JPS624085A - Tube for housing semiconductor device - Google Patents

Tube for housing semiconductor device

Info

Publication number
JPS624085A
JPS624085A JP60135512A JP13551285A JPS624085A JP S624085 A JPS624085 A JP S624085A JP 60135512 A JP60135512 A JP 60135512A JP 13551285 A JP13551285 A JP 13551285A JP S624085 A JPS624085 A JP S624085A
Authority
JP
Japan
Prior art keywords
semiconductor device
tube
tube body
housing
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60135512A
Other languages
Japanese (ja)
Inventor
鈴木 瑞一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60135512A priority Critical patent/JPS624085A/en
Publication of JPS624085A publication Critical patent/JPS624085A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の収納に用いる収納用チューブに関
するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a housing tube used for housing semiconductor devices.

〔従来の技術〕[Conventional technology]

この種の収納用チューブは第2図に示すように、チュー
ブ本体1内に収納空間1cLを設け、その両端に半導体
装置2の出入れ用開口1bを設け、凸状に隆起する底部
ICに半導体装置2を跨らせて該半導体装置2を列状に
並べこれを収納するものである。
As shown in FIG. 2, this type of storage tube has a storage space 1cL in the tube body 1, an opening 1b for loading and unloading the semiconductor device 2 at both ends, and a convexly raised bottom IC. The semiconductor devices 2 are arranged in a row and housed with the devices 2 straddling each other.

一般に収納用チューブとこれに収納された半導体装置と
の間には隙間3があり、半導体装置2は固定されていな
い。
Generally, there is a gap 3 between the storage tube and the semiconductor device stored therein, and the semiconductor device 2 is not fixed.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

そのため、収納用チューブに加わる衝撃や振動が原因で
、チューブ内の半導体装置が破損するという問題があっ
た。
Therefore, there has been a problem in that the semiconductor devices inside the tube are damaged due to shocks and vibrations applied to the housing tube.

本発明は収納用チューブに挿入された半導体装置から力
を受けて該半導体装置を固定する収納用チューブを提供
するものである。
The present invention provides a housing tube that receives force from a semiconductor device inserted into the housing tube and fixes the semiconductor device therein.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は複数個の半導体装置を列状に並べてこれを収納
する収納用チューブにおいて、チューブ本体内に挿入さ
れた半導体装置に押圧されて弾性変形しその弾性力をも
って該半導体装置をチューブ本体の内壁に圧接する弾性
突起を本体内に有することを特徴とする半導体装置の収
納用チューブである。
The present invention provides a housing tube for storing a plurality of semiconductor devices arranged in a row, which is elastically deformed by being pressed by a semiconductor device inserted into the tube body, and the semiconductor device is pushed against the inner wall of the tube body by the elastic force. This is a tube for housing a semiconductor device, characterized by having an elastic protrusion inside the main body that comes into pressure contact with the main body.

〔実施例〕〔Example〕

以下、本発明の一実施例を図によって説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

第1図(ω、(b) 、 (c)において、チューブ本
体1は収納しようとする半導体装置を象った形状の収納
空間1αを有し、収納空間1αの両端は半導体装置の出
入れの開口1b、1bとなっている点は従来と同様な構
造である。
In Fig. 1 (ω, (b) and (c)), the tube body 1 has a storage space 1α shaped like the semiconductor device to be stored, and both ends of the storage space 1α are used for loading and unloading the semiconductor device. The structure is similar to the conventional one in that the openings 1b and 1b are provided.

本発明は収納空間1αの凸状に隆起させた底部ICに弾
性突起1dを傾斜させて上向きに複数個長さ方向に一定
間隔をあけて一体に設けたものである。
In the present invention, a plurality of elastic protrusions 1d are integrally provided on the convexly raised bottom IC of the storage space 1α so as to face upward at regular intervals.

今、弾性突起1αが上傾する側の開口と反対側の開口す
なわち第1図(b)において左端の開口1bから半導体
装置2をチューブ本体1内に挿入する0本発明では収納
空間1α内に弾性突起1dが設けられており、半導体装
置2は弾性突起1dを左端から次々と弾性変形させつつ
チューブ本体1内に押し込まれる・このようにして複数
個の半導体装置2は弾性突起1dを変形させつつチュー
ブ本体1内に列状に収納される。
Now, the semiconductor device 2 is inserted into the tube body 1 from the opening on the opposite side to the opening on the side where the elastic protrusion 1α is inclined upward, that is, the opening 1b at the left end in FIG. An elastic protrusion 1d is provided, and the semiconductor device 2 is pushed into the tube body 1 while elastically deforming the elastic protrusion 1d one after another from the left end. In this way, the plurality of semiconductor devices 2 deform the elastic protrusion 1d. They are housed in a row within the tube body 1.

