JPS63247400A - Method for controlling continuous electroplating - Google Patents
Method for controlling continuous electroplatingInfo
- Publication number
- JPS63247400A JPS63247400A JP8068987A JP8068987A JPS63247400A JP S63247400 A JPS63247400 A JP S63247400A JP 8068987 A JP8068987 A JP 8068987A JP 8068987 A JP8068987 A JP 8068987A JP S63247400 A JPS63247400 A JP S63247400A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- thickness
- efficiency
- current
- equality
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000009713 electroplating Methods 0.000 title claims description 5
- 238000007747 plating Methods 0.000 claims abstract description 100
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 101100518501 Mus musculus Spp1 gene Proteins 0.000 abstract 2
- 101100119193 Schizosaccharomyces pombe (strain 972 / ATCC 24843) eta2 gene Proteins 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 17
- 239000010959 steel Substances 0.000 description 17
- 238000012545 processing Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
技術分野
本発明は、金属帯状体、たとえば銅帯を連続電気めっき
し、そのめっき厚みを制御する方法に関する。DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD This invention relates to a method for continuously electroplating a metal strip, such as a copper strip, and controlling the plating thickness.
背景技術
金属帯状体の表面に形成されるめっき付着量であるめっ
き厚みは、めっき電流を制御することによって調整する
ことができる。従来では、希望するめっき厚みを得るた
めに、ライン出側においてめっきされた鋼板をサンプリ
ングし、これを手分析し、この値に基づいてめっき電流
を決定している。BACKGROUND ART The plating thickness, which is the amount of plating deposited on the surface of a metal strip, can be adjusted by controlling the plating current. Conventionally, in order to obtain the desired plating thickness, a plated steel plate is sampled at the output side of the line, this is manually analyzed, and the plating current is determined based on this value.
発明が解決すべき問題点
このような先行技術では、分析は作業者によって行なわ
れるので、パッチ処理となる。したがって時系列的にめ
っき効率が変化した場合には、めっき厚みの制御を迅速
に対処することが不可能である。そのため、めっき厚み
を均一にすることができない。Problems to be Solved by the Invention In such prior art, analysis is performed by an operator, resulting in a patch process. Therefore, when the plating efficiency changes over time, it is impossible to quickly control the plating thickness. Therefore, it is not possible to make the plating thickness uniform.
本発明の目的は、金属帯状体の長さ方向に均一なめつき
厚みを得ることができるようにした連続電気めっきの制
御方法を提供することである。An object of the present invention is to provide a continuous electroplating control method that makes it possible to obtain a uniform plating thickness in the length direction of a metal strip.
間に点を解決するための手段
本発明は、金属帯状体のめっき厚みＦａ、金属帯状体の
速度Ｖａ、めっき電流Ｉａおよびめっき液の温度Ｔａと
を、同時にかつ複数回実測し、めっき電流Ｉａに基づい
て電流密度Ｄｋを計算し、各測定時毎に、めっき効率η
１、
ただしＫは定数
を求め、この結果に基づいて、次式のめっき効率η２に
おける定数Ａ 、Ｂ 、Ｃ、Ｄを求め、？ ２ ＝Ａ
−Ｄｋ＋Ｂ −Ｖ＋Ｃ−Ｔ＋Ｄこれによってめっき厚み
を希望する値に制御することを特徴とする連続電気めっ
きの制御方法である。Means for Solving Problems in the Invention The present invention measures the plating thickness Fa of the metal strip, the speed Va of the metal strip, the plating current Ia, and the temperature Ta of the plating solution simultaneously and multiple times, and calculates the plating current Ia. The current density Dk is calculated based on the plating efficiency η for each measurement.
1, where K is a constant, and based on this result, find constants A, B, C, and D in the plating efficiency η2 of the following equation, and ? 2 = A
-Dk+B -V+C-T+D This is a continuous electroplating control method characterized by controlling the plating thickness to a desired value.
