JPS63238283A - Method and device for partially plating ceramic package - Google Patents
Method and device for partially plating ceramic packageInfo
- Publication number
- JPS63238283A JPS63238283A JP7045187A JP7045187A JPS63238283A JP S63238283 A JPS63238283 A JP S63238283A JP 7045187 A JP7045187 A JP 7045187A JP 7045187 A JP7045187 A JP 7045187A JP S63238283 A JPS63238283 A JP S63238283A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- ceramic package
- plated
- soln
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 130
- 239000000919 ceramic Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 17
- 230000000873 masking effect Effects 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims description 22
- 239000007921 spray Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 13
- 238000002347 injection Methods 0.000 abstract description 12
- 239000007924 injection Substances 0.000 abstract description 12
- 238000011084 recovery Methods 0.000 abstract description 6
- 238000013019 agitation Methods 0.000 abstract description 5
- 239000000243 solution Substances 0.000 description 31
- 238000007789 sealing Methods 0.000 description 13
- 238000003756 stirring Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〈発明の利用分野〉
この発明は、セラミックパッケージのメッキ方法、特に
そのメッキ対象面部にのみ金等の貴金属をメッキする部
分メッキ方法及びその装置に関する。ここで、第５図に
示すセラミックパッケージ１とは、段々状に形成された
シーリング部２、リード部３及びダイパッド部４から成
るマウント部５を有し、両サイドにはサイドリード部６
が設けられているもので、このうちマウント部５がメッ
キ対象面部とされるものである。DETAILED DESCRIPTION OF THE INVENTION Field of Application of the Invention The present invention relates to a method for plating a ceramic package, and more particularly to a partial plating method and apparatus for plating precious metals such as gold only on the surface to be plated. Here, the ceramic package 1 shown in FIG. 5 has a mounting part 5 consisting of a sealing part 2, a lead part 3, and a die pad part 4 formed in a stepped manner, and side lead parts 6 on both sides.
Of these, the mount portion 5 is the surface portion to be plated.
尚、本明細書における「メッキ」とは、「電解メッキ」
又は「無電解メッキ」の何れであてもよい。In addition, "plating" in this specification refers to "electrolytic plating"
Or "electroless plating" may be used.
〈従来の技術〉
従来、セラミックパッケージのメッキ方法としては、例
えば、ラックメッキ方法が、またその部分メッキ方法と
しては、レジストシール法、あるいは機械的マスキング
方法（モジュールマスク；日本エレクトロプレイティン
グ・エンジニャース株式会社の登録商標）等が知られて
いる。<Prior art> Conventionally, as a plating method for ceramic packages, for example, a rack plating method is used, and as a partial plating method, a resist seal method or a mechanical masking method (module mask; Nippon Electroplating Engineers Co., Ltd. Ltd. (registered trademark), etc. are known.
〈発明が解決しようとする問題点〉
しかしながら、上記ラックメッキ方法は、メッキ処理作
業自体は簡単・容易であるものの、不必要な部分（具体
的には、サイドリード部６）にもメッキされてしまい金
等の高価なメッキ材料を徒に浪費してしまうという点で
不十分であり、また上記レジストシール法は、レジスト
処理作業が大変であるため作業性において劣り、また上
記機械的シール法は、セラミックパッケージ１の特性、
即ちマウント部５とサイドリード部６との間が非常に狭
い（通常１ｍ以下）という特性故に、この部分について
十分なシールのスペースを採ることができないため確実
なシールを行うことができず、結局、シール漏れによっ
て生じた不要部分のメッキを剥離しなければならないこ
とになり、結果として、経済性及び作業性とも不十分な
ものとなってしまう。<Problems to be Solved by the Invention> However, although the rack plating method described above is simple and easy, unnecessary parts (specifically, the side lead parts 6) are also plated. The resist sealing method described above is unsatisfactory in that it wastes expensive plating materials such as plating metal, and the resist sealing method is inferior in workability because the resist processing work is difficult, and the mechanical sealing method described above is , characteristics of ceramic package 1,
In other words, due to the characteristic that the space between the mount part 5 and the side lead part 6 is very narrow (usually 1 m or less), it is not possible to provide a sufficient sealing space for this part, making it impossible to perform a reliable seal. In this case, it becomes necessary to peel off the plating on unnecessary parts caused by seal leakage, and as a result, both economical efficiency and workability become insufficient.
