JPS6323318A - Projection exposure device - Google Patents
Projection exposure deviceInfo
- Publication number
- JPS6323318A JPS6323318A JP62088717A JP8871787A JPS6323318A JP S6323318 A JPS6323318 A JP S6323318A JP 62088717 A JP62088717 A JP 62088717A JP 8871787 A JP8871787 A JP 8871787A JP S6323318 A JPS6323318 A JP S6323318A
- Authority
- JP
- Japan
- Prior art keywords
- light
- reticle
- light shielding
- opening
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 19
- 238000005286 illumination Methods 0.000 claims description 14
- 230000000903 blocking effect Effects 0.000 claims description 6
- 230000004907 flux Effects 0.000 abstract description 5
- 239000011521 glass Substances 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70066—Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
本発明は投影露光装置、特に半導体製造分野でレチクル
（フォトマスク）に形成されているパターンをウェハに
投影露光する装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a projection exposure apparatus, and particularly to an apparatus for projecting and exposing a pattern formed on a reticle (photomask) onto a wafer in the field of semiconductor manufacturing.
半導体素子（例えばＩＣ，ＬＳＩ、ＶＬＳＩ等）の製造
過程では、レチクル（）オドマスク）に形成されている
微細なパターンを半導体ウェハにウェハ上に欠陥を発生
させることなく正確に投影露光することが要求される。In the manufacturing process of semiconductor devices (e.g., IC, LSI, VLSI, etc.), it is necessary to accurately project and expose a fine pattern formed on a reticle (or odomask) onto a semiconductor wafer without causing defects on the wafer. be done.
このようなＧｔｎ光を可能にする装置の一例としては、
例えばステッパと呼ばれる投影露光装置が知られている
。An example of a device that enables such Gtn light is:
For example, a projection exposure apparatus called a stepper is known.
ステッパはレチクル上の１〜数個のマスクパターンを所
定の縮小率でウェハ上に投影し、ステップアンドリピー
ト（Ｐ！り返し）′Ｈ光によりウェハ全面にパターンを
配列して焼付けている。The stepper projects one to several mask patterns on the reticle onto the wafer at a predetermined reduction ratio, and uses step-and-repeat (P! repeat)'H light to arrange and print the patterns over the entire surface of the wafer.
ところで、レチクル（フォトマスク）のパターン部以外
の領域には焼付は光が透過しないようにクローム等が蒸
着されている。これはパターン部以外の領域を焼付は光
が通過し、この焼付は光がウェハを露光すると、ウェハ
上のパターン部に何等かの欠陥が発生する恐れがあるか
らである。特に、ステッパではパターン部以外の領域を
通過してきた焼付は光はウェハ上で隣接して投影焼付け
されるパターンに有害な露光を与えることになり、その
パターンに重大な欠陥を発生させてしまう。しかし、レ
チクルの蒸着面にはピンホールや何等かの損傷がある場
合がある。By the way, chrome or the like is deposited on areas other than the patterned areas of the reticle (photomask) to prevent light from passing through the area. This is because light passes through areas other than the pattern area, and if the wafer is exposed to this light, some defects may occur in the pattern area on the wafer. In particular, in the case of a stepper, the light that passes through areas other than the pattern area will give harmful exposure to the adjacent pattern projected and printed on the wafer, causing serious defects in the pattern. However, there may be pinholes or other damage on the evaporation surface of the reticle.
このため、従来より、ウェハ上に有害な焼付は光が到達
しないように焼付は光の照明光路中に遮光手段を設ける
ことが提案されてはいるが、実用的に充分なものではな
かった。For this reason, it has been proposed in the past to provide a light shielding means in the illumination optical path of the printing light to prevent the harmful printing light from reaching the wafer, but this has not been practically sufficient.
本発明はこのような事情に鑑みなされたもので、その目
的は例えばレチクルのような第１物体に形成されている
パターンを例えばウェハのような第２物体に正確に、且
つ欠陥を発生させることなく投影露光することのできる
投影露光装置を提供することにある。The present invention was made in view of the above circumstances, and its purpose is to accurately transfer a pattern formed on a first object, such as a reticle, to a second object, such as a wafer, and to generate defects. An object of the present invention is to provide a projection exposure apparatus that can perform projection exposure without any problems.
