JPS63211791A - Manufacture of printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a printed circuit board suitable for use in forming a switching pattern on a printed circuit board.

[Summary of the invention]

This invention provides a printed circuit board manufacturing method suitable for forming a switching pattern on a printed circuit board, in which the switching pattern is formed on the printed circuit board and then the switching mounting hole or the guide positioning hole is formed. In the process, at least a portion of the switching pattern is formed higher than the surrounding area, or the surrounding area of the switching pattern is formed lower than a portion of the switching pattern, thereby improving the positional accuracy of the contact portion of the switching pattern. .

[Conventional technology]

A switch may be configured by forming a switching pattern on a printed circuit board and slidably attaching a slider to the switching pattern.

For example, in miniaturized electronic devices such as portable headphone stereo tape recorders, the packaging density is extremely high, so high positional accuracy is required when forming printed circuit boards. Therefore, in such miniaturized electronic devices, when configuring the switch as described above, it is necessary to form the switching pattern at an accurate position.

When configuring a switch as described above, conventionally, after the process of forming a switching pattern on a printed circuit board is completed, a mold is removed to form the external shape of the printed circuit board, and the slider is mounted at a desired position. to form a hole.

[Problem that the invention seeks to solve]

However, when forming a switching pattern on a printed circuit board, pattern displacement inevitably occurs. and,
When removing the mold after forming the switching pattern, the mold is removed according to the position of the formed switching pattern.
Accurate positioning is very difficult. For this reason,
Conventional printed circuit boards have had a problem in that the formed switching patterns are misaligned with respect to the outer shape and mounting holes of the printed circuit board.

Therefore, an object of the present invention is to provide a method for manufacturing a printed circuit board that can form a switching pattern at an accurate position with respect to the outer shape.

[Means for solving problems]

After forming a switching pattern on a printed circuit board, the present invention forms a mounting hole for switching or a guide positioning hole on the printed circuit board, and forms at least a portion of the switching pattern higher than the periphery of the switching pattern, or This is a method of manufacturing a printed circuit board in which the periphery of the switching pattern is formed lower than the periphery of a part of the switching pattern.

[Effect]

After the switching patterns 2A to 2D and 3 are formed on the printed circuit board 1, parts of the switching patterns 2A to 2D and 3 are formed using the same mold as that used to form the outer shape and the mounting hole 6 of the printed circuit board 1. is raised, or the periphery of the switching patterns 2A to 2D and 3 is depressed or punched, and the contact piece 9A of the slider 9 of the slider 7
A contact portion 10 is formed to be in contact with and 9B. In this way, since the contact portion 10 is formed with the same mold as that used to form the outer shape of the printed circuit board 1 and the mounting hole 〇, the contact portion 10 is formed with respect to the outer shape of the printed circuit board 1 and the position of the mounting hole 6. , can be positioned accurately.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

INDUSTRIAL APPLICATION This invention is used when forming a switching pattern on a printed circuit board and configuring a switch. In FIG. 1, 1 is a printed circuit board. As the printed circuit board 1, for example, a metal substrate is used. Of course, substrates other than metal substrates may be used. On the printed circuit board 1, switching patterns 2A, 2B, 2G, 2D and a switching pattern 3 are formed. Switching pattern 2
Patterns 4A to 4D are derived from each of A to 2D, and pattern 5 is derived from switching pattern 3. The switch contact portions of the switching patterns 2A to 2D and the switching pattern 3 are raised relative to the board surface of the printed circuit board 1.

This is to accurately position the switch contact portions of the switching patterns 2A to 2D and 3 with respect to the outer diameter of the printed circuit board 1 and the mounting hole 6. A mounting hole 6 is formed at the center of a portion surrounded by the switching patterns 2A to 2D and the switching pattern 3. The center shaft 8 of the slider 7 is inserted into the mounting hole 6, and the slider 7 is rotatably arranged on the switching patterns 2A to 2D and 3 of the printed circuit board 1. The bottom surface of the slider 7 has a second
As shown in the figure, a sliding piece 9 is attached. One contact portion 9A of this sliding piece 9 is brought into contact with the switch contact portion of the switching pattern 3, and the other contact portion 9B of the sliding piece 9 is selectively contacted with the switch contact portion of the switching patterns 2A to 2D, A switching operation is performed.

When producing this printed circuit board 1, first, switching patterns 2A to 2D and 3 and patterns 4A to 4D and 5 are formed on the printed circuit board 1. At this time, the sizes of the switching patterns 28 to 2D and 3 are the same as those of the slider 7 in the switching patterns 2A to -2D and 3.
The contact portions are made to be slightly larger than the contact portions that will come into contact with the contact pieces 9A and 9B of the slider 9. Since the contact portions of the switching patterns 2A to 2D and 3 are in contact with the contact pieces 9A and 9B of the slider 9 of the slider 7 to form a switch, the positions of the contact portions of the switching patterns 2A to 2D and 3 are as follows. It must be determined accurately with respect to the outer shape of the printed circuit board 1 and the position of the mounting hole 6.

