JPS63248159A - Semiconductor photodetector - Google Patents

Semiconductor photodetector

Info

Publication number
JPS63248159A
JPS63248159A JP62082416A JP8241687A JPS63248159A JP S63248159 A JPS63248159 A JP S63248159A JP 62082416 A JP62082416 A JP 62082416A JP 8241687 A JP8241687 A JP 8241687A JP S63248159 A JPS63248159 A JP S63248159A
Authority
JP
Japan
Prior art keywords
picture element
trench
pixel
layer
charges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62082416A
Other languages
Japanese (ja)
Inventor
Masanori Aida
合田 雅宣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP62082416A priority Critical patent/JPS63248159A/en
Publication of JPS63248159A publication Critical patent/JPS63248159A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Element Separation (AREA)

Abstract

PURPOSE:To prevent an effect on an adjacent picture element when beams are projected to a picture element by forming a trench around the picture element. CONSTITUTION:A trench 5 is cut between a picture element 3 for a semiconductor photodetector and an adjacent picture element 4. The ions of phosphorus are implanted into the trench 5 and diffused to shape a gettering layer 6. Silicon dioxide is attached into the trench, and poly Si 8 is deposited onto silicon dioxide. When beams are projected to the picture element for the semiconductor photodetector constituted in this manner and charges are generated, charges do not transfer to the adjacent picture element in a shallow region because there exists the electrically insulated trench 5 between the picture element and the adjacent picture element. Since the layer 6 is shaped in a section lower than the trench 5, charges reaching to the layer 6 are annihilated in the layer 6. Accordingly, beams have no effect on the adjacent picture element.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、コピー装置等の転写に用いる半導体受光装
置における画素に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a pixel in a semiconductor light receiving device used for transfer in a copying machine or the like.

〔発明の概要〕[Summary of the invention]

この発明は、半導体受光装置における画素において画素
のまわりに溝を設け、画素下部をゲッタリングされた層
で被うことにより、発生したキャリアが他の画素に影響
を及ぼすことを防ぐようにしたものである。
This invention prevents generated carriers from affecting other pixels by providing a groove around the pixel in a semiconductor light receiving device and covering the lower part of the pixel with a gettered layer. It is.

(従来の技術〕 従来、第2図に示すようにP″1とn −tで作られた
画素3が知られていた。
(Prior Art) Conventionally, as shown in FIG. 2, a pixel 3 made up of P″1 and n−t has been known.

(発明が解決しようとする問題点〕 しかし、従来の半導体受光装置は、たとえ画素3に光が
入って来た場合でもその画素で獲えられなかった電荷が
となりの画素に到達し影響を及ぼす等の欠点があった。
(Problem to be solved by the invention) However, in the conventional semiconductor light receiving device, even if light enters pixel 3, the charge that is not captured by that pixel will reach the neighboring pixel and affect it. There were drawbacks such as.

そこでこの発明は、従来のこのような欠点を解決するた
め、画素に光が入った際に、となりの画素に影響するの
を防ぐことを目的としている。
Therefore, in order to solve these conventional drawbacks, the present invention aims to prevent light from affecting neighboring pixels when light enters a pixel.

〔問題点を解決するための手段〕[Means for solving problems]

上記問題点を解決するために、この発明は、画素と画素
の間に溝を堀り、この溝にリンのイオン注入を行ない拡
散し溝の下にゲッタリングの層を作り、さらにこの溝の
壁に二酸化ケイ素を付着させ、その上にポリシリコンを
積み、溝をふさぐことで、画素に光が入った場合に、と
なりの画素に影響を及ぼすことを防ぐようにした。
In order to solve the above problems, the present invention digs a groove between pixels, implants phosphorous ions into the groove, diffuses it, and creates a gettering layer under the groove, and further improves the depth of the groove. By attaching silicon dioxide to the walls and stacking polysilicon on top of it to close the grooves, they prevented light entering a pixel from affecting neighboring pixels.

〔作用〕[Effect]

上記のように構成された半導体受光装置の画素に光が入
り電荷が発生したとすると、この画素と、となりの画素
との間には電気的に絶縁された、溝があるため浅い領域
においてはとなりの画素に電荷が行くようなことはない
。また、溝よりも下部においては、ゲッタリングの層が
あるためここまできた電荷はこの層で消滅してしまう。
Suppose that light enters a pixel of a semiconductor photodetector configured as described above and a charge is generated. Since there is an electrically insulated groove between this pixel and an adjacent pixel, it will not work in a shallow area. There is no charge going to the neighboring pixel. Furthermore, since there is a gettering layer below the groove, the charges that have reached this layer disappear in this layer.