この目的を達成するために、本発明は光源からの光で第
１物体に形成されているパターンを第２物体に投影露光
するための照明光路中に、前記光源からの光を遮断する
ための、前記パターンに対応する開口を有する遮光手段
を前記第１物体の厚みに対応して前記照明光路の光軸方
向に移動するように配置することを要旨としている。To achieve this object, the present invention provides a method for blocking light from the light source during an illumination optical path for projecting and exposing a pattern formed on a first object onto a second object using light from the light source. , the gist is that a light shielding means having an opening corresponding to the pattern is arranged so as to move in the optical axis direction of the illumination optical path in accordance with the thickness of the first object.
以下、本発明を図示の実施例に基づいて詳細に説明する
。Hereinafter, the present invention will be explained in detail based on illustrated embodiments.
第１図は本発明の投影露光装置（例えばステッパ）の照
明系の一例を示すもので、この照明系によりレチクル２
２の下側の面Ｂに形成された回路用パターン２２ａが焼
付は光で照明される。なお、この図では示していないが
、レチクル２２の下方には順に縮小投影レンズとウェハ
が配置されている。FIG. 1 shows an example of an illumination system of a projection exposure apparatus (for example, a stepper) according to the present invention.
The circuit pattern 22a formed on the lower surface B of 2 is printed with light. Although not shown in this figure, a reduction projection lens and a wafer are arranged below the reticle 22 in this order.
超高圧水銀灯などの光源ｉｔの近傍には光源１１から放
射された光束を有効に集光するための楕円鏡１２が配置
され、次いで光路に沿って順に、赤外光の大部分を透過
し紫外光を反射するためのコールドミラー１３、光束の
配光特性を均一にするためのインテグレータ１４、反射
ｆｉ１５、コンデンサレンズ１６、反射鏡１７、遮光装
置１８、コンデンサレンズ１９、反射鏡２０、コンデン
サレンズ２１、レチクル２２が配置されている。反射鏡
１５．１７．２０はそれぞれ光軸を直角に折曲げて照明
系を小型化するためのものであり、コンデンサレンズ１
６は光源１１からの光を集光して、遮光装置１８の遮光
面Ａを均一に照明するためのものである。An elliptical mirror 12 is placed near a light source IT such as an ultra-high pressure mercury lamp to effectively condense the luminous flux emitted from the light source 11, and then sequentially along the optical path transmits most of the infrared light and converts it into ultraviolet light. A cold mirror 13 for reflecting light, an integrator 14 for making the distribution characteristics of the luminous flux uniform, a reflection fi 15, a condenser lens 16, a reflector 17, a light shielding device 18, a condenser lens 19, a reflector 20, a condenser lens 21 , a reticle 22 is arranged. The reflecting mirrors 15, 17, and 20 are used to bend the optical axis at right angles to make the illumination system more compact, and the condenser lens 1
Reference numeral 6 is for condensing the light from the light source 11 to uniformly illuminate the light shielding surface A of the light shielding device 18.
第３図は遮光装置１８の斜視図である。この遮光装置１
８は第１図に示すごとくコンデンサレンズ１９、２１に
より、その遮光する面Ａがレチクル２２のパターン面Ｂ
と共役な関係になるように配置されている。また、遮光
装置１８は不図示の遮光装置駆動機構により、レチクル
２２の回路用パターン部２２ａ、もしくはレチクル２２
の下方に配置されている露光を受けるウェハ（不図示）
との回転方向の位置合わせのために、レチクル２２の回
転に連動して第２図（ａ）に矢印で示す回転（θ）方向
に回動可能であり、更にレチクル２２を他のガラス等の
透明部の厚さが異なるレチクルに取替え、屈折力が変化
した場合に、上記の共役な関係を維持するために、第１
図に矢印で示す光軸方向に移動可能である。FIG. 3 is a perspective view of the light blocking device 18. This light shielding device 1
8 is a condenser lens 19, 21 as shown in FIG.
