JP2008222248A - Lid packaging method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lid packaging method whereby deformation of lids during packaging is prevented, packaged lids are prevented from being displaced and rubbed by one another during their transport or conveyance, and the lids can be easily taken out when used. <P>SOLUTION: To accommodate the lids 4 in a hollow stick 1, a dummy block 2 is disposed in the hollow stick 1 such that while the dummy block 2 is gradually moved downward by a drive mechanism, the lids 4 are inserted from the opening 1a in the upper part of the hollow stick 1 and thereby laid over the dummy block 2. In this case, an interval between the opening 1a in the upper part of the hollow stick 1 and the top face of the uppermost lid 4 on the dummy block 2 is in the range of 0 to 20 mm. Thereafter, the dummy block 2 is removed, rubber caps or resin caps 6 are pushed in the upper and lower openings of the hollow stick 1, thereby sealing the openings so that the lids 4 in the hollow stick 1 are sandwiched from above and below by the upper and lower rubber caps or resin caps 6. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for packing a lid used to seal a hollow portion of a hollow package that houses electronic components such as electronic circuits, semiconductors, and piezoelectric vibrators.

  The lid used to seal the hollow portion of the hollow package that houses the electronic components is generally formed from a metal material such as Kovar material, 42 alloy material, silver brazing material, gold tin material, solder material, etc. At the time of packing, one or a plurality of sheets are packed and packed.

  There are aeration packaging and vacuum packaging as forms of such packaging, but in the case of aeration packaging, the lid moves in the bag during transportation or movement of the lid. Alternatively, the lid and the bag rub against each other, and metal powder is generated from the lid. This metal powder, particularly a metal powder having a particle size of 3 μm or more, has an adverse effect such as causing a circuit short circuit in an electronic component in the hollow package. Further, even in the case of vacuum packaging, since the lid has a thin plate thickness of 0.2 mm or less and 0.03 mm or more, if the vacuum is strongly applied, the lid is deformed, so that complete vacuum packaging cannot be performed. Therefore, even in the case of vacuum packaging, there is a problem in that metal powder is generated due to rubbing between the lids or between the lid and the bag, as in the case of air-filled packaging.

  In the case of packaged packaging, it is necessary to take out the lid from the bag when using the lid and insert it into a lid supply jig or the like to the seam welding machine or EB sealing machine. There is also a problem that it takes much time and cost.

  On the other hand, Patent Document 1 discloses a method of sequentially stacking and storing a large number of plate-like chip components in a hollow state in a hollow hollow stick. Specifically, in the method of Patent Document 1, the chip components are inserted in a horizontal state from the upper opening of the hollow stick, and are sequentially placed and stacked on a receiving seat of a receiving spring disposed in the hollow stick. At this time, the receiving springs arranged in the hollow sticks are sequentially lowered by being pushed down by the stacked chip components.

  According to the method of Patent Document 1, a packaging body in which a large number of chip components are horizontally stacked in a hollow stick can be obtained. When using chip components, one by one from the opening of the hollow stick. It can be taken out, and the working time and cost can be reduced compared with the case of the above-mentioned packaged packaging.

  However, in the method of Patent Document 1, as described above, since the receiving spring arranged in the hollow stick is pushed down by the chip components to be stacked, excessive force is applied to the chip components when the receiving spring is pushed down. The chip parts may be damaged. In particular, when a thin lid having a thickness of 0.2 mm or less and 0.03 mm or more, which is an object of the present invention, is stored in a hollow stick by the method of Patent Document 1, it is added to the lid to push down the receiving spring. The force cannot be ignored and causes the lid to deform.