作 用
本発明に従えば、めっき効率り２を決定するための定数
Ａ 、Ｂ 、Ｃ、Ｄを、めっき厚みＦａ、速度■ａ、め
っき電流Ｉａおよび温度Ｔａの同時的なかつ複数回の実
測値に基づいて定め、このめっき効率り２の式によって
めっき厚みを希望する値に制御するようにしたので、作
業者による分析作業が不必要になり、しがも連続的に分
析が可能になる。According to the present invention, the constants A, B, C, and D for determining the plating efficiency 2 are determined by simultaneous and multiple actual measurements of the plating thickness Fa, speed a, plating current Ia, and temperature Ta. Since the plating thickness is controlled to a desired value using the formula of plating efficiency 2, analysis work by the operator is unnecessary and continuous analysis is possible.
これによって金属帯状体の長さ方向に希望する均一なめ
っき厚みを形成することが可能になる。This makes it possible to form a desired uniform plating thickness in the length direction of the metal strip.
実施例
第１図は、本発明の一実施例の全体の系統図である。め
っきされるべき金属帯状体である鋼板の原板１は、プラ
イドルロール２がら前処理装置３に導かれて洗浄などさ
れる。前処理装置３がらの鋼板は、ステアリングロール
４がらめっき処理装ｆｉ５に供給される。このめっき処
理装置５では、鋼板がめつき液２２内を通過する。この
めっき液２２内には、鋼板の上下に電極２１が配置され
る。Embodiment FIG. 1 is an overall system diagram of an embodiment of the present invention. An original steel sheet 1, which is a metal strip to be plated, is guided through a pre-drill roll 2 to a pretreatment device 3, where it is cleaned and the like. The steel plate from the pretreatment device 3 is supplied to the steering roll 4 plating treatment device fi5. In this plating processing apparatus 5 , the steel plate passes through a plating solution 22 . Electrodes 21 are placed in this plating solution 22 above and below the steel plate.
鋼板にはコングクトロール２０が接触し、鋼板に電気的
に接続される。めっき処理装置５からのめっきされた鋼
板は、ステアリングロール６を経て走行し、その途中で
めっき厚み計７によって鋼板の表面に形成されためっき
厚みが測定される。このめっき厚み計７は、たとえばＸ
＠などを用いた構成によって実現されてもよい。鋼板は
さらに、後処理装置８を経てプライドルロール９から出
側ルーパーで貯留され、さらにプライドルロール１１を
経てテンションリール１３で巻取られる。テンションリ
ール１３の上流側には鋼板の剪断のためにシャー１２が
配置される。Kongtrol 20 contacts the steel plate and is electrically connected to the steel plate. The plated steel plate from the plating processing device 5 travels through a steering roll 6, and along the way, the thickness of the plating formed on the surface of the steel plate is measured by a plating thickness gauge 7. This plating thickness gauge 7 is, for example,
It may be realized by a configuration using @ or the like. The steel plate further passes through a post-processing device 8, is stored in a looper on the exit side from a prydle roll 9, further passes through a prydle roll 11, and is wound up on a tension reel 13. A shear 12 is arranged upstream of the tension reel 13 for shearing the steel plate.
めっき電流制御回路１６は、フングクトロール２０と電
極２１との間にめっき電流を流す。このめっき電流は、
電流検出器１７によって検出される。めっき処理装置５
におけるめっき８！２２の温度は、めっき液温度検出器
１８によって検出される。プライドルロール９に設けら
れたライン速度検出器１９は、鋼板の走行している速度
を検出する。The plating current control circuit 16 causes a plating current to flow between the Fungktrol 20 and the electrode 21 . This plating current is
It is detected by the current detector 17. Plating processing equipment 5
The temperature of the plating 8!22 in is detected by the plating solution temperature detector 18. A line speed detector 19 provided on the priddle roll 9 detects the running speed of the steel plate.