It is arranged so that it has a conjugate relationship with. Further, the light shielding device 18 is driven by a light shielding device drive mechanism (not shown) to the circuit pattern portion 22a of the reticle 22 or the reticle 22.
Wafer to be exposed (not shown) placed below
In order to align the rotational direction with the reticle 22, it can be rotated in the rotational (θ) direction shown by the arrow in FIG. 2(a) in conjunction with the rotation of the reticle 22. In order to maintain the above conjugate relationship when the reticle is replaced with a reticle with a different thickness of the transparent part and the refractive power changes, the first
It is movable in the optical axis direction indicated by the arrow in the figure.
第３図に戻って遮光装置１８の構成を説明する、
と、基板３０上には、モータ３１、モータ３１
の回転軸にそれぞれ固定されて回転可能な送りネジ部３
２、モータ３１及び送りネジ部３２の回転により所定方
向（図示矢印方向）に移動可能な送りナツト部３３、及
び送りナツト部３３上に固定され、かつ鋭利な側縁部（
エツジ）３４ａを有する遮光板３４がそれぞれ４組配置
され、４個の側縁部３４ａにより矩形の開口部３５を構
成する。この開口部３５の面は遮光装置１８の遮光面Ａ
と同一面上にある。なお、第３図がらも明らかな如く、
４枚の遮光板３４のうち第１及び第２遮光板の移動方向
と第３及び第４遮光板の移動方向はそれぞれ同じである
が、第１及び第２遮光板の移動方向に対する第３及び第
４遮光板の移動方向は異なっている。また、第１及び第
２遮光板に対して第３及び第４遮光板は同一面側に配置
されている。４つのモータ３１は各遮光板３４ごとに独
存して設けられている。Returning to FIG. 3, the configuration of the light shielding device 18 will be explained.
And, on the board 30, there are a motor 31 and a motor 31.
The feed screw parts 3 are each fixed to the rotating shaft of the rotary shaft and can be rotated.
2. A feed nut section 33 that is movable in a predetermined direction (in the direction of the arrow in the figure) by the rotation of the motor 31 and the feed screw section 32, and a sharp side edge (
Four sets of light shielding plates 34 each having an edge 34a are arranged, and a rectangular opening 35 is formed by the four side edges 34a. The surface of this opening 35 is the light shielding surface A of the light shielding device 18.
is on the same plane as Furthermore, as is clear from Figure 3,
Among the four light shielding plates 34, the moving direction of the first and second light shielding plates and the moving direction of the third and fourth light shielding plates are the same, but the third and second light shielding plates are different from each other in the moving direction of the first and second light shielding plates. The moving directions of the fourth light shielding plate are different. Moreover, the third and fourth light shielding plates are arranged on the same side as the first and second light shielding plates. Four motors 31 are provided independently for each light shielding plate 34.
第１図において、光源１１より放射された光束は、光学
素子＋２，１：Ｊ、＋４．１５．１６．１７の順に反射
、屈折し、遮光装置１８の面Ａを均一に照明する。遮光
装置１８の開口部３５の外側に照射された光束は、４つ
の遮光板３４によりけられ、開口部３５を通過した光束
は、第１図において点線で示す如く、レチクル２２のパ
ターン面Ｂを照明する。ここで遮光装置１８の遮光面Ａ
とレチクル２２のパターン面Ｂとは、光学的に共役な関
係に配置されているので、遮光装置１８の開口部３５の
縁部は、第２図（ｂ）に点線で示すようにパターン面Ｂ
上に鮮明な輪郭で投影され、レチクル２２の回路用パタ
ーン部２２ａの外側の領域を完全に遮光することができ
る。In FIG. 1, the light beam emitted from the light source 11 is reflected and refracted in the order of optical elements +2, 1:J, +4, 15, 16, 17, and uniformly illuminates the surface A of the light shielding device 18. The light beam irradiated to the outside of the aperture 35 of the light shielding device 18 is blocked by the four light shielding plates 34, and the light beam that has passed through the aperture 35 hits the pattern surface B of the reticle 22, as shown by the dotted line in FIG. illuminate. Here, the light shielding surface A of the light shielding device 18
and the pattern surface B of the reticle 22 are arranged in an optically conjugate relationship, so the edge of the opening 35 of the light shielding device 18 is aligned with the pattern surface B as shown by the dotted line in FIG. 2(b).