Further, as described in Patent Document 1, it is not sufficient as a packing form to simply stack and store the chip components in the hollow stick in a horizontal state. That is, the chip parts are only stacked in the vertical direction in the hollow stick, and are not restricted in the vertical direction. Therefore, if the chip parts are transported or moved in this state, the chip parts are vertically moved in the hollow stick. The chip parts are rubbed against each other in the direction. Therefore, even if this method of Patent Document 1 is applied to the lid packaging described above, the problem that metal powder is generated due to rubbing of the lids is not solved.
JP 2000-68687 A

  The problem to be solved by the present invention is that the lid is not deformed during packing, the packed lid is not displaced and rubbed during transportation or movement, and when the lid is used, An object of the present invention is to provide a lid packaging method that can be easily taken out.

  The lid packaging method of the present invention is obtained by sequentially stacking and storing lids having a thickness of 0.2 mm or less and 0.03 mm or more in a hollow hollow stick having openings at the top and bottom in a horizontal state, The basic structure is to push and seal the upper and lower openings of the stick with a rubber plug or a resin plug.

  When the lid is stored in the hollow stick, a dummy block is placed in the hollow stick, and the dummy block is sequentially lowered by the drive mechanism while inserting the lid from the upper opening of the hollow stick. The lid is laminated on the block, and at this time, the distance between the upper opening of the hollow stick and the upper surface of the uppermost lid on the dummy block is set within a range of 0 to 20 mm.

  As described above, in the present invention, since the dummy blocks are sequentially lowered by the driving mechanism, it is not necessary to push down the lid in order to lower the dummy blocks. Accordingly, no extra force is applied to the lid during packing, and the lid is not deformed.

  Further, when the lid is stored in the hollow stick, the gap between the upper opening of the hollow stick and the upper surface of the uppermost lid on the dummy block is within a range of 0 to 20 mm, so that the lid Can be reliably stacked in a horizontal state. In other words, when the distance exceeds 20 mm, the lid body tends to be in a vertical state (also referred to as vertical insertion) in the hollow stick, and cannot be reliably stacked in a horizontal state. In addition, when the said space | interval is too small, when a cover body is accommodated in a hollow stick, there exists a possibility that a cover body may fall down, Therefore It is preferable that the said space | interval shall be in the range of 2-20 mm. The range is more preferable, and it is more preferable that the range be constant within this range.

  In addition, when the thickness of the lid is less than 0.03 mm, it is difficult to store the lid reliably in a horizontal state, and the lid may be entangled by being deformed in a vertically inserted state.

  In the present invention, after the lid is stored in the hollow stick, the dummy block is removed, and the upper and lower openings of the hollow stick are pushed and sealed with a rubber plug or a resin plug, and the hollow stick is sealed with the upper and lower rubber plugs or resin plugs. Hold the top and bottom of the inner lid. As a result, the lid is securely held in the hollow stick, and does not rub off during transportation or movement.

  As the hollow stick used in the present invention, it is preferable to use a hollow stick having a clearance of 0.005 to 0.5 mm between the peripheral surface of the hollow portion and the outer periphery of the lid body to be stored. By setting the clearance within this range, the lid can be reliably held in the hollow stick. Conversely, if the clearance is less than 0.005 mm, problems such as vertical entry and deformation of the lid are likely to occur. It becomes easier to occur as the thickness of the lid becomes thinner.

  The shape of the hollow portion of the hollow stick and the lid body in plan view is generally square or rectangular. In this case, the corner R of the hollow portion is preferably 0 to 1.0 mm. When the corner R of the hollow portion exceeds 1.0 mm, the corner portion of the lid body comes into contact with the corner portion of the hollow portion, and the lid body is easily deformed.

  The hollow stick is preferably made of a material such as vinyl chloride resin or polyethylene terephthalate resin, which is coated with an antistatic agent to prevent generation of static electricity. Moreover, in order to prevent a part of the plasticizer contained in the constituent material of the upper and lower rubber stoppers or the resin stopper from oozing out from the tip portion, the material of the tip portion is prevented. Is preferably made of hard rubber.

