JPH09142948A - Method for joining ceramic structure - Google Patents
Method for joining ceramic structureInfo
- Publication number
- JPH09142948A JPH09142948A JP32520295A JP32520295A JPH09142948A JP H09142948 A JPH09142948 A JP H09142948A JP 32520295 A JP32520295 A JP 32520295A JP 32520295 A JP32520295 A JP 32520295A JP H09142948 A JPH09142948 A JP H09142948A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- ceramic structure
- joined
- heating
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明法はセラミックス構造
体の接合方法に関し、更に詳しくはアルミニウム材を介
して簡易な手法でセラミックス構造体を接合させる事に
特徴を有するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining ceramic structures, and more specifically, it is characterized by joining ceramic structures through an aluminum material by a simple method.
【0002】[0002]
【従来の技術】従来、セラミックス構造体としてのセラ
ミックス部材同士の結合や、セラミックス部材に他の形
態の材質を接合させる場合には、各種ろう材を介して接
合していた。例えば特開昭58−74544号公報「接
合構体とその製造方法」においては、1対の被接合部材
を表面がガラスで被覆された金属ろう材を介して重合し
て加熱することにより金属のほかガラスやセラミックス
をも接合できることを開示している。2. Description of the Related Art Conventionally, when joining ceramic members as a ceramic structure or joining other forms of material to the ceramic members, various brazing materials have been used for joining. For example, in Japanese Unexamined Patent Publication No. 58-74544, "Joining Structure and Manufacturing Method Thereof", a pair of members to be joined are polymerized and heated through a metal brazing material whose surface is covered with glass to heat a metal other than the metal. It discloses that glass and ceramics can also be joined.
【0003】更に、特開昭61−286059号公報
「アルミニウム合金とアルミナセラミックスとの接合方
法」においては、アルミナセラミックス上にMo等の金
属層を形成し、その上にAl金属層単層を形成した後ブ
レージング処理を行なって一体化する方法が開示されて
いる。Further, in JP-A-61-286059, "Method of Joining Aluminum Alloy and Alumina Ceramics", a metal layer such as Mo is formed on alumina ceramics, and an Al metal layer single layer is formed thereon. After that, a method of performing a brazing process to integrate them is disclosed.
【0004】[0004]
【発明が解決しようとする課題】上述のように従来の金
属ろう材は単一組成だけでは接合強度が弱いため、これ
ら金属の周囲をガラス質で覆ったり、他の金属層の作用
と合わせたりして接合強度を高めることに工夫を凝らし
ていた。従ってコスト高となる欠点があった。As described above, since the conventional metal brazing material has a weak bonding strength with only a single composition, it is necessary to cover the periphery of these metals with glass or to combine them with the action of other metal layers. I tried to improve the bonding strength. Therefore, there is a drawback that the cost becomes high.
【0005】本発明の目的は、単一の金属材を特定条件
下で加圧接合することによって二種類の構造体を接合し
得る新規な接合方法を提供するにある。An object of the present invention is to provide a novel joining method capable of joining two kinds of structures by pressure joining a single metal material under specific conditions.
【0006】[0006]
【課題を解決するための手段】本発明者等は斯かる課題
を解決するために鋭意研究したところ、アルミニウム材
の溶解域を利用することによって簡易な手法で接合が可
能であることを見出し本発明方法を提供することができ
た。Means for Solving the Problems The inventors of the present invention have conducted diligent research to solve such problems, and found that the use of the melting region of an aluminum material enables a simple method for bonding. Inventive methods could be provided.
