JP2009177106A - Ceramic member for semiconductor light-emitting apparatus, method of manufacturing ceramic member for semiconductor light-emitting apparatus, semiconductor light-emitting apparatus, and display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plate-shaped ceramic member that can have a higher degree of flexibility in design than allowed by conventional technologies. <P>SOLUTION: A plate-shaped ceramic member 15, which converts the wavelength of light emitted from a semiconductor light-emitting device, is formed of two or more types of ceramic materials, and is partitioned into multiple blocks 15a and 15b. Each block is formed of one selected from two or more types of ceramic materials. At least one of two or more types of ceramic materials contains a wavelength conversion material that converts the wavelength of light. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to the structure of a member that converts the wavelength of light emitted from a semiconductor light emitting device.

  In recent years, a white light source including a blue light-emitting diode that is a semiconductor light-emitting element and a silicone resin molded body that contains yellow phosphor particles that convert blue light into yellow light has become widespread. Blue light emitted from the blue light emitting diode is partially converted into yellow light when passing through the silicone resin molding, and as a result, white light in which blue light and yellow light are mixed is output. The silicone resin molded body is formed by dispersing a yellow phosphor particle in a silicone resin to produce a phosphor paste, molding the phosphor paste into a predetermined shape, and thermally curing the phosphor paste.

At present, as a member for converting blue light into yellow light, the resin molded body as described above is widely used, but it has been pointed out that the resin molded body has the following drawbacks.
Since the phosphor particles have a wide particle size distribution, it is difficult to uniformly disperse them in the resin. Even if dispersed uniformly, the phosphor particles have a higher specific gravity than the resin. Therefore, if the phosphor particles are left standing for a long time after the phosphor paste is prepared, the phosphor particles will settle and maintain a uniform dispersion state. Can not do it. Therefore, the density of the phosphor particles in the resin molding varies from product to product, resulting in variations in hue between products.

Moreover, since resin such as silicone and epoxy has low translucency due to deterioration over time, it is difficult to obtain high light output over a long period of time (see, for example, Patent Document 1).
To deal with such drawbacks, Patent Document 1 employs a ceramic material yellow phosphor formed into a plate and fired, and the resulting plate-shaped ceramic member is used as a member for converting the wavelength of light. Propose to do. Patent Document 1 describes that by doing so, high light output can be obtained over a long period of time. Further, although not explicitly disclosed in Patent Document 1, if a plate-like ceramic member is employed, the process of dispersing phosphor particles in the resin is not required in the first place, so that the problem of variations in color between products is also eliminated. It is guessed.
JP 2004-146835 A JP 2007-150331 A

  However, in the technique disclosed in Patent Document 1, since a plate-shaped ceramic member is formed from one type of phosphor material as a ceramic material, there is a limitation on the types of phosphor materials that can be actually used. Then, there exists a problem that it is difficult to give a freedom degree to the design of a plate-shaped ceramic member.

  For example, even if you try to use a ceramic material with high thermal conductivity to enhance the heat dissipation characteristics of a plate-shaped ceramic member, there are restrictions on the types of phosphor materials that can actually be used, so you can achieve the desired heat dissipation characteristics. It may be impossible to do so. Further, even if it is attempted to reduce the thickness of the plate-like ceramic member in order to adjust the light hue, it is considered that the desired hue may not be realized from the viewpoint of ensuring the mechanical strength.

  Accordingly, an object of the present invention is to provide a ceramic member for a semiconductor light-emitting device, a method for manufacturing a ceramic member for a semiconductor light-emitting device, a semiconductor light-emitting device, and a display device that can have a higher degree of design freedom than the prior art.

  The ceramic member for a semiconductor light-emitting device according to the present invention is a ceramic member for a semiconductor light-emitting device that converts the wavelength of light emitted from a semiconductor light-emitting element, and is composed of two or more types of ceramic materials, and is divided into a plurality of blocks. And each block is made of one type of ceramic material selected from the two or more types of ceramic materials, and at least one type of the ceramic materials of the two or more types of ceramic materials is optical It contains a wavelength conversion material that converts the wavelength.

  The method for producing a ceramic member for a semiconductor light-emitting device according to the present invention also includes a ceramic for a semiconductor light-emitting device composed of two or more types of ceramic materials including at least one type of ceramic material containing a wavelength conversion material that converts the wavelength of light. A method for manufacturing a member, comprising: a first step of preparing an unsintered ceramic material sheet for each of the two or more types of ceramic materials; and a step of preparing two or more types of ceramic materials prepared in the first step. A second step of laminating fired sheets to form a sheet laminate, and a sheet laminate obtained in the second step is sliced vertically or obliquely on the upper surface of the sheet laminate to provide various types of ceramic materials A third step of forming an unsintered sheet in which the blocks made of are arranged in the order in which they are stacked in the second step The fourth step of forming an unfired ceramic structure corresponding to the structure of the target ceramic member using the unfired sheet obtained in the third step, and the unfired ceramic obtained in the fourth step And a fifth step of firing the structure.

A semiconductor light-emitting device according to the present invention includes a semiconductor light-emitting element mounted on a base and a ceramic member having the above-described configuration disposed in the light irradiation direction of the semiconductor light-emitting element.
The display device according to the present invention uses the semiconductor light emitting device having the above-described configuration.

  According to the said structure, the ceramic member for semiconductor light-emitting devices is comprised from 2 or more types of ceramic materials, and at least 1 type of ceramic material contains the wavelength conversion material. By using two or more kinds of ceramic materials in this way, the degree of freedom can be given to the design of the ceramic member as compared with the prior art using only one type of ceramic material.

The best mode for carrying out the present invention will be described in detail with reference to the drawings.
(Embodiment 1)
<Configuration>
1 is a cross-sectional view schematically showing a configuration of a semiconductor light emitting device according to Embodiment 1 of the present invention.

  An LED light source 10 that is a semiconductor light emitting device includes a package base 11, an LED element 13, and a plate-shaped ceramic member 15 as main components. The package base 11 has a bottomed cylindrical shape, and the LED element 13 is mounted on the bottom of the cylinder and the plate-like ceramic member 15 is disposed so as to close the opening of the cylinder. The package base 11 is made of, for example, copper, aluminum, iron, gold, silver, stainless steel, alloys containing these, metal oxide (aluminum oxide, silicon oxide, etc.), metal nitride ( (Aluminum nitride, silicon nitride, etc.), silicon carbide, metal silicon, carbon, and other inorganic materials. By using a material having high thermal conductivity for the package base, the heat generation suppressing effect of the wavelength conversion member described later is further enhanced. Here, the LED element is a semiconductor light emitting element having a semiconductor multilayer structure including a light emitting layer between a first conductive type layer and a second conductive type layer. The LED element 13 is mounted on a wiring pattern 12 formed on the surface of the package base 11, and emits blue light when electric power is supplied through the wiring pattern 12. The periphery of the LED element 13 is filled with a translucent material 14 made of a resin material such as silicone, epoxy or fluorine, or an inorganic material such as glass. The LED element 13 may be hollow without being filled with the translucent material 14. The plate-shaped ceramic member 15 is disposed on the front surface of the LED element 13 and functions as a member that converts blue light into yellow light. The blue light emitted from the LED element 13 is partially converted into yellow light when passing through the plate-like ceramic member 15, and as a result, white light in which blue light and yellow light are mixed is output.

FIG. 2 is a perspective view schematically showing the configuration of the plate-like ceramic member according to Embodiment 1 of the present invention.
The plate-like ceramic member 15 shown in FIG. 2 is partitioned into a total of 30 blocks of 15 blocks 15 a made of the ceramic material A and 15 blocks 15 b made of the ceramic material B. Each of these blocks has a rectangular parallelepiped shape with the same dimensions, and the adjacent blocks are made of different ceramic materials in both the width direction and the thickness direction. At least one of the ceramic materials A and B contains a phosphor material that converts blue light into yellow light. Specific combinations of the ceramic materials A and B are exemplified below.
(Example 1)
Ceramic material A: Yellow phosphor Y ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce)
Ceramic material B: Translucent material Al ₂ O ₃
(Example 2)
Ceramic material A: Yellow phosphor Y ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce)
Ceramic material B: Translucent material YAG
(Example 3)
Ceramic material A: Yellow-green phosphor Y ₃ (Al, Ga) ₅ O ₁₂ : Ce ³⁺ (YAG: Ce partially Ga substituted)
Ceramic material B: Yellow-orange phosphor (Y, Gd) ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce partially substituted with Gd)
(Example 4)
Ceramic material A: Green phosphor (Ba, Sr) ₂ SiO ₄ : Eu ²⁺
Ceramic material B: Red phosphor (Ca, Sr) AlSiN ₃ : Eu ²⁺
In Example 1 above, YAG: Ce which is a yellow phosphor and alumina Al ₂ O ₃ which is a translucent material.
Is a combination. Example 2 is a combination of YAG: Ce, which is a yellow phosphor, and YAG, which is a translucent material. By combining the yellow phosphor and the translucent material in this manner, for example, a desired color can be achieved while ensuring the mechanical strength. In addition, regarding Example 1, the thermal conductivity of YAG: Ce is 11 W / m · K, whereas alumina Al ₂ O ₃
The thermal conductivity of is 30 W / m · K. Thus, by adopting a combination of a yellow phosphor and a translucent material having a higher thermal conductivity than the yellow phosphor, the heat dissipation characteristics of the plate-shaped ceramic member 15 can be enhanced. In recent years, it has been clarified that phosphor emits heat due to Stokes loss when it emits light, while the luminous efficiency decreases as the temperature of the phosphor increases (FIG. 38 shows the relationship between phosphor temperature and emission peak height). Showing). Therefore, it is desired to employ a ceramic material having a high thermal conductivity in order to enhance the heat dissipation characteristics of the plate-like ceramic member 15. By adopting the above combination, the heat dissipation characteristics of the plate-like ceramic member 15 can be enhanced, and the heat generated by the phosphor can be radiated to the outside through the attached package base 11, and as a result, the luminous efficiency Can be suppressed.

