JPS63226908A - Manufacture of laminated ceramic capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a multilayer ceramic capacitor in which internal electrodes and dielectric ceramic are combined in alternating layers.

(Prior art) Generally speaking, multilayer ceramic capacitors are small and can obtain large capacitance, and are also easy to mount on printed circuit boards, so they are currently used in large quantities in various electronic devices. .

Conventionally, a method as shown in FIG. 3 is well known as a method for manufacturing a multilayer ceramic capacitor.

That is, first, as shown in FIG. 3(a), a raw ceramic sheet l is prepared, and an electrode made of an electrode material such as silver-palladium (Ag-Pd) is placed on one main surface of the raw ceramic sheet l. The paste is printed in a matrix shape to form electrodes 2 that will become internal electrodes of the multilayer ceramic capacitor to be manufactured. Then, like this, electrode 2 is placed on one main surface.
Ceramic raw sheet formed! Multiple sheets of Figure 3 (
After lamination as shown in b), a dummy sheet 3 is laminated and pressed on top of the outermost ceramic raw sheet 1 to form a laminated block 4 of ceramic raw sheets 1.

The green ceramic sheet 1 is cut into chips so that the N poles 2 formed on each green ceramic sheet 1 and the green ceramic sheet 1 are alternately combined in a layered manner, as shown in FIG. 3(C). Thus, the element body 5 of the multilayer ceramic capacitor is formed. After firing this element body 5 in a firing furnace (not shown), as shown by the dotted line in FIG. 3(C), the element body 5 is
Terminal electrodes 6 and 7 are formed by applying an electrode paste made of an electrode material such as silver (Ag) or palladium (Pd) to both ends of the electrode and baking it onto the element body 5.

Then, those that meet the predetermined standards are selected and aligned, and as shown in FIG. 3(d), rollers 9 to I.
The printing ink is supplied to the letterpress deck 13, and this deck 1
3 is applied to the transfer roller I4 to mark the surface of the multilayer ceramic capacitor 8 with the product name, manufacturing company name, etc.

Thereafter, the multilayer ceramic capacitor 8 is packaged in a predetermined packaging shape using a taping method, a magazine method, or the like, and is supplied to a user.

By the way, in the above-described conventional manufacturing method of multilayer ceramic capacitors, when marking the product name, manufacturing company name, etc. on the surface of multilayer ceramic capacitors 8, it is necessary to align the multilayer ceramic capacitors 8 one by one and put them on a printing machine. Not only does it take a lot of time to mark,
Since the multilayer ceramic capacitor 8 has an uneven surface due to the terminal electrodes 6 and 7, there is a problem in that marking cannot be performed smoothly using a printing machine.

In addition, when marking both sides of the multilayer ceramic capacitor 8, after marking the -th time and drying the ink adhering to the multilayer ceramic capacitor 8, when marking the multilayer ceramic capacitor 8 a second time, There was also the problem of having to select the printing surface to be newly printed.

(Objective of the Invention) An object of the present invention is to provide a method for manufacturing a multilayer ceramic capacitor, which enables efficient marking of multilayer ceramic capacitors, reduces variation in marking positions, and improves the rate of non-defective products. be.

(Structure of the Invention) For this reason, the present invention provides that, before the step of baking terminal electrodes onto a laminated body of raw ceramic sheets, the body is placed in a cavity provided in a holding member. The process includes a step of fitting and holding the element body, and then applying an insulating heat-resistant paste onto the element body for marking. It is characterized by being burned into the body. The heat-resistant paste attached to the element body by marking is baked onto the element body together with the terminal electrode,
It remains on the surface of the multilayer ceramic capacitor. This results in
Marking is performed on the multilayer ceramic capacitor.

(Effects of the Invention) According to the present invention, marking is performed while the element body, on which no terminal electrodes are formed, has constant external dimensions, and has no irregularities on the surface, is held in the holding member. In addition to greatly improving the efficiency of marking, the positioning accuracy of markings also improves significantly, and the rate of non-defective products increases.

(Example) Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

An embodiment of the method for manufacturing a multilayer ceramic capacitor according to the present invention is shown in FIGS. 1(a) to 1(e). Although this example shows a manufacturing method for obtaining a large number of capacitors at the same time, the present invention is not limited to this, and the capacitors may be manufactured one by one.