【0007】即ち、本発明は複数のセラミックス構造体
の接合すべき面を660℃以上に加熱せしめる第一工程
と、次いで加熱された一方のセラミックス構造体の接触
すべき面にアルミニウム材を接触させた後、他のセラミ
ックス構造体を載置させて加熱接合する第二工程とから
成ることを特徴とするセラミックス構造体の接合方法で
ある。また、本発明は、セラミックス構造体の接合すべ
き面を660℃以上に加熱せしめる第一工程と、次いで
加熱された接合すべき面にアルミニウム材を接触させ
て、該アルミニウム材の接触面を一部溶解すると共に、
さらに該アルミニウム材表面を一部溶解した後、この面
に他のセラミックス構造体を接触させて加圧接合させる
第二工程とから成ることを特徴とするセラミックス構造
体の接合方法であり、この場合、上記加圧接合は2g/
mm2 以上の圧力をかけて行なうのが好ましい。That is, according to the present invention, the first step of heating the surfaces to be joined of the plurality of ceramic structures to 660 ° C. or higher, and then the aluminum material is brought into contact with the surfaces of the one heated ceramic structure to contact. After that, a second step of mounting another ceramic structure and then heating and bonding the ceramic structure is performed. The present invention also provides a first step of heating the surfaces of the ceramic structure to be joined to 660 ° C. or higher, and then contacting the heated surfaces to be joined with an aluminum material so that the contact surface of the aluminum material is As the part dissolves,
And a second step in which the surface of the aluminum material is partially melted, and then another ceramic structure is brought into contact with this surface to perform pressure bonding. , The pressure bonding is 2 g /
It is preferable to apply a pressure of mm 2 or more.
【0008】[0008]
【発明の実施の形態】本発明において使用するセラミッ
クス構造体としては、アルミナ製円柱材や、AlN製角
柱材等どんな形状の構造体でもよいが、構造体の接着面
を660℃以上に加熱することから、この温度以上に耐
える素材であれば上記以外の構造体でも構わない。BEST MODE FOR CARRYING OUT THE INVENTION The ceramic structure used in the present invention may be a structure of any shape such as an alumina columnar material or an AlN prismatic material, but the bonding surface of the structure is heated to 660 ° C. or higher. Therefore, a structure other than the above may be used as long as the material can withstand the temperature or higher.
【0009】上記構造体表面を660℃以上の温度に加
熱するのは、接合する金属板としてのアルミニウム材の
接触面を溶解させるためであり、これはアルミニウムの
融点が660℃であることによる(第一工程)。The surface of the structure is heated to a temperature of 660 ° C. or higher in order to melt the contact surface of the aluminum material as the metal plate to be joined, which is because the melting point of aluminum is 660 ° C. ( First step).
【0010】加熱されたセラミックス構造体へのアルミ
ニウム材の接触は、セラミックス構造体が加熱炉から出
たら直ぐに行なうが、これはセラミックス構造体表面の
温度の低下を防止しながら接触させるためである。The aluminum material is brought into contact with the heated ceramics structure immediately after the ceramics structure comes out of the heating furnace, for the purpose of preventing the temperature of the surface of the ceramics structure from decreasing.
【0011】次いで、該セラミックス構造体表面にアル
ミニウム板を接触させたまま、再び加熱炉に装入して6
80℃でアルミニウム板の表面を一部溶解させる。Then, while keeping the aluminum plate in contact with the surface of the ceramic structure, the ceramic structure was charged again into the heating furnace and 6
Part of the surface of the aluminum plate is melted at 80 ° C.
【0012】この温度制御は660℃〜700℃の範囲
が好ましい。これは660℃以下では、アルミニウム板
が融解せず700℃以上にすると融解速度が進み、後の
加圧接合操作が難しくなることによる。This temperature control is preferably in the range of 660 ° C to 700 ° C. This is because the aluminum plate does not melt at 660 ° C. or lower and the melting rate progresses at 700 ° C. or higher, which makes the subsequent pressure bonding operation difficult.
【0013】次いで、もう一方の被セラミックス構造体
を、上記アルミニウム板表面に接触させて、2g/mm
2 以上の加圧をかけて接合するが、この場合、溶解した
アルミニウムは空気酸化により酸化膜を発生するため、
圧力をかけてこの酸化膜を破って純アルミニウムの部分
で接触させるようにする(第二工程)。Next, the other ceramic structure is brought into contact with the surface of the aluminum plate, and 2 g / mm
Two or more pressures are applied to bond, but in this case, the molten aluminum forms an oxide film by air oxidation, so
A pressure is applied to break the oxide film so that the pure aluminum portion comes into contact with the oxide film (second step).