  In addition, in Example 3 above, a yellow-green phosphor obtained by substituting a part of aluminum Al in YAG: Ce, which is a yellow phosphor, with gallium Ga, and a part of yttrium Y in YAG: Ce, which is a yellow phosphor, are obtained using gadolinium. A combination with a yellow-orange phosphor substituted with Gd. By replacing a part of aluminum Al with gallium Ga, the emission peak wavelength can be shifted to the short wavelength side. Further, by replacing part of yttrium Y with gadolinium Gd, the emission peak wavelength can be shifted to the longer wavelength side. Thus, by adopting a combination of phosphors having different emission peak wavelengths, it is possible to realize a desired color tone and to improve the color rendering properties necessary for illumination.

Moreover, the above Example 4 is a combination of (Ba, Sr) ₂ SiO ₄ : Eu ²⁺ that is a green phosphor and (Ca, Sr) AlSiN ₃ : Eu ²⁺ that is a red phosphor. That is, this is an example of a combination of phosphors having different emission peak wavelengths. A phosphor obtained by introducing europium Eu into strontium silicate barium (Ba, Sr) ₂ SiO ₄ can adjust the emission color from green to orange by changing the composition ratio of strontium Sr and barium Ba. Thus, by adopting a combination of phosphors having different emission peak wavelengths, it is possible to realize a desired color tone and to improve the color rendering properties necessary for illumination.

As the fluorescent material, in addition to the above, those terbium Tb was activated in ^{_{YAG Y 3 Al 5 O 12:}} Tb 3+, YAG to those that have been activated with cerium Ce and praseodymium _{Pr Y 3 Al 5 O 12:} Ce 3+ , Pr ³⁺ , thiogallate phosphor CaGa ₂ S ₄ : Eu ²⁺ or α-sialon phosphor Ca-α-SiAlON: Eu ²⁺ , (0.75 (Ca _0.9 Eu _0.1 ) O · 2.25AlN · 3 .25Si ₃ N ₄ : Eu ²⁺ , Ca _1.5 Al ₃ Si ₉ N ₁₆ : Eu ^2+, etc.) can also be used. In addition to the above, as the green phosphor, aluminate phosphor BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , Mn ²⁺ , (Ba, Sr, Ca) Al ₂ O ₄ : Eu ²⁺ , α-sialon phosphor Sr _1.5 Al ₃ Si ₉ N ₁₆ : Eu ²⁺ , Ca-α-SiAlON: Yb ²⁺ , β-sialon phosphor β-Si ₃ N ₄ : Eu ²⁺ , oxynitride silicate (Ba, Sr, oxynitride phosphor) Ca) Si ₂ O ₂ N ₂ : Eu ²⁺ or oxonitridoaluminosilicate (Ba, Sr, Ca) ₂ Si ₄ AlON ₇ : Ce ³⁺ _{(Ba, Sr, Ca) Al} 2-x Si x O 4-x N x: Eu 2+ (0 <x <2), nitridosilicate phosphor is a nitride phosphor _{(Ba, Sr, Ca) 2} Si ₅ N ₈ : Ce ³⁺ , thiogallate phosphor SrGa ₂ S ₄ : Eu ²⁺ , garnet phosphor Ca ₃ Sc ₂ Si ₃ O ₁₂ : Ce ³⁺ , BaY ₂ SiAl ₄ O ₁₂ : Ce ^{3+ and the} like can also be used. As the orange phosphor, in addition to the above, α-sialon phosphor Ca-α-SiAlON: Eu ²⁺ can be used. As red phosphors, sulfide phosphors (Sr, Ca) S: Eu ²⁺ , La ₂ O ₂ S: Eu ³⁺ , Sm ³⁺ , silicate phosphors Ba ₃ MgSi ₂ O ₈ : Eu ²⁺ , Mn (Ca, Sr) SiN ₂ : Eu ²⁺ , (Ca, Sr) AlSiN ₃ : Eu ²⁺ and Sr ₂ Si _5−x Al _x O _x N _8−x : Eu that are ²⁺ and nitride or oxynitride phosphors ²⁺ (0 ≦ x ≦ 1) can also be used. As the translucent material, in addition to the above, MgO (thermal conductivity 54 W / m · K), Y ₂ O ₃ (thermal conductivity 14.5 W / m · K), ZnO (thermal conductivity 20 W / m · K). In addition to oxides and nitrides such as AlN (thermal conductivity 150 W / m · K), carbon-based materials such as SiC (thermal conductivity 400 W / m · K) can also be used.

Phosphor materials with emission peak wavelengths from the semiconductor light-emitting element, including those emitting ultraviolet light having a wavelength of 200 nm to 380 nm and visible light having a wavelength of 380 nm to 510 nm, and the phosphor materials described above. Can be combined to synthesize white light. Examples are shown below.
(1) A semiconductor light emitting device having an emission peak wavelength of 200 nm to less than 420 nm, preferably 360 nm to 410 nm, a blue phosphor having an emission peak wavelength of 420 nm to less than 510 nm, preferably 440 nm to less than 510 nm, and an emission peak wavelength of 560 nm. A combination of yellow to orange phosphors of not less than 600 nm and preferably not less than 565 nm and not more than 580 nm.
(2) A semiconductor light emitting device having an emission peak wavelength of 200 nm to less than 420 nm, preferably 360 nm to 410 nm, a blue phosphor having an emission peak wavelength of 420 nm to less than 510 nm, preferably 440 nm to less than 510 nm, and an emission peak wavelength of 510 nm or more. A combination of a blue-green to green phosphor of less than 560 nm, preferably 510 nm to 550 nm, and a red phosphor having an emission peak wavelength of 600 nm to less than 660 nm, preferably 620 nm to 640 nm.
(3) A semiconductor light emitting device having an emission peak wavelength of 200 nm to less than 420 nm, preferably 360 nm to 410 nm, a blue phosphor having an emission peak wavelength of 420 nm to less than 510 nm, preferably 440 nm to less than 510 nm, and an emission peak wavelength of 510 nm. More than 560 nm, preferably 510 nm to 550 nm blue-green to green phosphor, emission peak wavelength 560 nm to less than 600 nm, preferably 565 nm to 580 nm or less yellow to orange phosphor, and emission peak wavelength 600 nm to less than 660 nm A combination of red phosphors of preferably 620 nm or more and 640 nm or less.
(4) A combination of a semiconductor light emitting device having an emission peak wavelength of 420 nm or more and less than 510 nm, preferably 440 nm or more and less than 510 nm, and a yellow to orange phosphor having an emission peak wavelength of 560 nm or more and less than 600 nm, preferably 565 nm or more and 580 nm or less.
(5) A semiconductor light emitting device having an emission peak wavelength of 420 nm to less than 510 nm, preferably 440 nm to less than 510 nm, a blue-green to green phosphor having an emission peak wavelength of 510 nm to less than 560 nm, preferably 510 nm to 550 nm, and an emission peak. A combination of red phosphors having a wavelength of 600 nm to less than 660 nm, preferably 620 nm to 640 nm.
(6) A semiconductor light emitting device having an emission peak wavelength of 420 nm to less than 510 nm, preferably 440 nm to less than 510 nm, a blue-green to green phosphor having an emission peak wavelength of 510 nm to less than 560 nm, preferably 510 nm to 550 nm, and an emission peak. A combination of a yellow to orange phosphor having a wavelength of 560 nm to 600 nm, preferably 565 nm to 580 nm, and a red phosphor having an emission peak wavelength of 600 nm to less than 660 nm, preferably 620 nm to 640 nm.
(7) A combination of a semiconductor light emitting device having an emission peak wavelength of 420 nm or more and less than 510 nm, preferably 440 nm or more and less than 510 nm, and a blue-green to green phosphor having an emission peak wavelength of 510 nm or more and less than 560 nm, preferably 510 nm or more and 550 nm or less.
(8) A combination of a semiconductor light emitting device having an emission peak wavelength of 420 nm or more and less than 510 nm, preferably 440 nm or more and less than 510 nm, and a yellow to orange phosphor having an emission peak wavelength of 560 nm or more and less than 600 nm, preferably 565 nm or more and 580 nm or less.
(9) A combination of a semiconductor light emitting device having an emission peak wavelength of 490 nm to less than 510 nm, preferably 490 nm to less than 500 nm, and an orange to red phosphor having an emission peak wavelength of 590 nm to less than 660 nm, preferably 600 nm to 630 nm.