そこで、この発明では、確実なシール効果を以て、しか
も正確且つ迅速にメッキ対象面部へのメッキを行なえる
セラミックパッケージの部分メッキ方法及びその装置を
提供することを目的としている。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method and apparatus for partial plating of a ceramic package, which can accurately and quickly plate a surface to be plated with a reliable sealing effect.
〈問題点を解決するための手段〉
上記目的を達成するための手段として、第１発明〔特許
請求の範囲（１）記載の発明、以下同じ〕では、メッキ
液を噴射状態にてオーバーフロー型のメッキ処理槽内へ
供給すると共に、所定液面レベルを保たせつつこのメッ
キ処理槽から排出・回収せしめ且つ、セラミックパッケ
ージのメッキ対象面部を前記液面に対し傾斜させた状態
でメッキ液と接触せしめることを要旨とし、また第２発
明〔特許請求の範囲（２）記載の発明、以下同じ〕では
、メッキ装置に、噴射状態にて供給されるメッキ液をオ
ーバーフロー堰にて所定液面レベルを保ちながら排出す
るメッキ処理槽及びメッキ液の液面に対し傾斜状態で配
される上蓋を設け、メッキ対象物たるセラミックパッケ
ージのメッキ対象面部に□ 相応する第１メッキ開口
及びこの第１メッキ開口へ一端を臨ませる複数の第１通
孔を備えるマスキングパッドを前記上蓋の上面に装着し
且つ、この上蓋に前記第１メッキ開口に連通ずる第２メ
ッキ開口及び一端を前記各第１通孔に連通し他端をメッ
キ処理槽内へ臨ませる複数の第２通孔を設けることを要
旨としている。<Means for solving the problem> As a means for achieving the above object, in the first invention [the invention described in claim (1), the same applies hereinafter], a plating solution is sprayed in an overflow type. The plating solution is supplied into a plating tank, and is discharged and collected from the plating tank while maintaining a predetermined liquid level, and the surface of the ceramic package to be plated is brought into contact with the plating solution while being inclined with respect to the liquid level. In addition, in the second invention [the invention described in claim (2), the same applies hereinafter], the plating liquid supplied to the plating apparatus in a sprayed state is maintained at a predetermined liquid level at an overflow weir. An upper lid is provided which is arranged at an angle with respect to the liquid level of the plating treatment tank and the plating solution to be discharged, and a first plating opening corresponding to the plating target surface of the ceramic package which is the object to be plated and one end connected to the first plating opening are provided. A masking pad having a plurality of first through holes facing through is attached to the upper surface of the upper lid, and a second plating opening communicates with the first plating opening in the upper lid, and one end thereof communicates with each of the first through holes. The gist is to provide a plurality of second through holes whose other ends face into the plating tank.
