JPS63227608A - Radiation curable resin composition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a resin composition that is cured by radiation such as ultraviolet rays, X-rays, and electron beams, and in particular, a radiation-curable resin suitable for use in duplicating information recording carriers. The present invention relates to a composition.

[Conventional technology]

Conventionally, a method using an ultraviolet curable resin composition has been known when manufacturing high-quality information recording carriers using a mold (stamper) for making copies of information recording carriers such as video discs and audio discs. It is being An information recording carrier using an ultraviolet curable resin composition is usually manufactured in the following manner. First, an ultraviolet curable resin composition is sandwiched between a stamper and a plate-shaped backing carrier made of glass, polycarbonate, polymethyl methacrylate, etc., and the composition layer is irradiated with ultraviolet rays to cure it. The above recorded signal pattern is transferred to the cured composition layer. Thereafter, a metal reflective layer is formed by vapor-depositing a metal such as aluminum onto the cured composition layer to which the pattern has been transferred, and a protective coating layer is further provided on the metal reflective layer.

JP-A-60-206815 discloses that the ultraviolet curable resin composition includes urethane (meth)acrylate;
Aromatic hinyl monomers such as styrene and vinyltoluene;
and an ultraviolet curable resin composition containing a photopolymerization initiator.

[Problem that the invention seeks to solve]

However, the ultraviolet curable resin composition described in JP-A-60-206815 contains a highly volatile monofunctional aromatic vinyl monomer, and when producing an information recording carrier, these monomers are The functional aromatic vinyl monomer evaporates, which not only pollutes the working environment but also impairs the health of workers, which is an important problem that should be improved from the viewpoint of industrial use. In addition, these easily volatile monofunctional aromatic vinyl monomers are easily volatilized by the heat generated during ultraviolet curing, and furthermore, they foam within the resulting cured composition layer, producing air bubbles and causing damage to the information recording carrier. This poses a fatal problem as an information recording carrier in that it causes defects, deterioration, etc. in recorded signals.

Furthermore, in an information recording carrier manufactured using an ultraviolet curable resin composition, there may be defects in the recording signal in the portion of the backing carrier made of resin such as polymethyl methacrylate or polycarbonate that is in contact with the cured composition layer. There is a problem in that minute deformation sufficient to cause deterioration etc. occurs. Although the cause of this is not clear, it is presumed that the ultraviolet curable resin composition used partially swells and deforms the backing carrier made of resin.

Therefore, the object of the present invention is to provide high safety without polluting the working environment with low toxicity, and to prevent defects and deterioration of recorded signals such as generation of bubbles in the cured composition layer and deformation of the backing carrier. The object of the present invention is to provide a high-quality radiation-curable resin composition that does not cause the above problems.

[Means for solving problems]

The present invention solves the problems of the prior art, and provides (A) a (meth)acrylate having two or more (meth)acryloyl groups in one molecule; and (B) a A radiation-curable resin composition containing urethane (meth)acrylate having two or more (meth)acryloyl groups is provided.

In the radiation-curable resin composition of the present invention, the [epoxy (meth)acrylate] used as component (A) refers to the [epoxy (meth)acrylate] having a carboxyl group per mole of a jepoxy compound having two epoxy groups in one molecule. It means a (meth)acrylic acid ester compound substantially free of epoxy groups, obtained by reacting 1 mole or more of at least one type of compound selected from meth)acrylic compounds and proceeding with addition polymerization.

The molecular weight of the epoxy (meth)acrylate that is component (A) is usually 300 or more and less than 2,000, preferably 400 to 1,500. If this molecular weight is less than 300, the impact strength after curing of the radiation-curable resin composition tends to decrease, and if it is 2,000 or more, the heat resistance of the radiation-curable resin composition after curing tends to decrease. There is a tendency for sexual performance to decline.

