JPS63226080A - Composite assembly of light emitting diode - Google Patents

Abstract

PURPOSE:To obtain an LED matrix display and an LED array with extremely reduced dimensions and a high density by a method wherein at least the surface layer of a substrate which is solidified by simultaneous sintering is made of white ceramics and, at the same time, a sectioning frame member is made of colored ceramics which absorbs the colored light emitted by a light emitting diode. CONSTITUTION:A substrate/sectioning frame laminated ceramic member 1 is composed of a large number of green sheets which are sintered and completely solidified after hot-press lamination and a circuit substrate 2 and a sectioning frame member 3 are provided in it. The green sheet for the circuit substrate 2 is made of slurry produced by mixing alumina powder, glass frit and the like, organic binder and solvent so as to have a thickness of 0.05-1.0 mm by a doctor-blade method. Connection patterns 7 are formed by sintering after Au paste is applied by screen printing and the green sheet produced through a sintering process becomes white ceramics. The green sheet for the sectioning frame member 3 is produced by the same method except that a proper quantity of transition element ions whose (d) shell is not filled are mixed in the glass component and the green sheet baked afterwards becomes colored ceramics.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a light emitting diode (hereinafter referred to as LED) composite assembly, particularly for example an LED matrix display,
An LED composite assembly in which a large number of LEDs are arranged close to each other in a matrix or an array, such as an LED static elimination array, is used.

<Prior Art> FIGS. 8 and 9 show a conventional LED matrix display, in which FIG. 8 is a perspective view of a display unit, and FIG. 9 is a sectional view of a main part thereof.

In the same figure, 51 is a circuit board such as a ceramic board, and on the circuit board 51, for example, an LED 5 that emits green light is mounted.
2 are arranged in a matrix at equal intervals, and are each connected to a predetermined conductive pattern on the circuit board 51 by die bonding and wire bonding (not shown).

Reference numeral 53 indicates a partitioning frame portion (a window portion (small chamber) 53a for housing each of the LEDs 52) mounted on the circuit board 51.
is formed. This partitioning frame member 53 is integrally molded from, for example, white synthetic resin, and has a white translucent light diffusing portion 5 on its surface that matches the window portion 53a.
A diffusion sheet member 54, which also serves as a decorative sheet, is attached with an adhesive. Reference numeral 55 denotes a support plate that also serves as a heat sink and is attached to the back side of the circuit board 51.
It is in close contact with a portion other than a pattern portion for external connection formed on the back surface of 1, that is, a portion coated with an insulating coating. Note that 56 is a screw for attaching the division frame member 53 to the support plate 55 with tight adhesion strength.

A plurality of LED matrix display units having the above-mentioned configuration are combined vertically and horizontally in close proximity and used for displaying guidance messages, etc. at stations, airports, etc., for example. FIG. 8 shows a state in which the LEDs 52 of the display unit are selectively emitted to display the word "STATION".

<Problems to be Solved by the Invention> By the way, in the above-mentioned conventional configuration, the partition frame member 5
3, screws 56 are required for strength reasons, but a plurality of through holes must be drilled in the circuit board 51 for the screws 56. There is a problem in that the degree of freedom in designing the above-mentioned fine, high-density patterns is hindered. This tendency became particularly noticeable as the density of colored dots in displays increased, and became a major obstacle to miniaturization of displays. It is also expected that if the density of colored dots increases, the thickness of the wall between the window portions 53a of the partitioning frame member 53 will become thinner, making it virtually impossible to insert the screw 56 therethrough.

In order to avoid this problem, it is conceivable to fix the division frame member 53 to the circuit board 51 with an adhesive, but since it is exposed to severe temperature conditions due to the flashing of the large number of LEDs 52, Due to the difference in thermal expansion coefficient between the frame member 53 and the frame member 53, warpage and the like tend to occur, and there is a problem in the reliability of the adhesion strength between the two members 51 and 53.

On the other hand, as described above, the synthetic resin division frame member 53 is
The thickness (height) cannot be reduced below a predetermined amount due to constraints on molding conditions or mechanical strength. For this reason, the distance between the LED 52 and the light diffusing portion 54a becomes relatively long, and the irradiation efficiency decreases. Therefore, as described above, the division frame member 53 is made of a white material with good reflectance. In this case, when the density of the LED display increases, the wall between the windows 53a in the 53rd division frame section t becomes thinner, causing light leakage to the adjacent window 53a, resulting in a problem that the display quality is significantly reduced. In order to prevent this light leakage, it is conceivable to make the side wall of the window portion 53a an inclined surface and deposit a metal thin film thereon. In order to make it well, there are certain limitations in terms of size and density.