The semiconductor multilayer film of the semiconductor light emitting device is made of a generally known nitride semiconductor material such as GaN, an oxide semiconductor material such as ZnO, and a sulfide semiconductor material such as ZnS.
The plate-like ceramic member 15 shown in FIG. 2 is divided into three layers in the thickness direction and ten rows in the width direction, but the present invention is not limited to this. An example of the actual dimensions of the plate-shaped ceramic member 15 is about 3 mm in width, about 3 mm in depth, and about 100 μm in thickness. An example of the dimensions of one block is about 20 μm in width, about 3 mm in depth, and about 20 μm in thickness. is there. In the case of this dimension example, the plate-shaped ceramic member 15 is divided into five layers in the thickness direction and 15 rows in the width direction. At present, it has been confirmed that the length of one side of the block can be easily realized up to about 5 μm according to the manufacturing method described later.

  Hereinafter, modified examples related to the configuration of the plate-shaped ceramic member will be described with reference to FIGS. 3 to 11. Also in these modified examples, the number of sections is appropriately changed according to product specifications and the like.

  The plate-like ceramic member 15 shown in FIG. 3 is partitioned into a total of 30 blocks of 15 blocks 15 a made of the ceramic material A and 15 blocks made of the ceramic material B. The plate-shaped ceramic member 15 shown in FIG. 3 is divided into three layers in the thickness direction, the first and third layers are divided into 10 rows in the width direction, and the second layer is divided into 10 rows in the depth direction. Has been. All the blocks have a rectangular parallelepiped shape with the same dimensions, and adjacent blocks in the layer are made of different ceramic materials.

  The plate-like ceramic member 15 shown in FIG. 4 is partitioned into a total of 300 blocks, 150 blocks 15 a made of the ceramic material A and 150 blocks 15 b made of the ceramic material B. The plate-like ceramic member 15 shown in FIG. 4 is divided into three layers in the thickness direction, 10 rows in the width direction, and 10 rows in the depth direction. Each of these blocks has a rectangular parallelepiped shape with the same dimensions, and the adjacent blocks are made of different ceramic materials in any of the width direction, the depth and the thickness direction.

  The plate-like ceramic member 15 shown in FIG. 5 is partitioned into a total of 10 blocks, that is, 5 blocks 15 a made of the ceramic material A and 5 blocks 15 b made of the ceramic material B. The plate-like ceramic member 15 shown in FIG. 5 is partitioned into 10 rows in the width direction. Each of these blocks has a rectangular parallelepiped shape with the same dimensions, and the adjacent blocks in the width direction are made of different ceramic materials.

  The plate-like ceramic member 15 shown in FIG. 6 is partitioned into a total of 100 blocks of 50 blocks 15 a made of the ceramic material A and 50 blocks 15 b made of the ceramic material B. The plate-like ceramic member 15 shown in FIG. 6 is divided into 10 rows in the width direction and 10 rows in the depth direction. Each of these blocks has a rectangular parallelepiped shape with the same dimensions, and the adjacent blocks are made of different ceramic materials in both the width direction and the depth direction.

  The plate-like ceramic member 15 shown in FIG. 7 is partitioned into a total of five blocks, two blocks 15 a made of the ceramic material A and three blocks 15 b made of the ceramic material B. The plate-like ceramic member 15 shown in FIG. 7 is divided into five layers in the thickness direction. Each of these blocks has a rectangular parallelepiped shape with the same dimensions, and the adjacent blocks in the thickness direction are made of different ceramic materials.

  The plate-like ceramic member 15 shown in FIG. 8 includes a total of three blocks, one block 15c made of the ceramic material C, one block 15d made of the ceramic material D, and one block 15e made of the ceramic material E. It is divided into blocks. At least one of the ceramic materials C, D, and E contains a phosphor material that converts blue light into yellow light. In the plate-like ceramic member 15 shown in FIG. 8, the block 15e is partitioned so as to include the blocks 15c and 15d. Such an inclusion structure is particularly effective when a sulfide-based phosphor CaS: Eu or a thiogallate-based phosphor that is sensitive to humidity is employed.

  The plate-shaped ceramic member 15 shown in FIG. 9 has a total of 11 blocks, including five blocks 15c made of ceramic material C, five blocks 15d made of ceramic material D, and one block 15e made of ceramic material E. It is divided into blocks.

The plate-like ceramic member 15 shown in FIG. 10 includes a total of 30 blocks, 10 blocks 15f made of ceramic material F, 10 blocks 15g made of ceramic material G, and 10 blocks 15h made of ceramic material H. It is divided into blocks. Each of these blocks has a rectangular parallelepiped shape with the same dimensions, and the adjacent blocks are made of different ceramic materials in both the width direction and the thickness direction. At least one of the ceramic materials F, G, and H contains a phosphor material that converts blue light into yellow light. Specific combinations of the ceramic materials F, G, and H are exemplified below.
(Example 5)
Ceramic material F: Yellow-green phosphor Y ₃ (Al, Ga) ₅ O ₁₂ : Ce ³⁺ (YAG: Ce partially Ga substituted)
Ceramic material G: Yellow-orange phosphor (Y, Gd) ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce partially substituted with Gd)
Ceramic material H: Translucent material Al ₂ O ₃
In Example 5 above, a yellow-green phosphor in which a part of aluminum Al in YAG: Ce, which is a yellow phosphor, is substituted with gallium Ga, and a part of yttrium Y in YAG: Ce, which is a yellow phosphor, are converted into gadolinium Gd. Is a combination of a yellow-orange phosphor substituted with the above and alumina Al ₂ O ₃ which is a translucent material. In this way, combining two types of yellow phosphors and a translucent material having a higher thermal conductivity than these, a plate-like shape can be achieved while achieving the desired color and improving the color rendering required for illumination. The heat dissipation characteristics of the ceramic member 15 can be enhanced.

The plate-like ceramic member 15 shown in FIG. 11 includes a total of five blocks, two blocks 15f made of ceramic material F, one block 15g made of ceramic material G, and two blocks 15h made of ceramic material H. It is divided into blocks. The plate-shaped ceramic member 15 shown in FIG. 11 is divided into five layers in the thickness direction. Each of these blocks has a rectangular parallelepiped shape with the same dimensions, and the adjacent blocks in the thickness direction are made of different ceramic materials.
<Manufacturing method>
Next, the manufacturing method of the plate-shaped ceramic member having the above-described configuration will be described.

FIG. 12 is a diagram showing a flow of a method for manufacturing a plate-shaped ceramic member according to Embodiment 1 of the present invention.
In this flow, an example of forming a plate-shaped ceramic member composed of ceramic materials A and B is shown. First, in order to produce an unfired sheet (also referred to as “green sheet”) containing the ceramic material A, a slurry containing the raw material of the ceramic material A, a binder, a plasticizer and a solvent is prepared using a dispersing stirrer ( Step S11), a sheet is formed on the base film (Step S12). For example, when the ceramic material A is a yellow phosphor YAG: Ce, yttrium oxide Y ₂ O ₃ , aluminum oxide Al ₂ O ₃ , and cerium oxide CeO ₂ are selected as raw materials for the ceramic material A. Further, a butyral resin as the binder, butylbenzyl phthalate as the plasticizer, and a mixture of butyl acetate (90%) and butyl carbitol (10%) as the solvent can be employed.

In parallel with the above process, an unfired sheet containing the ceramic material B is produced (steps S13 and S14). For example, when the ceramic material B is a translucent material Al ₂ O ₃ , aluminum oxide Al ₂ O ₃ is selected as the raw material of the ceramic material B.

Next, an unfired sheet containing the ceramic material A and an unfired sheet containing the ceramic material B are laminated to form a sheet laminate (step S15).
Next, using a precision cutter, the sheet laminate is cut in a direction perpendicular to the upper surface of the sheet laminate to form an unfired sheet containing the ceramic materials A and B in a striped shape (step S16). Then, by combining the obtained unfired sheets, an unfired ceramic structure corresponding to the structure of the target plate-shaped ceramic member is formed.

Next, the unfired ceramic structure is debindered in a degreasing furnace (step S17) and fired in a firing furnace (step S18). In the binder removal step, for example, the temperature is increased from room temperature to 400 ° C. at a rate of 50 ° C. per hour, 400 ° C. is maintained for about 2 hours to 4 hours, and then naturally cooled. In the firing step, for example, it is heated to about 1700 ° C. to 1800 ° C. under vacuum or _N 2 -H ₂ atmosphere. Thereby, the ceramic structure corresponding to the structure of the target plate-shaped ceramic member can be obtained.

  Next, the surface of the obtained ceramic structure is polished (step S19), cut to the size of the target plate-shaped ceramic member (step S20), and after an inspection process (step S21), Get the product.

FIG. 13 is a diagram schematically showing the state of the sheet forming step (steps S12 and S14).
In the sheet forming step, a thin film 31 of slurry is formed on the base film 32 conveyed in the horizontal direction by using the die coater 21 and is dried by passing through the inside of the drying equipment 22, so that the non-containing ceramic material A is contained. A fired sheet is formed. The thickness of the unsintered sheet can be appropriately adjusted from about 5 μm to about 1 mm, and is adjusted slightly thicker than the final product in consideration of shrinkage during firing and the amount of surface polishing. The base film 32 is made of, for example, polyethylene terephthalate and has a thickness of about 50 μm. The temperature condition of the drying equipment 22 is, for example, about 90 ° C. to 110 ° C., and is appropriately adjusted according to the film thickness of the slurry and the conveyance speed.

