JPS63205822A - Device for fixing photodetector - Google Patents
Device for fixing photodetectorInfo
- Publication number
- JPS63205822A JPS63205822A JP3843987A JP3843987A JPS63205822A JP S63205822 A JPS63205822 A JP S63205822A JP 3843987 A JP3843987 A JP 3843987A JP 3843987 A JP3843987 A JP 3843987A JP S63205822 A JPS63205822 A JP S63205822A
- Authority
- JP
- Japan
- Prior art keywords
- receiving element
- light
- photodetector
- fixing plate
- optical base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 239000006071 cream Substances 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Moving Of The Head For Recording And Reproducing By Optical Means (AREA)
- Optical Head (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、光デイスク再生装置の光学ピックアンプに用
いることができる受光素子固定装置に関するものである
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a light receiving element fixing device that can be used in an optical pick amplifier of an optical disc playback device.
従来の技術
光デイスク再生装置の光学ピックアップに使用される受
光素子はミクロン単位の位置決めが必要であり、その位
置決めは、光学ピックアップの生産工程において重要な
問題である。2. Description of the Related Art A light receiving element used in an optical pickup of an optical disc playback device requires positioning in microns, and positioning is an important problem in the production process of optical pickups.
ところで従来の例えば第４図、第６図に示す受光素子固
定装置では、受光素子１を備えた受光素子固定板２は光
学ベース４に、ビス３を前記光学ベース４のビス穴４１
Ｌに絞め込み、前記受光素子固定板２の切り欠き部２ａ
ヲ利用して、前記ビス３のヘッド３１Ｌと前記光学ベー
ス４とによっ七前記受光素子固定板２を圧着することに
より前記受光素子１を光学ベース４に固定していた。By the way, in the conventional light-receiving element fixing device shown in FIGS. 4 and 6, for example, the light-receiving element fixing plate 2 equipped with the light-receiving element 1 is attached to the optical base 4, and the screw 3 is inserted into the screw hole 41 of the optical base 4.
Narrow it down to L and cut out the notch 2a of the light receiving element fixing plate 2.
The light receiving element 1 was fixed to the optical base 4 by pressing the light receiving element fixing plate 2 between the head 31L of the screw 3 and the optical base 4.
発明が解決しようとする問題点
ところが、このような方法では、受光素子１全位置決め
した後、ビス３を絞め込むため、絞め込む前後で位置が
ずれ、生産過程において工数が増大するという問題があ
った。また絞め込むことによって絞め付は部に残留応力
が発生し、その残留応力により経時変化が発生し、受光
素子の位置がずれるという問題があった。Problems to be Solved by the Invention However, in this method, since the screw 3 is tightened after the light receiving element 1 is fully positioned, there is a problem that the position shifts before and after tightening, increasing the number of man-hours in the production process. Ta. Further, due to tightening, residual stress is generated in the tightening portion, and this residual stress causes a change over time, causing a problem that the position of the light receiving element is shifted.
本発明はこのような従来の問題点を解消するものであり
、固定時の受光素子の位置ずれがほとんどなく、かつ経
時変化環境変化のほとんどない優れた受光素子固定装置
を提供するものである。The present invention solves these conventional problems, and provides an excellent light-receiving element fixing device in which there is almost no displacement of the light-receiving element when it is fixed, and there is almost no environmental change over time.
問題点を解決するための手段
本発明の受光素子固定装置は、受光素子を備えた受光素
子固定板を光学ベースに半田を用いることにより固定さ
せるものである。Means for Solving the Problems The light-receiving element fixing device of the present invention fixes a light-receiving element fixing plate provided with a light-receiving element to an optical base by using solder.
作用
本発明の受光素子固定装置は、受光素子を備えた受光素
子固定板を光学ベースに半田を用いて固定させることに
より、固定時の位置ずれがほとんどなく、また経時変化
環境変化がほとんどなくなるという効果を有するもので
ある。Function: The light-receiving element fixing device of the present invention fixes the light-receiving element fixing plate equipped with the light-receiving element to the optical base using solder, so that there is almost no positional shift during fixation, and there is almost no environmental change over time. It is effective.
実施例
以下、本発明の一実施例の受光素子固定装置を図面に基
づき説明する。第１図に示すように光学ベース９の穴９
＆に銅製ピン７を圧入し、前記銅製ピン了のヘッド表面
Ｔ＆にクリーム半田８を塗布しておく。そして第２図に
示すように、受光素子固定板６の圧着面において穴６＆
の周囲を銅はく６ｂにて形成しておく。そして、第１図
に示すように、前記受光素子固定板６の穴６１Ｌと前記
クリーム半田８を塗布された前記銅製ピン７のヘッド表
面子ａとを重ねるように前記受光素子固定板６と前記光
学ベース９を圧着させ、前記受光素子固定板６の穴６ａ
ｆ利用して、前記クリーム半田８を熱溶融させること
によって、前記受光素子５を備えた前記受光素子固定板
６を前記光学ベース９に対しｘ−ｙ平面内にて位置決め
し、前記クリーム半田８の凝固全利用して第３図に示す
ように前記受光素子６を備えた前記受光素子固定板６を
前記光学ベース９に速やかに固定することができる。EXAMPLE Hereinafter, a light receiving element fixing device according to an example of the present invention will be explained based on the drawings. Hole 9 of optical base 9 as shown in FIG.