【0014】また、他の実施例においては複数の被セラ
ミックス構造体を660℃以上に加熱した後、アルミニ
ウム板を介在し、加圧接合することによっても、上記同
様に接合体を得ることができる。この場合、構造体接合
に要する圧力は、通常のプレスにて2g/mm2 以上の
加圧でよいが、好ましい接合体を得るために本実施例で
は10g/mm2 の圧力をかけた。In another embodiment, a joined body can be obtained in the same manner as described above by heating a plurality of ceramic structures to 660 ° C. or more and then performing pressure joining with an aluminum plate interposed. . In this case, the pressure required for joining the structures may be 2 g / mm 2 or more with a normal press, but in this example, a pressure of 10 g / mm 2 was applied in order to obtain a preferable joined body.
【0015】この他、上記セラミックス構造体表面を6
60℃以上に加熱する手段としては、上記のように加熱
炉を用いる他、固定したセラミックス構造体表面を移動
可能なバーナー等を用いて加熱することによっても接合
可能である。In addition, the surface of the ceramic structure is
As a means for heating to 60 ° C. or higher, in addition to using the heating furnace as described above, heating can also be performed by using a movable burner or the like on the surface of the fixed ceramic structure.
【0016】[0016]
【実施例】以下、実施例を参照して本発明方法を詳細に
説明するが、本発明方法の範囲はこれらに限定されるも
のではない。EXAMPLES The method of the present invention will be described in detail below with reference to examples, but the scope of the method of the present invention is not limited to these.
【0017】(実施例1)被セラミックス構造体として
直径50mmのAlN製円柱体構造体1(直径50mm
×長さ100mm)を型枠に保持して加熱炉中にて85
0℃の一定温度に30分間保持したものに、30mm×
40mm×厚さ1mmのアルミニウム板2を接触させ
た。(Embodiment 1) A cylindrical structure 1 made of AlN having a diameter of 50 mm (diameter 50 mm)
× length 100 mm) is held in the mold and 85 in a heating furnace
30mm x 30mm x 30mm at a constant temperature of 0 ℃
The aluminum plate 2 having a size of 40 mm and a thickness of 1 mm was brought into contact.
【0018】次いで、再びAlN製円柱体構造体1を型
枠に保持したまま加熱炉を3分程で通過させ、アルミニ
ウム板表面を溶解した後、炉外にてもう一方の被セラミ
ックス構造体であるアルミナ製円柱体構造体3(直径5
0mm×長さ30mm)を接触させ、通常のプレスにて
10g/mm2 の圧力をかけてアルミニウム材表面の酸
化膜を破り、両セラミックス構造体1,3を接合した。Next, the AlN columnar body structure 1 is again passed through the heating furnace for about 3 minutes while being held in the mold to melt the surface of the aluminum plate, and then outside the furnace, the other ceramic structure body is used. A certain alumina columnar structure 3 (diameter 5
(0 mm × 30 mm in length) was contacted, a pressure of 10 g / mm 2 was applied by a normal press to break the oxide film on the surface of the aluminum material, and both ceramic structures 1 and 3 were bonded.
【0019】(実施例2)図2に示すように、被セラミ
ックス構造体として70mm角のアルミナ製角形体構造
体4と、直径40mm×長さ60mmのアルミナ製円柱
体構造体3とを夫々型枠(図示せず)に保持して加熱炉
中にて850℃の一定温度で30分間保持した(第一工
程)。(Embodiment 2) As shown in FIG. 2, a 70 mm square prismatic structure 4 made of alumina and a cylindrical structure 3 made of alumina having a diameter of 40 mm and a length of 60 mm are respectively formed as ceramic structures. It was held in a frame (not shown) and held in a heating furnace at a constant temperature of 850 ° C. for 30 minutes (first step).