FIG. 14 is a diagram schematically showing the state of the stacking step (step S15).
In the laminating step, a support plate 23 made of stainless steel on which the foam sheet 24 is formed is prepared (FIG. 14A), and the unfired sheet 33 containing the ceramic material A with the base film 34 attached is used as the foam sheet 24. It is placed on top and heated and pressurized (FIG. 14B). The thickness of the foam sheet 24 is approximately 150Myuemu～200myuemu, heating is 80 ° C. to 100 ° C. or so, the pressure is 10kg ^/ cm ² ~30kg ^/ cm 2 approximately. Thereafter, the base film 34 is peeled off (FIG. 14C), and the unfired sheet 33 is left (FIG. 14D). Next, the unfired sheet 35 containing the ceramic material B with the base film 36 attached is placed on the unfired sheet 33 and heated and pressurized (FIG. 14E), and the base film 36 is peeled off. (FIG. 14F), leaving the unfired sheet 35 (FIG. 14G). Such an operation is alternately repeated for an unfired sheet containing the ceramic material A and an unfired sheet containing the ceramic material B.

FIG. 15 is a diagram schematically showing the state of the laminated body cutting step (step S16).
In the laminate cutting step, first, the foam sheet 24 is heated to about 150 ° C. to be foamed (FIG. 15A), the sheet laminate 36 is peeled off from the support plate 23 (FIG. 15B), and a precision cutting machine is used. 25, the sheet laminate 36 is cut in the vertical direction on the upper surface of the sheet laminate to form an unfired sheet 37 containing the ceramic materials A and B in stripes (FIG. 15 (d)). The obtained unfired sheets 37 are combined to form an unfired ceramic structure 38 corresponding to the structure of the target plate-shaped ceramic member (FIG. 15 (e)). The unfired ceramic structure 38 corresponds to the structure of the plate-shaped ceramic member shown in FIG. The unfired sheet 37 can be used alone or as an unfired ceramic structure. In that case, it corresponds to the structure of the plate-like ceramic member shown in FIG.

  Further, if the unfired sheets 37 containing the ceramic materials A and B in a striped pattern are stacked while being sequentially rotated by 90 °, an unfired ceramic structure corresponding to the structure of the plate-like ceramic member shown in FIG. 3 is formed. Can do.

  Further, as shown in FIG. 16, the unfired sheets 37 are further combined and cut (FIG. 16A) to form an unfired sheet 40 containing the ceramic materials A and B in a checkered pattern (FIG. 16B). ), Which can be combined to form the unfired ceramic structure 41 (FIG. 16C). The unfired ceramic structure 41 corresponds to the structure of the plate-shaped ceramic member shown in FIG. The unsintered sheet 40 can be used alone or as an unsintered ceramic structure. In that case, it corresponds to the structure of the plate-like ceramic member shown in FIG.

  The method for forming a plate-shaped ceramic member composed of two types of ceramic materials A and B has been described above, but plate-shaped ceramics composed of three or more types of ceramic materials as shown in FIGS. The same applies when forming the member. Therefore, an unfired ceramic structure corresponding to the structure of the plate-like ceramic member shown in FIGS. 10 and 11 can be easily formed.

Moreover, the non-fired ceramic structure corresponding to the structure of the plate-like ceramic member shown in FIG. 7 can be obtained without going through the laminate cutting step. 8 and FIG. 9, the green ceramic structure corresponding to the structure of the plate-shaped ceramic member is formed by first forming a structure to be included using the green sheet, and then changing the side surface of this structural body to another structure. It can be formed by covering with a green sheet.
<Verification>
In order to verify the performance of the plate-shaped ceramic member according to Embodiment 1 of the present invention, the inventors produced a sample of the plate-shaped ceramic member, and (1) the heat dissipation characteristics of the plate, (2) the surface of the plate Emission color unevenness and (3) Evaluation of variations in hue between samples were performed.

FIG. 19 is a cross-sectional view schematically showing the configuration of the verification system.
The configuration of the LED light source is the same as the configuration shown in FIG. 1 except that the periphery of the LED element 13 is a hollow 51. The LED light source is mounted on a substrate electrode 53 formed on the surface of the substrate 52 and receives power supply via the substrate electrode 53. A heat sink 54 is provided on the back surface of the substrate 52. As the LED element 13, a 1 mm square size If = 1000 mA (equivalent to an optical output of 900 mW) was used. The heat dissipation characteristics of the plate of (1) and the variation in hue between samples of (3) were evaluated using the verification system shown in FIG.

FIG. 20 is a cross-sectional view schematically showing the configuration of the verification system.
The configuration of the LED light source is the same as the configuration of FIG. 19 except that the shape of the package base 11 and the periphery of the LED element 13 are filled with silicone which is a translucent material 14. The uneven luminescent color on the plate surface in (2) was evaluated using the verification system shown in FIG.

The verification results will be described below.
FIG. 21 is a diagram for explaining the verification result of the heat dissipation characteristics of the plate and the configuration of the sample.

In order to verify the heat dissipation characteristics of the plate this time, there are three types of wavelengths: a fluorescent particle silicone plate (FIG. 21B), a ceramic single plate (FIG. 21C), and a ceramic composite plate (FIG. 21D). A conversion member was prepared. As the plate size, a plate having a width of 2.5 mm, a depth of 2.5 mm, and a thickness of 0.3 mm was used. The fluorescent particle silicone plate is a silicone resin molded body containing yellow phosphor particles YAG: Ce inside. The ceramic single plate is composed only of the yellow phosphor YAG: Ce. The ceramic composite plate has the same structure as that shown in FIG. 2, and is composed of a yellow phosphor YAG: Ce and a translucent material Al ₂ O ₃ . Both the fluorescent particle silicone plate and the ceramic single plate correspond to the prior art, and the ceramic composite plate corresponds to the first embodiment of the present invention.

  According to the verification results of the heat dissipation characteristics of the plate in FIG. 21A, when the LED element 13 is emitting light, the chip temperature of the LED element 13 is 45 ° C. for the fluorescent particle silicone plate, 46 ° C. for the ceramic single plate, and ceramics. It is 47 ° C. for the composite plate. On the other hand, the surface temperature of the plate is 150 ° C. for the fluorescent particle silicone plate, 85 ° C. for the ceramic single plate, and 65 ° C. for the ceramic composite plate. Thereby, it turns out that Embodiment 1 of this invention can provide the thermal radiation characteristic superior to the prior art.

FIG. 22 is a diagram for explaining the verification result of the uneven emission color on the plate surface and the configuration of the sample.
In order to verify the uneven emission color of the plate surface this time, fluorescent particle silicone plate (FIG. 22B), ceramic single plate (FIG. 22C), ceramic single layer composite plate (FIG. 22D), Four types of wavelength conversion members of a ceramic multilayer composite plate (FIG. 22 (e)) were prepared. As the plate size, a plate having a width of 2 mm, a depth of 2 mm, and a thickness of 0.3 mm was used. The fluorescent particle silicone plate is a silicone resin molded body containing yellow phosphor particles YAG: Ce inside. The ceramic single plate is composed only of the yellow phosphor YAG: Ce. The ceramic single-layer composite plate has a structure similar to that shown in FIG. 5 and is composed of a yellow phosphor YAG: Ce and a translucent material YAG. The ceramic multilayer composite plate has the same structure as that shown in FIG. 2, and is composed of a yellow phosphor YAG: Ce and a translucent material YAG. Both the fluorescent particle silicone plate and the ceramic single plate correspond to the prior art, and the ceramic single layer composite plate and the ceramic multilayer composite plate correspond to Embodiment 1 of the present invention. The uneven luminescence color on the surface of the plate was measured using a microspectroscopy system that combines a microscope and a spectroscopic measurement device. The chromaticity of a fixed point with a diameter of 200 μm at any 25 points on the plate surface was measured, and the characteristics between the various plates were compared with the magnitude of the color difference as the color unevenness.

  According to the verification result of the uneven emission color on the surface of the plate in FIG. 22A, when the LED element 13 is emitting light, the fluorescent particle silicone plate has no uneven emission color, the Ce concentration in the ceramic single plate, and the thickness of the plate. By adjusting the linear transmittance, emission color unevenness can be eliminated. On the other hand, in the ceramic single layer composite plate, emission color unevenness occurs, but the emission color unevenness can be reduced by adjusting the linear transmittance. In addition, the ceramic multilayer composite plate adjusts the Ce concentration, the thickness of the plate, and the linear transmittance for the block made of yellow phosphor, and the linear transmittance is adjusted for the block made of a light-transmitting material to eliminate uneven emission color. be able to.