第２図は、第１図に示された実施例の電気的構成を示す
ブロック図である。めっき厚み計７、電流検出器１７、
めっき液温度検出器１８およびライン速度検出器１９が
らの各出力は、マイクロコンピュータなどによって実現
される処理回路２３に与えられ、これによって処理回路
２３は次に述べる演算を行ない、電流制御回路１６によ
るめっき電流を制御する。FIG. 2 is a block diagram showing the electrical configuration of the embodiment shown in FIG. 1. Plating thickness gauge 7, current detector 17,
The respective outputs from the plating solution temperature detector 18 and the line speed detector 19 are given to a processing circuit 23 realized by a microcomputer or the like, and thereby the processing circuit 23 performs the calculations described below. Control plating current.
第３図を参照して、ステップｎ１がらステップｎ２に移
り、予想して定めた成る条件で鋼板のめっきを行ない、
これによって鋼板のめっき厚みＦａ。Referring to FIG. 3, proceeding from step n1 to step n2, plating the steel plate under the predicted and determined conditions,
This increases the plating thickness Fa of the steel plate.
速度Ｖａ、めっき電流Ｉａおよびめっき液の温度Ｔ８を
、検出器７．１７，１８．１９によってステップｎ３
において同時に検出し、この測定値に基づいてステッ
プｎ４ではめっき効率＋７１を求める。The speed Va, the plating current Ia and the temperature T8 of the plating solution are detected in step n3 by the detectors 7.17 and 18.19.
, and based on this measured value, the plating efficiency +71 is determined in step n4.
ここでＫは定数である。Here K is a constant.
ステップｎ５ では、第２式で示されるめっき効率ｒ
／２
η２＝Ａ−Ｄｋ＋Ｂ−Ｖ＋Ｃ−Ｔ＋Ｄ ・・・（２）
における定数Ａ 、Ｂ 、Ｃ、Ｄ を連立方程式によ
って計算して求めるために、ステップｎ６ では前述
の第１式で求めためっき効率η１を第２式のめっき効率
り２に等しいと置き、このｔＪＳ２式における電流密度
Ｄｋをめっき電流Ｉａに基づいて計算して代入するとと
もに、第２式のＶ、Ｔには上述の速度Ｖａ、めっき液の
温度Ｔａをそれぞれ代入する。ステップｎ３〜ステツプ
ｎ６ の動作をステップｎ７で定めた複数回、少な（
とも４回繰返すことによって４つの定数Ａ 、Ｂ 、Ｃ
、Ｄをステップｎ８で連立方程式によって計算すること
が可能になる。In step n5, the plating efficiency r expressed by the second equation
/2 η2=A-Dk+B-V+C-T+D...(2)
In order to calculate and obtain the constants A, B, C, and D using simultaneous equations, in step n6, the plating efficiency η1 obtained from the first equation above is set equal to the plating efficiency 2 of the second equation, and this tJS2 The current density Dk in the equation is calculated based on the plating current Ia and is substituted, and the above-mentioned speed Va and temperature Ta of the plating solution are substituted into V and T of the second equation, respectively. The operations from step n3 to step n6 are repeated multiple times as determined in step n7.
By repeating both four times, four constants A, B, C
, D can be calculated by simultaneous equations in step n8.
次にステップｎ ９ では、鋼板にめっきを行なうラ
イン運転によって新たに、めっき厚みＦｂ、速度ｖｂ、
めっき電流Ｉｂおよびめっき液の温度Ｔｂを検出器７．
１７，１８．１９ によって実測する。Next, in step n9, the plating thickness Fb, speed vb,
The plating current Ib and the temperature Tb of the plating solution are detected by a detector 7.
17, 18, and 19.
ステップ１１１０ では、この実測値に基づいてめっ
き効率η３を求める。In step 1110, the plating efficiency η3 is determined based on this measured value.
ステップｎｉｌでは、めっき電流Ｉｌｌに基づいて電流
密度Ｄｋｌ を計算し、第４式に基づいて定数Ｄ１を
求める。In step nil, a current density Dkl is calculated based on the plating current Ill, and a constant D1 is determined based on the fourth equation.
