JPS63213399A - Method and structure for remodelling board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] A method for modifying a board and its structure, which eliminates the modification pad on the surface layer of the board by providing a modification pattern on the inner layer of the board, and allows the modification work to be carried out on the surface of the board. This eliminates the use of discrete wires, improves the mounting density of the board, improves the workability of modification work, improves the performance of the board, and enables automation of modification.

[Industrial application field]

The present invention relates to a board scheduled for modification and a method for modifying the same, and more specifically, to a modification structure and a modification method that make it possible to automate mounting of high-density multi-terminal elements on a board and modification work.

As the mounting density of printed circuit boards becomes higher, the integration of devices also becomes more highly integrated, and the number of bins of input/output terminals provided on the devices also tends to increase significantly.

As the multi-terminal element, various types such as pair chips and packages can be used. For example, in LSI packages, PGACPIN GRIDARRAY) type,
In other words, by using a type in which a large number of input/output terminals are arranged in a matrix on the bottom of the package, it is possible to provide a large number of input/output terminals within a small and limited pancage size due to high-density mounting of printed circuit boards. can.

By the way, in general, after forming the pattern wiring of a printed circuit board, especially a multilayer printed circuit board that has signal wiring inside, an error in the pattern wiring is discovered, or if there is a problem such as a short circuit due to a manufacturing defect in the printed circuit board. , the printed circuit board must be modified to change the circuit or repair the board, or the printed circuit board must be discarded.
Which one to choose depends on economic efficiency, but as mentioned above, as printed circuit boards become more densely packaged and elements become more highly integrated, the necessity and economic efficiency of modification increases.

Therefore, in order to improve the workability of modification work and expand the scope of application,
Generally, a board is modified using a modification structure that is provided in advance during the manufacture of the board.

It is desirable that this modification structure be able to accommodate modification of the circuit part including any terminal for all elements, so as the mounting density of the board increases and the number of input/output terminal pins increases. As a result, the number of structures for modification will increase and become more complex, and as a result, depending on the structure for modification and the method of modification, the manufacturing cost, packaging density, and modifyability of the board will be greatly affected.

In addition, in order to completely automate the manufacturing of boards or systems, it is necessary that the modification work of boards can also meet the demands for automation.

In summary, there is a need for a method and structure for modifying a board that enables high-density mounting of elements on a board, improved performance and modifyability, and automation.

[Conventional technology]

For example, as shown in Figure 12 (A) and Figure 12 (B), a conventional multi-terminal element mounting structure that is planned for modification of a stolen board is designed to take into consideration the possibility of modifying the element and board. The wiring pattern 5 is connected to the element terminal pad 3 via a large number of modification pads 71 provided on the surface layer 2 of the substrate 10.

In FIGS. 12(A) and 12(B), the element 6 mounted on the substrate 1 is of the PGA type with a large number of element terminals 7 arranged on the bottom of the package, and A large number of element terminal pads 3 are provided in an arrangement corresponding to the above arrangement of the element terminals 7.

On the surface N2 of the substrate 1, in positions outside the projection area of the element 6 and close to each element terminal pad 3, there are a large number of modification bars 71 and the substrate in one-to-one correspondence with the element terminal pads 3. An internal connection ■rA pad 73 is provided.

Each element terminal pad 3 and corresponding modification pad 71
and are connected by a modification pad lead-out pattern 70 wired on the inner layer 4 of the substrate 1.

Further, each modification pad 71 and the corresponding board internal connection VIA pad 73 are connected by a modification cant pattern 72 wired on the surface layer 2 of the board 1.

Reference numeral 74 denotes a board internal connection [VIA] that connects the board internal connection VIA pad 73 and the board internal wiring pattern 5.

Figure 12 (C) and Figure 12 (D) are similar to Figure 12 (
With the conventional structure of A) and FIG. 12(B) in the initial state,
The following is an example of a modified board when modified using a conventional method.