FIG. 23 is a diagram for explaining the verification result of the variation in hue between samples.
In order to verify the variation in hue between samples, three types of wavelength conversion members were prepared: a fluorescent particle silicone plate, a ceramic composite plate, and a ceramic composite plate (thickness control). As the plate size, a plate having a width of 2.5 mm, a depth of 2.5 mm, and a thickness of 0.3 mm was used. The fluorescent particle silicone plate is a silicone resin molded body containing yellow phosphor particles YAG: Ce inside. The ceramic composite plate has the same structure as that shown in FIG. 2, and is composed of a yellow phosphor YAG: Ce and a translucent material YAG. The ceramic composite plate (thickness control) is obtained by further adjusting the thickness of the plate. The fluorescent particle silicone plate corresponds to the prior art, and the ceramic composite plate and the ceramic composite plate (thickness control) correspond to the first embodiment of the present invention. In evaluating the variation in hue between samples, an integrating sphere was used to measure the emission color.

100 samples were prepared for each plate configuration, and the hue measurement results were plotted in a chromaticity coordinate system. The distribution of plots in chromaticity coordinates corresponds to the variation in hue between samples. According to this, in the ceramic composite plate (FIG. 23 (b)), the variation in hue between samples can be suppressed to 2/5 times that of the fluorescent particle silicone plate (FIG. 23 (a)). It was found that by controlling the thickness of the composite plate (FIG. 23 (c)), the variation in hue between samples can be suppressed to 2/3 times that of the ceramic composite plate (FIG. 23 (b)).
(Embodiment 2)
<Configuration>
FIG. 24 is a cross-sectional view schematically showing the configuration of the semiconductor light emitting device according to Embodiment 2 of the present invention. FIG. 25 is a perspective view schematically showing the configuration of the plate-shaped ceramic member according to Embodiment 2 of the present invention.

In the second embodiment, the configuration of the ceramic member 15 is different from that of the first embodiment. Since the configuration other than this is common to the first embodiment, the description thereof is omitted.
The ceramic member 15 shown in FIGS. 24 and 25 is partitioned into a total of two blocks, a block 15a made of the ceramic material A and a block 15b made of the ceramic material B. From the viewpoint of the content of the phosphor material that is the wavelength conversion material, the ceramic member 15 surrounds the first region containing the phosphor material and the first region and does not contain the phosphor material (or It has a second region (containing the phosphor material at a lower content than the first region). In this example, the first area is composed of the block 15a, and the second area is composed of the block 15b. The first region of the ceramic member 15 has a disk shape. Regarding the size, the diameter of the first region is La, the inner diameter of the opening of the package base 11 is Lb, and the thickness of the ceramic member 15 is T. In this case, it is preferable to satisfy the condition of Lb ≦ La ≦ (Lb + T). Further, the second region of the ceramic member 15 is joined to the package base 11 by solder, brazing material, adhesive, fasteners or the like. Specific combinations of the ceramic materials A and B are exemplified below.
(Example 6)
Ceramic material A: Yellow phosphor Y ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce)
Ceramic material B: Translucent material Al ₂ O ₃
(Example 7)
Ceramic material A: Yellow phosphor Y ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce)
Ceramic material B: Translucent material YAG
(Example 8)
Ceramic material A: Yellow phosphor Y ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce), cerium high concentration Ceramic material B: Yellow phosphor Y ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce), cerium low concentration The combinations of the phosphor materials of Examples 6 and 7 are the same as the combinations of the phosphor materials of Examples 1 and 2 of the first embodiment. As the yellow phosphor, those exemplified in Embodiment 1 other than YAG: Ce can be used. Moreover, about the ceramic material B which comprises a 2nd area | region, not only a translucent material but an opaque material is employable.

  In Example 8, both the ceramic materials A and B include the yellow phosphor YAG: Ce. However, when the ceramic material A composing the first region and the ceramic material B composing the second region are compared, the doping amount of cerium as an activator is different. By reducing the amount of cerium doped in the second region as compared with the first region, heat generation in the second region can be reduced, and as a result, the heat dissipation characteristics of the ceramic member 15 can be enhanced.

Hereinafter, modified examples related to the configuration of the plate-shaped ceramic member will be described with reference to FIGS. 26 to 29.
In the plate-like ceramic member 15 shown in FIGS. 26 and 27, the thickness and position of the block 15a constituting the first region are different from those of the plate-like ceramic member 15 shown in FIGS. In the plate-shaped ceramic member 15 shown in FIG. 26, the side surface and the lower surface of the first region are surrounded by the second region. In the plate-shaped ceramic member 15 shown in FIG. 27, the side surface and the upper and lower surfaces of the first region are surrounded by the second region.

The plate-like ceramic member 15 shown in FIG. 28 is partitioned into a total of three blocks: a block 15 i made of the ceramic material I, a block 15 j made of the ceramic material J, and a block 15 k made of the ceramic material K. In this example, the first area is composed of blocks 15i and 15j, and the second area is composed of blocks 15k. Specific combinations of ceramic materials I, J, and K are exemplified below.
(Example 9)
Ceramic material I: Yellow-green phosphor Y ₃ (Al, Ga) ₅ O ₁₂ : Ce ³⁺ (YAG: Ce partially Ga substituted)
Ceramic material J: Yellow-orange phosphor (Y, Gd) ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce partially substituted with Gd)
Ceramic material K: Translucent material YAG
(Example 10)
Ceramic material I: Green phosphor (Ba, Sr) ₂ SiO ₄ : Eu ²⁺
Ceramic material J: Red phosphor (Ca, Sr) AlSiN ₃ : Eu ²⁺
Ceramic material K: Translucent material YAG
The combination of the phosphor materials of Examples 9 and 10 is the same as the combination of the phosphor materials of Examples 3 and 4 of the first embodiment. In addition to the above, those exemplified in Embodiment 1 can be used as the yellow-green phosphor, yellow-orange phosphor, green phosphor, and red phosphor. Moreover, about the ceramic material K which comprises a 2nd area | region, not only a translucent material but an opaque material is employable.

The plate-like ceramic member 15 shown in FIG. 29 is partitioned into a total of three blocks: a block 15a made of a ceramic material A, a block 15b made of a ceramic material B, and a block 15l made of a ceramic material L. In this example, the first area is composed of the block 15a, and the second area is composed of the block 15b and the block 15l. Specific combinations of the ceramic materials A, B, and L are exemplified below.
(Example 11)
Ceramic material A: Yellow phosphor Y ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce)
Ceramic material B: Translucent material YAG
Ceramic material L: Translucent material Al ₂ O ₃
In Example 11 above, alumina (Al ₂ O ₃ ), which has a higher thermal conductivity than YAG, is used as the constituent material of the block 15l, so that the heat dissipation characteristics of the ceramic member 15 can be enhanced.
<Manufacturing method>
Next, two typical examples of the method for manufacturing the plate-shaped ceramic member having the above-described configuration will be described.

FIG. 30 is a diagram showing a flow of a method for manufacturing a plate-shaped ceramic member according to Embodiment 2 of the present invention.
In this flow, an example of forming a plate-shaped ceramic member composed of ceramic materials A and B is shown. First, the billet containing the raw material of ceramic material A, a binder, a plasticizer, and a solvent is prepared using the dispersion stirrer (step S31). For example, when the ceramic material A is a yellow phosphor YAG: Ce, yttrium oxide Y ₂ O ₃ , aluminum oxide Al ₂ O ₃ , and cerium oxide CeO ₂ are selected as raw materials for the ceramic material A. Methyl cellulose can be used as the binder, polyacrylic acid as the plasticizer, and water as the solvent.

In parallel with the above process, a billet containing the raw material of ceramic material B, a binder, a plasticizer, and a solvent is prepared using a dispersing stirrer (step S32). For example, when the ceramic material B is a translucent material YAG, yttrium oxide Y ₂ O ₃ and aluminum oxide Al ₂ O ₃ are selected as raw materials for the ceramic material B.

  Next, using an extrusion molding machine, a rod-shaped (stick-shaped) green molded body composed of two billets is formed with the billet containing the ceramic material A as the core material and the billet containing the ceramic material B as the coating material. (Step S33).

  Next, using a precision cutter, the rod-shaped green compact is cut perpendicular to the longitudinal direction to form a plate-shaped green compact that includes the ceramic material A in the center and the ceramic material B around it. (Step S34).

  Next, the plate-shaped green body is debindered (step S35), fired (step S36), surface-polished (step S37), and after an inspection process (step S38), a plate-shaped ceramic member product is obtained. obtain. The steps of binder removal, firing, surface polishing, and inspection are the same as in the first embodiment.

FIG. 31 is a diagram schematically showing the state of the stick forming step (step S33).
In the stick forming process, first, the billet 71 containing the ceramic material A is put into the inner cylinder of the extrusion molding machine 26, and the billet 72 containing the ceramic material B is put into the outer cylinder. Thereafter, the billets 71 and 72 are extruded along with the pressing of the cylinder head of the extrusion molding machine 26, pass through the drying equipment 22, and are dried to form a rod-shaped green molded body. In the example shown in FIG. 31, both billets 71 and 72 are extruded with fluidity, but one billet 71 may be solidified in advance as shown in FIG. 32. . In this way, manufacturing errors in the shape of the boundary surface between the billets 71 and 72 can be suppressed.

