JPS6324058A - Continuous vacuum deposition plating device - Google Patents
Continuous vacuum deposition plating deviceInfo
- Publication number
- JPS6324058A JPS6324058A JP16743786A JP16743786A JPS6324058A JP S6324058 A JPS6324058 A JP S6324058A JP 16743786 A JP16743786 A JP 16743786A JP 16743786 A JP16743786 A JP 16743786A JP S6324058 A JPS6324058 A JP S6324058A
- Authority
- JP
- Japan
- Prior art keywords
- steel sheet
- vacuum deposition
- plated
- deposited
- steel plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 11
- 238000001771 vacuum deposition Methods 0.000 title abstract description 6
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 26
- 239000010959 steel Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 238000007738 vacuum evaporation Methods 0.000 claims description 9
- 238000001704 evaporation Methods 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 7
- 239000002923 metal particle Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 13
- 230000008018 melting Effects 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 3
- 238000007740 vapor deposition Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 17
- 229910052725 zinc Inorganic materials 0.000 description 17
- 239000011701 zinc Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 5
- 238000005246 galvanizing Methods 0.000 description 4
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は連続真空蒸着亜鉛メッキ等のメッキ装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a plating apparatus for continuous vacuum evaporation galvanizing, etc.
連続真空蒸着亜鉛メッキ等のメッキ装置では、蒸発時に
おいて蒸発亜鉛粒子に熱エネルギーの形態で与えられた
運動エネルギーで蒸発亜鉛粒子が鋼板に衝突し付着堆積
する。In plating equipment such as continuous vacuum evaporation galvanizing, the kinetic energy given to the evaporated zinc particles in the form of thermal energy during evaporation causes the evaporated zinc particles to collide with the steel plate and deposit thereon.
こうした、従来の連続真空蒸着亜鉛メッキの蒸着部につ
いて詳述すると、牙４図（ａ）に示したように５００℃
程度の亜鉛浴蒸発源５から出た亜鉛粒子は、その噴出エ
ネルギーのみで約１Ｏ−２Ｔｏｒｒの真空中を移動し、
鋼板７の亜鉛蒸着面１０に付着堆積し膜を形成している
が、粒子の衝突エネルギーが小さいため、牙４図（ｂ）
に示したように粒子の堆積状態は粗くピンホール１３の
発生も多い。このように、従来の手法では蒸発亜鉛粒子
の運動エネルギーが伝いため亜鉛膜の膜質に問題があっ
た。To explain in detail the deposition part of conventional continuous vacuum evaporation galvanizing, as shown in Figure 4 (a), the temperature is 500°C.
Zinc particles emitted from the zinc bath evaporation source 5 move in a vacuum of about 1 O-2 Torr only by the ejection energy,
Zinc is deposited and deposited on the surface 10 of the steel plate 7 to form a film, but since the collision energy of the particles is small, the zinc evaporation surface 10 of the steel plate 7 is deposited, so that the particles are deposited on the surface 10 of the steel plate 7.
As shown in FIG. 2, the particles are deposited coarsely and pinholes 13 occur frequently. As described above, in the conventional method, the kinetic energy of the evaporated zinc particles is transferred, resulting in a problem with the film quality of the zinc film.
そこで、この発明は前記のような従来の連続真空蒸着メ
ッキにおける不都合な点ヤ改善して膜質の向上を図るこ
とのできるメッキ装置を提供するものである。SUMMARY OF THE INVENTION Therefore, the present invention provides a plating apparatus capable of improving film quality by overcoming the disadvantages of conventional continuous vacuum evaporation plating as described above.
この発明による連続真空蒸着メッキ装置は鋼板の金属蒸
着面近傍に熱電子発生源を設けると共に、鋼板に正のバ
イアス電圧を印加する点に特徴がある。The continuous vacuum evaporation plating apparatus according to the present invention is characterized in that a thermionic generation source is provided near the metal evaporation surface of the steel plate, and a positive bias voltage is applied to the steel plate.
以下、図示するこの発明の実施例により説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained below with reference to illustrated embodiments.
牙１図に亜鉛メッキを行なう実施例装置の全体図を示し
たが、ここで、外部溶解炉６、真空蒸着槽１及びダクト
２等で構成されるメッキ装置の亜鉛蒸着面１０近傍には
熱電子発生源としてフィラメント９が設けられている。Fig. 1 shows an overall diagram of an embodiment of the apparatus for galvanizing.Here, heat is applied to the vicinity of the zinc evaporation surface 10 of the plating apparatus, which is composed of an external melting furnace 6, a vacuum evaporation tank 1, a duct 2, etc. A filament 9 is provided as an electron source.
このフィラメント９にはフィラメント用電源１２が接続
されており、適切な交流電流によりフィラメント９が加
熱される。A filament power source 12 is connected to the filament 9, and the filament 9 is heated by an appropriate alternating current.
このフィラメント９は、熱電子を大面積より放出できる
よう牙３図に示すタングステン等のメツシュ形状とし、
長さは鋼板７の幅と同程度にすることにより、鋼板面の
幅方向全域にわたり、均一に電子衝撃が加えられる。ま
た、フィラメントの寿命も単線形状のもの罠比ベエネル
ギー密度が小さいので長くなる。The filament 9 has a mesh shape made of tungsten or the like as shown in Fig. 3 so that thermoelectrons can be emitted from a large area.
By making the length approximately the same as the width of the steel plate 7, the electron impact can be uniformly applied to the entire width of the steel plate surface. In addition, the life of the filament is longer than that of a single wire filament because the energy density is lower than that of a filament.
さらに、鋼板７をガイドするローラ１４にはバイアス用
直流電源１１からの正のバイアス電圧が印加されており
、電子は加速されて鋼板７０表面に衝突する。Further, a positive bias voltage from the bias DC power source 11 is applied to the roller 14 that guides the steel plate 7, and the electrons are accelerated and collide with the surface of the steel plate 70.