チューブ本体1内に押し込まれた半導体装置2は弾性変
形した突起1dの変形による弾性力を受けて収納室間1
αの上部内壁に押し付けられ密着する。
The semiconductor device 2 pushed into the tube body 1 is moved between the storage chambers 1 by the elastic force caused by the deformation of the elastically deformed protrusion 1d.
It is pressed against the upper inner wall of α and comes into close contact with it.

したがって、各半導体装置2は突起1dから押圧力を受
けてチューブ本体1に密着し、チューブ本体1と半導体
装置2との間の摩擦力にて前後左右の動きが規制されて
固定され、チューブに加えられる振動、衝撃によりチュ
ーブ内で浮動することがなくなる。
Therefore, each semiconductor device 2 receives a pressing force from the protrusion 1d and comes into close contact with the tube body 1, and the frictional force between the tube body 1 and the semiconductor device 2 restricts the movement in the front and back and left and right directions, and the semiconductor device 2 is fixed to the tube. No longer floating in the tube due to applied vibrations or shocks.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明はチューブ本体に突起を設け
、この突起で半導体装置をチューブ本体内で固定するよ
うにしたので、チューブに衝撃、振動等による半導体装
置の容器の破損を防止できる効果がある。
As explained above, the present invention provides a protrusion on the tube body and uses the protrusion to fix the semiconductor device within the tube body, which has the effect of preventing damage to the container of the semiconductor device due to impact, vibration, etc. on the tube. be.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(α)は本発明の一実施例を示す斜視図、(b)
は同側面図、(e)は同断面図、第2図は従来の半導体
装置の収納用チューブの容器本体の断面図である。 1・・・チューブ本体、1α・・・収納空間、ld・・
・弾性突起特許出願人  日本電気株式会社 (C) 第1図 第2因
FIG. 1 (α) is a perspective view showing one embodiment of the present invention, (b)
2 is a side view of the same, FIG. 2 is a sectional view of the container body of a conventional storage tube for semiconductor devices. 1...Tube body, 1α...Storage space, ld...
・Elastic protrusion patent applicant NEC Corporation (C) Figure 1 Factor 2

Claims (1)

【特許請求の範囲】[Claims] (1)複数個の半導体装置を列状に並べてこれを収納す
る収納用チューブにおいて、チューブ本体内に挿入され
た半導体装置に押圧されて弾性変形しその弾性力をもつ
て半導体装置をチューブ本体の内壁に圧接する弾性突起
を本体内に有することを特徴とする半導体装置の収納用
チューブ。
(1) In a storage tube that stores a plurality of semiconductor devices arranged in a row, the semiconductor device inserted into the tube body is pressed and deformed elastically, and the semiconductor device is moved into the tube body with its elastic force. A tube for storing a semiconductor device, characterized in that the main body has an elastic protrusion that presses against an inner wall.
JP60135512A 1985-06-21 1985-06-21 Tube for housing semiconductor device Pending JPS624085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60135512A JPS624085A (en) 1985-06-21 1985-06-21 Tube for housing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60135512A JPS624085A (en) 1985-06-21 1985-06-21 Tube for housing semiconductor device

Publications (1)

Publication Number Publication Date
JPS624085A true JPS624085A (en) 1987-01-10

Family

ID=15153495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60135512A Pending JPS624085A (en) 1985-06-21 1985-06-21 Tube for housing semiconductor device

Country Status (1)

Country Link
JP (1) JPS624085A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63245789A (en) * 1987-03-31 1988-10-12 アマノ株式会社 Time register
US5173446A (en) * 1988-06-28 1992-12-22 Ricoh Company, Ltd. Semiconductor substrate manufacturing by recrystallization using a cooling medium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63245789A (en) * 1987-03-31 1988-10-12 アマノ株式会社 Time register
US5173446A (en) * 1988-06-28 1992-12-22 Ricoh Company, Ltd. Semiconductor substrate manufacturing by recrystallization using a cooling medium

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