FIG. 33 is a diagram schematically showing the state of the stick cutting step (step S34).
In the stick cutting process, the rod-shaped green molded body 73 obtained in the stick molding process is prepared (FIG. 33A), and the rod-shaped green molded body 73 is moved in the longitudinal direction using the precision cutting machine 25. Cut vertically (FIG. 33 (b)) to obtain a plate-shaped unfired compact 74 including the ceramic material A in the center and the ceramic material B around (FIG. 33 (c)). The structure of the green compact 74 corresponds to the structure of the plate-like ceramic member 15 shown in FIGS. Therefore, the plate-shaped ceramic member 15 shown in FIGS. 24 and 25 can be obtained by firing the green compact 74 as it is. In addition, by preparing a plate-shaped unfired molded body composed only of the billet 72 containing the ceramic material B, and laminating this on one or both surfaces of the unfired molded body 74, FIG. 26, FIG. 27, FIG. A plate-like ceramic member 15 shown in FIG. 29 can be obtained. In addition, by preparing two types of plate-like green compacts 74 having different ceramic materials A, and bonding them together and firing them, the plate-shaped ceramic member 15 shown in FIG. 28 can be obtained.

FIG. 34 is a diagram showing a flow of a method for manufacturing a plate-shaped ceramic member according to Embodiment 2 of the present invention.
In this flow, an example of forming a plate-shaped ceramic member composed of ceramic materials A and B is shown. First, a slurry containing a raw material of ceramic material A, a binder, a plasticizer, and a solvent is prepared using a dispersion stirrer (step S51). For example, when the ceramic material A is a yellow phosphor YAG: Ce, yttrium oxide Y ₂ O ₃ , aluminum oxide Al ₂ O ₃ , and cerium oxide CeO ₂ are selected as raw materials for the ceramic material A. In parallel with this, a slurry containing the raw material of ceramic material B, a binder, a plasticizer, and a solvent is prepared using a scattered stirrer (step S52). When the ceramic material B is a translucent material YAG, yttrium oxide Y ₂ O ₃ and aluminum oxide Al ₂ O ₃ are selected as raw materials for the ceramic material B. The binder, plasticizer, and solvent are the same as those in the first embodiment.

  Next, an unfired sheet is formed from the slurry containing the ceramic material B (step S53), and the slurry containing the ceramic material A is printed on the main surface of the unfired sheet containing the ceramic material B using a screen printing machine (step S54). ).

  Next, the unfired sheet is removed from the binder (step S55), fired (step S56), surface-polished (step S57), cut (step S58), passed through an inspection process (step S59), and a plate-shaped ceramic member. Get the product. The steps of binder removal, firing, surface polishing, slicing, and inspection are the same as in the first embodiment.

FIG. 35 is a diagram schematically showing the state of the process after the printing process (step S53).
In the printing process, the slurry 76 containing the ceramic material A is applied to the main surface of the green sheet 75 containing the ceramic material B using the printing plate 27 and the squeegee 28 (FIG. 35A), and the applied slurry 76 is applied. Is dried by the drying equipment 22 (FIG. 35B). Thereafter, the foam sheet 24 is foamed, and the unsintered sheet 75 is peeled off from the stainless support plate 23 (FIG. 35C). In the firing step, the cerium ions contained in the slurry 76 are diffused into the unfired sheet 75, resulting in the formation of a cerium-doped region 75a and an undoped region 75b (FIG. 35 ( d)). Thereafter, the surface of the sheet 75 is polished by the grinder 29 (FIG. 35 (e)) and separated into pieces using the dicing saw 30 (FIG. 35 (f)).
<Verification>
In order to verify the performance of the plate-shaped ceramic member according to Embodiment 2 of the present invention, the inventors produced a sample of a plate-shaped ceramic member and evaluated the heat dissipation characteristics of the plate.

FIG. 36 is a cross-sectional view schematically showing the configuration of the verification system.
The package base 11 is made of alumina (Al ₂ O ₃ ), and the size of the opening is φ1.8 mm. The size of the ceramic member 15 is 4 mm × 4 mm × 0.3 mm, and the size of the first region is φ1.9 mm × 0.3 mm. As the LED element 13, a 1 mm square size If = 1000 mA (equivalent to an optical output of 900 mW) was used.

FIG. 37 is a diagram for explaining the verification result of the heat dissipation characteristic of the plate and the configuration of the sample.
In order to verify the heat dissipation characteristics of the plate, the fluorescent particle silicone plate (FIG. 37 (b)), the ceramic single plate (FIG. 37 (c)), the ceramic composite 1 plate (FIG. 37 (d)), and the ceramic composite 2 plate Four types of wavelength conversion members (FIG. 37 (e)) were prepared. The fluorescent particle silicone plate is a silicone resin molded body containing yellow phosphor particles YAG: Ce inside. The ceramic single plate is composed only of the yellow phosphor YAG: Ce. In the ceramic composite 1 plate, the first region is composed of a yellow phosphor YAG: Ce and the second region is composed of a translucent material YAG. The ceramic composite 2 plate has a first region made of a yellow phosphor YAG: Ce and a second region made of a translucent material alumina (Al ₂ O ₃ ). The fluorescent particle silicone plate and the ceramic single plate correspond to the prior art, and the ceramic composite 1 plate and the ceramic composite 2 plate correspond to Embodiment 2 of the present invention.

  According to the verification result of the heat dissipation characteristics of the plate in FIG. 37A, when the LED element 13 emits light, the chip temperature of the LED element 13 is 105 ° C. for the fluorescent particle silicone plate, 106 ° C. for the ceramic single plate, and ceramics. It is 106 ° C. for the composite 1 plate and 107 ° C. for the ceramic composite 2 plate. On the other hand, the surface temperature of the plate is 210 ° C. for the fluorescent particle silicone plate, 144 ° C. for the ceramic single plate, 136 ° C. for the ceramic composite 1 plate, and 121 ° C. for the ceramic composite 2 plate.

  That is, the surface temperature of the plate according to the second embodiment of the present invention is lower than the surface temperature of the plate according to the prior art. This is because the second region of the ceramic member does not contain a phosphor material as a wavelength conversion material, so there is no heat generation due to Stokes loss in the second region, and the amount of heat generated by the entire plate can be reduced. This is presumed to be because heat generated in is easily conducted to the second region and thus to the package base.

Further, the light from the LED element is not directly incident on the second region of the ceramic member, but is incident as stray light through the first region. Therefore, if the second region contains the phosphor material at the same concentration as the first region (corresponding to the prior art), the stray light emitted from the second region is more than the light emitted from the first region. It will pass through the area | region containing fluorescent substance material for a long time, and a fluorescent color will become comparatively strong and will cause color nonuniformity. In Embodiment 2 of the present invention, the second region does not contain a phosphor material, or the second region contains a phosphor material at a lower concentration than the first region. Color unevenness can be suppressed.
<Modifications and application examples>
FIG. 39 is a cross-sectional view schematically showing a modification of the LED light source according to Embodiment 1 of the present invention.

As shown in FIG. 39A, the LED light source 60 has a plate-shaped ceramic member in which the LED element 63 is mounted on the wiring pattern 62 formed on the base 61 and directly contacts the light emitting surface of the LED element 63. 65 may be provided, and the LED element 63 and the plate-shaped ceramic member 65 may be covered with the resin 64. Further, as shown in FIG. 39B, the LED element 63 may be mounted by wire bonding using a wire 66. Further, an optical member 67 may be provided as shown in FIG. The optical member 67 can be composed of translucent materials such as YAG, Al ₂ O ₃ , AlN, MgO and the like.

FIG. 40 is a diagram illustrating the structure of the optical member 67.
The optical member 67 has a dome shape (FIG. 40A), a dome-shaped composite body (FIG. 40B), a roughened surface shape (FIG. 40C), and an inverted mesa shape (FIG. 40D). )), A round shape (FIG. 40E), a dome shape in which a plate-shaped ceramic member is embedded (FIG. 40F), and the like. It is also conceivable to use the surface shape of the plate-shaped ceramic member itself as an optical member (FIG. 40 (g)). For example, if a material that can be easily etched is used as the translucent material, the uneven shape can be formed on the surface of the plate-shaped ceramic member by etching. The optical member 67 can be attached by forming a dome-shaped ceramic member, for example, with a die cut into a dome shape, and thermocompression-bonding it to the plate-shaped ceramic member.

FIG. 41 is a view showing a modification of the plate-like ceramic member according to Embodiment 2 of the present invention.
The block 15a constituting the first region of the ceramic member 15 may have a square plate shape (FIG. 41A) or a polygonal plate shape according to the shape of the opening of the package base 11 (FIG. 41A). 41 (b)). The outer shape of the ceramic member 15 may be a disk shape (FIG. 41C) or a rectangular plate shape (FIG. 41D). Further, the first region may protrude from the second region (FIG. 41 (e)), or a plurality of first regions may be provided for multi-chip applications (FIG. 41 (f)). Moreover, it is good also as providing the metal layer 15m for joining with a package base in the inner periphery of a 2nd area | region.