A copper pin 7 is press-fitted into the copper pin 7, and cream solder 8 is applied to the head surface T& of the copper pin. As shown in FIG. 2, holes 6 &
A copper foil 6b is formed around the area. As shown in FIG. 1, the light-receiving element fixing plate 6 and the light-receiving element fixing plate 6 are aligned so that the hole 61L of the light-receiving element fixing plate 6 and the head surface a of the copper pin 7 coated with the cream solder 8 overlap. The optical base 9 is crimped, and the hole 6a of the light receiving element fixing plate 6 is
By thermally melting the cream solder 8 using f, the light receiving element fixing plate 6 equipped with the light receiving element 5 is positioned with respect to the optical base 9 within the x-y plane, and the cream solder 8 As shown in FIG. 3, the light-receiving element fixing plate 6 provided with the light-receiving element 6 can be quickly fixed to the optical base 9 by fully utilizing the solidification.
発明の効果
以上のように本発明の受光素子固定装置によれば次の効
果を得ることができる。Effects of the Invention As described above, according to the light receiving element fixing device of the present invention, the following effects can be obtained.
（１）受光素子全光学ベースに位置決めした後、受光素
子に物理的な外力を加えず、半田の凝固によって受光素
子を光学ベースに固定するため、位置決め前後の位置ず
れがほとんど発生しない。(1) After the light-receiving element is positioned on the all-optical base, the light-receiving element is fixed to the optical base by solder solidification without applying any physical external force to the light-receiving element, so almost no positional deviation occurs before and after positioning.
（２）物理的に材料にひずみを加えないため、残留応力
が発生せず、そのため経時環境変化による位置ずれが発
生しない。(2) Since no physical strain is applied to the material, no residual stress is generated, and therefore positional shift due to environmental changes over time does not occur.
（３）半田を加熱することによって受光素子の再配置が
可能である。(3) The light receiving element can be rearranged by heating the solder.
、第１図は本発明の一実施例における受光素子固定装置
の構成を示す分解斜視図、第２図は受光素子固定板の圧
着面の平面図、第３図は受光素子の固定状態を示す分解
断面図、第４図は従来の受光素子固定装置の構成を示す
斜視図、第６図は受光素子の固定状態ヲ示す断面図であ
る。
５・・・・・・受光素子、６・・・・・・受光素子固定
板、６ａ・・・・・・穴、６ｂ・・・・・・銅はく、７
・・・・・・銅製ビス、Ｔ＆・・・・・ヘッド表面、８
・・・・・クリーム半田、９・・・・・・光学ベース、
９＆・・・・・・ビス穴。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名Ｓ−
−光女梵索子
６ａ−大
第２図, FIG. 1 is an exploded perspective view showing the structure of a light-receiving element fixing device in an embodiment of the present invention, FIG. 2 is a plan view of the crimping surface of the light-receiving element fixing plate, and FIG. 3 is a diagram showing the fixed state of the light-receiving element. FIG. 4 is a perspective view showing the structure of a conventional light-receiving element fixing device, and FIG. 6 is a cross-sectional view showing a state in which the light-receiving element is fixed. 5... Light receiving element, 6... Light receiving element fixing plate, 6a... Hole, 6b... Copper foil, 7
・・・・・・Copper screw, T & ・・・Head surface, 8
...Cream solder, 9...Optical base,
9&...screw hole. Name of agent: Patent attorney Toshio Nakao and one other person S-
-Mitsujo Bonsakuko 6a-Large 2nd figure
Claims (1)
前記受光素子を備えた前記受光素子固定板を半田を用い
ることにより、前記光学ベースに固定する構成とした受
光素子固定装置。Comprising a light receiving element, a light receiving element fixing plate, and an optical base,
A light-receiving element fixing device configured to fix the light-receiving element fixing plate provided with the light-receiving element to the optical base using solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3843987A JPS63205822A (en) | 1987-02-20 | 1987-02-20 | Device for fixing photodetector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3843987A JPS63205822A (en) | 1987-02-20 | 1987-02-20 | Device for fixing photodetector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63205822A true JPS63205822A (en) | 1988-08-25 |
Family
ID=12525337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3843987A Pending JPS63205822A (en) | 1987-02-20 | 1987-02-20 | Device for fixing photodetector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63205822A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03102653A (en) * | 1989-09-14 | 1991-04-30 | Mitsubishi Electric Corp | Optical pickup device |
| JPH03102643A (en) * | 1989-09-14 | 1991-04-30 | Mitsubishi Electric Corp | Optical pickup device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60143618A (en) * | 1983-12-29 | 1985-07-29 | 松下電器産業株式会社 | Electronic part |
| JPS60180194A (en) * | 1984-02-27 | 1985-09-13 | 松下電器産業株式会社 | Device for mounting part on circuit board |
| JPS6157314B2 (en) * | 1979-10-24 | 1986-12-06 | Iwaki Seiyaku Kk |
-
1987
- 1987-02-20 JP JP3843987A patent/JPS63205822A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157314B2 (en) * | 1979-10-24 | 1986-12-06 | Iwaki Seiyaku Kk | |
| JPS60143618A (en) * | 1983-12-29 | 1985-07-29 | 松下電器産業株式会社 | Electronic part |
| JPS60180194A (en) * | 1984-02-27 | 1985-09-13 | 松下電器産業株式会社 | Device for mounting part on circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03102653A (en) * | 1989-09-14 | 1991-04-30 | Mitsubishi Electric Corp | Optical pickup device |
| JPH03102643A (en) * | 1989-09-14 | 1991-04-30 | Mitsubishi Electric Corp | Optical pickup device |
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