そのためとなりの画素に影響を及ぼすようなことはない
Therefore, there is no effect on neighboring pixels.

〔実施例〕〔Example〕

以下に、この発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.

第1図において、半導体受光装置の画素3と、となりの
画素4の間に溝5を堀る。その清5にリンのイオン注入
を行ない拡散することでゲッタリング層6を作る。?1
#5に二酸化ケイ素を付着させる。さらにその上にポリ
シリコン8を積む。
In FIG. 1, a groove 5 is dug between a pixel 3 and an adjacent pixel 4 of the semiconductor light receiving device. A gettering layer 6 is formed by implanting phosphorus ions into the liquid 5 and diffusing them. ? 1
Attach silicon dioxide to #5. Further, polysilicon 8 is stacked thereon.

このように画素3ととなりの画素4との間に溝5を堀り
、ゲッタリング層6を設けることで、画素間の電荷の移
動を防ぐようにしている。
In this way, by digging the groove 5 between the pixel 3 and the adjacent pixel 4 and providing the gettering layer 6, the movement of charges between the pixels is prevented.

〔発明の効果〕〔Effect of the invention〕

この発明は、以上説明したように画素のまわりに溝を掘
り、下部にゲッタリング層を設けることで、画素間の影
響を小さくする効果がある。
As explained above, this invention has the effect of reducing the influence between pixels by digging a groove around the pixels and providing a gettering layer underneath.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明にかかる半導体受光装置の縦断面図、
第2図は従来の半導体受光装置の縦断面図である。 1・・・濃いP領域  2・・・n基板3・・・画素 
    4・・・となりの画素5・・・ン簿     
  6・・・ゲッタリング層7・・・中間絶縁層  8
・・・ポリシリコン9・・・電極 以上
FIG. 1 is a longitudinal cross-sectional view of a semiconductor light receiving device according to the present invention;
FIG. 2 is a longitudinal sectional view of a conventional semiconductor light receiving device. 1...Dark P region 2...N substrate 3...Pixel
4...Next pixel 5...N list
6...Gettering layer 7...Intermediate insulating layer 8
...Polysilicon 9...More than electrode

Claims (3)

【特許請求の範囲】[Claims] (1)画素のまわりに溝を掘ったことを特徴とする半導
体受光装置。
(1) A semiconductor light receiving device characterized by having a groove dug around a pixel.
(2)前記画素下部にゲッタリング層を設けたことを特
徴とする特許請求の範囲第1項記載の半導体受光装置。
(2) The semiconductor light receiving device according to claim 1, further comprising a gettering layer provided below the pixel.
(3)前記溝に二酸化ケイ素を付着させ、さらにその上
にシリコンを積載したことを特徴とする特許請求の範囲
第1項記載の半導体受光装置。
(3) The semiconductor light-receiving device according to claim 1, wherein silicon dioxide is attached to the groove, and silicon is further stacked thereon.
JP62082416A 1987-04-03 1987-04-03 Semiconductor photodetector Pending JPS63248159A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62082416A JPS63248159A (en) 1987-04-03 1987-04-03 Semiconductor photodetector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62082416A JPS63248159A (en) 1987-04-03 1987-04-03 Semiconductor photodetector

Publications (1)

Publication Number Publication Date
JPS63248159A true JPS63248159A (en) 1988-10-14

Family

ID=13773984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62082416A Pending JPS63248159A (en) 1987-04-03 1987-04-03 Semiconductor photodetector

Country Status (1)

Country Link
JP (1) JPS63248159A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01281001A (en) * 1988-04-30 1989-11-13 Kobashi Kogyo Co Ltd Device for connecting working machine to tractor
JPH0231153U (en) * 1988-08-20 1990-02-27
JPH05110053A (en) * 1991-10-14 1993-04-30 Matsushita Electron Corp Solid-state imaging device and manufacture thereof
US9704909B2 (en) 2015-03-25 2017-07-11 Canon Kabushiki Kaisha Image sensor and method of manufacturing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01281001A (en) * 1988-04-30 1989-11-13 Kobashi Kogyo Co Ltd Device for connecting working machine to tractor
JPH0231153U (en) * 1988-08-20 1990-02-27
JPH05110053A (en) * 1991-10-14 1993-04-30 Matsushita Electron Corp Solid-state imaging device and manufacture thereof
US9704909B2 (en) 2015-03-25 2017-07-11 Canon Kabushiki Kaisha Image sensor and method of manufacturing the same

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