42 and 43 are cross-sectional views schematically showing modifications of the LED light source according to Embodiment 2 of the present invention.
As shown in FIG. 42A, the LED light source 80 may have a structure in which the periphery of the LED element 83 is a hollow 88. 42B, the LED light source 80 may have a structure in which the upper surface of the LED element 83 and the lower surface of the ceramic member 85 are in close contact with each other. 42C, the LED light source 80 has a structure in which a metal layer 81m formed on the upper surface of the base 81 and a metal layer 85m formed on the lower surface of the second region of the ceramic member 85 are metal-bonded. It is good. Further, as shown in FIG. 42 (d), the LED light source 80 may be provided with a reflecting plate 81 r in the cylinder of the base 81 and cover the LED element 83 with a lens-like translucent material 84. Further, as shown in FIG. 42E, a structure in which the ceramic member 85 is directly disposed on the LED element 83 may be employed. Here, the LED element 83 includes an LED substrate 83a, a light emitting layer 83b, and a metal layer 83m. The metal layer 83m of the LED element 83 is metal-bonded to a metal layer 85m formed in the second region of the ceramic member 85. It has a structure. Also, as shown in FIG. 43 (a), a plurality of LED elements 83 may be mounted on the base 81, and the range of the first region of the ceramic member 85 may be the same as the opening of the base 81. As shown in FIG. 43B and FIG. 43C, the range of the first region of the ceramic member 85 may be limited to the portion corresponding to the LED element 83. Here, the portion corresponding to the LED element 83 is the lower limit of the region corresponding to the light emitting surface of the LED element 83 when viewed from the light irradiation direction, and the length of the ceramic member is equal to the thickness of the ceramic member. It shall mean the range where the upper limit is the area obtained by extending the irradiation area in the outer edge direction. The light irradiation region is a region where light from the LED element 83 is incident on the surface of the ceramic member 85 facing the LED element 83. Further, as shown in FIG. 43 (b), the base 81 may be flat and the ceramic member 85 may be supported by a metal member 90 disposed on the base 81, or as shown in FIG. 43 (c). Alternatively, the base 81 may have a bottomed cylindrical shape, and the ceramic member 85 may be supported by the base 81. Further, an optical member 87 may be provided as shown in FIG. Examples of the optical member 87 may be formed on the front and back surfaces of the ceramic member 85 as shown in FIG. 44 in addition to those shown in FIG. Further, both surfaces of the ceramic member may be flat as shown in FIG. 45 (a), only one surface of the ceramic member may be rough as shown in FIG. 45 (b), or FIG. As shown in (2), both surfaces of the ceramic member may be roughened. Further, as shown in FIGS. 45D and 45E, the first region of the ceramic member may be expanded or contracted in the thickness direction of the ceramic member.

  An application example of the LED light source according to the embodiment of the present invention is a display device such as an electric bulletin board as shown in an exploded perspective view of FIG. The display device 91 includes a substrate 92 on which a plurality of LED light sources 10 are two-dimensionally disposed, a reflector 93 that is disposed on the substrate 92 and has an opening 93 a at a position corresponding to the LED light source 10, and is disposed on the reflector 93. And a lens plate 94 having a lens 94a for condensing light in a desired direction at a position corresponding to the opening 93a, a front panel disposed on the front surface of the substrate, a housing supporting the substrate and the front panel, and the like.

As mentioned above, although the plate-shaped ceramic member and LED light source which concern on this invention were demonstrated based on embodiment, this invention is not limited to these embodiment. For example, the following modifications can be considered.
(1) In Embodiment 1, the plate-shaped ceramic member is partitioned into rectangular parallelepiped blocks, but is not necessarily limited to a rectangular parallelepiped shape. For example, a rhomboid shape whose cross section is a parallelogram may be used. The block having the rhomboid shape can be realized by cutting the upper surface of the sheet laminate in an oblique direction in the step of cutting the sheet laminate.
(2) In the embodiment, a phosphor is used as a wavelength conversion material, but in addition to a general phosphor, a light that absorbs and absorbs light of a certain wavelength, such as a semiconductor, a metal complex, an organic dye, or a pigment Can be used in the present invention without particular limitation as long as the material contains substances that emit light of different wavelengths.
(3) Although LED elements are used as semiconductor light emitting elements in the embodiments, the present invention is not limited to this. For example, a light emitting transistor or a semiconductor laser can be used.
(4) In the embodiment, white light is obtained by a combination of a blue light emitting diode and a yellow phosphor. However, the present invention is not limited to this, and each phosphor that emits an ultraviolet light emitting diode and three primary colors (red, green, and blue). It is good also as a combination.
(5) In Embodiment 1, the plate-like ceramic member is divided into a plurality of blocks having the same dimensions, but the present invention is not limited to this. By appropriately adjusting the film thickness of the slurry thin film in the sheet forming step of the unfired sheet, unfired sheets having different thicknesses can be formed. By using unfired sheets having different thicknesses formed in this way, plate-like ceramic members partitioned into blocks having different dimensions can be realized.

  The present invention is applicable to, for example, a white light source using LEDs.

Sectional drawing which shows typically the structure of the LED light source which concerns on Embodiment 1 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The figure which shows the flow of the manufacturing method of the plate-shaped ceramic member which concerns on Embodiment 1 of this invention. The figure which shows typically the mode of a sheet forming process (step S12, S14) The figure which shows typically the mode of a lamination process (step S15) The figure which shows typically the mode of a laminated body cutting process (step S16). The figure which shows typically the mode of a laminated body cutting process (step S16). The figure which shows typically the mode of a lamination process (step S15) The figure which shows typically the mode of a laminated body cutting process (step S16). Sectional view schematically showing the configuration of the verification system Sectional view schematically showing the configuration of the verification system The figure for explaining the verification result of the heat dissipation characteristic of the plate and the composition of the sample The figure for explaining the result of verifying the emission color unevenness of the plate surface and the configuration of the sample Diagram for explaining the results of the color variation between samples Sectional drawing which shows typically the structure of the LED light source which concerns on Embodiment 2 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 2 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 2 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 2 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 2 of this invention. The perspective view which shows typically the structure of the plate-shaped ceramic member which concerns on Embodiment 2 of this invention. The figure which shows the flow of the manufacturing method of the plate-shaped ceramic member which concerns on Embodiment 2 of this invention. The figure which shows typically the mode of a stick formation process (step S33) The figure which shows typically the mode of a stick formation process (step S33) The figure which shows typically the mode of a stick cutting process (step S34). The figure which shows the flow of the manufacturing method of the plate-shaped ceramic member which concerns on Embodiment 2 of this invention. The figure which shows typically the mode of the process after a printing process (step S54). Sectional view schematically showing the configuration of the verification system The figure for explaining the verification result of the heat dissipation characteristic of the plate and the composition of the sample Diagram showing the relationship between phosphor temperature and emission peak height Sectional drawing which shows typically the modification of the LED light source which concerns on Embodiment 1 of this invention. The figure which illustrates the structure of the optical member 67 The figure which shows the modification of the plate-shaped ceramic member which concerns on Embodiment 2 of this invention. Sectional drawing which shows typically the modification of the LED light source which concerns on Embodiment 2 of this invention. Sectional drawing which shows typically the modification of the LED light source which concerns on Embodiment 2 of this invention. The figure which illustrates the structure of the optical member 87 Sectional drawing which shows the modification of the plate-shaped ceramic member which concerns on Embodiment 2 of this invention The disassembled perspective view of the principal part of the display apparatus which concerns on embodiment of this invention

Explanation of symbols

10, 60, 80 LED light source 11, 61, 81 Package base 12, 62, 82 Wiring pattern 13, 63, 83 LED element 14, 64, 84 Translucent material 15, 65, 85 Plate-shaped ceramic member 15a, 15b, 15c, 15d Block 15e, 15f, 15g, 15h Block 15i, 15j, 15k, 15l Block 15m, 81m, 83m, 85m Metal layer 21 Die coater 22 Drying equipment 23 Support plate 24 Foam sheet 25 Precision cutting machine 26 Extrusion molding Machine 27 Printing plate 28 Squeegee 29 Grinder 30 Dicing saw 31 Slurry thin film 32, 34, 36, 43, 45, 47 Base film 33, 35, 37, 40, 42, 44, 46, 49, 75 Unfired sheet 36, 48 Sheet laminate 38, 41 Unfired Synthetic ceramic structure 61 Base 66 Wire 67 Optical member 71, 72 Billet 73 Rod-shaped green molded body 74 Plate-shaped green molded body 76 Slurry 90 Metal member 91 Display device 92 Substrate 93 Reflector 94 Lens plate

Claims (31)

