hot gas of the first refrigeration cycle is allowed to flow into the heater. Device. 2. The liquid type thermal shock test apparatus according to claim 1, characterized in that a proportional control valve is used to control the inflow of hot gas into the heater.