Furthermore, since there is a distance of more than a predetermined distance between the LED 52 and the light diffusion section 54a, the so-called viewing angle α (FIG. 9)
The size of the display was small, and there was also a problem with visibility when viewing the display from an angle.

It should be noted that the above-mentioned problems, except for visibility, are similar to those of LED static eliminator arrays that require sharpness between dots.

<Purpose> Therefore, the technical problems to be solved by the present invention are as described above. The aim is to eliminate the disadvantages of
High-density LED matrix display, LED
In addition to making it possible to provide an array, it is also possible to provide a product that does not allow any light to fall between adjacent dots, and that allows for a wide viewing angle in the case of a display.

Means for Solving the Problems> The above-mentioned object of the present invention is to arrange a large number of chip-shaped light emitting diodes arranged and connected on a substrate, one or several pieces at a time, in the window portion of the partitioning frame member. In the LED composite assembly, the substrate and the dividing frame member are simultaneously sintered to form an integral structure by a green sheet stacking Z sintering method, and at least the surface layer of the substrate is made of white ceramic, and
This is achieved by making the division frame member made of colored ceramics that absorbs the color of light emitted from the light emitting diode.

<For 1 piece> Green sheets are prepared separately for the circuit board and for the division frame members by a doctor blade method or the like. The former green sheet is punched with through-holes, printed with conductors, etc., and then laminated with a plurality of sheets, while the latter green sheet is laminated with a plurality of sheets and a large number of windows are punched therein.

Thereafter, the plurality of green sheet groups for the circuit board and the plurality of green sheet groups for the division frame members are aligned, laminated by hot pressing, and then sintered to be integrated. Thus, the green sheet area I'! In the substrate/section frame polymeric ceramic member created by the sintering method, an LED is placed and bonded within the window portion.

Therefore, since the circuit board and the partitioning frame member are made of a completely integrated ceramic material, there is no need for means such as screwing or adhesion to connect the two.

Furthermore, since the green sheets are laminated to form the dividing frame member, it is easy to increase the density by reducing the window interval, and the thickness of the dividing frame member can be made as small as possible.

In addition, in the glass component mixed with alumina, Cu”,
Mn”, Co”, Nr2”, T i”,
Transition element ions such as V"+Cr3°, Fe2°, Fe" are added in the form of acids (particles), and the division frame members created by this can selectively absorb the emitted light color of the LED or completely absorb visible light. All of the windows are colored ceramics that absorb light, completely preventing light leakage between adjacent windows.

<Example> The present invention will be described below based on an example in which the present invention is applied to an LED matrix display. FIG. 1 is an enlarged sectional view of the main part of an LED matrix display, FIG. 2 is an enlarged sectional view of the main part in the manufacturing process, and FIG. 3 is an enlarged plan view of the main part in the state shown in FIG.

In each figure, what is generally indicated by reference numeral 1 is the board/
A segmented frame polymerized ceramic (8JiSt2C hereinafter referred to as a polymerized ceramic body) is made of a large number of green sheets that are hot-press polymerized and then sintered to be completely integrated, and includes a circuit board 2 and a segmented frame member 3. There is.

Reference numeral 4 denotes three parts formed on the dividing frame member 3 at equal intervals vertically and horizontally, for example, those having a diameter of about 1.5 to 2.5 mm are attached to the dividing frame member 3 at a pitch of 2 to 3 mm. are provided in high density near each side of the area. 5 is a chip-shaped cutting edge ED located in each of the three parts 4, for example, 0.3~
A small size of about 0.5 mm square and 0.25 to 0.4 inches in height has been selected.

The LED 5 is placed at a predetermined position in the second part 4 by an automatic feeding machine, and the connection pattern 6.7 on the circuit board 2 is
connected to. That is, by a known method, the LED 5 is die-bonded to the connection pattern 6, and its anode is die-bonded to the connection pattern 7 by a wire 8.
Bonded. In the illustrated embodiment, one LED 5 is arranged in each window 4, but for example, a pair of an LED chip emitting red light and an LED chip emitting green light may be arranged in each window 4. It is also possible to arrange two pieces at a time.

