JPS63244800A - Wiring method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a wiring method, and more specifically, to a wiring method for wiring along the inside of a casing of an electrical device made of synthetic resin or the like.

[Technical Background of the Invention] Taking a television as an example, the casing has C.
Including RT and speakers, volume, switches,
Various circuit boards, such as a tuner, an earphone socket, and a display LED, are provided at various locations within the housing, and conventionally, these are connected using lead wires. For this reason, not only does wiring work require a considerable number of man-hours, but also the lead wires become entangled with other electrical components, requiring work such as bundling them together and space.

[Object of the Invention] This invention has been made in order to eliminate the above-mentioned conventional drawbacks, and its purpose is to integrally form the main wiring pattern inside the housing along the shape of the molding inside the housing. The object of the present invention is to provide a wiring method that enables the following.

[Embodiments] Hereinafter, the present invention will be described in detail with reference to embodiments of electrical equipment as shown in the accompanying drawings.

FIG. 1 shows, for example, when injection molding a housing 1 of an electrical device as shown in FIG. A base sheet 5 is shown.

That is, this mold includes a female mold 2 and a male mold 3 that can be opened and opened in the horizontal direction in the drawing, and the base sheet 5 is molded in the cavity formed between them. According to the invention, prior to molding, the female mold 2 and the male mold 3 are
A wiring element 4 is arranged between the two. In this embodiment, the wiring element 4 is preferably configured such that when a base sheet 5 made of a thin flexible wiring board made of thermoplastic is molded, a predetermined wiring pattern 6 made of, for example, copper foil is present on the inner surface. .

Before closing the female mold 2 and male mold 3, the wiring element 4 is heated to a predetermined temperature (for example, 160 degrees Celsius) by a heater 9 to bring the base sheet 5 into a thermoplastic state.
Then, the female mold 2 and the male mold 3 are closed and the wiring element is molded into a shape along the inner wall surface of the housing 1.

7 is an air hole during molding.

Although an example is shown where only the wiring pattern 6 of the base sheet 5 is molded, it is possible to surface-mount electronic components (not shown) on the wiring pattern 6 in advance and solder the terminals with, for example, 22DtC (7). The electronic component may be placed in a thermoplastic state at the predetermined temperature lower than the predetermined temperature while the electronic component is mounted.

According to this embodiment, the wiring element 4 has a pair of glue parts 8.8
It is wound between the female mold 2 and the male mold 3, and is supplied between the female mold 2 and the male mold 3 in sequence.

Further, after molding the base sheet 5, the female mold 2
and the male mold 3 are slightly separated, and a molten synthetic resin for making a housing 1 of a television or the like is poured through the air hole 7 into the cavity formed between the female mold 2 and the base sheet 5. The casing 1 can also be formed within the same shed by casting like injection molding.

Note that the base sheet 5 and the housing 1 may be attached by being fused in a slightly molten state, or by pasting.

[Effects] As is clear from the description of the embodiments described above, according to the present invention, wiring elements can be arranged along the inner wall surface of the housing by the same method as when injection molding the housing, so that, for example, It is also possible to attach parts (volumes) that are directly attached to wiring elements that extend part of the electrical components outside the housing so that they protrude from the housing.In addition to making effective use of the inside of the housing for wiring, it is also possible to connect wiring elements individually. This greatly reduces the hassle of connecting each electrical component with lead wires, which improves productivity.
The effects are remarkable, such as increasing the degree of freedom in design.

[Brief explanation of drawings]

The drawings show one embodiment of the present invention, and FIG. 1 is a schematic explanatory diagram showing an example of the relationship between a mold and wiring elements used for carrying out this invention, and FIG. FIG. 3 is a cross-sectional view showing a base sheet of a wiring element obtained by the method. 1 is a housing, 2 is a female mold, 3 is a male mold, 4 is a wiring element, 5
is a base sheet on which wiring elements are placed, 6 is a wiring pattern, 7 is an air vent or injection molding port, 8 is a reel, 9
is a heating heater.

Claims (1)

[Claims] A wiring element consisting of a base sheet having an electrical component on the inside of the wiring pattern surface and a wiring pattern approximately following the inside shape of the casing inside the casing of the electrical device is thermoformed so as to follow the inside of the casing. A wiring method characterized by attaching so as to form a wire.