JPS63248159A - Semiconductor photodetector - Google Patents
Semiconductor photodetectorInfo
- Publication number
- JPS63248159A JPS63248159A JP62082416A JP8241687A JPS63248159A JP S63248159 A JPS63248159 A JP S63248159A JP 62082416 A JP62082416 A JP 62082416A JP 8241687 A JP8241687 A JP 8241687A JP S63248159 A JPS63248159 A JP S63248159A
- Authority
- JP
- Japan
- Prior art keywords
- picture element
- trench
- pixel
- layer
- charges
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000005247 gettering Methods 0.000 claims abstract description 8
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 5
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 5
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 4
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 2
- 239000011574 phosphorus Substances 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 229920005591 polysilicon Polymers 0.000 description 3
- -1 phosphorous ions Chemical class 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Element Separation (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、コピー装置等の転写に用いる半導体受光装
置における画素に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a pixel in a semiconductor light receiving device used for transfer in a copying machine or the like.
この発明は、半導体受光装置における画素において画素
のまわりに溝を設け、画素下部をゲッタリングされた層
で被うことにより、発生したキャリアが他の画素に影響
を及ぼすことを防ぐようにしたものである。This invention prevents generated carriers from affecting other pixels by providing a groove around the pixel in a semiconductor light receiving device and covering the lower part of the pixel with a gettered layer. It is.
(従来の技術〕
従来、第2図に示すようにP″1とn −tで作られた
画素3が知られていた。(Prior Art) Conventionally, as shown in FIG. 2, a pixel 3 made up of P″1 and n−t has been known.
(発明が解決しようとする問題点〕
しかし、従来の半導体受光装置は、たとえ画素3に光が
入って来た場合でもその画素で獲えられなかった電荷が
となりの画素に到達し影響を及ぼす等の欠点があった。(Problem to be solved by the invention) However, in the conventional semiconductor light receiving device, even if light enters pixel 3, the charge that is not captured by that pixel will reach the neighboring pixel and affect it. There were drawbacks such as.
そこでこの発明は、従来のこのような欠点を解決するた
め、画素に光が入った際に、となりの画素に影響するの
を防ぐことを目的としている。Therefore, in order to solve these conventional drawbacks, the present invention aims to prevent light from affecting neighboring pixels when light enters a pixel.
上記問題点を解決するために、この発明は、画素と画素
の間に溝を堀り、この溝にリンのイオン注入を行ない拡
散し溝の下にゲッタリングの層を作り、さらにこの溝の
壁に二酸化ケイ素を付着させ、その上にポリシリコンを
積み、溝をふさぐことで、画素に光が入った場合に、と
なりの画素に影響を及ぼすことを防ぐようにした。In order to solve the above problems, the present invention digs a groove between pixels, implants phosphorous ions into the groove, diffuses it, and creates a gettering layer under the groove, and further improves the depth of the groove. By attaching silicon dioxide to the walls and stacking polysilicon on top of it to close the grooves, they prevented light entering a pixel from affecting neighboring pixels.
上記のように構成された半導体受光装置の画素に光が入
り電荷が発生したとすると、この画素と、となりの画素
との間には電気的に絶縁された、溝があるため浅い領域
においてはとなりの画素に電荷が行くようなことはない
。また、溝よりも下部においては、ゲッタリングの層が
あるためここまできた電荷はこの層で消滅してしまう。Suppose that light enters a pixel of a semiconductor photodetector configured as described above and a charge is generated. Since there is an electrically insulated groove between this pixel and an adjacent pixel, it will not work in a shallow area. There is no charge going to the neighboring pixel. Furthermore, since there is a gettering layer below the groove, the charges that have reached this layer disappear in this layer.
そのためとなりの画素に影響を及ぼすようなことはない
。Therefore, there is no effect on neighboring pixels.
以下に、この発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.