Although the green sheet for the circuit board 2 and the green sheet for the division frame member 3 are prepared separately, materials for low-temperature firing under substantially the same firing temperature conditions are selected for both.

That is, the green sheet for the circuit board 2 is made from a slurry prepared by mixing alumina powder, glass frit, etc. with an organic binder and a solvent, and has a thickness of 0.05 to 1.0 mm by a known doctor blade method. is formed. Each of the green sheets thus created is subjected to through-hole drilling and metallization treatment depending on the layer to be provided. In this embodiment, except for the connection pattern 7 to which the LED 5 is wire-bonded, the other parts are metalized by screen printing Ag-Pd paste, and the connection pattern 7 is made of Au. It is made by screen printing the paste.

The green sheet thus created becomes white ceramics through a sintering process to be described later. In FIG. 1.2, 9 and 1O indicate the pattern formed by the Ag--Pd paste and the conductor in the through-hole.

On the other hand, the above-mentioned green sheet for the partition frame member 3 is also made from a slurry made by mixing alumina powder, glass frit, etc. with an organic binder and a solvent, using the same method.
．． The thickness is between 0.05 and 1.0. However, in the above-mentioned glass component of this material for producing green sheets, FS element ions, that is, Cu24, are present even though the d-shell is not filled.
．． Mn3−, Co”.

N i”, T i”, V”+Cr”, F
e", F e", etc. in the form of oxide 'I! One amount is mixed in. By doing so, this green sheet, which is fired later, becomes a colored ceramic and has a light-absorbing property with respect to the color of the emitted light from the LED 5. Therefore, the type of transition element ion mixed into the glass component is selected depending on the emitted light color of the LED 5 used, or one that has light absorption characteristics in the entire visible light region is selected. One type can be used alone or a plurality of types can be used in combination as necessary. When this transition element ion is used alone, the amount of transition element ion mixed in the glass component in the form of an oxide is an important factor, and the entire mixture of the glass component and the transition element ion oxide is %, the transition element ion oxide is 10 wt % or less. 10 reasons to do this
If it exceeds wt%, there will be a negligible difference in shrinkage rate between the green sheet for the classification frame member 3 and the circuit board February green sheet, and the simultaneous firing of both February and March green sheets, which will be described later, will occur. This is because warpage is unavoidable in the process. The lower limit of the transition element ion oxide mixed into the glass component depends on the difference in absorbance, etc. of the il-transition element ions used, and the total mixture of the glass component and the transition element ion oxide is 100 parts by weight. In this case, if the content is desirably about 0.5 to 2.5 wt% or more, sufficient light absorption characteristics can be obtained.

The fii type of transition element ions mixed into the glass component of the green sheet for the above-mentioned partitioning frame member 3 is determined by the emitted light color of the LED 5 as described above. FIG. 7 shows the emission characteristics of typical LEDs, such as GaAsP-LEDs that emit red light with a peak wavelength of 650 nm, or
For GaP-LEDs that emit red light with a peak wavelength of 700 nm, for example, Cu2'''' exhibits light absorption characteristics.
G a P - L E D, which emits green light with a peak wavelength of 565 nm, or G a P - L E D, which emits yellow light with a peak wavelength of 589 nm, which is not shown in FIG.
For the aAsP-LED, for example, co2'', Ni'', which exhibits light absorption characteristics for this, can be used, and this 0
In the case of 02', Ni'', the effect can be achieved with a relatively small amount of addition.Also, in order to provide light absorption characteristics to the entire visible light region, for example, Mn'' and Cr'' can be used; ”, the effect can be achieved with a relatively small amount added. That is, when LEDs with two different emission colors are disposed within the window 4, for example, when a pair of red and green LEDs is disposed,
M n 3° is valid.

Note that transition element ions are mixed in the glass in the form of oxides, and the absorption characteristic curve may shift slightly depending on the composition of the glass, so the balance with the composition of the glass should be taken into consideration. be. Furthermore, what is more important and should be taken into consideration is the shrinkage rate of the green sheet for the circuit board 2 and the green sheet for the partition frame member 3;
For example, if there is Cu'' in the glass, a green sheet containing Cu'' will have a higher shrinkage rate than a green sheet for white substrates (circuit board 2), and Mn'' in the glass.
If there is, a green sheet containing this will have a smaller shrinkage rate than a green sheet for white substrates. Therefore, Cu
The green sheet for the division frame member 3 containing glass mixed with 2° and M n 3" is effective in improving the difference in shrinkage rate from the green sheet for the circuit board 2. , the combination of different transition element ions can be changed in various ways to improve this apt!z.