Ｄ１＝η３−（Ａ−Ｄｋｌ＋Ｂ ・Ｖｂ十Ｃ−Ｔｂ）・
・・（４）
これによって前述のステップｎ８ でＰＩｔＪ２式に
基づいて計算された定ＩＤをＤｌに修正する。こうして
めっき効率η４を求める第５式をステップｎ１２におい
て設定する。D1=η3-(A-Dkl+B ・Vb×C-Tb)・
(4) As a result, the constant ID calculated based on the PItJ2 formula in step n8 described above is corrected to Dl. In this way, the fifth equation for calculating the plating efficiency η4 is set in step n12.
１４＝Ａ−Ｄｋ＋Ｂ −Ｖ＋Ｃ−Ｔ＋Ｄ１・・・（５
）
ステップｎ１３では、鋼板の速度Ｖｃ、めっき電流Ｉｃ
およびめっき液の温度Ｔｃの測定を行ない、めっき電流
Ｉｃに基づいて電流密度Ｄｋｃを計算する。そこでｔｔ
Ｓ５式に代入して、すなわち第６式の演算を仔なって、
めっき効率η４ａを求める。14=A-Dk+B-V+C-T+D1...(5
) In step n13, the speed Vc of the steel plate, the plating current Ic
Then, the temperature Tc of the plating solution is measured, and the current density Dkc is calculated based on the plating current Ic. So tt
By substituting into the S5 formula, that is, by substituting the operation of the 6th formula,
Find the plating efficiency η4a.
ｒ／４ａ＝Ａ−Ｄｋｃ十Ｂ◆■ｃ＋Ｃ−Ｔｃ＋Ｄ１・・
・（６）
ステップｎ１５では、めっき厚みの目標値Ｆｃを設定す
る。そこで前述のステップｎ１３ において実測した
速度ＶＣとステップ１１１４において第６式から計算し
ためっき効率７４ａとに基づいて、第７式の演算を行な
って、めっき電流Ｉｄを求める。r/4a=A-Dkc10B◆■c+C-Tc+D1...
-(6) In step n15, a target value Fc of plating thickness is set. Therefore, based on the speed VC actually measured in step n13 and the plating efficiency 74a calculated from equation 6 in step 1114, the calculation of equation 7 is performed to obtain the plating current Id.
この第７式で計算しためっき電流Ｉｄを表す信号を、処
理回路２３から電流制御回路１６に与え、めっき電流Ｉ
ｄでめっきを行なう。A signal representing the plating current Id calculated by this seventh equation is given from the processing circuit 23 to the current control circuit 16, and the plating current Id is
Perform plating in step d.
ステップｎ１７からはステップｎ９に戻り、このような
演算動作を繰返す。From step n17, the process returns to step n9, and such calculation operations are repeated.
本発明の他の実施例としてステップｎ１７ からステ
ップｎ２ に戻るようにしてもよい。In another embodiment of the present invention, the process may return from step n17 to step n2.
めっき厚み計７は、めっき処理装置５のライン出側の可
及的に近傍に設置し、これによって応答性を向上し、め
っき厚みを鋼板の長さ方向の全長にわた９正確な希望す
る値にめっきを行なうことを可能にすることができる。The plating thickness gauge 7 is installed as close as possible to the line output side of the plating processing equipment 5, thereby improving responsiveness and measuring the plating thickness to the exact desired value over the entire length of the steel plate. It can be possible to perform plating on.
本発明は、鋼板の亜鉛めっきなどだけでな（、その他の
材料から成る金属帯状体の各種のめっきを行なうために
広範囲に実施することができる。The present invention can be widely implemented not only for galvanizing steel sheets, but also for various types of plating of metal strips made of other materials.
効 果
以上のように本発明によれば、金属帯状体の表面に形成
されるめっきの厚みを正確に、しがもその金属帯状体の
艮手力向に沿って均一に制御することができる。しかも
めつき効率を求める回帰式は常時自動的に修正され、し
たがって時系列的にめっき効率が変化しても、めっき厚
みの制御の対応を迅速に行なうことができる。Effects As described above, according to the present invention, the thickness of the plating formed on the surface of the metal strip can be controlled accurately and uniformly along the direction of the force applied to the metal strip. . Moreover, the regression equation for determining plating efficiency is automatically corrected at all times, so even if plating efficiency changes over time, the plating thickness can be quickly controlled.