【0020】次いで、加熱されたアルミナ製角形体構造
体4の一面に60×60×厚さ40mmのアルミニウム
板2を接触させた後、図3に示すように直ぐにアルミナ
製円柱体構造体3を上記アルミニウム板表面に載置し、
10g/mm2 の圧力をかけて加熱接合させた(第二工
程)。Next, after the aluminum plate 2 of 60 × 60 × 40 mm in thickness is brought into contact with one surface of the heated alumina prismatic structure 4, the alumina cylindrical structure 3 is immediately attached as shown in FIG. Placed on the surface of the aluminum plate,
A pressure of 10 g / mm 2 was applied to bond by heating (second step).
【0021】この圧力により、アルミニウム板の純粋部
分が溶解して上記セラミックス構造体同士を接合でき
た。By this pressure, the pure parts of the aluminum plates were melted and the above ceramic structures could be joined together.
【0022】[0022]
【発明の効果】本発明は上述のように簡易な手法による
接合方法であるが、接合後の強度も従来のろう材を用い
た場合と同等であり、従来方法に比較すると生産コスト
ダウンに大幅に寄与し得る効果を有している。As described above, the present invention is a joining method by a simple method as described above, but the strength after joining is equivalent to the case of using a conventional brazing filler metal, and the production cost is significantly reduced as compared with the conventional method. Has an effect that can contribute to.
【図1】本発明の一実施例を示す概略図である。FIG. 1 is a schematic diagram showing one embodiment of the present invention.
【図2】本発明方法の説明図である。FIG. 2 is an explanatory view of the method of the present invention.
【図3】本発明方法の説明図である。FIG. 3 is an explanatory view of the method of the present invention.
1 AlN製円柱体構造体 2 アルミニウム板 3 アルミナ製円柱体構造体 4 アルミナ製角形体構造体 DESCRIPTION OF SYMBOLS 1 AlN cylindrical structure 2 Aluminum plate 3 Alumina cylindrical structure 4 Alumina prismatic structure
Claims (3)
面を660℃以上に加熱せしめる第一工程と、次いで加
熱された一方のセラミックス構造体の接触すべき面にア
ルミニウム材を接触させた後、他のセラミックス構造体
を載置させて加熱接合する第二工程とから成ることを特
徴とするセラミックス構造体の接合方法。1. A first step of heating the surfaces to be joined of a plurality of ceramic structures to 660 ° C. or higher, and then contacting an aluminum material with the surfaces to be contacted of one of the heated ceramic structures, And a second step of mounting another ceramic structure and heat-bonding the ceramic structure.
60℃以上に加熱せしめる第一工程と、次いで加熱され
た接合すべき面にアルミニウム材を接触させて、該アル
ミニウム材の接触面を一部溶解すると共に、さらに該ア
ルミニウム材表面を一部溶解した後、この面に他のセラ
ミックス構造体を接触させて加圧接合させる第二工程と
から成ることを特徴とするセラミックス構造体の接合方
法。2. The surface to be joined of the ceramic structure is 6
The first step of heating to 60 ° C. or higher, and then contacting the heated surfaces to be joined with an aluminum material to partially melt the contact surface of the aluminum material and further partially melt the surface of the aluminum material. Then, a second step of bringing another ceramic structure into contact with this surface to perform pressure bonding, and a method for bonding a ceramic structure.