In the thus produced green sheet for the dividing frame member 3, through holes for the 8 parts 4 are punched at the above-mentioned size and pitch. This punching may be performed for one sheet at a time (Greasy), but in this embodiment, it is punched for a plurality of sheets (
This is done by stacking several sheets to more than 10 sheets until the thickness (height) corresponds to the thickness (height) of the partitioning frame member 3. The thickness of the dividing frame member 3 after sintering is set to be 0.8 to 1.6 mm.

Then, a predetermined number of green sheets for the circuit board 2 created as described above are aligned and stacked in a predetermined order, and on top of this, a group of green sheets for the plurality of partition frame members 3 described above are aligned and stacked. Both groups of green sheets are then hot pressed (laminated). One hot-pressed cow weighs 40-70°C, 150-300 kg
/ cm 2 is appropriate.

The laminated green sheet for the circuit board 2 and the green sheet for the partition frame member 3 are simultaneously sintered and integrated at a relatively low sintering temperature, that is, a peak sintering temperature of 850 to 1000°C, The polymerized ceramic body 1 described above is obtained.

After that, a conductive adhesive (not shown) is applied by a dispenser onto the connection pattern 6 exposed in each window 4 of the polymerized ceramic body 1, and then a conductive adhesive (not shown) is applied by a known die bonding machine. LE
D5 is positioned and bonded. Thereafter, wire bonding using an Au wire is performed using a wire bonding machine. FIGS. 2 and 3 show the state after this process is completed.

The LED 5 positioned within the window 4 as described above is embedded, if necessary, with a translucent resin 11 filled within the window 4 to an extent that covers the LED 5, as shown in FIG.

The light-transmitting resin is, for example, a transparent or white semi-transparent silicone resin, and is capable of diffusing the light from the LED 5 inside. Reference numeral 12 denotes a light diffusion film which also serves as a decorative sheet, and is adhered to the upper surface of the partitioning frame member 3 with an adhesive 13. By providing the above-mentioned light diffusing members 11 and 12 in duplicate in this way, even if the distance from the LED 5 to the upper surface of the dividing frame member 3 is short, the light emitted from each dot can be visually recognized as uniform. In addition, since the distance between the LED 5 and the light diffusion film 12 is extremely short, the luminous efficiency is much better than before, and the viewing angle is also larger than before, as shown in the first diagram. β, which also improves visibility when viewing the display from an angle.

In FIG. 1, reference numeral 14 denotes a support plate made of metal such as aluminum that also serves as a heat dissipation plate, and is attached to the back surface of the circuit board 2 by appropriate means, and is used for external connections formed on the back surface of the circuit board 2. It is in close contact with the part other than the pattern part, that is, the insulating coated part.

As described above, according to the present invention, the circuit board 2 and the division frame member 3 are green sheets! Since it is integrated by the J\ layer sintering method, the thickness of the dividing frame member 3 is made as thin as possible,
Moreover, even if the arrangement pitch of the window portions 4 is made fine, this formation is easy, and 8V mechanical strength can be guaranteed. Therefore, the arrangement of optical dots can be dramatically improved compared to before, and a high-resolution matrix display can be provided. Furthermore, as a result of this high density, the walls between the adjacent window parts 4.4 become thin, but since the dividing frame member 3 is made of colored ceramics that have light absorption characteristics for the emitted light color of the LED 5,
There is no risk of light leaking between the eight adjacent sections, and there is no deterioration of display quality.

(Experimental Example-1) As materials for the green sheet for the circuit board 2, 1 part of alumina powder 50IIF, 39 parts by weight of glass frit, and 1O of acrylic acid resin as a binder! 50 parts by weight of xylene as a solvent, 2.5 parts by weight of DBP (dibutyl phthalate) as a plasticizer, and 1 part by weight of a dispersant were prepared and thoroughly kneaded in a ball mill to prepare a slurry. The above glass frit is SiC2, Pb0,
A material containing CaO as a main component was used.

The above slurry was applied onto a carrier film by a doctor blade method and solidified to produce a green sheet. The thickness of each green sheet was set to be 0.2 mm after sintering. Guide holes and through holes were formed in each layer of the produced green sheet by punching, and then selective metallization was performed by screen printing using Ag-Pd paste.