A clear outline is projected on the reticle 22, and the area outside the circuit pattern portion 22a of the reticle 22 can be completely shielded from light.
更に、遮光装置１８の開口部３５の領域及び位置は、こ
の照明系が装備される投影露光装置、例えばステッパの
電子処理部から、レチクル２２の大きさにより出される
信号により４つのモータ３１のそれぞれが所定の回転を
し、各モータ３１の軸に連結されている４つの送りネジ
３２により４つの送りナツト３３がそれぞれ所定方向に
移動し、従って４つの遮光板３４のそれぞわが各モータ
３Ｉによって該信号に応じた位置へ移動することにより
、光軸と直角方向に変化することができる。このような
４枚の遮光板３４の移動、調整は各遮光板３４ごとに設
けられているモータ３１によって同時に行うことも可能
である。Further, the area and position of the aperture 35 of the light shielding device 18 are controlled by each of the four motors 31 according to a signal issued from an electronic processing unit of a projection exposure apparatus equipped with this illumination system, such as a stepper, depending on the size of the reticle 22. rotates in a predetermined manner, and the four feed nuts 33 are moved in predetermined directions by the four feed screws 32 connected to the shaft of each motor 31, so that each of the four light shielding plates 34 is rotated by each motor 3I. By moving to a position according to the signal, it is possible to change the direction perpendicular to the optical axis. Such movement and adjustment of the four light shielding plates 34 can also be performed simultaneously by the motor 31 provided for each light shielding plate 34.
これらにより、レチクル２２の回路用パターン部２２ａ
の領域に合致した照明が可能となる。即ち、照明系の行
動照射範囲内で、電気的処理により、レチクル２２に対
する遮光の寸法、形状、位置を無段階に選択することが
できる。また、第４図（ａ）に示す如く、遮光装置１８
に凹形等の異なる形状の遮光板３４ｂを２枚取り付けた
り、或いは、第４図（ｂ）に示す如く、４枚の遮光板３
４の外に同様な遮光板３４ｃを新たに附加すれば、レチ
クル２２の矩形でない回路用パターンも投影露光するこ
とができる。この照明系を装備したステッパでは、焼付
を行うに際し、レチクル２２内に回路パターンとテスト
パターンを混在させ、回路パターンの焼付を行う時には
テストパターン部を遮光して回路パターン部だけに焼付
光を照射し、逆にテストパターンの焼付を行う時には回
路パターン部を遮光してテストパターン部だけに焼付光
を与えることも可能となる。Due to these, the circuit pattern portion 22a of the reticle 22
This makes it possible to provide lighting that matches the area. That is, within the action irradiation range of the illumination system, the size, shape, and position of light shielding for the reticle 22 can be selected steplessly by electrical processing. Further, as shown in FIG. 4(a), the light shielding device 18
As shown in FIG. 4(b), two light shielding plates 34b of different shapes such as a concave shape may be attached to the
If a similar light shielding plate 34c is newly added in addition to the light shielding plate 4, a non-rectangular circuit pattern of the reticle 22 can also be exposed by projection. In a stepper equipped with this illumination system, when printing, a circuit pattern and a test pattern are mixed in the reticle 22, and when printing a circuit pattern, the test pattern area is shielded from light and only the circuit pattern area is irradiated with printing light. Conversely, when printing a test pattern, it is also possible to shield the circuit pattern portion from light and apply the printing light only to the test pattern portion.