The above-mentioned jepoxy compounds used in the synthesis of this epoxy (meth)acrylate include, for example, those obtained by reacting polyhydric phenols such as bisphenol A1, halogenated bisphenol A, hydrogenated bisphenol A1, bisphenol F1, catechol, and resorcinol with epichlorohydrin. Diglycidyl ether of polyhydric phenol obtained;
diglycidyl ether of an alkylene oxide adduct of a polyhydric phenol obtained by reacting an alkylene oxide adduct of the polyhydric phenol such as ethylene oxide or propylene oxide with epichlorohydrin; ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol; Diglycidyl ether of polyhydric alcohol obtained by reacting polyhydric alcohol such as tetramethylene glycol and polytetramethylene glycol with epichlorohydrin; with polybasic acid such as phthalic acid, isophthalic acid, terephthalic acid, maleic acid, and adipic acid. Diglycidyl ester of polybasic acid obtained by reacting with epichlorohydrin; Jepoxy novolac resin obtained by reacting novolac type phenol resin with epichlorohydrin; polyamine such as aniline, di(4-acinophenyl)methane and epichlorohydrin diglycidylamine obtained by reacting; alicyclic jepoxy compounds such as vinylcyclohexene dioxide, dicyclopentadiene dioxide, bis(3,4-epoxycyclohexylmethyl) phthalate; and jepoxidized polybutadienes. Can be done.

Examples of the above-mentioned (meth)acrylic compounds having a carboxyl group include acrylic acid, methacrylic acid, and the like.

The reaction temperature for the above addition polymerization is 20 to 130°C, preferably 40 to 70°C, and catalysts for the reaction include tertiary amines, imidazoles, organic acid metal salts, Lewis acids, amine complex salts, etc. , preferably triethanolamine, N
, N, N', N'-tetramethylethylenediamine, N
, N-dimethylpiperazine, N-methylmorpholine,
Boron trifluoride etherate and the like can be used.

The amount of these catalysts used is preferably 0.01 to 5 parts by weight based on 100 parts by weight of the reaction raw materials.

Moreover, commercially available products can also be used as this epoxy (meth)acrylate, for example, [EA-1370J
(manufactured by Mitsubishi Yuka Fine Co., Ltd.), [Epoxy Ester 300
2MJ (manufactured by Kyoeisha Yushi Kagaku Kogyo Co., Ltd.), “Epoxy Ester 70PAJ (same), rFM-201J (same)
, [Epoxy Ester 3002AJ (same), "Visco"#540J (manufactured by Osaka Organic Chemical Industry Co., Ltd.), and the like.

[Urethane (meth)acrylate] used as component (B) in the radiation-curable resin composition of the present invention is defined as having two or more of at least one type of (meth)acryloyl group in one molecule, and a urethane bond. have 2 or more (meta)
Means an acrylic ester compound.

The molecular weight of the urethane (meth)acrylate as component (B) is usually 400 or more and less than 10,000, preferably 400 to 4,000. If this molecular weight is less than 400, the compatibility with component (A) will decrease, making it difficult to form a uniform composition, and if it is 10,000 or more,
The heat resistance stability of the radiation-curable resin composition after curing tends to decrease.

The production of this urethane (meth)acrylate as component (B) involves, for example, (1) a polyisocyanate compound having two or more isocyanate groups in one molecule (hereinafter simply referred to as a "polyisocyanate compound") and a hydroxyl group. (meta)
A method of reacting a polyisocyanate compound with an acrylic compound; (2) A polyisocyanate compound and a polyol compound having two or more hydroxyl groups in one molecule (hereinafter simply referred to as a "polyol compound") are reacted at an equivalent ratio of isocyanate groups/hydroxyl groups. is larger than 1 and the isocyanate group is in excess, and then the obtained product having an isocyanate group is reacted with a (meth)acrylic compound having a hydroxyl group.

Examples of the polyisocyanate compound used in the above manufacturing method include 2. 4-) Luene diisocyanate,
2.6-) Luene diisocyanate, 1.3-xylene diisocyanate, 1.4-xylene diisocyanate, 1,5-naphthalene diisocyanate, m-phenylene diisocyanate, p-phenylene diisocyanate, 3,3'-dimethyl-4,4' -Diphenylmethane diisocyanate, 4.4'-diphenylmethane diisocyanate, 3,3'-dimethylphenylene diisocyanate, 4.4'-biphenylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane diisocyanate, tetramethylene diisocyanate, 3.3'- Dimethoxy-4,4'-diphenylene diisocyanate, 2,4-
Naphthalene diisocyanate, 4.4'-diisocyanat diphenyl ether, 1. 3-diisocyanatomethylcyclohexane, 1,4-diisocyanatomethylcyclohexane, 4,4'-diisocyanatocyclohexane, etc.; and cyclized dimers, cyclized trimers, etc. thereof; polymethylene polyphenylisocyanate , triphenylmethane-4,4',4''-triisocyanate, and the like.

