JPS63248683A - Magazine stopper - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a magazine stopper for storing semiconductor devices.

[Conventional technology]

Regarding the magazine stopper, see Japanese Patent Application Laid-Open No. 59-35455.
It is stated in the No. As shown in FIG. 4, its outline includes an upper plug 2 composed of a plurality of saw blade-shaped parts 1, and a flat plate-shaped part formed so as to protrude outside the magazine 3 when the upper plug 2 is inserted into the magazine 3. It consists of an external protrusion 4.

[Problem that the invention seeks to solve]

However, when the above-described magazine stopper 5 is used to transport ceramic electronic components, there is a risk that the product may be damaged because it cannot absorb external shocks.

An object of the present invention is to provide a technique that allows semiconductor devices housed in a magazine to be transported without being damaged.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

That is, in the magazine stopper, a shock absorbing mechanism is provided in a portion that protrudes from the magazine.
[Function] According to the above-mentioned means, damage to the semiconductor device can be prevented by absorbing the shock applied to the magazine stopper from the outside by the shock absorbing mechanism without directly transmitting it to the semiconductor device inside the magazine. It is preventable.

〔Example〕

Hereinafter, a magazine stopper that is an embodiment of the present invention will be described using FIGS. 1 and 2.

The entire magazine stopper 6 is made of an elastic material such as synthetic resin, and the upper stopper 7 at one end has a plurality of saw blade-shaped parts that can be attached to and detached from the inner wall surface of the magazine 9 to prevent the ejector from falling out of the magazine 8. It is formed to fit freely. 10
is an external protrusion formed to protrude outside the magazine to prevent the magazine stopper 6 from being inserted into the magazine 9 more than necessary. Reference numeral 11 denotes a shock absorption mechanism in which a hole/I/12 is formed to absorb external force from the direction F. When force is applied, the hole collapses, and the shock is directly transferred from the magazine stopper 6. It is designed to be relaxed without being transmitted to the semiconductor device 13.

Next, the effects of this embodiment will be explained.

(11 By forming a shock absorbing mechanism in the magazine stopper, when an external shock is applied to the magazine stopper, the shock is absorbed without being directly transmitted to the semiconductor device, which eliminates the problem of damage to the semiconductor device. The effect of reducing this can be obtained.

(2) By integrally forming the shock absorbing mechanism on the magazine stopper using the same material, it is possible to suppress an increase in cost and to achieve the effect that the work of inserting the stopper into the magazine is extremely simple.

Although the present invention has been specifically described above based on the invention made by the present inventor, it goes without saying that the present invention is not limited to the above-mentioned embodiments, and can be modified in various ways without departing from the gist thereof. For example, the hole is not limited to the cylindrical shape as in the third person figure, but may be prismatic. Further, as shown in FIG. 3B, the shock absorbing mechanism may be constructed of easily bendable fins 14. Furthermore, a hole may be formed in the upper stopper 7 to absorb impact.

In the above description, the invention made by the present inventor was mainly applied to a magazine stopper for a magazine for storing semiconductor devices, which is the background field of application, but the invention is not limited to this, for example, It can be applied to magazine stoppers for storing various small items.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

That is, it is possible to absorb the impact applied to the magazine stopper and prevent damage to the semiconductor device.

[Brief explanation of the drawing]

Fig. 1 is a magazine stopper that is an embodiment of the present invention, Fig. 2 is an explanatory diagram of the operation of the stopper, Figs. 3A and 3B are magazine stoppers of other embodiments of the present invention, and Fig. 4 is a conventional one. It is an explanatory view of a stopper. 6... Magazine stopper, 7... Top plug, 8... Serrated portion, 9... Magazine, 10... External protrusion,
11...Shock absorption mechanism, 12...Hole, 13...
- Semiconductor device, 14... fin. Agent: Patent Attorney Katsuo Ogawa ゛No. 1
Fig. /υ Fig. 2/3 De\176' Fig. 1 Fig. 1

Claims (1)

[Claims] 1. A magazine stopper that is removably attached to both ends of a cylindrical magazine that accommodates a plurality of semiconductor devices in series, one end of which is fitted into the magazine, and the other end of which protrudes from the magazine; A magazine stopper characterized in that a shock absorbing mechanism is formed in the protruding portion.