However, only the connection pattern portion for wire bonding described above was printed with Au paste.

On the other hand, as a material for the green sheet for the division frame member 3,
Except for the glass frit mentioned above, three sets of green sheets made of the same material as the green sheet for the circuit board 2 and the same weight parts were prepared. The glass frit I added to this is the same composition as above, with the addition of CuO powder, and when the glass component and CuO are added to 1 part of 100ffij, CuO is 2.5
Three types were prepared: wt%, 5 wt%, and 10 wt%. This was added to the above composition, parts by weight of other components, CuO
38.5 for glass frit containing 2.5 wt%
38 parts by weight for a glass frit containing 5 wt% of CuO and 37 parts by weight for a glass frit containing iowt% of CuO were mixed separately using the same method to create 31,000 types of slurry. did. Three types of green sheets were created from these three types of slurry using the same method. The thickness of each green sheet was set so that each green sheet had a thickness of 0.2 mm after sintering. After drilling guide holes in each type of green sheet, the window portion 4 was punched in a state in which five sheets of each type were stacked.

The diameter of the window portion 4 is 2III+, and each window portion 4 has a length and a width of 2.
．． The holes were drilled at equal intervals with a pitch of 5 mm.

Five green sheets for the circuit board Fi2 prepared as described above were aligned in a predetermined order and laminated, and three types of green sheet groups made up of the five sheets were aligned and laminated, respectively. °C, 150kg/am
Hot pressing was performed under the conditions of 2 and lamination was performed. After that, after cutting out the outer shape of the laminated green sheet group in which 10 green sheets were integrated, the temperature profile shown in Fig. 4 was applied, namely, 500°C...50 minutes, peak temperature 900°C...10 minutes. Sintered under the following conditions.

The thus obtained polymeric ceramic body 1 in which the circuit board 2 and the partitioning frame member 3 are completely integrated has a highly precise arrangement of 4 windows with a fine pitch, and has sufficient mechanical strength. did it. However, if the CuO in the crow is 1
In the case where 0 wt% was used, there were many cases in which warpage, which could not be ignored in practice, occurred due to the difference in shrinkage rate between the green sheets for the circuit board 2 and the partition frame member 3. the other 2
As for the types, I was able to clear most of the sleds.

In addition, the three types of polymerized ceramic bodies created in this way
The division frame member 3 exhibits a blue color that becomes darker as the amount of Cu0O increases, and the light transmittance of the white board (circuit board 2) is 100%.
When this was done, the light transmittance of each division frame member 3 containing CuO in the above-mentioned proportion in the glass had characteristics as shown in FIG. As is clear from Fig. 5, even in the third division frame part t, which has a high light transmittance and contains 2.5 wt% of CuO in the glass, its light transmittance is 20% in the long wavelength range of 600 nm or more. % or less, and it was confirmed that the light absorbing property was sufficiently exhibited in the red region.

Each polymeric ceramic body l having a dividing frame member 3 containing 2.5'vVt% or 5wt% of CuO in the above-mentioned glass.
In each window part 4, 0.5 mm square and 0.3 mm high.
A red-emitting GaP-LED (chip) 5 is connected to the connection pattern 6.7 by known methods of die bonding and wire bonding, and each window portion 4 is filled with the translucent resin 11 made of silicone resin. After that, a light diffusion film 12 was attached to complete the LED matrix display.

The resulting matrix displays are ultra-compact, high-density displays with no light leakage between adjacent dots, and have wide viewing angles.

(Experimental Example 2) The green sheet for the circuit board 2 was made of the same material and the same composition ratio as in Experimental Example 1, and was finished to be the same in all aspects including the thickness.

As the material for the green sheet for the partitioning frame member 3, two sets of the same material and the same weight parts as those for the circuit board 2 except for the crow frit were prepared. The glass frit to be added to this is made by adding Mn2O3 powder to the above-mentioned 5I02, PbO1CaO as the main component, and combining the glass components and Mn2
When O3 is added to 100 parts by weight, Mn, 0
Two types were prepared in which 3 was 2 wt% and 7.7 wt%. M
For a glass frit containing 2 W t% n203, 38.5! j1 part, also 7.7 Mn2O3
37 parts by weight of Karasu Frit I. containing Wt% were mixed and two types of slurries were separately prepared using the same method. For each slurry, green sheets were prepared with the same thickness as in Experimental Example 1, five of each of the two types of green sheets were laminated, and the same windows 4 as in Experimental Example 1 were bored.