〈作 用〉
即ち、噴射状態にてオーバーフロー型のメッキ処理槽内
へ供給することにより常に十分な撹拌をメッキ液に与え
ているので、正確且つ迅速なメッキに好適な条件を得ら
れると同時に、メッキ液を所定液面レベルを保たせつつ
このオーバーフロー型のメッキ処理槽から排出・回収せ
しめると共に、このメッキ液へメッキ対象面部を液面に
対し傾斜させた状態で接触せしめたことにより、前記噴
射状態による撹拌の圧力が必要以上にメッキ対象面部へ
及ぶことのないようにしているので、僅かなシールスペ
ースであっても十分なシール効果を得られることになる
（第１発明、第２発明）。<Function> That is, by supplying the plating solution in an overflow type plating process tank in a jet state, sufficient agitation is always given to the plating solution, so that conditions suitable for accurate and rapid plating can be obtained, and at the same time, The plating solution is discharged and collected from the overflow type plating tank while maintaining a predetermined liquid level, and the surface to be plated is brought into contact with the plating solution at an angle with respect to the liquid level. Since the pressure of stirring depending on the state is not applied to the surface to be plated more than necessary, a sufficient sealing effect can be obtained even with a small sealing space (first invention, second invention). .
また、マスキングパッド及びこのマスキングパッドが装
着される上蓋に、相互に連通ずる第１、第２の両道孔を
各々設け、第１通孔の一端を第１メッキ開口へ臨ませる
と同時に第２通孔の他端をメッキ処理槽内へ臨ませてい
るので、この両道孔を通うてメッキ液が循環することに
よりメッキ対象面部が有する凸凹（段々）の隅々までも
撹拌効果が及ぶと共に、この循環により凸凹（段々）の
隅に滞留し易い気泡を排除できることになり、より迅速
且つ正確なメッキを行なえることになる（第２発明）。Further, the masking pad and the upper lid to which the masking pad is attached are provided with first and second two-way holes that communicate with each other, so that one end of the first through hole faces the first plating opening, and at the same time the second through hole is opened. Since the other end of the hole faces into the plating tank, the plating solution circulates through these two-way holes, and the stirring effect reaches every corner of the unevenness (steps) on the surface to be plated. The circulation makes it possible to eliminate air bubbles that tend to accumulate in the corners of uneven surfaces (steps), allowing for faster and more accurate plating (second invention).
く実 施 例〉
以下、この発明の実施例を、第１図〜第７図を参照して
説明する。尚、以下の説明では、第２発明を主体とし、
第１発明については、適宜言及するものとする。Embodiments Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 7. In addition, in the following explanation, the second invention is the main subject,
The first invention will be mentioned as appropriate.
このセラミックパッケージの部分メッキ装置１− ０で
は、オーバーフロー型のメッキ処理槽１１、このメッキ
処理槽１１から排出されるメッキ液１２を回収する回収
槽１３及びこの両槽１１．１３を覆う上蓋１４を備える
スパージャ−１５を設けている。This partial plating apparatus 1-0 for ceramic packages includes an overflow type plating tank 11, a recovery tank 13 for collecting the plating solution 12 discharged from the plating tank 11, and an upper lid 14 that covers both tanks 11 and 13. A sparger 15 is provided.
メッキ処理槽１１は、メッキ液１２の液面１６に対し傾
斜状態とされたその底部１８に噴射体１９を備えており
、メッキ処理槽１１と噴射体１９の接続は、噴射ノズル
２０及び複数の補助噴射孔２１を備える陽極化された噴
射プレート２２を介してなされている。ここで、噴射プ
レート２２に突出する噴射ノズル２０と共に複数の補助
噴射孔２１を設け、両者の組合せによりメッキ液１２の
撹拌をいわば立体的に効率よく行なえるようにしている
のに応じて、噴射ノズル２０の先端開口をマウント部５
（メッキ対象面部）より１５〜５０鵬と、通常のジェッ
トメッキの場合の３〜１２ｍに比べ大きく離している。The plating tank 11 is equipped with a spray body 19 at its bottom 18 which is inclined with respect to the liquid level 16 of the plating solution 12. The plating tank 11 and the spray body 19 are connected through a spray nozzle 20 and a plurality of spray nozzles 20 and a plurality of spray bodies 19. This is done via an anodized injection plate 22 with auxiliary injection holes 21. Here, a plurality of auxiliary injection holes 21 are provided together with the injection nozzles 20 protruding from the injection plate 22, and the combination of the two allows the plating solution 12 to be efficiently stirred in a three-dimensional manner. The tip opening of the nozzle 20 is connected to the mount section 5.
