JPS6322734U - - Google Patents
Info
- Publication number
- JPS6322734U JPS6322734U JP11545086U JP11545086U JPS6322734U JP S6322734 U JPS6322734 U JP S6322734U JP 11545086 U JP11545086 U JP 11545086U JP 11545086 U JP11545086 U JP 11545086U JP S6322734 U JPS6322734 U JP S6322734U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- board
- edge
- substrate surface
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/799—Apparatus for disconnecting
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の実施例を示す平面図、第２図
は第１図のＡ―Ａ線断面図、第３図は従来のＩＣ
基板の例を示す側面図、第４図はそのＩＣ素子の
剥離状態を示す側面図である。 １……基板、２……配線パターン、３……接着
剤、４……ＩＣ素子、５……突片。
は第１図のＡ―Ａ線断面図、第３図は従来のＩＣ
基板の例を示す側面図、第４図はそのＩＣ素子の
剥離状態を示す側面図である。 １……基板、２……配線パターン、３……接着
剤、４……ＩＣ素子、５……突片。
Claims (1)
- 基板面に設けられた配線パターン上に導電性樹
脂を介してＩＣ素子を固着してなるＩＣ基板にお
いて、前記配線パターンにＩＣ素子の端縁に沿つ
て補助用突片を設けたことを特徴とするＩＣ基板
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11545086U JPS6322734U (ja) | 1986-07-28 | 1986-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11545086U JPS6322734U (ja) | 1986-07-28 | 1986-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322734U true JPS6322734U (ja) | 1988-02-15 |
Family
ID=30999114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11545086U Pending JPS6322734U (ja) | 1986-07-28 | 1986-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322734U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011028813A (ja) * | 2009-07-27 | 2011-02-10 | Nhk Spring Co Ltd | ヘッドサスペンションの再生方法及びリワーク用切断治具 |
-
1986
- 1986-07-28 JP JP11545086U patent/JPS6322734U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011028813A (ja) * | 2009-07-27 | 2011-02-10 | Nhk Spring Co Ltd | ヘッドサスペンションの再生方法及びリワーク用切断治具 |