  According to the present invention, the lid body is not deformed at the time of packing, and the packed lid body is not displaced and rubbed during transportation or movement. Therefore, by using the present invention for the packaging of the lid used to seal the hollow portion of the hollow package for electronic components, it is possible to prevent the lids from rubbing and generating metal powder after assembly. It is possible to prevent a problem such as a circuit short circuit from occurring in an electronic component in the hollow package.

  Furthermore, when using the lid, it can be taken out one by one from the upper or lower opening of the hollow stick, and the working time and cost can be reduced as compared with the case of the conventional packaged packing.

  Embodiments of the present invention will be described below with reference to the drawings.

  In the lid packing method according to the present invention, first, the lid is housed in a hollow hollow stick having upper and lower openings. At this time, as shown in FIG. 1, the dummy block 2 is arranged in the hollow stick 1. A support bar 3 is connected to the lower end of the dummy block 2, and the dummy block 2 can be moved up and down by connecting the support bar 3 to a drive mechanism such as a cylinder (not shown).

  When the lid 4 is stored in the hollow stick 1, the lid 4 is inserted from the upper opening 1a of the hollow stick 1 while the dummy block 2 is sequentially lowered by the drive mechanism, The lid 4 is laminated on the substrate. At this time, in consideration of the insertion speed of the lid 4, the lowering speed of the dummy block 2 is adjusted by the drive mechanism, and the distance between the upper opening 1 a of the hollow stick 1 and the upper surface of the upper lid on the dummy block is adjusted. 5 is made constant within a range of 0 to 20 mm.

  When the storage of the lid body 4 in the hollow stick 1 is completed, the upper opening 1a of the hollow stick 1 is pressed and sealed with a rubber plug or a resin plug 6, and then the lid body 4 is packed in the hollow stick 1 In the finished state, the dummy block 2 has a shape that protrudes half from the lower opening of the hollow stick 1 so that the dummy block 2 is turned upside down and the dummy block 2 is removed, as shown in FIG. The lower opening is pressed and sealed with a rubber plug or a resin plug 6, and the upper and lower sides of the lid body 4 in the hollow stick 1 are held between the upper and lower rubber plugs or the resin plug 6. These operations are performed by handling operations by the operator.

  Next, a method for automating the storage of the lid 4 in the hollow stick 1 will be described.

  FIG. 3 shows a first example. In this example, the lid body 4 delivered from the lid body feeder 7 is transported to the slide base 9 by the transport device 8, and the lid body 4 in the hollow stick 1 is fed by the slide base 9. In addition, since the silver brazing material and the nickel plating material are mainly used for the lid 4, the situation of the front and back surfaces is different. In the case of the silver brazing material, the front side is silver brazing and the back side is nickel. In the case of a nickel plating material, the edge sag surface generated at the time of the punching press is distinguished from the front side and the edge burr side is the back side, and it is indispensable to pack the lid 4 on the same surface. A reflected light sensor 10 is attached immediately before moving from the lid supply unit 6 to the transport device 8, thereby determining the front and back of the lid 4, and an air ejection nozzle is provided for the lid 4 so as to align with the specified surface side. After preparing the front and back with the front and back sorting gates 11, the slide 9 is slid from the transport device 8, so that the hollow stick 1 is filled.

  At that time, the lid 4 that has not become the front surface or the rear surface that has been defined as a specified surface is blown to a collection box (not shown) by the injection pressure from the air ejection nozzle.

  FIG. 4 shows a second example. In this example, the lid body 4 delivered from the lid body feeder 7 is transported by the transport device 8, and further, the lid body 4 is transported to the positioning table 14 by the first suction arm 12, and then the lid body is transported by the second suction arm 13. Insert the body into the hollow stick 1. The positioning table 14 is provided with an image processing device 15, thereby determining the front and back of the lid 4, and arranging the front and back with the front and back sorting gate 11 provided with the air ejection nozzle provided on the determination table 14. Fill the hollow stick 1 with At this time, the lid body 4 that has not become the front surface or the back surface as the specified surface is collected in the same manner as in the first example.