(The surface to be plated) is 15 to 50 meters away, which is much larger than the 3 to 12 meters in the case of normal jet plating.
このことは、後述のメッキ液面１６に対するマウント部
５（メッキ対象面部）の傾斜設定と同様に、必要以上の
撹拌圧がマウント部５、具体的にはマウント部５とサイ
ドリード部６との間をマスキングパッド２日がシールし
ている部分へ及ぶのを防ぐ作用を有するものである。ま
た、複数の補助噴射孔２１を設けることは、メッキ液１
２のメッキ処理槽１１への供給乃至メッキ処理槽１１か
らの排出を迅速に行なえるという点でも有用である。尚
、噴射ノズル２０は、個々のメッキ条件での要求に応じ
て選択的に陽極化されるものである。This means that an excessive stirring pressure is applied to the mount part 5, specifically the mount part 5 and the side lead part 6, as well as the inclination setting of the mount part 5 (surface to be plated) with respect to the plating liquid level 16, which will be described later. The masking pad has the effect of preventing the masking pad from reaching the sealed area. Further, providing a plurality of auxiliary injection holes 21 means that the plating solution 1
It is also useful in that the supply to the plating tank 11 of No. 2 and the discharge from the plating tank 11 can be performed quickly. Incidentally, the injection nozzle 20 is selectively anodized according to the requirements of individual plating conditions.
回収槽１３は、傾斜状態のメッキ処理槽１１の上側（Ａ
側）に設けられており、メッキ処理槽１１の傾斜上端に
設けたオーバーフロー堰２４にて所定液面レベルを保ち
ながら排出するメッキ液１２を回収し貯液槽２５へ戻す
ためのものである。The recovery tank 13 is located above the inclined plating tank 11 (A
This is for collecting the plating solution 12 discharged from the overflow weir 24 provided at the sloping upper end of the plating tank 11 while maintaining a predetermined liquid level and returning it to the liquid storage tank 25.
ここで、「所定液面レベル」とは、第１図の如き状態に
おいてセラミックパッケージ１のマウント部５（メッキ
対象面部）全体がメッキ液１６に接触し得る状態、即ち
マウント部５（メッキ対象面部）の上端以上で、好まし
くはこの上端より数■高い液面レベルをいう。Here, the "predetermined liquid level" refers to a state where the entire mount portion 5 (surface to be plated) of the ceramic package 1 can come into contact with the plating solution 16 in the state shown in FIG. ), preferably several inches higher than this upper limit.
上蓋１４には、マウント部５に相応する第１メッキ開口
２６及びこの第１メッキ開口２６へ一端を臨ませる複数
の第１通孔２７を備え、セラミックパッケージ１のマウ
ント部５以外をメッキ液１２からシールするマスキング
パッド２８が装着されると共に、第１メッキ開口２６に
連通ずる第２メッキ開口２９及び一端を各第１通孔２７
に連通し他端をメッキ処理槽１１内へ臨ませる複数の第
２通孔３０が設けられている。しかも、この上蓋１４は
、メッキ処理槽１１の底部１８と平行状態で配され、同
様にメッキ液１２の液面１６に対し傾斜状態とされてい
る。メッキ液１２の液面１６に対する上１［１４の傾斜
角度ｅは、５°〜６０゜とすることが可能で、特に好ま
しくは４０″〜４５°である。尚、この実施例では、第
１、第１通孔２７．３０を各々第１、第１メッキ開口２
６．２９各々の両側に設けているが、上側（Ａ側）のみ
に設けるものであってもよい。ただ、後述の如き両道孔
２７．３０の気泡排出機能からすると、上側（Ａ側）の
第２通孔３０は、気泡が排出し易いように、第１図中で
水平乃至右上がりの状態にして設けられるのがより一層
好ましいものである。また、マスキングパッド１３の第
１メッキ開口２６の形状は、セラミックパッケージ１と
の接触側へ向かって広がる錐体状とされているが、この
ような形状にすると、マウント部５のシーリング部２の
メッキ厚がリード部３乃至ダイパッド部４のメッキ厚よ
り厚くなってしまうのを防止できるという点で好ましい
が、必ずしもこれに限られず、例えば第７図に示すよう
な置体状であってもよい。The upper lid 14 is provided with a first plating opening 26 corresponding to the mount part 5 and a plurality of first through holes 27 whose ends face the first plating opening 26, so that the parts other than the mount part 5 of the ceramic package 1 are exposed to the plating solution 12. A masking pad 28 for sealing is attached to the second plating opening 29 communicating with the first plating opening 26 and one end of the second plating opening 29 communicating with the first through hole 27 .