After the switching patterns 2A to 2D and 3 and the patterns 4A to 4D and 5 are formed on the printed circuit board 1, the outer shape of the printed circuit board 1 is processed using the same mold, and the mounting holes 6 are formed, and further, Switching patterns 2A-2D and 3 are raised. The raised portions of the switching patterns 2A to 2D and 3 are used as contact portions, and are brought into contact with the contact pieces 9A and 9B of the slider 9 of the slider 7.

The raised portions of the switching patterns 2A to 2D and 3 are formed using the same mold that forms the outer shape of the printed circuit board 1 and the mounting holes 6. Therefore, the positional accuracy of this raised portion can be accurately determined with respect to the outer shape of the printed circuit board 1 and the mounting hole 60 position 1. These raised portions are the contact pieces 9A and 9 of the slider 9 of the slider 7.
Since this is the contact portion with B, this contact portion is accurately determined with respect to the outer shape of the printed circuit board 1 and the position of the mounting hole 6.

In other words, if the switching patterns 2A to 2D and 3 are misaligned with respect to the outer shape of the printed circuit board 1 and the mounting hole 6, as shown in FIGS. 3B and 3C1 and 4B and 4C, However, since the contact parts 10 are formed with the same mold, the positions of the contact parts 10 are different from the switching patterns 28 to 2.
It will always be the same if D and 3 are located correctly (Fig. 3A1, Fig. 4A).

In the above-described embodiment, the contact portions 10 of the switching patterns 2A to 2D and 3 are formed by raising a portion of the switching patterns 2A to 2D and 3 using the same mold that forms the outer shape of the printed circuit board 1 and the mounting holes 6. The structure is formed by

In this way, in addition to raising a part of the switching patterns 28 to 2D and 3, the outer shape of the printed circuit board 1 and the mounting hole 6 are formed around the switching patterns 2A to 2D and 3, as shown in FIG. The recesses 11 may be formed around the switching patterns 28 to 2D and 3 by using the same mold. Furthermore, as shown in FIG. 6, the surroundings of the switching patterns 2A to 2D and 3 are punched out using the same die used to form the outer shape of the printed circuit board 1 and the mounting holes 6, thereby forming the switching patterns 2A to 2D.
- You may make it form the notch 12 around 2D and 3. Even in this case, the position of the contact portion IO is accurately determined with respect to the outer shape of the printed circuit board 1 and the mounting hole 6, as in the case where a part of the switching pattern is raised.

Furthermore, when parts of the switching patterns 2A to 2D and 3 are raised, the switching patterns 2A to 2D and 3 may be peeled off from the printed circuit board 1 when the switching patterns 2A to 2D and 3 are raised. It is possible to put it away.

If the surroundings of the switching patterns 2A to 2D and 3 are punched out, the switching patterns 2A to 2D and 3 will not be peeled off from the printed circuit board 1.

〔Effect of the invention〕

According to this invention, the contact piece 9 of the slider 9 of the slider 7
The contact portion 1o that comes into contact with A and 9B is the printed circuit board 1
After the switching patterns 2A to 2D and 3 are formed, a part of the switching patterns 2A to 2D and 3 is raised using the same mold that forms the outer shape of the printed circuit board l and the mounting hole 6. Alternatively, it is formed by recessing or punching out the surroundings of the switching patterns 2A to 2D and 3. Therefore, the positional accuracy of the contact portion IO can be accurately determined with respect to the outer shape of the printed circuit board 1 and the mounting hole 6.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a printed circuit board and a slider to which the present invention is applied, Fig. 2 is a plan view of the slider, Fig. 3 is a sectional view used to explain an embodiment of the invention, and Fig. 4 is a perspective view of the slider. FIG. 5 is a sectional view used to explain another embodiment of the invention, and FIG. 6 is a sectional view used to explain still another embodiment of the invention. Explanation of main symbols in the drawings 1 Niblint board, 2A to 2D, 3 Niswitching pattern, 6: Mounting hole, 7: Slider, 9: Sliding piece, 10
: Contact part. Agent Patent Attorney Masato Sugiura Figure 1 Figure 2 Figure 4 2A to 2α3 Real Cannon I9°1 Ushi I: 1C voice of e (Miiku 1 Figure 6

Claims (1)

[Claims] After forming the switching pattern on the printed circuit board,
A mounting hole or a guide positioning hole for switching is formed in the printed circuit board, and at least a part of the switching pattern is formed higher than the periphery of the switching pattern, or a part of the periphery of the switching pattern is formed to be higher than the periphery of the switching pattern. A method of manufacturing a printed circuit board that is formed lower.