第1図において、半導体受光装置の画素3と、となりの
画素4の間に溝5を堀る。その清5にリンのイオン注入
を行ない拡散することでゲッタリング層6を作る。?1
#5に二酸化ケイ素を付着させる。さらにその上にポリ
シリコン8を積む。In FIG. 1, a groove 5 is dug between a pixel 3 and an adjacent pixel 4 of the semiconductor light receiving device. A gettering layer 6 is formed by implanting phosphorus ions into the liquid 5 and diffusing them. ? 1
Attach silicon dioxide to #5. Further, polysilicon 8 is stacked thereon.
このように画素3ととなりの画素4との間に溝5を堀り
、ゲッタリング層6を設けることで、画素間の電荷の移
動を防ぐようにしている。In this way, by digging the groove 5 between the pixel 3 and the adjacent pixel 4 and providing the gettering layer 6, the movement of charges between the pixels is prevented.
この発明は、以上説明したように画素のまわりに溝を掘
り、下部にゲッタリング層を設けることで、画素間の影
響を小さくする効果がある。As explained above, this invention has the effect of reducing the influence between pixels by digging a groove around the pixels and providing a gettering layer underneath.
第1図はこの発明にかかる半導体受光装置の縦断面図、
第2図は従来の半導体受光装置の縦断面図である。
1・・・濃いP領域 2・・・n基板3・・・画素
4・・・となりの画素5・・・ン簿
6・・・ゲッタリング層7・・・中間絶縁層 8
・・・ポリシリコン9・・・電極
以上FIG. 1 is a longitudinal cross-sectional view of a semiconductor light receiving device according to the present invention;
FIG. 2 is a longitudinal sectional view of a conventional semiconductor light receiving device. 1...Dark P region 2...N substrate 3...Pixel
4...Next pixel 5...N list
6...Gettering layer 7...Intermediate insulating layer 8
...Polysilicon 9...More than electrode
Claims (3)
体受光装置。(1) A semiconductor light receiving device characterized by having a groove dug around a pixel.
徴とする特許請求の範囲第1項記載の半導体受光装置。(2) The semiconductor light receiving device according to claim 1, further comprising a gettering layer provided below the pixel.
にシリコンを積載したことを特徴とする特許請求の範囲
第1項記載の半導体受光装置。(3) The semiconductor light-receiving device according to claim 1, wherein silicon dioxide is attached to the groove, and silicon is further stacked thereon.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62082416A JPS63248159A (en) | 1987-04-03 | 1987-04-03 | Semiconductor photodetector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62082416A JPS63248159A (en) | 1987-04-03 | 1987-04-03 | Semiconductor photodetector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63248159A true JPS63248159A (en) | 1988-10-14 |
Family
ID=13773984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62082416A Pending JPS63248159A (en) | 1987-04-03 | 1987-04-03 | Semiconductor photodetector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63248159A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01281001A (en) * | 1988-04-30 | 1989-11-13 | Kobashi Kogyo Co Ltd | Device for connecting working machine to tractor |
JPH0231153U (en) * | 1988-08-20 | 1990-02-27 | ||
JPH05110053A (en) * | 1991-10-14 | 1993-04-30 | Matsushita Electron Corp | Solid-state imaging device and manufacture thereof |
US9704909B2 (en) | 2015-03-25 | 2017-07-11 | Canon Kabushiki Kaisha | Image sensor and method of manufacturing the same |
-
1987
- 1987-04-03 JP JP62082416A patent/JPS63248159A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01281001A (en) * | 1988-04-30 | 1989-11-13 | Kobashi Kogyo Co Ltd | Device for connecting working machine to tractor |
JPH0231153U (en) * | 1988-08-20 | 1990-02-27 | ||
JPH05110053A (en) * | 1991-10-14 | 1993-04-30 | Matsushita Electron Corp | Solid-state imaging device and manufacture thereof |
US9704909B2 (en) | 2015-03-25 | 2017-07-11 | Canon Kabushiki Kaisha | Image sensor and method of manufacturing the same |
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