  By the method described with reference to FIGS. 3 and 4, a lid for a hollow package for electronic components (length 6.2 × width 4.4 × thickness 0.1 mm) was accommodated in a hollow stick. The hollow stick was made of vinyl chloride, and a cationic surfactant was applied to the peripheral surface of the hollow portion as an antistatic agent. In addition, the clearance between the peripheral surface of the hollow portion of the hollow stick and the outer periphery of the lid was set to 0.2 mm. That is, the cross-sectional dimension of the hollow part of the hollow stick was 6.6 × length × 4.8 mm (corner R: maximum 0.3 mm). Further, the interval 5 described in FIG. 1 is made constant at 5 mm.

  In the example of FIG. 3, 500,000 covers per day, 700,000 lids per day, and in the example of FIG. 4, 200 covers per minute, 280,000 lids per day, trouble with the hollow stick. We were able to store without.

  In this way, after storing the lid in the hollow stick, the upper and lower openings of the hollow stick are sealed with rubber plugs, and the upper and lower sides of the lid in the hollow stick are sandwiched between the upper and lower rubber plugs to did.

  The package (Example) was transported by about 600 km, and the degree of generation of metal powder (dust) by transportation was evaluated. Specifically, as shown in FIG. 5, a mending tape 16 made by Sumitomo 3M was affixed to the lid 4 after transportation, and the metal powder adhering after peeling it was counted for 3 μm or more. Moreover, the same evaluation was performed also about the conventional bag-packed goods as a comparative example. In both Examples and Comparative Examples, 32 lids were evaluated and the average number of metal powders was determined.

The results are shown in Table 1.

  From Table 1, it can be seen that in the examples of the present invention, the number of metal powders generated by transportation is significantly reduced as compared with the comparative examples.

It is sectional drawing which shows the state which accommodates a cover body in a hollow stick in this invention. It is a perspective view which shows the state which seals the upper and lower opening part of a hollow stick after accommodating a cover body in a hollow stick in this invention. It is explanatory drawing which shows the 1st example for accommodating a cover body automatically in a hollow stick in this invention. It is explanatory drawing which shows the 2nd example for accommodating a cover body automatically in a hollow stick in this invention. It is explanatory drawing which shows the method of evaluating the grade of generation | occurrence | production of the metal powder by transport of a cover body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Hollow stick 2 Dummy block 3 Support rod 4 Cover body 5 Space | interval 6 Rubber stopper or resin stopper 7 Cover body feeder 8 Conveying device 9 Slide base 10 Reflected light sensor 11 Front / back sorting gate 12 First suction arm 13 Second suction arm 14 Positioning Table 15 Image processing device 16 Mending tape

Claims (3)

After a lid having a plate thickness of 0.2 mm or less and 0.03 mm or more is sequentially stacked and stored in a hollow hollow stick having openings at the top and bottom in a horizontal state, the upper and lower openings of the hollow stick are plugged into rubber plugs or A method of packing a lid that is sealed with a resin stopper,
When the lid is stored in the hollow stick, a dummy block is arranged in the hollow stick, and the dummy block is sequentially lowered by the drive mechanism, and the lid is inserted from the upper opening of the hollow stick and placed on the dummy block. The lid is laminated, and at this time, the distance between the upper opening of the hollow stick and the upper surface of the upper lid on the dummy block is in the range of 0 to 20 mm.
Thereafter, the dummy block is removed, and the upper and lower openings of the hollow stick are pressed and sealed with rubber plugs or resin plugs to hold the upper and lower sides of the lid in the hollow stick.   The method of packing a lid according to claim 1, wherein a hollow stick having a clearance between the peripheral surface of the hollow portion and the outer periphery of the lid to be stored is 0.005 to 0.5 mm.   The method for packing a lid according to claim 2, wherein the hollow stick and the lid have a square or rectangular shape in plan view, and a hollow stick having a corner R of 0 to 1.0 mm is used.

Images