Examples of the above acrylic or methacrylic compounds having a hydroxyl group include 2-hydroxyethyl (meth)
Acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxyoctyl (meth)acrylate, pentaerythritol tri (meth)acrylate,
Examples include glycerin di(meth)acrylate, diventaerythritol monohydroxybenta(meth)acrylate, and the like.

Further, examples of the polyol compound include polyester diol, polyether diol, polycaprolactone diol, polycarbonate diol, and the like. Examples of polyester diols include ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, tetramethylene glycol, polytetramethylene glycol, 1,6-hexanediol, neopentyl glycol, and 1,4-cyclohexane dimetatool. Examples include polyester diols obtained by reacting a hydric alcohol with a polybasic acid such as phthalic acid, isophthalic acid, terephthalic acid, maleic acid, fumaric acid, adipic acid, and cehatic acid. Examples of polyether diols include polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and alkylene oxide adducts of bisphenol.

Examples of polycaprolactone diol include ε-caprolactone, ethylene glycol, polyethylene glycol, polypropylene glycol, tetramethylene glycol, polytetramethylene glycol, 1.
6-hexanediol, neopentyl glycol, 1.
Examples include polycaprolactone diol obtained by reacting divalent diols such as 4-cyclohexane dimetatool and 1,4-butanediol. Commercially available products can also be used as the polycarbonate diol, such as rD
Ni80 j (manufactured by Nippon Polyurethane Co., Ltd.), rDN-
981j (same), rDN-982j (same),
rDN-983J (same), IP (, -8000J,
(manufactured by PPG, USA), etc.

Further, as the polyol compound, one having two or more hydroxyl groups among the epoxy (meth)acrylates of component (A) described above and having a molecular weight of 300 or more and less than 2,000 can also be used.

The reaction between a polyisocyanate compound and a (meth)acrylic compound having a hydroxyl group in the production method (1); In the reaction with the (meth)acrylic compound, a catalyst such as copper naphthenate, cobalt naphthenate, zinc naphthenate, n-butyltin laurate, or triethylamine is added in an amount of 0.01 to 1 part by weight per 100 parts by weight of the total amount of reaction raw materials. It can be carried out using about parts by weight and usually at a temperature of about 10 to 80°C.

The radiation-curable resin composition of the present invention uses a photopolymerization initiator that generates polymerization active species through intramolecular and intermolecular hydrogen abstraction reactions upon irradiation with ultraviolet rays, such as benzophenone, chlorothioxanthone, Michler's ketone, isopropylthioxanthone, and 2-methyl By blending thioxanthone, halogenated benzophenone, halogenated alkyl allyl ketone, etc., it can be made UV curable.

For these photopolymerization initiators, if necessary, a tertiary amine such as 4-dimethylaminobenzoic acid, 4-dimethylaminobenzoic acid alkyl ester, 2-dimethylaminobenzoic acid, 2-dimethylaminobenzoic acid Photosensitizers such as alkyl esters and isoamyl 4-dimethylaminobenzoate can be used in combination.

The proportion of the epoxy (meth)acrylate component (A) in the radiation-curable resin composition is preferably 5 to 70% by weight, particularly 8 to 60% by weight.

If the proportion of this component (A) is less than 5% by weight, the hardness of the radiation-curable resin composition after curing tends to decrease,
Moreover, if it exceeds 70% by weight, the impact resistance after curing tends to decrease.

The proportion of the urethane (meth)acrylate component (B) in the radiation-curable resin composition is preferably 2 to 70% by weight, particularly 3 to 50% by weight. The proportion of this component (B) is
When it exceeds 70% by weight, the water absorption after curing of the resulting radiation-curable resin composition tends to increase, and when it is less than 2% by weight, when used in an information recording carrier, the backing support and the cured This tends to lead to a decrease in adhesion with the composition.

