JPS63222030A - Production of quartz part by hot press bonding - Google Patents

Abstract

PURPOSE:To enable bonding of quartz parts at a relatively low temperature and to improve the yield of quartz part free from residual bubbles and having high quality, by applying a proper pressure in the hot bonding of quartz. CONSTITUTION:In the production of a quartz part by hot-press bonding, the bonding is carried out while applying a pressure of 1.5-200kg/cm<2> to the face to be bonded.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a method for manufacturing quartz parts, such as a quartz analysis cell, by assembling and joining quartz parts to form them.

[Summary of the invention]

We focused on the fact that applying appropriate pressure during bonding promotes the fusion and integration of the bond at lower temperatures, and also improves bonding defects such as bubbles and insufficient fusion on the bonding surface. Pressure conditions were set.

[Conventional technology]

The conventional method for joining quartz parts is to hold the assembly together with forceps, or to secure it with a wire with a high melting temperature such as W (tungsten) wire, and then heat it with an oxygen-hydrogen flame or by inserting it into an electric furnace. It was then fused and bonded.

[Problem that the invention seeks to solve]

Sufficient pressure cannot be obtained with the conventional method of pressing with Vincent, and even if the wire is tied with the same W (tungsten) wire and inserted into the electric furnace, the furnace will not work even if it is tied and pressurized at room temperature. At the initial stage of heating inside, the W wire heats up first, expands and loosens, and the pressurizing effect is lost.

If you try to join the surfaces to be joined with insufficient flatness and no close contact, the softening temperature (approximately 1450
℃), and must be heated to a temperature close to or higher than the flow temperature (approximately 1750°C) for sufficient fusion and integration.

In this case, insufficient bonding force and residual air bubbles occur, resulting in poor bonding and bonding defects.

Moreover, when the heating temperature becomes transient, flow deformation occurs due to its own weight, causing product defects.

[Means for solving problems]

If the position is held with a pin, then the material is held in place using a clamp that uses spring pressure to crimp it under appropriate pressure conditions, or if the material is crimped with a weight and heat bonded, the bond will be fused at a relatively low heating temperature. .

Also, when inserting the wire into an electric furnace to heat it, do not secure it with W (tungsten) wire, but wrap the W wire around it and suspend weights at both ends to prevent the W wire from expanding. Also, make sure that a constant pressure is always applied.

If heated in this state, fusion will occur at a relatively low heating temperature.

However, in this case, as the temperature of the W (tungsten) wire increases by 1, the tensile strength decreases and the wire diameter is stretched and becomes thinner.
Eventually, the wire will break, so it is necessary to use a wire diameter that is thicker than the wire diameter used simply for lashing in the past.

[Operation] Quartz is originally composed of almost pure arsenic oxide (SiO□), and unlike multi-element constituent materials such as glass, it has the property of partially fusing together even at room temperature when cleaned quartz is rubbed together. shows.

Therefore, fusion of the crimped surfaces is promoted.

〔Example〕

The test pieces used in the experiment were 20m x 2ou x 4m thick plate materials polished to an almost perfect mirror surface, as well as U-shaped materials, but the values were calculated per unit area of the joint surface. The pressure was adjusted.

Those with good flatness and high specularity of the joining surface will be fused and integrated at a lower temperature even if the pressing force is small, while those with rough surface roughness and irregularities will require a large pressing force.

In the evaluation of the results of each example in Table 1, a product in which the entire joint surface was fused and no bubbles remained was considered a good product, and the pressurizing force and heating temperature at that time are indicated by a circle.

Items marked with Δ in the table indicate slight deformation.

The x mark indicates poor bonding and large deformation.

Table 1 List of pressure and heat bonding effects From the results of the examples 1. At 0 kg/cra, there is not much effect, but at 1.5 kg/- or more, it shows a remarkable effect, and at 200
If the pressure exceeds 250 kg/c+a, the deformation becomes severe, so the pressing force was limited to 200 kg/ffl.

When the surface of the test piece was changed from a mirror surface to a slightly rough surface, it was necessary to set the temperature approximately 100° C. higher to obtain the same bonding result.

When the heating temperature was not raised, the same effect was obtained even if the pressing force was approximately doubled.

However, the experiment in the example was conducted in an electric furnace for 30 minutes to ensure temperature accuracy.
Heating was performed for 0 minutes.

〔Effect of the invention〕

In thermal bonding of quartz, it is possible to bond at a relatively low temperature by applying appropriate pressure, and there are no residual bubbles, resulting in a high quality product rate, which greatly contributes to industrially safe and stable production. It is.

that's all

Claims (1)

[Claims] 1.5kg/cm^2 to 20 to the surface to be joined
A method for manufacturing quartz parts by pressurized and heated bonding, characterized by bonding while applying pressure in the range of 0 kg/cm^2.