こうした構成において、フィラメント９をフィラメント
用電源により約２０００°Ｃに加熱すると、多量の熱電
子８が放出される。これが、ローラ１４に接触して正の
バイアス電圧の印加された鋼板７上の亜鉛蒸淘面１０に
向って加速して衝突するので電子衝撃を与える。この衝
撃面では電子衝撃による発熱を起こし、牙２図（ａ）
、 （ｂｌに示したようにミクロ的には蒸着亜鉛粒子３
′が溶解し粒子の再結合によりピンホール部が埋められ
る。In such a configuration, when the filament 9 is heated to about 2000° C. by the filament power supply, a large amount of thermionic electrons 8 are emitted. This contacts the roller 14 and accelerates and collides with the zinc evaporated surface 10 on the steel plate 7 to which a positive bias voltage is applied, giving an electron impact. This impact surface generates heat due to electron impact, and Fang 2 (a)
(As shown in bl, microscopically, the deposited zinc particles 3
' dissolves and the pinhole is filled by recombination of the particles.
この作用は蒸着亜鉛粒子３の状態で一層ごとに行なわれ
るので堆積膜は緻密となり、鋼板７と蒸着亜鉛膜との間
に熱作用も発生するので付着力も向上する。Since this action is performed layer by layer in the state of the vapor-deposited zinc particles 3, the deposited film becomes dense, and since a thermal action is also generated between the steel plate 7 and the vapor-deposited zinc film, the adhesion is improved.
この実施例ではフィラメント用電源１２として交流電源
を用いたが直流電源でも可能であり、亜銘以外のＡｔ、
Ｔｉ等の金属及びＡｌ２Ｏ３等の無機材料及び有機材料
の連続真空蒸着にも適用できる。In this embodiment, an AC power source was used as the filament power source 12, but a DC power source is also possible.
It can also be applied to continuous vacuum deposition of metals such as Ti and inorganic and organic materials such as Al2O3.
この発明による連続真空蒸着メッキ装置の実施例は以上
の通りであり、次に述べる効果を挙げることができる。The embodiments of the continuous vacuum evaporation plating apparatus according to the present invention are as described above, and the following effects can be achieved.
鋼板上に付滑した蒸着金属膜は、熱電子衝突による電子
衝撃効果でミクロ的な溶解及び再結合を起こすのでピン
ホールは除去され緻密で付着力の強いものとなる。The vapor-deposited metal film smoothed onto the steel plate undergoes microscopic dissolution and recombination due to the electron impact effect caused by thermionic collision, so pinholes are removed and the film becomes dense and has strong adhesion.
牙１図は実施例の構成図、牙２図（ａ） 、 （ｂｌは
熱電子の作用を示す概念図、牙６図はフィラメントの構
成図、牙４図（ａ）は従来例の構成図、牙４図（ｂ）は
従来の亜鉛蒸着面を示す拡大図である。
１・・・・・・真空蒸着槽、２・・・・・・ダクト、３
・・・・・・蒸発亜鉛粒子、３′・・・・・・蒸着亜鉛
粒子、４・・・・・・シャッター、５・・・・・・蒸発
源、６・・・・・・外部溶解炉、７・・・・・・鋼板、
８・・・・・・熱電子、９・・・・・・フィラメント、
１０・・・・・・亜鉛蒸着面、１１・・・・・・バイア
ス用直流電源、１２・・・・・・フィラメント用電源、
１３・・・・・・ピンホール、１４・・・・・・ローラ
。Fang 1 is a configuration diagram of the embodiment, Fang 2 (a) and (bl are conceptual diagrams showing the action of thermoelectrons, Fang 6 is a filament configuration diagram, Fang 4 (a) is a configuration diagram of a conventional example) , Fang 4 (b) is an enlarged view showing a conventional zinc evaporation surface. 1... Vacuum deposition tank, 2... Duct, 3
... Evaporated zinc particles, 3'... Vapor deposited zinc particles, 4... Shutter, 5... Evaporation source, 6... External melting Furnace, 7... steel plate,
8... Thermal electron, 9... Filament,
10... Zinc vapor deposition surface, 11... DC power supply for bias, 12... Power supply for filament,
13...Pinhole, 14...Roller.
Claims (1)
うメッキ装置において、 鋼板近傍に熱電子発生源を設けると共に、鋼板に正のバ
イアス電圧を印加することを特徴とする連続真空蒸着メ
ッキ装置。[Claims] A plating apparatus that performs vacuum evaporation on a steel plate with metal particles emitted from a metal bath evaporation source, characterized in that a thermionic generation source is provided near the steel plate and a positive bias voltage is applied to the steel plate. Continuous vacuum evaporation plating equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16743786A JPS6324058A (en) | 1986-07-16 | 1986-07-16 | Continuous vacuum deposition plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16743786A JPS6324058A (en) | 1986-07-16 | 1986-07-16 | Continuous vacuum deposition plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6324058A true JPS6324058A (en) | 1988-02-01 |
Family
ID=15849690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16743786A Pending JPS6324058A (en) | 1986-07-16 | 1986-07-16 | Continuous vacuum deposition plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6324058A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100429148B1 (en) * | 1999-11-09 | 2004-04-28 | 주식회사 포스코 | Apparatus for coating Zn onto the surface of the steel sheet by using Zn vapor |
-
1986
- 1986-07-16 JP JP16743786A patent/JPS6324058A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100429148B1 (en) * | 1999-11-09 | 2004-04-28 | 주식회사 포스코 | Apparatus for coating Zn onto the surface of the steel sheet by using Zn vapor |
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