Further, when a photopolymerization initiator is used, the proportion of the photopolymerization initiator in the radiation-curable resin composition is preferably 10% by weight or less, particularly 2 to 8% by weight.

In addition to the above-mentioned components, the radiation-curable resin composition of the present invention also contains a (meth)acrylate compound other than component (A) or (B), which contains at least one type of (meth)acrylic ester. They may be blended within a range that does not impair the effects of the invention.

This (meth)acrylate compound is represented by, for example, an acryloyl group of the formula; ) A compound represented by the formula: -CH2CH20C++4-)r One type of group selected from OR2, which may be the same or different, R2 represents a hydrogen atom or a (meth)acryloyl group, and at least one of R2 is It is a (meth)acryloyl group. ) Compound 1, -p.

(Here, Y represents -5O7- or -3-, and R1
is as described above, and each R1 may be the same or different)
A compound represented by the formula: %Formula% (wherein R1 is as described above, and each R1 may be the same or different) a compound represented by the formula: %Formula% (where each R3 is ( meth)acryloyl group or an alkyl group, and at least two of R'' are (meth)acryloyl groups. (
meth)acrylate, diethylene glycol di(meth)
acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate,
1,4-butanediol di(meth)acrylate, 1.
3-butylene glycol di(meth)acrylate, 1.
6-hexanethiol di(meth)acrylate, neopentyl glycol di(meth)acrylate, bisphenol A dioxyethyl(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane Trioxyethyl (meth) acrylate, trimethylolpropane trioxyprobyl (meth) 12 Power +++-L /-” No or!
I 1 It L −+blind, L++/JkrS,
2-hydroxypropyl acrylate, tetrahydrofurfuryl acrylate, butoxyethyl acrylate,
Ethyl diethylene glycol acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate-1.
, phenoxyethyl acrylate, dicyclopentadiene acrylate, polyethylene glycol acrylate, polypropylene glycol acrylate, methyltriethylene glycol acrylate, isobornyl acrylate, isobornyl methacrylate, 7-amino-3
, 7-cytatyloctyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl methacrylate, polypropylene glycol methacrylate, diethylaminoethyl methacrylate, trimethylolpropane triacrylate, ethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol diacrylate , 1゜4-butanediol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate-1
・, trimethylolpropane trioxyethyl acrylate, tricyclodecane dimetatool diacrylate,
One or more types of tricyclodecane dimethacrylate-1., dicyclopentadiene diacrylate-1., dicyclopentadiene dimethacrylate, etc. can be blended.

(Meth)acryle-I compounds other than these (A) or (B) can be obtained as commercial products, and r
SA, -1002J (Mitsubishi Yuka Fine Co., Ltd.), r
F A -731MJ (Hitachi Chemical Co., Ltd.), rKA
YARADR-604J (Nippon Kayakusha), rK
AYARAD D-330j (same), “Viscoat #7
00J (Osaka Organic Company), rsR-454j (SAR
TOMER Inc.), etc.

Furthermore, monofunctional compounds such as vinylphenol, acrylamide, vinyl acetate, vinyl ether, and styrene can also be blended as appropriate.

In addition to what has been explained above, various additives may be added to the radiation-curable resin composition of the present invention, if necessary, within a range that does not impair the final brightness effect. For example, antioxidants, ultraviolet absorbers, silicone-based or fluorine-based mold release agents, etc. may be mentioned.

The radiation curable resin composition of the present invention has a viscosity at 25°C of usually 500 to 20.0 OOcP, preferably too to 10.0 OOcP. If the viscosity is less than 5OOcP, the radiation-curable resin composition tends to drip during application; if it exceeds 20,000cP,
When used as an information transfer layer of an information recording carrier, there is a risk that the transferability of the recording signal pattern on the stamper may be poor.

〔Example〕

EXAMPLES Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited to these Examples.

In the following examples, the viscosity is a value measured at 25° C. using a rotating B-type viscometer.