A plurality of second through holes 30 are provided, which communicate with each other and have the other end facing into the plating tank 11 . Moreover, the upper lid 14 is disposed parallel to the bottom 18 of the plating bath 11 and is also inclined with respect to the liquid level 16 of the plating solution 12. The inclination angle e of the upper part 14 with respect to the liquid level 16 of the plating solution 12 can be 5° to 60°, and is particularly preferably 40" to 45°. , the first through holes 27 and 30 are connected to the first and first plated openings 2, respectively.
6.29 It is provided on both sides of each, but it may be provided only on the upper side (side A). However, considering the bubble evacuation function of the two-way holes 27 and 30 as described later, the second passage hole 30 on the upper side (A side) should be placed horizontally or upwardly to the right in Fig. 1 to facilitate the evacuation of air bubbles. It is even more preferable that the Further, the shape of the first plating opening 26 of the masking pad 13 is a cone-like shape that widens toward the contact side with the ceramic package 1, but when it is shaped like this, the sealing part 2 of the mount part 5 is This is preferable in that it can prevent the plating thickness from becoming thicker than the plating thickness of the lead part 3 to the die pad part 4, but it is not necessarily limited to this, and for example, a stand-up shape as shown in FIG. 7 may be used. .
尚、図中、３２はポンプ、３３は整流器である。In addition, in the figure, 32 is a pump and 33 is a rectifier.
また、３６はメッキ処理槽ｌｌ内を大気圧と平行させる
ための通気孔である。Further, 36 is a vent hole for making the inside of the plating treatment tank 11 parallel to the atmospheric pressure.
以下、このセラミックパッケージの部分メッキ装置１０
の作動状態を説明する。The following is a partial plating apparatus 10 for this ceramic package.
Explain the operating status of.
メッキ液１２は、貯液槽２５よりポンプ３２にて送られ
、噴射体１９を介して噴射状態にてメッキ処理槽１１へ
供給される。このようにメッキ処連槽１１へ供給された
メッキ液１２は、オーバーフロー堰２４にて所定液面レ
ベルを保ちつつ回収槽１３へ排出せしめられている。そ
して、メッキ対象物としてのセラミックパッケージ１は
、第１メッキ開口２６へそのマウント部５を合わされて
図示せぬ押圧手段により矢示Ｂ方向より押し付けられな
がら上蓋１４、具体的にはマスキングパッド２８にセッ
トされることにより、メッキ液１２の液面１６に対し傾
斜状態とされると共に、マスキングパッド２８にてシー
ルされ、マウント部５のみをメッキ液１２に接触させて
部分メッキされることになる。この際、マウント部５に
ある凸凹（段々）がメッキ状態に微妙な影響を及ぼすと
同時に、凸凹（段々）の隅にマウント部５に付着してい
た気泡やメッキにより生じる気泡が滞留し易いものであ
るが、マスキングパッド２８及び上蓋１４の第１、第２
通孔３０．３０を通ってメッキ液１２が循環することに
より、凸凹（段々）の隅々までも撹拌効果がよくいきわ
たり凸凹（段々）の微妙な影響を抑えることができ、さ
らにこの循環により凸凹（段々）の隅に滞留する気泡を
排除できることになる。The plating liquid 12 is sent from the liquid storage tank 25 by a pump 32, and is supplied to the plating processing tank 11 in a sprayed state via a jetting body 19. The plating solution 12 thus supplied to the plating tank 11 is discharged to the recovery tank 13 while maintaining a predetermined liquid level at the overflow weir 24. Then, the ceramic package 1 as the object to be plated is placed on the top lid 14, specifically, on the masking pad 28 while being pressed from the direction of arrow B by a pressing means (not shown) with its mounting portion 5 aligned with