Below, lamination under all the same conditions as Experimental Example-1,
Through the sintering process, two kinds of the above-mentioned polymeric ceramic bodies 1 were obtained in a stack of 10 sheets. In the obtained polymeric ceramic body 1, the window portions 4 with fine pitches were formed with high precision, and the mechanical strength was also sufficiently guaranteed.

However, the Mn2O3 content in the glass component is 7.7 wt%.
Some warping occurred.

The thus produced two types of polymeric ceramic body 10 division frame member 3 exhibits a red color that becomes deeper as the Mn2O3 content increases, and when the light transmittance of the white board (circuit board 2) is 100%, the above-mentioned color in the glass is displayed. 2 containing Mn2O3 in proportion
The light transmission characteristics of the seed sorting frame member 3 were as shown in FIG. As is clear from the figure, Mn2 in the glass
Even if it contains 2wt% O3, the visible light range is about 3%.
% or less, and it was confirmed that there was more than sufficient light absorption in the entire visible light range. Therefore, Mn2O3
It can be expected that even if the amount of addition is less than this value, it will be sufficient in terms of absorbance.

Further, in the same manner as in the experimental example, the LEDs 5 (however, LEDs 5 of each emission color were mixed) were bonded, then filled with a translucent resin 11, and a light diffusion film 12 was attached to complete the display.

The resulting display is an LE display with different luminescent colors in the visible light range.
For all D dots, there was no light leakage between adjacent dots, and the dots were ultra-compact, high-density, and had a wide viewing angle.

Note that in the above embodiments and experimental examples, an LED matrix display was described, but it goes without saying that the present invention can be applied to an LED static eliminator array and the like.

<Effects> As described above, according to the present invention, an ultra-small and high-density LED
It is possible to provide 7-trix displays, LED arrays, etc. with high precision, and it is also possible to provide products with no light leakage between adjacent dots and a wide viewing angle for displays, which has great industrial value.

[Brief explanation of drawings]

1 to 6 relate to embodiments of the present invention, and FIG. 1 is an LE
Figure 2 is an enlarged cross-sectional view of the main parts of the D-matrix display, Figure 2 is an enlarged cross-sectional view of the main parts of the manufacturing process, Figure 3 is an enlarged plan view of the main parts in the state shown in Figure 2, and Figure 4 is the sintering temperature conditions in the experimental example. 5 and 6 are graphs showing the light transmittance characteristics of dividing frame members according to different experimental examples. FIG. 7 is a graph showing the light emission characteristics of typical LEDs. Figure 9 relates to a conventional LED matrix display.
FIG. 8 is a perspective view, and FIG. 9 is an enlarged sectional view of main parts. 1...Substrate/dividing frame polymeric ceramic member (polymerized ceramic body) 2...Circuit board 3...Dividing frame member 4...Window part 5... ...Light emitting diode (LED)6.7...
... Connection pattern 11 ... Translucent resin

Claims (4)

[Claims] (1) In a configuration in which a large number of chip-shaped light emitting diodes are arranged and connected on a substrate, one or several chip-shaped light emitting diodes are arranged in each window of a partitioning frame member, and the substrate and the partitioning frame member are laminated with green sheets. The light emitting device is characterized in that the substrate is simultaneously sintered to form an integral structure by a sintering method, and at least the surface layer of the substrate is made of white ceramics, and the partition frame member is made of colored ceramics that absorbs the color of light emitted from the light emitting diode. Diode composite assembly. (2) The dividing frame member is characterized in that the glass component mixed with alumina contains transition element ions in the form of oxides that have absorption spectral characteristics in the visible light region. A light emitting diode composite assembly as described. (3) The transition element ions are Cu^2^+, Mn^3
^+, Co^2^+, Ni^2^+, Ti^3^+, V
^3^+, Cr^3^+, Fe^2^+, Fe^3^+
The light emitting diode composite assembly according to claim 2, characterized in that the light emitting diode composite assembly is at least one or two or more of the following. (4) The light emission according to claim 2, characterized in that when the oxide of the transition element is a single type of oxide, it is blended in the glass component at a ratio of 10 wt% or less. Diode composite assembly.