Component (B) urethane (meth)acrylate small bottom synthesis example 1 Capacity 11 7 equipped with thermometer, stirrer and reflux condenser
In a lasco, 214 g of 2.4-)luene diisocyanate
, 0.2 g of n-butyltin laurate, 214 g of tricyclodecane dimetatool diacrylate (S A-1002 manufactured by Mitsubishi Yuka Fine Co., Ltd.), and 0.4 g of nohydroquinone monomethyl ether, and heated to 60°C. Thereafter, 285 g of 2-hydroxyethyl acrylate was added dropwise from the dropping funnel while being careful not to raise the temperature of the reaction system. After the dropwise addition of 2-hydroxyethyl acrylate, the reaction was carried out at 60°C for 4 hours to form urethane acrylate (hereinafter referred to as "urethane acrylate-1 to (i)").
) was generated. Next, it was confirmed by infrared absorption spectrum that no isocyanate groups remained in the resulting mixture.

In this way, a mixture of urethane acrylate (i) and tricyclodecane dimetatool diacrylate containing 70% by weight of urethane acrylate-1(i) was obtained.

Synthesis Example 2 In a flask with a capacity of 1β equipped with a thermometer, a stirrer, and a reflux condenser, 107 g of isophorone diisocyanate, 0.2 g of n-butyltin laurate, and trimethylolpropane trioxyethyl acrylate (USA SARTOM
After adding 200 g of ER (S PTMG100O) manufactured by Kasei Co., Ltd.) 378g was added to trimethylolpropanetrioxyethyl acrylate (s R
-454) A uniform mixture of 300 g was added dropwise. After the addition of the mixture was completed, the mixture was reacted at 60° C. for 4 hours. Next, 2-hydroxyethyl methacrylate 14 was added to this.
g and reacted at 60°C for another 2 hours to produce urethane methacrylate (hereinafter referred to as "urethane methacrylate
i) J) was generated. Next, it was confirmed by infrared absorption spectrum that no isocyanate groups remained in the resulting mixture.

In this way, 50% of urethane methacrylate (ii)
A mixture of urethane methacrylate (ii) and trimethylolpropane trioxyethyl acrylate containing % by weight was obtained.

Synthesis Example 3 173 g of 2.4-toluene diisocyanate was placed in a 1β flask equipped with a thermometer, stirrer, and reflux condenser.
, 0.2 g of n-butyltin laurate, 114 g of tricyclodecane dimetatool diacrylate (S A-1002 manufactured by Mitsubishi Yuka Fine Co., Ltd.), and 0.4 g of hydroquinone monomethyl ether, and after heating to 60°C, From the dropping funnel, add ethylene oxide adduct of bisphenol A (NOF type, D A-400) 198 g, taking care not to raise the temperature of the reaction system.
A mixture of 100 g of tricyclodecane dimetatool diacrylate (S A-1002) and 100 g of tricyclodecane dimetatool diacrylate (SA-1002) was added dropwise thereto, and after the addition of the mixture was completed, the mixture was reacted at 60° C. for 4 hours. Next, 129 g of hydroxypropyl acrylate was added to this, and the reaction was further carried out at 60°C for 2 hours.
Urethane acrylate (hereinafter referred to as [urethane acrylate (iii)j) was produced. Next, it was confirmed by infrared absorption spectrum that no isocyanate groups remained in the resulting mixture.

In this way, a mixture of urethane acrylate (iii) and tricyclodecane dimetatool diacrylate containing 70% by weight of urethane acrylate (iii) was obtained.

Synthesis Example 4 Into a capacity IC flask equipped with a thermometer, stirrer, and reflux condenser, 210 g of 4,4'-dicyclohexylmethane diisocyanate, 0.2 g of dibutyltin laurate,
Trimethylolpropanetrioxyethyl acrylate (manufactured by SARTOMER, USA, 5R-454) 64g
After charging 0.4 g of hydroquinone monotyl ether and heating to 60°C, epoxy acrylate (EA-1370 manufactured by Mitsubishi Yuka Fine Co., Ltd.) was added from the dropping funnel while being careful not to raise the temperature of the reaction system.
A homogeneous mixture of 197 g of trimethylolpropane trioxyethyl acrylate (S R-454) (150 g of the above) was added dropwise, and after the addition of the mixture was completed, the mixture was heated at 60°C for 4 hours.
Allowed time to react. Next, 93 g of 2-hydroxyethyl acrylate was added thereto, and the reaction was further carried out at 60°C for 2 hours to produce urethane acrylate (hereinafter referred to as "urethane acrylate (iv)"). Next, it was confirmed by infrared absorption spectrum that no isocyanate groups remained in the resulting mixture.