A ceramic member for a semiconductor light emitting device for converting the wavelength of light emitted from a semiconductor light emitting element,
It is composed of two or more types of ceramic materials and is divided into a plurality of blocks, each block consisting of one type of ceramic material selected from the two or more types of ceramic materials,
The ceramic member for a semiconductor light emitting device, wherein at least one ceramic material of the two or more ceramic materials contains a wavelength conversion material that converts a wavelength of light. The ceramic member for a semiconductor light emitting device is partitioned so that two or more blocks are arranged in at least one direction among three directions of width, depth, and thickness,
The ceramic material constituting each block is selected so that adjacent blocks are made of different ceramic materials in at least one of the directions in which two or more blocks are arranged. The ceramic member for a semiconductor light-emitting device according to claim 1. The ceramic material constituting each block is selected so that the two or more types of ceramic materials repeatedly appear in at least one of the directions in which two or more blocks are arranged. The ceramic member for a semiconductor light-emitting device according to claim 2. The ceramic member for a semiconductor light emitting device is partitioned so that two or more arrangement layers in which two or more blocks are arranged in the width and depth directions are laminated in the thickness direction,
The ceramic member for a semiconductor light-emitting device according to claim 1, wherein the ceramic material constituting each block is selected so that adjacent blocks are made of different ceramic materials in any direction. The ceramic member for a semiconductor light emitting device is partitioned so that one or more blocks are arranged in the thickness direction in the width and depth directions.
The ceramic member for a semiconductor light-emitting device according to claim 1, wherein the ceramic material constituting each block is selected so that adjacent blocks are made of different ceramic materials in any direction. The ceramic member for a semiconductor light emitting device is partitioned so that two or more arrangement layers in which one block is arranged in the depth direction in the width direction are laminated in two or more layers in the thickness direction,
The ceramic member for a semiconductor light-emitting device according to claim 1, wherein the ceramic material constituting each block is selected so that adjacent blocks are made of different ceramic materials in any direction. The ceramic member for a semiconductor light emitting device is partitioned so that one or more blocks are arranged in the depth and thickness directions in the width direction.
The ceramic material for a semiconductor light-emitting device according to claim 1, wherein the ceramic material constituting each block is selected such that adjacent blocks are made of different ceramic materials. The ceramic member for a semiconductor light emitting device includes a first arrangement layer in which one or more blocks are arranged in the depth direction in the width direction and a second arrangement layer in which two or more blocks are arranged in the width direction and one block in the depth direction. Are divided so that two or more layers are alternately laminated in the thickness direction,
The ceramic material constituting each block in the first arrangement layer is selected so that adjacent blocks are made of different ceramic materials in the width direction,
2. The semiconductor light emitting device according to claim 1, wherein the ceramic material constituting each block in the second arrangement layer is selected such that adjacent blocks are made of different ceramic materials in the depth direction. Ceramic member. The ceramic member for a semiconductor light-emitting device according to claim 1, wherein a length of at least one side of the block is 5 µm or more and 100 µm or less. The ceramic member for a semiconductor light-emitting device is partitioned so that one or more blocks are arranged in the width direction and the depth direction in the thickness direction.
The ceramic material for a semiconductor light-emitting device according to claim 1, wherein the ceramic material constituting each block is selected such that adjacent blocks are made of different ceramic materials. The ceramic member for a semiconductor light-emitting device is partitioned so that one or two or more blocks include other one or two or more blocks,
The ceramic material for a semiconductor light-emitting device according to claim 1, wherein the ceramic material constituting each block is selected such that adjacent blocks are made of different ceramic materials. The two or more types of ceramic materials include a first ceramic material containing a wavelength conversion material and a second ceramic material not containing a wavelength conversion material,
2. The ceramic member for a semiconductor light emitting device according to claim 1, wherein the thermal conductivity of the second ceramic material is higher than the thermal conductivity of the first ceramic material. The two or more types of ceramic materials include first and second ceramic materials containing a wavelength conversion material,
The emission peak wavelength of the wavelength conversion material contained in the first ceramic material is different from the emission peak wavelength of the wavelength conversion material contained in the second ceramic material. Ceramic member for semiconductor light emitting device. The ceramic member for a semiconductor light-emitting device has a first region including one or more blocks, and a second region including one or more blocks and surrounding the first region,
Each of the blocks included in the first region contains a wavelength conversion material,
Any of the blocks included in the second region contains the wavelength conversion material at a content rate lower than the content rate of the wavelength conversion material in the first region, or none contains the wavelength conversion material. The ceramic member for semiconductor light-emitting devices according to claim 1. The ceramic member for a semiconductor light-emitting device according to claim 14, wherein all of the blocks included in the second region are made of a translucent material. The ceramic member for a semiconductor light-emitting device according to claim 14, wherein the ceramic member for a semiconductor light-emitting device generates heat only in the first region when light having a specific wavelength is incident thereon. A method for producing a ceramic member for a semiconductor light-emitting device composed of two or more ceramic materials including at least one ceramic material containing a wavelength conversion material for converting the wavelength of light,
A first step of preparing an unsintered sheet of ceramic material for each of the two or more types of ceramic material;
A second step of laminating unfired sheets of two or more types of ceramic materials prepared in the first step to form a sheet laminate;
The sheet laminate obtained in the second step is sliced vertically or obliquely with respect to the upper surface of the sheet laminate, and the blocks made of various types of ceramic materials are arranged in the order in which they are laminated in the second step. A third step of forming an unfired sheet,
A fourth step of forming an unfired ceramic structure corresponding to the structure of the target ceramic member using the unfired sheet obtained in the third step;
And a fifth step of firing the unsintered ceramic structure obtained in the fourth step. A method for producing a ceramic member for a semiconductor light-emitting device. In the fourth step, the unfired sheet obtained in the third step is laminated so that adjacent blocks are made of different ceramic materials to form a sheet laminate, and the obtained sheet laminate is The method for producing a ceramic member for a semiconductor light-emitting device according to claim 17, wherein the ceramic member is a fired ceramic structure. The fourth step includes
A first sub-process in which the unfired sheet obtained in the third step is laminated so that adjacent blocks are made of different ceramic materials to form a sheet laminate;
The sheet laminate obtained in the first sub-process is sliced in the sheet laminate perpendicularly or obliquely to the upper surface of the sheet laminate, and the blocks made of various types of ceramic materials are in the first direction. A second sub-process for forming unfired sheets arranged in the order of stacking in the second process and arranged in the order of stacking in the first sub-process in the second direction;
The unfired sheets obtained in the two sub-processes are laminated so that adjacent blocks are made of different ceramic materials to form a sheet laminate, and the obtained sheet laminate is used as the unfired ceramic structure. The method for manufacturing a ceramic member for a semiconductor light-emitting device according to claim 17, further comprising a third sub-step. The method for producing a ceramic member for a semiconductor light-emitting device according to claim 17, wherein a thickness of the unfired sheet prepared in the first step is not less than 5 µm and not more than 1 mm. A method for producing a ceramic member for a semiconductor light-emitting device composed of two or more ceramic materials including at least one ceramic material containing a wavelength conversion material for converting the wavelength of light,
A first step of producing each billet of two ceramic materials selected from the two or more types of ceramic materials;
A second step of forming a rod-shaped green molded body composed of the two billets using one billet of the two billets obtained in the first step as a core material and the other billet as a covering material. When,
A third step of slicing the rod-shaped green molded body obtained in the second step perpendicular to the longitudinal direction to form a plate-shaped green molded body composed of the two billets;
A fourth step of forming an unfired ceramic structure corresponding to the structure of the target ceramic member using the plate-like unfired molded body obtained in the third step;
And a fifth step of firing the unsintered ceramic structure obtained in the fourth step. A method for producing a ceramic member for a semiconductor light-emitting device. In the second step, the two billets are formed into a rod shape using an extrusion molding machine, and then the molded body formed into a rod shape is dried using a drying facility, whereby the rod-shaped unfired molded body is formed. The method for producing a ceramic member for a semiconductor light-emitting device according to claim 21, wherein: In the second step, a solid core material is formed from one billet of the two billets, and the other billet of the two billets is formed on the solid core material using an extrusion molding machine. The semiconductor light-emitting device according to claim 21, wherein the rod-shaped green body is obtained by coating and forming into a rod shape, and then drying the rod-shaped molded body using a drying facility. Manufacturing method of ceramic member for apparatus. The method for manufacturing a ceramic member for a semiconductor light-emitting device according to claim 21, further comprising a sixth step of polishing one or both surfaces of the ceramic structure obtained in the fifth step using a grinder. . A semiconductor light emitting device mounted on a base;
A semiconductor light emitting device comprising: the ceramic member according to claim 1 disposed in a light irradiation direction of the semiconductor light emitting element. A base, a semiconductor light emitting element mounted on the base, and the ceramic member according to claim 14,
The ceramic member is arranged such that the first region is arranged in the light irradiation direction of the semiconductor light emitting element and the second region is joined to the base. apparatus. The ceramic member has a plate shape and is disposed opposite to the light emitting surface of the semiconductor light emitting element,
When the ceramic member is viewed from the light irradiation direction of the semiconductor light emitting element, the first region of the ceramic member has a lower limit of the region corresponding to the light emitting surface of the semiconductor light emitting element and a length corresponding to the thickness of the ceramic member. 27. The semiconductor light emitting device according to claim 26, wherein the semiconductor light emitting device occupies a region within an upper limit of a region obtained by extending the light irradiation region of the ceramic member in the outer edge direction. The base has a bottomed cylindrical shape, the semiconductor light emitting element is mounted on the bottom of the base, and the ceramic member has a plate-like shape. Is arranged so as to block the opening of
When the ceramic member is viewed from the light irradiation direction of the semiconductor light emitting element, the first region of the ceramic member has a lower limit of a region corresponding to the opening of the base and a length corresponding to the thickness of the ceramic member. 27. The semiconductor light emitting device according to claim 26, wherein the semiconductor light emitting device occupies a region within an upper limit of a region corresponding to an opening portion of the base that extends in the outer edge direction. 27. The semiconductor light emitting device according to claim 26, wherein the second region of the ceramic member is joined to the base by a metal material. 27. The semiconductor light-emitting device according to claim 25, further comprising an optical member provided on a surface of the ceramic member.   27. A display device comprising the semiconductor light emitting device according to claim 25 or claim 26.

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