第１図は本発明の一実施例の全体の系統図、第２図は＃
Ｓ１図に示された実施例の電気的構成を示すブロック図
、ｐｌＩＪ３図は動作を説明するための７０−チャート
である。
１・・・原板、３・・・前処理装置、５・・・めっき処
理装置、７・・・めっき厚み計、８・・・後処理装置、
１Ｇ・・・電流制御回路、１７・・・めっき電流検出器
、１８・・・めっき液温度検出器、１９・・・ライン速
度検出器、２０・・・コンダクトロール、２１・・・電
極、２２・・・めっき液Figure 1 is an overall system diagram of one embodiment of the present invention, and Figure 2 is #
Figure S1 is a block diagram showing the electrical configuration of the embodiment shown in Figure S1, and Figure plIJ3 is a 70-chart for explaining the operation. DESCRIPTION OF SYMBOLS 1... Master plate, 3... Pre-processing device, 5... Plating processing device, 7... Plating thickness gauge, 8... Post-processing device,
1G... Current control circuit, 17... Plating current detector, 18... Plating solution temperature detector, 19... Line speed detector, 20... Conductor roll, 21... Electrode, 22 ...Plating solution
Claims (1)
めっき電流Ｉａおよびめっき液の温度Ｔａとを、同時に
かつ複数回実測し、 めっき電流Ｉａに基づいて電流密度Ｄｋを計算し、各測
定時毎に、めっき効率η１、 η１＝Ｋ・Ｖａ・Ｆａ／Ｉａ ただしＫは定数 を求め、 この結果に基づいて、次式のめっき効率η２における定
数Ａ、Ｂ、Ｃ、Ｄを求め、 η２＝Ａ−Ｄｋ＋Ｂ・Ｖ＋Ｃ・Ｔ＋Ｄ これによってめっき厚みを希望する値に制御することを
特徴とする連続電気めっきの制御方法。[Claims] Plating thickness Fa of the metal strip, speed Va of the metal strip,
Measure the plating current Ia and the temperature Ta of the plating solution simultaneously and multiple times, calculate the current density Dk based on the plating current Ia, and calculate the plating efficiency η1, η1=K・Va・Fa/ Ia However, K is determined as a constant, and based on this result, the constants A, B, C, and D in the plating efficiency η2 of the following formula are determined, and η2=A-Dk+B・V+C・T+D By this, the plating thickness is set to the desired value. A control method for continuous electroplating, characterized by controlling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8068987A JPS63247400A (en) | 1987-03-31 | 1987-03-31 | Method for controlling continuous electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8068987A JPS63247400A (en) | 1987-03-31 | 1987-03-31 | Method for controlling continuous electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63247400A true JPS63247400A (en) | 1988-10-14 |
Family
ID=13725302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8068987A Pending JPS63247400A (en) | 1987-03-31 | 1987-03-31 | Method for controlling continuous electroplating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63247400A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05148696A (en) * | 1991-11-25 | 1993-06-15 | Mitsubishi Electric Corp | Plating current controller |
| BE1006710A5 (en) * | 1992-11-25 | 1994-11-22 | Sikel Nv | Method for a continuous Zn coated steel sheet manufacturing process and thesteel sheet obtained in this manner |
| KR20180016941A (en) * | 2016-08-08 | 2018-02-20 | 가부시키가이샤 에바라 세이사꾸쇼 | Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method |
-
1987
- 1987-03-31 JP JP8068987A patent/JPS63247400A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05148696A (en) * | 1991-11-25 | 1993-06-15 | Mitsubishi Electric Corp | Plating current controller |
| BE1006710A5 (en) * | 1992-11-25 | 1994-11-22 | Sikel Nv | Method for a continuous Zn coated steel sheet manufacturing process and thesteel sheet obtained in this manner |
| KR20180016941A (en) * | 2016-08-08 | 2018-02-20 | 가부시키가이샤 에바라 세이사꾸쇼 | Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method |
| US11098414B2 (en) | 2016-08-08 | 2021-08-24 | Ebara Corporation | Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method |
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