the first plating opening 26. By being set, it is inclined with respect to the liquid level 16 of the plating solution 12, and is sealed with the masking pad 28, so that only the mount portion 5 is brought into contact with the plating solution 12 and is partially plated. At this time, the unevenness (steps) on the mount part 5 has a subtle effect on the plating condition, and at the same time, the air bubbles attached to the mount part 5 and the air bubbles generated by the plating tend to stay in the corners of the unevenness (steps). However, the masking pad 28 and the first and second
By circulating the plating solution 12 through the through holes 30 and 30, the stirring effect is well spread to every corner of the unevenness (steps), and the subtle effects of the unevenness (steps) can be suppressed. This means that air bubbles that accumulate in the corners of the steps can be eliminated.
このように、メッキ液１２に常に十分な撹拌を与えてい
るので、正確且つ迅速なメッキに好適な条件を得られる
と同時に、噴射状態による撹拌の圧力が必要以上にマウ
ント部５、具体的にはマウント部５とサイドリード部６
との間をマスキングパッド２８がシールしている部分へ
及ぶことのないようにしているので、僅かなシールスペ
ースであっても十分なシール効果を得られることになる
。In this way, sufficient agitation is always given to the plating solution 12, so that conditions suitable for accurate and rapid plating can be obtained, and at the same time, the pressure of agitation due to the injection state is not excessively applied to the mount portion 5, specifically. mount part 5 and side lead part 6
Since the space between the masking pad 28 and the masking pad 28 does not extend to the sealed area, a sufficient sealing effect can be obtained even with a small sealing space.
迅速なメッキ条件の一つの具体的数値例としては、１〜
３Ａ／ｄｍ”の電流密度が可能となり、通常０．２５Ａ
／ｄｍ”の電流密度しか与えることのできないラックメ
ッキ方法に比べ非常に秀れたものとなっている点が挙げ
られる。また、第１、第２の両道孔２７．３０により、
マウント部５が有する凸凹（段々）の隅々までも撹拌効
果が及ぶと共に、凸凹（１段々）の隅に滞留し易い気泡
を排除できることになり、より迅速且つ正確なメッキを
行なえることにもなる。One specific numerical example of rapid plating conditions is 1 to
3A/dm” current density is possible, typically 0.25A
It is very superior to the rack plating method, which can only provide a current density of /dm". Also, the first and second two-way holes 27.30
The agitation effect reaches every corner of the unevenness (steps) of the mount part 5, and it also eliminates air bubbles that tend to stay in the corners of the unevenness (steps), allowing for faster and more accurate plating. Become.
第６図には、他の実施例を示す。この実施例は、第２通
孔３０に接続するサブ通孔３４を設け、このサブ通孔３
４より第２通孔３０を介してマウント部５ヘエアを噴き
出し、メッキ処理槽１１からメッキ液１２を排出した後
にもなおマウント部５に付着しているメッキ液１２を除
去し、ドラッグアウト（回収工程へのメッキ液の持ち出
し）の量をできるだけ少なくしている点に特徴がある。FIG. 6 shows another embodiment. In this embodiment, a sub-hole 34 connected to the second through-hole 30 is provided, and this sub-hole 3
4 to the mount part 5 through the second through hole 30 to remove the plating solution 12 still attached to the mount part 5 even after the plating solution 12 has been discharged from the plating treatment tank 11, and drag out (recovery) the plating solution 12. The feature is that the amount of plating solution taken out to the process is kept as small as possible.