First, as shown in FIGS. 1(a), (b), and (c), the already explained FIGS. 3(a), (b), and (C)
In exactly the same process as above, a laminated block 4 is formed from the raw ceramic sheet 1 and the dummy sheet 3 on which the electrode 2 is not formed. Then, this laminated block 4 is cut into chips to form an element body 5.

The element body 5 formed by cutting the laminated block 4 into chips as described above is fired together with other element bodies 5, and then the first
As shown in Figure (d), it is fitted into a cavity 20a formed in a plate-shaped holding member 20 and held. In this state, a product name, a manufacturing company name, etc. are screen printed on the element body 5 using a heat-resistant paste 24 having insulating properties using a screen printing device 23 having a screen 22 stretched over a frame 21. The heat-resistant paste 24 is adhered onto the element body 5 through the printing pattern formed on the screen 22 by moving the spatula 25 in the direction shown by arrow A within the frame 2I of the screen printing device 23. do. As a result, necessary marks 26 are formed on the element body 5 by the heat-resistant paste 24, as shown in FIG. 1(e).
is printed.

Thereafter, when the terminal electrode 6.7 is applied and baked on the element body 5, the heat-resistant paste 24 printed on the element body 5 is also baked onto the element body 5 during this baking process, as shown in FIG.
As shown in e), from the heat-resistant paste 247 mark 2
A multilayer ceramic capacitor 27 having a number 6 can be obtained. In this way, each element body 5 is inserted into each cavity 2 of the holding member 20 at a stage when the terminal electrodes 6 and 7 are not yet formed on the element body 5 and the outer dimensions are constant and there are no irregularities.
Since the heat-resistant paste 24 is printed while being held accurately at 0, a, marking of the multilayer ceramic capacitor 27 can be performed accurately and easily, and the manufacturing efficiency of the multilayer ceramic capacitor 27 is greatly improved.

In addition, in Fig. 1 (a) to e), Fig. 3 (a)
) to d) are indicated with corresponding reference numerals, and redundant explanations will be omitted.

In the above embodiment, screen printing was used to print the heat-resistant paste 24 on the element body 5, but instead of screen printing, letterpress printing or intaglio printing was used as shown in FIGS. 2(a) to (d). can be used.

That is, in FIG. 2(a), the heat-resistant paste 24 supplied to the intaglio deck 31 is attached to the transfer member 32, and the heat-resistant paste 24 attached to the transfer member 32 is transferred to the element body 5 (see FIG. 1(c)). (see).

Further, in FIG. 2(b), a relief plate 33 is used.

On the other hand, in FIGS. 2C and 2D, the heat-resistant paste 24 is directly printed on the element body 5 using the intaglio plate 34 or the letterpress plates 3 and 5, without using the transfer member 32 as described above.

[Brief explanation of drawings]

FIGS. 1(a), (b), (c), (d), and (e) are explanatory diagrams of an embodiment of the method for manufacturing a multilayer ceramic capacitor according to the present invention, respectively; FIGS. 2(a), ( b), (c) and (d) are explanatory diagrams of the printing method used in the manufacturing method of the multilayer ceramic capacitor according to the present invention, respectively, and Figures 3 (a), (b), (c) and (d) are respectively FIG. 3 is an explanatory diagram of a conventional method of manufacturing a multilayer ceramic capacitor. DESCRIPTION OF SYMBOLS 1... Ceramic raw sheet, 2... Electrode, 4... Laminated block, 5... Element body, 6, 7... Terminal electrode, 23... Screen printing device, 24... Heat resistant paste, 26... mark, 27
...Multilayer ceramic capacitor. Figure 1Δ

Claims (1)

[Claims] (1) A step of laminating and pressing together a plurality of green ceramic sheets to form a laminated body of raw ceramic sheets, a step of firing this laminated body, and a step of forming the raw ceramic sheet on the main surface. In the method for manufacturing a multilayer ceramic capacitor, the method includes the step of baking a terminal electrode on the element body, which is electrically conductive to the internal electrode, the element body being attached to a holding member before the step of baking the terminal electrode on the element body. It has a step of attaching and holding a heat-resistant paste with insulating properties onto the element body by printing and marking the element body. A method for manufacturing a multilayer ceramic capacitor characterized by baking a paste onto an element body.