JPS6323655B2 - - Google Patents
Info
- Publication number
- JPS6323655B2 JPS6323655B2 JP13399887A JP13399887A JPS6323655B2 JP S6323655 B2 JPS6323655 B2 JP S6323655B2 JP 13399887 A JP13399887 A JP 13399887A JP 13399887 A JP13399887 A JP 13399887A JP S6323655 B2 JPS6323655 B2 JP S6323655B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- adhesive sheet
- semiconductor
- handling ring
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 59
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 238000003672 processing method Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 42
- 238000000034 method Methods 0.000 description 19
- 238000004140 cleaning Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62133998A JPS6323334A (ja) | 1987-05-29 | 1987-05-29 | 半導体素子処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62133998A JPS6323334A (ja) | 1987-05-29 | 1987-05-29 | 半導体素子処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6323334A JPS6323334A (ja) | 1988-01-30 |
| JPS6323655B2 true JPS6323655B2 (fr) | 1988-05-17 |
Family
ID=15117991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62133998A Granted JPS6323334A (ja) | 1987-05-29 | 1987-05-29 | 半導体素子処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6323334A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11437747B2 (en) | 2020-09-25 | 2022-09-06 | Apple Inc. | Spring-loaded contacts having capsule intermediate object |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02214134A (ja) * | 1989-02-15 | 1990-08-27 | Nitto Denko Corp | 半導体ウエハマウンタにおける粘着テープテンション付与装置 |
| FR2794443B1 (fr) * | 1999-06-02 | 2001-06-22 | Commissariat Energie Atomique | Procede de transfert d'elements et dispositif permettant ledit transfert |
| JP4546626B2 (ja) * | 2000-08-29 | 2010-09-15 | 株式会社ディスコ | 半導体素子のピックアップ方法 |
| JP4835830B2 (ja) * | 2005-12-22 | 2011-12-14 | 株式会社東京精密 | エキスパンド方法、装置及びダイシング装置 |
| CN106816412B (zh) * | 2017-01-19 | 2019-05-24 | 吉林麦吉柯半导体有限公司 | 晶圆的切割工艺及晶圆的生产方法 |
-
1987
- 1987-05-29 JP JP62133998A patent/JPS6323334A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11437747B2 (en) | 2020-09-25 | 2022-09-06 | Apple Inc. | Spring-loaded contacts having capsule intermediate object |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6323334A (ja) | 1988-01-30 |
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