尚、図中３５は、セラミックパッケージ１を位置決めす
るためのピンである。その他の点については、前記実施
例と同様なのでその説明を省略する。Note that 35 in the figure is a pin for positioning the ceramic package 1. The other points are the same as those of the previous embodiment, so the explanation thereof will be omitted.
〈発明の効果〉
この発明は、以上説明してきた如く、噴射状態による供
給とオーバーフロー（排出）とを組合せ、しかもメッキ
液の液面に対し傾斜状態とさせてメッキ対象面部をメッ
キ液と接触させることとし、これらの３条件を有機的に
協働させ微妙なバランスのメッキ条件を形成しているの
で、秀れたシール性を以て、しかも正確且つ迅速にセラ
ミックパッケージの部分メッキを行なえるという秀れた
効果がある（第１発明、第２発明）。<Effects of the Invention> As explained above, the present invention combines supply by injection and overflow (discharge), and also brings the surface to be plated into contact with the plating solution in an inclined state with respect to the surface of the plating solution. In particular, these three conditions work together organically to form delicately balanced plating conditions, making it possible to perform partial plating of ceramic packages accurately and quickly with excellent sealing performance. (first invention, second invention).
また、マスキングパッド及び上蓋に、相互に連通ずる第
１、第２の両道孔を設け、この両道孔を介してのメッキ
液の循環によりメッキ対象面部が有する凸凹の隅々まで
も撹拌効果が及ぶようにすると共に、この循環により凸
凹の隅に滞留し易い気泡を排除することとしているので
、より正確且つ迅速なメッキを行なえるという秀れた効
果もある（第２発明）。In addition, the masking pad and the top cover are provided with first and second holes that communicate with each other, and the circulation of the plating solution through these holes allows the stirring effect to reach every uneven corner of the surface to be plated. At the same time, this circulation eliminates air bubbles that tend to accumulate in the corners of uneven surfaces, which has the excellent effect of allowing more accurate and rapid plating (second invention).
第１図は、第２発明の実施例に係るセラミックパッケー
ジの部分メッキ装置の要部を示す概略側断面図、
第２図は、マスキングパッドの概略斜視図、第３図は、
第２図中の矢示■−■線に沿う断面図、
第４図は、第２図中の矢示ＩＶ−ＴＶ線に沿う断面図、
第５図は、セラミックパッケージの概略斜視図、第６図
は、他の実施例に係るセラミ゛ツクパッケ−ジの部分メ
ッキ装置の要部を示す概略側断面図、そして
第７図は、他の実施例に係るマスキングパッドの概略断
面図である。
ｌ−・・−セラミックパッケージ
５−−−−−−−マウント部（メッキ対象面部）１０−
・−セラミックパッケージの部分メッキ装置１１−−−
−−−−メッキ処理槽 −１２・・−・−・メッキ液
１３・−−一−−・−回収槽
１４−−−−−−一上蓋
１６−・−液面
２４−・・−オーバーフロー堰
２６−−−−−−−第１メッキ開口
２７−−−−−−・−第１通孔
２８−−−−−−−マスキングパッド
２９・−−−−−−一第２メッキ開口
３０−−−−−−一第２通孔
２６ 第ｊヌッ央間口
第４図 ２７Ｍ１通口
Ｚｂ第１メ・／キ聞口FIG. 1 is a schematic side sectional view showing the main parts of a partial plating apparatus for a ceramic package according to an embodiment of the second invention, FIG. 2 is a schematic perspective view of a masking pad, and FIG.