第５図（ａ） 、 （ｂ）は第３図の遮光装置１８の遮
光板３４と同様な目的の遮光板１を有する投影露光装置
（例えばステッパ）の概略構成を示している。これらの
図において、２はレチクル、３はレチクルステージ、４
は投影レンズ、５はウェハであり、遮光板１はレチクル
２に形成された回路用パターン２ａの損傷を防止するた
めに、第５図（ａ）ではレチクル２の上側で光軸方向に
ａ、また、第５図（ｂ）ではレチクル２の下側で光軸方
向にｂの距離をおいて配置されている。従って、遮光板
１はレチクル２のパターン２ａをウェハ５に焼付けるた
めの光の照明光路をけらないようにするために、第５図
（ａ）ではパターン２ａの領域からＣ１また、第５図（
ｂ）ではパターン２ａの＠域からｄの距離だけその先端
１ａが離れるようにセットすることが必要となっている
。5(a) and 5(b) schematically show the structure of a projection exposure apparatus (for example, a stepper) having a light shielding plate 1 having the same purpose as the light shielding plate 34 of the light shielding device 18 in FIG. In these figures, 2 is the reticle, 3 is the reticle stage, and 4 is the reticle stage.
5 is a projection lens, 5 is a wafer, and in order to prevent damage to the circuit pattern 2a formed on the reticle 2, the light shielding plate 1 is a, Further, in FIG. 5(b), they are placed below the reticle 2 at a distance b in the optical axis direction. Therefore, in order to prevent the illumination optical path of the light for printing the pattern 2a of the reticle 2 onto the wafer 5, the light-shielding plate 1 is provided from the area of the pattern 2a in FIG. (
In b), it is necessary to set the tip 1a so that it is separated from the @ area of the pattern 2a by a distance d.
以上の如く、本発明によれば、照明系の照明範囲（遮光
範囲）を決定する遮光手段を照明光路の光軸方向にも移
動可能とし、第１物体の厚みが変化するような場合にも
遮光手段の遮光面と第１物体のパターン面の光学的な共
役■１係を維持可能としているので、余分な焼付は光に
１２１されることなく、例えばレチクルのような第１物
体に形成されているパターンを例えばウェハのような第
２物体に正確に、且つ欠陥が発生することなく投影露光
することができる。As described above, according to the present invention, the light shielding means that determines the illumination range (shading range) of the illumination system can also be moved in the optical axis direction of the illumination optical path, and even when the thickness of the first object changes. Since it is possible to maintain an optical conjugate relationship between the light shielding surface of the light shielding means and the pattern surface of the first object, unnecessary printing is not caused by the light and is formed on the first object such as a reticle. It is possible to project and expose a pattern onto a second object, such as a wafer, accurately and without defects.
第１図は本発明の投影露光装置の一実施例の要部を示す
図、第２図（ａ） 、 （ｂ）は本実施例の遮光装置、
レチクルの端面をそれぞれ示す図、第３図は遮光装置を
詳細に示す斜視図、第４図（ａ） 、 （ｂ）は遮光装
置の変形例を示す図、第５図（ａ） 、 （ｂ）はそれ
ぞれ遮光装置を有する投影露光装置の例を示す図である
。
１８・・・・・・遮光装置
２２・・・・・・レチクル
３４・・・・・・遮光板
３５・・・・・・開［１部
Ａ・・・・・・遮光面
Ｂ・・・・・・レチクルの回路用パターン面第１図
第２図（ａ） 第２図（ｂ）
第５図（ａ）
第５図（ｂ）FIG. 1 is a diagram showing the main parts of an embodiment of the projection exposure apparatus of the present invention, and FIGS. 2(a) and (b) show the light shielding device of the present embodiment,
3 is a perspective view showing details of the light shielding device, FIGS. 4(a) and (b) are views showing modified examples of the light shielding device, and FIGS. 5(a) and (b) are diagrams showing the end faces of the reticle. ) is a diagram showing an example of a projection exposure apparatus each having a light shielding device. 18... Light blocking device 22... Reticle 34... Light blocking plate 35... Open [1 part A... Light blocking surface B... ...Circuit pattern surface of reticle Figure 1 Figure 2 (a) Figure 2 (b) Figure 5 (a) Figure 5 (b)
Claims (1)
ンを第２物体に投影露光するための照明光路中に、前記
光源からの光を遮断するための前記パターンに対応する
開口を有する遮光手段を前記第１物体の厚みに対応して
前記照明光路の光軸方向に移動するように配置したこと
を特徴とする投影露光装置。(1) An opening corresponding to the pattern for blocking the light from the light source is provided in the illumination optical path for projecting and exposing the pattern formed on the first object onto the second object with the light from the light source. A projection exposure apparatus characterized in that a light shielding means is arranged to move in the optical axis direction of the illumination optical path in accordance with the thickness of the first object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62088717A JPS6323318A (en) | 1987-04-13 | 1987-04-13 | Projection exposure device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62088717A JPS6323318A (en) | 1987-04-13 | 1987-04-13 | Projection exposure device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58152474A Division JPS6045252A (en) | 1983-08-23 | 1983-08-23 | Illuminating system of projecting and exposing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6323318A true JPS6323318A (en) | 1988-01-30 |
| JPH0142130B2 JPH0142130B2 (en) | 1989-09-11 |
Family
ID=13950655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62088717A Granted JPS6323318A (en) | 1987-04-13 | 1987-04-13 | Projection exposure device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6323318A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439281U (en) * | 1990-08-01 | 1992-04-02 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5393371A (en) * | 1977-01-28 | 1978-08-16 | Hitachi Ltd | Device for drawing scan pattern |
| JPS5433425U (en) * | 1977-08-06 | 1979-03-05 | ||
| JPS55129333A (en) * | 1979-03-28 | 1980-10-07 | Hitachi Ltd | Scale-down projection aligner and mask used for this |
| JPS55132039A (en) * | 1979-04-02 | 1980-10-14 | Mitsubishi Electric Corp | Forming method for repeated figure |
| JPS56105635A (en) * | 1980-01-18 | 1981-08-22 | Optimetrix Corp | Front surface illuminator for semiconductor wafer |
| JPS5843518A (en) * | 1981-09-09 | 1983-03-14 | Nec Corp | Projecting and exposing device |
| JPS5845533U (en) * | 1981-09-24 | 1983-03-26 | 株式会社日立製作所 | Illuminance distribution measuring device |
| US4422755A (en) * | 1980-01-18 | 1983-12-27 | Optimetrix Corporation | Frontal illumination system for semiconductive wafers |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845533B2 (en) * | 1978-01-23 | 1983-10-11 | 三豊特殊工事株式会社 | Grab bucket for underground continuous wall excavation |
-
1987
- 1987-04-13 JP JP62088717A patent/JPS6323318A/en active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5393371A (en) * | 1977-01-28 | 1978-08-16 | Hitachi Ltd | Device for drawing scan pattern |
| JPS5433425U (en) * | 1977-08-06 | 1979-03-05 | ||
| JPS55129333A (en) * | 1979-03-28 | 1980-10-07 | Hitachi Ltd | Scale-down projection aligner and mask used for this |
| JPS55132039A (en) * | 1979-04-02 | 1980-10-14 | Mitsubishi Electric Corp | Forming method for repeated figure |
| JPS56105635A (en) * | 1980-01-18 | 1981-08-22 | Optimetrix Corp | Front surface illuminator for semiconductor wafer |
| US4422755A (en) * | 1980-01-18 | 1983-12-27 | Optimetrix Corporation | Frontal illumination system for semiconductive wafers |
| JPS5843518A (en) * | 1981-09-09 | 1983-03-14 | Nec Corp | Projecting and exposing device |
| JPS5845533U (en) * | 1981-09-24 | 1983-03-26 | 株式会社日立製作所 | Illuminance distribution measuring device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439281U (en) * | 1990-08-01 | 1992-04-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0142130B2 (en) | 1989-09-11 |
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