In this way, 70% of urethane acrylate (iv)
A mixture of urethane acrylate (iv) and trimethylolpropanetrioxyethyl acrylate as a polyacrylate monomer compound was obtained.

Examples 1 to 6 Urethane (meth)acrylates (i) to (iv) obtained in Synthesis Examples 1 to 4 and other components shown in Table 1 were blended in the amounts shown in Table 1, and carried out. Ultraviolet curable resin compositions of Examples 1 to 6 were prepared.

When the viscosity (25° C.) of each of the obtained ultraviolet curable resin compositions was measured, the results shown in Table 1 were obtained.

The following tests were conducted on each of the ultraviolet curable resin compositions obtained above.

(1) Primary skin irritation test As a result of testing on rabbits according to the method specified in the US EPA guidelines (1978), it was found that the ultraviolet curable resin compositions of all Examples did not cause primary skin irritation. Value (P
,T,1. ) was below ]-,0.

(2) Stamper removability After each of the radiation-curable resin compositions obtained above was uniformly applied to a nickel stamper with a film thickness of 100 μm, a polymethyl methacrylate substrate was placed on the side of the stamper coated with the composition. It was crimped.

The radiation-curable resin composition layer was irradiated with ultraviolet rays through a polymethyl methacrylate substrate to be cured.

After curing the radiation curable resin composition, apply a nickel stamper.
The cured composition layer was peeled off from the cured composition layer, but no abnormality such as damage or deformation was observed in the cured composition layer in any of the examples, and good stamper releasability was exhibited. Further, the cured composition layer after peeling off the stamper was closely observed under a microscope, and no defects due to inclusion of air bubbles or foaming were observed in any of the examples. Furthermore, in all of the examples, no swelling or deformation of the polymethyl methacrylate substrate due to the radiation-curable resin composition was observed.

〔Effect of the invention〕

The radiation-curable resin composition of the present invention has the following effects.

(1) The radiation-curable resin composition of the present invention has low toxicity and does not contaminate the working environment.

(2) The radiation-curable resin composition of the present invention provides a cured composition having both appropriate hardness and impact resistance.

(3) When the radiation-curable resin composition of the present invention is used on resin substrates such as polymethyl methacrylate and polycarbonate, it exhibits strong adhesion to these substrates without swelling or deforming the substrates. The present invention provides a cured composition having the following properties.

(4) The radiation-curable resin composition of the present invention provides a cured composition that does not cause foaming or air bubble entrapment during radiation curing and exhibits little shrinkage during curing.

(5) When the radiation-curable resin composition of the present invention is used for manufacturing an information recording carrier, the cured composition has good mold releasability against a nickel stamper and prevents damage to the stamper. It is to be suppressed as much as possible.

(6) The radiation-curable resin of the present invention provides good productivity when used in the production of information recording carriers.

Agent Patent Attorney Doshinai Iwamiya@Inventor Yoshio Matsumura Higashionai Cell I℃ 2-11-24 Tsukiji, Chuo-ku Nippon Gosei Co., Ltd. (2-11-24 Tsukiji, Chuo-ku, Tokyo) Nippon Gosei Co., Ltd. - Caldwell Lane 1440! Supplementary JE (spontaneous) August 5, 1988 Patent Application No. 045089 2, Name of invention Radiation curable resin composition name (417) B Honsei Rubber Co., Ltd. 6,
Number of inventions increased by amendment None 7, Subject of amendment Column 8 for detailed explanation of the invention in the specification, Contents of amendment (1) The description of the following parts of the specification (before amendment)
(After correction) Correct as shown in (after correction).

(2) Correct the formula on the second line of page 17 of the specification as shown below.

(3) Delete "tricyclodecane dimetatool diacrylate, tricyclodecane dimetatool dimethacrylate" from lines 2 to 4 of page 20 of the same book.

Claims (1)

Scope of Claims: (A) Epoxy (meth)acrylate having two or more (meth)acryloyl groups in one molecule, and (B) Urethane (meth) having two or more (meth)acryloyl groups in one molecule. ) A radiation-curable resin composition containing acrylate.