In FIG. 12(A) and FIG. 12(B), if there is any modification, the board internal connection [VIA
A cut pattern 72 at the time of modification between the pad 73 and the modification blade 71 is cut, and new wiring is performed using the modification wire 75 at an arbitrary position including the modification pad 71.

According to the conventional method, a number of modification pads 71 equal to the number of terminals are provided around a multi-terminal element in advance (therefore, the larger the number of element bins, the more modification pads 71 are provided around the multi-terminal element. There are disadvantages in that the number of layers increases and the number of layers has to be provided around the device, resulting in a decrease in device mounting density and an increase in board cost due to an increase in the size of the board.

Furthermore, according to the conventional method, each element terminal pad 3 and the modification pad 71 are connected by the modification pad extraction pattern 70 as board internal wiring, so the modification pad extraction pattern 70 is equal to the number of terminals of the multi-terminal element. The pad drawer pattern 70 is only necessary and for modification.
are concentratedly wired in the projection area of the element 6 and the nearby area around it.

Therefore, as the number of element bins increases, the number of layers within the board in which the modification pad extraction pattern 70 is to be wired increases.

Therefore, the total number of layers of the substrate 1 increases, which also has the drawback of increasing the substrate cost.

Furthermore, as the number of bins for a multi-terminal element increases, the area of the surface layer 2 of the substrate 1 where the modification pads 71 should be provided expands outward around the elements 6. The length becomes longer, and the length of the wiring pattern between elements also becomes longer.

As a result, the wiring delay increases, resulting in a deterioration in the performance of the board.

Furthermore, according to the conventional method, the modification wire 75 is
Therefore, when installing a cooling mechanism in the space above the element as a cooling method for the board, the modification wire 75 must be fixed in order to prevent the modification wire 75 from shaking and cooling efficiency to decrease. However, the disadvantage is that the workability of the modification work is poor.

Furthermore, since the modification wire 75 must be wired to the surface layer of the board 1, it is difficult to automate this wiring work, and therefore, there is a drawback that the modification work becomes costly and reduces efficiency. be.

[Problem that the invention seeks to solve]

This conventional method has a structure in which a pad for modification is prepared for each terminal of the element, which hinders high-density mounting of the elements, resulting in an increase in board cost and a decrease in performance.

In addition, in the conventional modification method, wiring work for modification wires is required, resulting in poor workability of the modification work and the problem of not being able to respond to automation.

The present invention was created in view of these points, and by performing modification without using modification pads and modification wires, it is possible to achieve high-density mounting of elements, high performance, reduction of board cost, and modification work. The purpose of this invention is to provide a method for modifying a board that can be automated and its structure.

[Means for solving problems]

1 to 3 are perspective views showing the principle of the present invention.

From FIG. 1 to FIG. 3, the board modification method of the present invention consists of the following three steps.

The first step is to cut between the element terminal pad 3 to be modified provided on the surface layer 2 of the board 1 and the in-board wiring pattern 5 connected thereto.

The second step is to connect the element terminal pad 3 to the modification pattern 2° previously provided on the inner layer 4 of the substrate 1.

The third step is to connect the remodeling patterns 20 that require wiring due to remodeling, or connect the remodeling patterns 20
This is a procedure for cutting the unnecessary part 51 of 0.

In addition, in the part to be modified -, the time order in which the above-mentioned first, second, and third procedures are performed is arbitrary.

I Hiroshi Structure 1 Structure The structure for modifying a board according to the present invention may have a modification pattern having one layer or multiple layers.

From Figure 1 to Figure 3, especially Figure 1 (A) and Figure 2 (
In A), when the modification pattern is one layer, the board modification structure of the present invention meets the following requirements (a), (b), and (c).
) with an element terminal pad 3 and an internal wiring pattern 5 on the board.
and a modification pattern 20.

(a) Element terminal pads 3 are provided on the surface layer 2 of the substrate 1 to connect the element terminals 7 of the elements 6, respectively.

(b) The in-board wiring pattern 5 is connected to each element terminal pad 3 without using a modification pad.

(C) The modification pattern 20 is the inner layer 4 of the substrate 1.
It is prepared in one layer.

Furthermore, this board modification structure satisfies the following requirements (d) and (
Cutting position 1 for modification when equipped with e) and (f) respectively
0, a modification pattern connection position 30 and a modification pattern cutting position 50 are provided on the surface layer 2 of the substrate 1.

(d) The cut position IO during modification is a position for canting the connection between the circuit board wiring pattern 5 and the element terminal pad 3 during modification.

(e) The modification pattern connection position 30 is a position for forming a connection VIA 31 from the element terminal pad 3 to the modification pattern 20 during modification.

(f) The modification pattern cutting position 50 is a position for canting an unnecessary portion 51 of the modification pattern 20 during modification.

Next, from FIG. 1 to FIG. 3, especially FIG. 1(A) and FIG. 3(A), the structure for modifying the board of the present invention when the modifying pattern is multilayered has the above-mentioned requirements ( a), (
b) or an element terminal pad 3, an in-board wiring pattern 5, and a modification pattern 2OA that meet the following requirements (e');
It consists of 20B,...

(e') The modification patterns 20A, 20B1, . . . are preliminarily provided in multiple layers of the inner layer 4 of the substrate 1.

Furthermore, this board modification structure has a modification cutting position 10 and a modification pattern connection position 30 that meet the above requirement (d) or the following requirements (e'), (f'), and (g'). ,
A modification pattern cutting position 50 and a channel change VIA formation position 40 are provided on the surface layer 2 of the substrate 1.

(e') The above modification pattern connection position 30 is connected to the modification patterns 20A and 20 from the element terminal pad 3 during modification.
This is a position for forming a connecting VIA 31 leading to any one of B, . . . .

(f') The modification pattern cutting position 50 is a position for cutting unnecessary portions 51 of the modification patterns 20A, 20B, . . . at the time of modification.

(g) VIA formation position 40 for channel switching
is a channel switching VI that extends from the surface layer 2 of the board 1 to both of the two layers of modification patterns that should be connected to each other among the multilayer modification patterns 20A, 20B, ... during modification.
This is the position for forming A41.

[Effect]

In order to modify the board by the method of the present invention in Method 6, the connection between the element terminal pad 3 to be modified and the wiring pattern 5 in the board is cut, and the element terminal pad 3 is connected to the modification pattern 2.
0.20A, 20B, etc., and interconnect or cut the modification patterns 20.20A, 20B5, etc. that require wiring.

Through this series of operations, the circuit including the element terminal pad 3 and the circuit board wiring pattern 5 configured before modification is abolished, and the element terminal pad 3 and the modification pattern 20, 20A, 20B, . . .・Can be modified to any circuit including.

According to this method, the modification patterns 20.20A, 20
B, . . . are designed to be electrically matched and arranged in advance on the inner layer 4 of the substrate 1, and these remodeling patterns 20, 20A are used when remodeling.

Since 20B... are selected and used in combination, there is no need to use twin wires, coaxial wires, etc. as discrete wires for modification. Therefore, it is easy to automate the modification work.

In addition, since discrete wires are not wired on the circuit board modified in this way, there is no fear that the discrete wires will interfere with the cooling action or that the discrete wires will move or vibrate due to the cooling action, and the wires can be fixed. There is no need for any wiring work, including processing, and the workability of remodeling work is excellent.

In the substrate l to which the structure of the claimed invention is applied, the element terminal pad 3 on the surface layer 2 and the wiring pattern 5 in the substrate are directly connected without using a modification pad, so that the element There is no need to secure an area around the projection area for arranging pads and the like for connecting the element terminal pads 3 and the wiring pattern 5 in the board, and therefore, high-density mounting of the board is possible.

In addition, since no modification pad is provided, the element terminal pad 3
There is also no need for a pattern for wiring the pad for modification and a wiring layer for the pattern.

Therefore, the number of substrate layers is reduced, and the wiring between elements is also shortened.
As a result, the wiring delay is reduced, and as a result, it is possible to improve the performance of the board and reduce costs.

According to the present invention, it is possible to reduce the number of circuit board layers as much as possible by setting the number of layers of the modification pattern to one layer, or to reduce the number of substrate layers as much as possible by setting the number of layers of the modification pattern to multiple layers, which allows complex modification work to be performed in many places. It is also possible to improve the adaptability of

To modify a board to which the structure of the present invention is applied,
Cutting work is performed at the modification cutting position 10 corresponding to the element terminal pad 3 to be modified.

Next, at the modification pattern connection position 30, the modification patterns 20, 20A, 20B, . . . are connected from the element terminal pad 3.
・A connecting VIA 31 is formed.

Furthermore, modification pattern 2 requires wiring due to modification.
VIA for channel switching compatible with 0A and 20B
At the formation position 40, a connecting VIA 41 is formed to connect both the modification patterns 20A and 20B to each other, and the modification pattern 20.2OA, 20B, etc., which does not require wiring, is cut at the modification pattern cutting position W50. Perform cutting work.

As described above, from the element terminal pad 3 to the wiring pattern 5 in the board.
The circuit portion passing through is discarded, and it can be remodeled to any new wiring that passes from the element terminal pad 3 to the modification patterns 20.2OA, 20B, . . . .

Modification work using this structure does not require the use of discrete wires, and the work can be performed at each position 10.30, 50.40 on the surface layer 2 of the substrate 1, so it has excellent workability. Can be fully automated.

〔Example〕

Figures 4 to 11 of the bell are examples of the present invention, among which Figures 4 to 7, as well as Figures 8(A) and 9.
FIG. 10(A), FIG. 10(A), and FIG. 11(A) mainly show the structure of the embodiment.

The structure of this example is that L1 disposed on the surface layer 2 of the substrate 1
It has a pattern, an L2 pattern and an L3 pattern arranged in two inner layers as pattern layers for modification, and other wiring patterns in the board.

The element 6 mounted on this substrate 1 is of the PGA type.

The first pattern described above includes a large number of element terminal pads 3 arranged in a matrix corresponding to the arrangement of the element terminals 7 in a matrix of the element 6, and pads 11 for cutting during modification extending from each element terminal pad 3. and a number of modification pattern connection pads 32 extending from each element terminal pad 3;
A large number of L arranged at positions corresponding to the gaps between adjacent elements 6
It has a pad 42 for forming a conductive VIA for switching one channel.

In this L1 pattern, position 1 for cutting during the above modification
0 is located on the cutting pad 11 during the modification.

Further, in the modification pattern connection pad 32, a donut-shaped through hole is formed as a modification pattern connection position 30.

Conductive VIA formation pad 42 for each L1 channel transfer
A through hole is formed in a donut shape as a conduction VIA formation position 40 for channel switching.

The two patterns described above are connected to the modification pattern 20A on the X-axis, which forms one axis of the orthogonal coordinate axes, and at positions corresponding to the modification pattern connection pad 32 of the L1 pattern. In addition, a conductive VIA forming pad 33A having a larger diameter than the through hole of the modification pattern connection pad 32, and the above-mentioned conductive V for changing one channel.
L2 channel switching conduction V connected to the modification pattern 2OA at a position corresponding to the IA formation pad 42
IA forming puff 43A and VIA for wiring pattern conduction in the board to pad 11 for cutting when modifying the L1 pattern.
12, and an in-board wiring pattern conduction pad 13 connected thereto.

In this L2 pattern, the L2 channel change conduction VIA formation pad 43A has a through hole smaller in diameter than the through hole of the channel change conduction VIA formation position 40 as the channel change conduction VIA formation position 44A. It has been formed.

The three patterns described above are connected to the modification pattern 20B on the other axis of the orthogonal coordinate axes, for example, the modification pattern 20B on the Y axis, and at positions corresponding to the modification pattern connection pads 32 of the L1 pattern. Conductive VIA formation pad 33B and the above-mentioned conductive VIA for switching 1 channel.
Forming pad 42 and L2 channel switching conduction VI
The conductive VIA forming pad 43B for L3 channel switching, which is connected to the modification pattern 20B at a position corresponding to both the A forming pad 43A, and the internal circuit board wiring pattern conductive pad 13 of the L2 pattern are connected to the modification pattern 20B. It has an in-board wiring pattern conduction pad 15 connected via a wiring pattern conduction VIA 14.

The pad 17 of the in-board wiring pattern 4 is connected to the in-board wiring pattern conduction pad 15 via the in-board wiring pattern conduction VIA 16 .

Since this embodiment has the above structure, before modification, the element terminals 7 of the element 6 are: the element terminal pad 3, the pad 11 for cutting during modification, the VrA 12 for conduction of the wiring pattern in the board, and the VrA 12 for the conduction of the wiring pattern in the board. It is electrically connected to the pad 17 of the in-board wiring pattern 4 through the pad 13, the in-board wiring pattern conduction VIA 14, the in-board wiring pattern conduction pad 15, and the in-board wiring pattern continuity VIA 16, and the L1 modification pattern. And the L2 modification pattern is not electrically connected to the element terminal pad 3.

Figure 8 to Figure 11 mainly show the board modification method of the embodiment, and Figure 8 (A), Figure 9 (A), and Figure 10 (A).
), FIG. 11(A) shows the initial state of modification.

When modifying, first, remove the element terminal pad 3 that is the target of modification.
At the modification cutting position 10, the modification cutting pad 11 is cut with a laser beam of a wavelength suitable for cutting the pad, and any of the modification pattern connection pads extending from the element terminal pad 3 is cut. By irradiating a laser beam with a wavelength for substrate destruction from the through hole of the modification pattern connection position 30 provided in the modification pattern connection pad 32, the L2 pattern or L3 pattern conductive VIA formation puff 33A or Form the VIA hole 34 up to 33B (see Figures 8(B) and 9).
Figure (B)).

In addition, in FIG. 8(B) and FIG. 9(B), the case where the VIA hole 34 is provided for the L3 pattern is illustrated.

Further, in FIG. 9(B), the wiring direction to be constructed by modification is illustrated as the direction indicated by an arrow 60.

The formation of the VIA hole 34 results in a T-branch, and the unnecessary portion 51 of the second modification pattern 20B determined by the wiring direction 60 is separated by laser cutting.

Next, the via holes 34 are filled with solder balls 35 or solder paste (FIG. 8(C)).

By irradiating the solder ball 35 with a laser beam, the solder ball 35 is remelted, and then a connecting VIA 31 is formed (FIGS. 8(D) and 9(C)').

As described above, the L3 modification pattern 20B, as an example of the modification pattern, can be connected to the element terminal pad 3 to be modified.

If two elements 6 to be connected to each other by modification work are in positions corresponding to the same L3 modification pattern 20B, each of these element terminal pads 3 is connected to the L3 modification pattern 20B as described above. All you have to do is make the connection.

Similar operations are performed when connecting the L2 modification pattern 20A to the element terminal pad 3.

Even when two elements 6 to be connected to each other in the modification work are located at positions corresponding to the same L2 modification pattern 20A, the work is similar to that described above for the L3 modification pattern 20B.

If two elements 6 to be connected to each other due to modification work are located at positions shifted in the X and Y axes, connect the L2 modification pattern 20A or the L3 modification pattern 20B to the elements 6 as described above. In addition to this work, the modification pattern channel change work, which will be explained below based on FIGS. 10 and 11, will be carried out.

FIG. 10(A) and FIG. 11(A) are the initial state,
Arrows 60 illustrate three wiring directions.

First, the conduction VIA formation position for channel changeover of the L1 channel changeover conduction VIA formation buffed 42 located at the channel changeover position where the modification pattern 20A and modification pattern 20B intersect to be connected by modification. By irradiating a laser beam with a wavelength for substrate destruction to 40, the channel switching conductive VIA formation position is changed from this L1 channel switching conductive VIA forming pad 42 to the L2 channel changing conductive VIA forming pad 43A. 44A to the conductive VIA formation pad 43B for L3 channel switching, and at the same time, the unnecessary portions 51 of the modification patterns 20A and 20B determined by the wiring direction 60 are separated by laser cutting. (Figure 10 (B), Figure 11 (
B)).

Next, the via holes 45 and 46 are filled with solder balls 47 or solder paste (FIG. 10(C)).

By irradiating the solder ball 47 with a laser beam, the solder ball 47 is remelted, and then the channel switching conduction via 4 is
1 (FIG. 1O (D) and FIG. 11 (C)).

As described above, connection wiring for switching from the L2 modification pattern 20A to the L3 modification pattern 20B or from the L3 modification pattern 20B to the 2 modification pattern 2OA is performed.

In this embodiment, any element terminal can be modified by modifying the element terminal pad section, or by combining the modification work of the element terminal pad and the modification work of the modification pattern channel switching section. Modifications between pads can be easily performed.

Moreover, each work involves pattern cutting using laser light,
Forming a VIA size using a laser beam, filling the VIA hole with solder balls, etc., and forming a VIA by irradiating the laser beam.
It is also easy to automate this series of operations.

In these modification operations, the laser beam can selectively destroy the metal and insulating layer of the substrate 1 by changing its type, intensity, and wavelength.

Therefore, in the L1 pattern, since the modification pattern connection pad 32 and the L1 channel switching conduction VIA formation pad 42 are donut-shaped, the insulating layer of the board can be directly destroyed by the laser beam irradiation. , and this donut shape can be used for alignment during automated remodeling.

modification pattern 20A corresponding to the laser beam irradiation position;
20B has pads 33A, 33B, and L for forming conductive VIA.
Conductivity vrA formation pad 43A1 for 2 channel transfer
In addition, since a pad 43B for forming a conductive VIA for changing over the L3 channel is provided, it is possible to correct misalignment of each layer during manufacture of the board or misalignment of the laser beam irradiation position during modification, and also for each modification. Pattern 20A, 2
The insulating layer located under 0B can be used as a barrier to prevent it from being destroyed by laser beam irradiation.

Further, the L1 channel transfer conduction VIA formation pad 42 has a donut shape with a through hole larger in diameter than the through hole of the corresponding L2 channel transfer conduction VIA formation pad 43A. In addition to facilitating selective destruction by laser beam irradiation as described above, and also for alignment when automating modification work, the channel The connecting portion between the transfer conduction VIA 41 and each modification pattern 20A, 20B can be made thicker to ensure a reliable connection.

As part of the modification work, modification patterns 20A and 20B
Since unnecessary portions 51 caused by T-branches and the like caused in the above are cut, it is possible to cope with electrical constraints and increase the utilization rate of each channel.

In addition to the Ll pattern as the surface layer pattern and the wiring pattern inside the board, the board of this embodiment has L2 and L3 modification pattern layers, so it can be modified to attach modification discrete wires to the element terminal pads 3. High-density mounting of devices on the surface layer is possible without providing pads, and only two layers are required for modification. Therefore, it is possible to reduce the wiring delay by reducing the number of substrate layers and shortening the wiring between elements. As a result, it is possible to improve the performance of the substrate and reduce the substrate cost.

The modification method of the present invention enables high-density packaging and high-density modification of elements without using discrete wires.

〔Effect of the invention〕

As described above, according to the present invention, the present invention has a simple configuration, utilizes a modification pattern prepared in advance on the inner layer of the substrate, eliminates the need for wiring discrete wires, and provides modification pads around the element. Since the modification can be carried out without the need for arranging the circuit board, it is possible to automate the modification work, improve the performance of the board, high-density mounting of the board, and reduce costs, which is extremely useful in practice.

[Brief explanation of the drawing]

FIG. 1(A) is a perspective view showing the structure before modification in the method of modifying the element terminal pad portion according to the present invention and the principle of its structure, and FIG. 1(B) is the modification based on the principle of FIG. 1(A). FIG. 2(A) is a perspective view showing the structure before modification, and FIG. A perspective view showing the structure after remodeling based on the principle of FIG. 2 (A), and FIG. 3 (A) showing the structure before remodeling in the method of connecting multilayer remodeling patterns and the principle of the structure according to the present invention. 3(B) is a perspective view showing the structure after modification based on the principle of FIG. 3(A), FIG. 4 is a sectional view showing the pattern structure according to the embodiment of the present invention, and FIG. 4. FIG. 6 is an explanatory diagram showing the L2 pattern of the structure in FIG. 4. FIG. 7 is an explanatory diagram showing the L3 pattern in the structure of FIG. 4. 8(A) to (D) are cross-sectional views showing each procedure in an embodiment of a method for modifying the element terminal pad portion using the structure shown in FIG. 4, and FIGS. 9(A) to (C), respectively. ) are perspective views showing the patterns in each procedure of Figures 8 (A), (B), and (D), respectively, and Figures 10 (A) to (D) are each using the structure of Figure 4. Cross-sectional views showing each procedure in an embodiment of the method for modifying the pattern channel switching section, Figures 11 (A) to (C) are respectively similar to Figure 10 (A
), (B), and (D); Figure 12 (A) is a sectional view of the conventional structure; Figure 12 (B) is a plan view of Figure 12 (A); Figure 12 (
C) is a sectional view showing the structure after modifying the board in FIG. 12(A) using the conventional method, and FIG.
) is a plan view of 1 to 3, 1 is the substrate, 2 is the surface layer of the board, 3 is the element terminal pad, 4 is the inner layer of the board, 5 is the wiring pattern inside the board, 6 is the element, 7 is the element terminal , 1O is the cutting position for modification, 20.20A, 20B, ... are the modification patterns respectively, 30 is the modification pattern connection position, 31 is the VI for connecting the element terminal pad and the modification pattern.
A, 40 is a VIA formation position for channel change, 41 is a VTA for channel change, 50 is a modification pattern cutting position, and 51 is an unnecessary part of the modification pattern.

Claims (3)

[Claims] (1) Cut between the element terminal pad (3) provided on the surface layer (2) of the substrate (1) and the internal wiring pattern (5) connected to the element terminal pad (3). The procedure for connecting the element terminal pad (3) to the modification pattern (20) prepared in advance on the inner layer (4) of the board (1), and the modification pattern (20) to be wired due to modification. Unnecessary part (51) of pattern (20) for connecting or modifying
A board modification method consisting of steps for cutting. (2) Element terminal pads (
3), an internal wiring pattern (5) connected to the element terminal pad (3) via a pattern that is cut during modification, and a wiring pattern pre-installed on the inner layer (4) of the board (1). There is a modification pattern (20) connected to the element terminal pad (3) during modification.
) A structure for modifying a board, characterized by comprising: (3) Element terminal pad (
3), an in-board wiring pattern (5) connected to the element terminal pad (3) without using a modification pad, and a wiring pattern pre-installed on the inner layer (4) of the board (1). It consists of multiple layers of modification patterns (20A, 20B,...), and the surface layer (2) of the board (1) is equipped with the internal wiring pattern (5) and the element terminal pad (3) during modification. A cutting position (10) for cutting the connection during modification, and a connecting VIA from the element terminal pad (3) to any of the modification patterns (20A, 20B,...) during modification.
(31) Remodeling pattern connection position to form (
30) and arbitrary two-layer modification patterns (20A, 20B) that should be connected to each other from the surface layer (2) of the substrate (1) during modification.
A channel switching VIA formation position (40) for forming a channel switching VIA (41) that reaches both
and a modification pattern cutting position (50) for cutting unnecessary portions (51) of the modification patterns (20A, 20B,...) during modification.