FIG. 4 is a sectional view taken along the line IV-TV in FIG. 2; FIG. 5 is a schematic perspective view of the ceramic package; FIG. 6 is a schematic side sectional view showing the main parts of a partial plating apparatus for ceramic packages according to another embodiment, and FIG. 7 is a schematic sectional view of a masking pad according to another embodiment. l-...-Ceramic package 5--Mount part (surface to be plated) 10-
・-Ceramic package partial plating equipment 11---
---Plating treatment tank -12...--Plating solution 13---Recovery tank 14--Top lid 16--Liquid level 24--Overflow weir 26--------First plating opening 27--First through hole 28--Masking pad 29--Second plating opening 30- ------1 2nd through hole 26 2nd J nut center frontage Figure 4 27M1 entrance Zb 1st me//ki opening
Claims (2)
キ処理槽内へ供給すると共に、所定液面レベルを保たせ
つつこのメッキ処理槽から排出・回収せしめ且つ、セラ
ミックパッケージのメッキ対象面部を前記液面に対し傾
斜させた状態でメッキ液と接触せしめるセラミックパッ
ケージの部分メッキ方法。(1) The plating solution is supplied in an overflow type plating tank in a sprayed state, and is discharged and collected from the plating tank while maintaining a predetermined liquid level, and the surface to be plated of the ceramic package is sprayed with the plating tank. A method for partial plating of ceramic packages in which the ceramic package is brought into contact with the plating solution at an angle to the surface.
ー堰にて所定液面レベルを保ちながら排出するメッキ処
理槽と、 メッキ液の液面に対し傾斜状態で配される上蓋とを設け
、そして メッキ対象物たるセラミックパッケージのメッキ対象面
部に相応する第１メッキ開口及びこの第１メッキ開口へ
一端を臨ませる複数の第１通孔を備えるマスキングパッ
ドを前記上蓋の上面に装着し且つ、この上蓋に前記第１
メッキ開口に連通する第２メッキ開口及び一端を前記各
第１通孔に連通し他端をメッキ処理槽内へ臨ませる複数
の第２通孔を設けたセラミックパッケージの部分メッキ
装置。(2) A plating treatment tank is provided in which the plating solution supplied in the spray state is discharged while maintaining a predetermined liquid level at an overflow weir, and an upper lid is arranged at an angle with respect to the liquid level of the plating solution, and A masking pad having a first plating opening corresponding to a surface to be plated of a ceramic package to be plated and a plurality of first through holes having one end facing the first plating opening is attached to the upper surface of the upper lid, and said first
A partial plating apparatus for a ceramic package, comprising a second plating opening communicating with the plating opening, and a plurality of second through holes having one end communicating with each of the first through holes and the other end facing into a plating bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7045187A JPH0730453B2 (en) | 1987-03-26 | 1987-03-26 | Method and apparatus for partial plating of ceramic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7045187A JPH0730453B2 (en) | 1987-03-26 | 1987-03-26 | Method and apparatus for partial plating of ceramic package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63238283A true JPS63238283A (en) | 1988-10-04 |
| JPH0730453B2 JPH0730453B2 (en) | 1995-04-05 |
Family
ID=13431881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7045187A Expired - Lifetime JPH0730453B2 (en) | 1987-03-26 | 1987-03-26 | Method and apparatus for partial plating of ceramic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0730453B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008045218A (en) * | 2007-10-01 | 2008-02-28 | Dowa Holdings Co Ltd | Plating method and patterning method on metal-ceramic composite member, wet treatment apparatus and metal-ceramic composite member for power module |
-
1987
- 1987-03-26 JP JP7045187A patent/JPH0730453B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008045218A (en) * | 2007-10-01 | 2008-02-28 | Dowa Holdings Co Ltd | Plating method and patterning method on metal-ceramic composite member, wet treatment apparatus and metal-ceramic composite member for power module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0730453B2 (en) | 1995-04-05 |
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