をかけることを特徴とする請求項1および2記載のセラ
ミックス構造体の接合方法。3. The method for joining a ceramic structure according to claim 1, wherein the pressure joining is performed by applying a pressure of 2 g / mm 2 or more.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32520295A JP3687161B2 (en) | 1995-11-21 | 1995-11-21 | Joining method of ceramic structures |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32520295A JP3687161B2 (en) | 1995-11-21 | 1995-11-21 | Joining method of ceramic structures |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09142948A true JPH09142948A (en) | 1997-06-03 |
JP3687161B2 JP3687161B2 (en) | 2005-08-24 |
Family
ID=18174168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32520295A Expired - Fee Related JP3687161B2 (en) | 1995-11-21 | 1995-11-21 | Joining method of ceramic structures |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3687161B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009206200A (en) * | 2008-02-26 | 2009-09-10 | Kyocera Corp | Substrate for mounting light emitting element, light emitting element package, and method of bonding ceramic and aluminum |
WO2012029816A1 (en) | 2010-08-31 | 2012-03-08 | 美濃窯業株式会社 | Boron carbide-containing ceramic bonded body and method for producing the bonded body |
US9789671B2 (en) | 2012-02-28 | 2017-10-17 | Mino Ceramic Co., Ltd. | Shock absorbing member |
KR101875717B1 (en) * | 2016-07-26 | 2018-07-09 | 에스티이엠 주식회사 | Diamond saw blade welding method and welding apparatus thereof |
JP2020512691A (en) * | 2017-03-21 | 2020-04-23 | コンポーネント リ−エンジニアリング カンパニー インコーポレイテッド | Ceramic material assembly for use in highly corrosive or erosive semiconductor processing applications |
-
1995
- 1995-11-21 JP JP32520295A patent/JP3687161B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009206200A (en) * | 2008-02-26 | 2009-09-10 | Kyocera Corp | Substrate for mounting light emitting element, light emitting element package, and method of bonding ceramic and aluminum |
WO2012029816A1 (en) | 2010-08-31 | 2012-03-08 | 美濃窯業株式会社 | Boron carbide-containing ceramic bonded body and method for producing the bonded body |
US9211600B2 (en) | 2010-08-31 | 2015-12-15 | Mino Ceramic Co., Ltd. | Boron carbide-containing ceramic bonded body and method for producing the bonded body |
US9789671B2 (en) | 2012-02-28 | 2017-10-17 | Mino Ceramic Co., Ltd. | Shock absorbing member |
KR101875717B1 (en) * | 2016-07-26 | 2018-07-09 | 에스티이엠 주식회사 | Diamond saw blade welding method and welding apparatus thereof |
JP2020512691A (en) * | 2017-03-21 | 2020-04-23 | コンポーネント リ−エンジニアリング カンパニー インコーポレイテッド | Ceramic material assembly for use in highly corrosive or erosive semiconductor processing applications |
Also Published As
Publication number | Publication date |
---|---|
JP3687161B2 (en) | 2005-08-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0314795B2 (en) | ||
JPH0362670B2 (en) | ||
JPH03174370A (en) | Method for joining ceramics and metal | |
SU772471A3 (en) | Method of producing bimetals | |
US3235943A (en) | Method of making a flux free bonded article | |
JPH09142948A (en) | Method for joining ceramic structure | |
US3249408A (en) | Flux free bonded article | |
US3693243A (en) | Method and apparatus for cladding metals | |
JPS5944956B2 (en) | Low temperature adhesion method | |
JPH0230382B2 (en) | REIKYAKUITATSUKITAAGETSUTONOSEIZOHOHO | |
JPH06163612A (en) | Manufacture and equipment for semiconductor device | |
JP2000301355A (en) | Eutectic press-contacting method of same kind of metallic member and its eutoctic press-contacting device | |
JPH01154886A (en) | Manufacture of al clad steel plate | |
JPS61289964A (en) | Brazing method | |
JPS62183331A (en) | Joining method for filmy member | |
JPS6321589B2 (en) | ||
JPH01150419A (en) | Superplastic forming method for metallic foil | |
JPS62264407A (en) | Gap forming jig | |
JPH04198069A (en) | Bonding of combination body of ceramics and metal | |
JPS629554B2 (en) | ||
JPS58107288A (en) | Production of clad steel plate | |
JPS6045158B2 (en) | Method for manufacturing thin plate-like single crystal ferrite | |
JP2000323167A (en) | Manufacture and manufacturing device of sodium-sulfur battery | |
KR100259910B1 (en) | Fabrication method of alumina dispersed copper plate using cu-al sheets | |
JPH02187282A (en) | Manufacture of cladded plate at both surfaces |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040608 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040622 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040823 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20041019 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041220 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050510 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20050530 |
|
R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080617 Year of fee payment: 3 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080617 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080617 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090617 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100617 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100617 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110617 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110617 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120617 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120617 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130617 Year of fee payment: 8 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |