JPS6322760U - - Google Patents

Info

Publication number
JPS6322760U
JPS6322760U JP1986116146U JP11614686U JPS6322760U JP S6322760 U JPS6322760 U JP S6322760U JP 1986116146 U JP1986116146 U JP 1986116146U JP 11614686 U JP11614686 U JP 11614686U JP S6322760 U JPS6322760 U JP S6322760U
Authority
JP
Japan
Prior art keywords
light emitting
lens
view
utility
same plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986116146U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451493Y2 (US06277897-20010821-C00009.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986116146U priority Critical patent/JPH0451493Y2/ja
Publication of JPS6322760U publication Critical patent/JPS6322760U/ja
Application granted granted Critical
Publication of JPH0451493Y2 publication Critical patent/JPH0451493Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Mounting And Adjusting Of Optical Elements (AREA)
JP1986116146U 1986-07-29 1986-07-29 Expired JPH0451493Y2 (US06277897-20010821-C00009.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986116146U JPH0451493Y2 (US06277897-20010821-C00009.png) 1986-07-29 1986-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986116146U JPH0451493Y2 (US06277897-20010821-C00009.png) 1986-07-29 1986-07-29

Publications (2)

Publication Number Publication Date
JPS6322760U true JPS6322760U (US06277897-20010821-C00009.png) 1988-02-15
JPH0451493Y2 JPH0451493Y2 (US06277897-20010821-C00009.png) 1992-12-03

Family

ID=31000463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986116146U Expired JPH0451493Y2 (US06277897-20010821-C00009.png) 1986-07-29 1986-07-29

Country Status (1)

Country Link
JP (1) JPH0451493Y2 (US06277897-20010821-C00009.png)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6359360A (ja) * 1986-08-29 1988-03-15 Koito Mfg Co Ltd ヘツドランプクリ−ナ用超広角ノズル
JP2002009349A (ja) * 2000-06-26 2002-01-11 Koha Co Ltd Led面発光装置およびその製造方法
JPWO2005029597A1 (ja) * 2003-09-19 2006-11-30 松下電器産業株式会社 照明装置
JP2011124196A (ja) * 2009-12-14 2011-06-23 Hitachi Appliances Inc 照明装置
JP4720978B2 (ja) * 2005-02-18 2011-07-13 ミネベア株式会社 面状照明装置
JP4744178B2 (ja) * 2005-04-08 2011-08-10 シャープ株式会社 発光ダイオード
JP2013511148A (ja) * 2009-11-13 2013-03-28 フォセオン テクノロジー, インコーポレイテッド 効率的な部分的コリメート用反射マイクロ光学アレイ
JP2015023218A (ja) * 2013-07-22 2015-02-02 ローム株式会社 Led照明装置
US9721934B2 (en) 2013-07-22 2017-08-01 Rohm Co., Ltd. LED lighting apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991764U (ja) * 1982-12-10 1984-06-21 ロ−ム株式会社 発光ダイオ−ドランプ
JPS6142002U (ja) * 1984-08-21 1986-03-18 スタンレー電気株式会社 Ledを光源とした車両用灯具

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55132713A (en) * 1979-03-30 1980-10-15 Nippon Synthetic Chem Ind Co Ltd:The Production of fibrous product of high-absorption polyvinyl alcohol resin

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991764U (ja) * 1982-12-10 1984-06-21 ロ−ム株式会社 発光ダイオ−ドランプ
JPS6142002U (ja) * 1984-08-21 1986-03-18 スタンレー電気株式会社 Ledを光源とした車両用灯具

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6359360A (ja) * 1986-08-29 1988-03-15 Koito Mfg Co Ltd ヘツドランプクリ−ナ用超広角ノズル
JP2002009349A (ja) * 2000-06-26 2002-01-11 Koha Co Ltd Led面発光装置およびその製造方法
JPWO2005029597A1 (ja) * 2003-09-19 2006-11-30 松下電器産業株式会社 照明装置
JP4720978B2 (ja) * 2005-02-18 2011-07-13 ミネベア株式会社 面状照明装置
JP4744178B2 (ja) * 2005-04-08 2011-08-10 シャープ株式会社 発光ダイオード
JP2013511148A (ja) * 2009-11-13 2013-03-28 フォセオン テクノロジー, インコーポレイテッド 効率的な部分的コリメート用反射マイクロ光学アレイ
JP2011124196A (ja) * 2009-12-14 2011-06-23 Hitachi Appliances Inc 照明装置
JP2015023218A (ja) * 2013-07-22 2015-02-02 ローム株式会社 Led照明装置
US9721934B2 (en) 2013-07-22 2017-08-01 Rohm Co., Ltd. LED lighting apparatus
US9837392B2 (en) 2013-07-22 2017-12-05 Rohm Co., Ltd. LED lighting apparatus

Also Published As

Publication number Publication date
JPH0451493Y2 (US06277897-20010821-C00009.png) 1992-12-03

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