JP2613243B2 - Manufacturing method of liquid crystal display device - Google Patents

Manufacturing method of liquid crystal display device

Info

Publication number
JP2613243B2
JP2613243B2 JP63053498A JP5349888A JP2613243B2 JP 2613243 B2 JP2613243 B2 JP 2613243B2 JP 63053498 A JP63053498 A JP 63053498A JP 5349888 A JP5349888 A JP 5349888A JP 2613243 B2 JP2613243 B2 JP 2613243B2
Authority
JP
Japan
Prior art keywords
tape
tape carrier
lead pattern
liquid crystal
crystal display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63053498A
Other languages
Japanese (ja)
Other versions
JPH01229228A (en
Inventor
昌雄 河野
勤 磯野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP63053498A priority Critical patent/JP2613243B2/en
Publication of JPH01229228A publication Critical patent/JPH01229228A/en
Application granted granted Critical
Publication of JP2613243B2 publication Critical patent/JP2613243B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、駆動用LSIチップをテープキャリアに実装
して使用する液晶表示装置の、LSIに接続したリードパ
ターンと、他の回路との接続作業が、確実に行えるよう
にした信頼性の高い液晶表示装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a connection between a lead pattern connected to an LSI and another circuit of a liquid crystal display device using a driving LSI chip mounted on a tape carrier. The present invention relates to a highly reliable liquid crystal display device capable of performing operations reliably.

［従来の技術］ LSIをテープキャリア方式で使用すると、組立作業が
効率化するだけでなく、それを使用した製品を小型化し
たり折りたたみ式にしたりするのに都合が良いので、液
晶表示装置にも広く利用されている（「日経マイクロデ
バイス」1987年６月号61−74頁）。[Prior art] When an LSI is used in a tape carrier system, not only the assembling work is made more efficient, but also it is convenient to miniaturize or fold the product using the same. It is widely used ("Nikkei Micro Devices", June 1987, pp. 61-74).

第３図は、液晶表示装置に駆動用LSIをテープキャリ
ア方式で装着する場合の、テープキャリア上のリードパ
ターンを他の回路と接続する部分の従来の場合の平面図
を示し、第４図は同じ場合の側断面図を示す。第３図
中、１はテープキャリアのテープ、２は液晶表示素子を
駆動するためのLSIチップ、３はテープキャリア側リー
ドパターンの半田付けすべき端子部で、第４図中、３は
テープキャリア側リードパターンの半田付けすべき端子
部、４は端子部接続用の半田、5aはテープキャリア側リ
ードパターンと接続する相手側たとえばプリント基板上
の回路の半田付けすべき端子部、６は半田付けすべき端
子部を加熱、加圧する作業機のヒータチップである。FIG. 3 is a plan view showing a conventional case where a lead pattern on a tape carrier is connected to another circuit when a driving LSI is mounted on a liquid crystal display device by a tape carrier method, and FIG. FIG. 3 shows a side sectional view of the same case. In FIG. 3, 1 is a tape of a tape carrier, 2 is an LSI chip for driving a liquid crystal display element, 3 is a terminal portion to be soldered of a lead pattern on a tape carrier side, and in FIG. The terminal part of the side lead pattern to be soldered, 4 is the solder for connecting the terminal part, 5a is the terminal part to be connected to the tape carrier side lead pattern, for example, the terminal part of the circuit on the printed circuit board to be soldered, and 6 is the soldering. This is a heater chip of a working machine that heats and pressurizes a terminal to be formed.

従来は、LSIを実装したテープキャリアのテープを、
個々の液晶表示装置に使用するために切り離す際に、第
３図に示すように、リードパターン接続部分の両側にあ
るテープを切り落していた（但し、接続作業対応個所の
テープには予め接続作業用の孔が穿設してあり、また、
上記切り離しに際しては、複数本のリードパターン端部
の間隔を保持させるためにリードパターン端部のテープ
は残しておく）。Conventionally, the tape of a tape carrier with an LSI
At the time of disconnection for use in individual liquid crystal display devices, tapes on both sides of the lead pattern connection portion were cut off as shown in FIG. Holes are drilled, and
At the time of the separation, the tape at the end of the lead pattern is left to keep the interval between the ends of the plurality of lead patterns.)

しかし、上記のような従来の回路接続方法による液晶
表示装置では、テープキャリアのリードパターン端子部
と、接続すべき相手側の他の回路の接続端子との間に、
当初、十分な量の半田層が存在していても、接続作業用
のヒータチップを押し下げ加熱、加圧すると、ヒータチ
ップの熱により半田が溶解しかけて軟化したとき、ヒー
タチップの加圧により、軟化した半田は周囲に押し出さ
れて第４図に示すようになり、テープキャリア側リード
パターンの半田付け端子部３と相手側たとえばプリント
基板上の回路の半田付けすべき端子部5aとが直接接触し
てしまい、両端子部の側面のみで半田接続されている状
態になっていた。However, in the liquid crystal display device according to the conventional circuit connection method as described above, between the lead pattern terminal portion of the tape carrier and the connection terminal of another circuit to be connected,
Initially, even if there is a sufficient amount of solder layer, when the heater chip for connection work is pressed down and heated and pressurized, the heat of the heater chip melts and softens the solder. The softened solder is pushed out to the periphery as shown in FIG. 4, and the soldering terminal portion 3 of the lead pattern on the tape carrier side and the terminal portion 5a to be soldered of the other side, for example, a circuit on a printed circuit board, are in direct contact. As a result, only the side surfaces of both terminal portions were connected by soldering.

［発明が解決しようとする課題］ 上記のように、テープキャリア方式で駆動用LSIチッ
プを装着した従来の液晶表示装置では、LSIチップに接
続したテープキアリア側リードパターンの端子部と、そ
の相手側たとえばプリント基板上の回路の端子部との接
続部では、半田は横にはみ出してしまうので、電気的に
確実な接続状態にならないという問題があった。[Problems to be Solved by the Invention] As described above, in the conventional liquid crystal display device in which the driving LSI chip is mounted by the tape carrier method, the terminal portion of the tape carrier side lead pattern connected to the LSI chip and the mating side thereof, for example, At the connection portion with the terminal portion of the circuit on the printed circuit board, the solder protrudes sideways, so that there is a problem that an electrically reliable connection state is not obtained.

本発明は上記課題を解決し、テープキャリア側リード
パターンの端子部と相手回路側端子部とが確実に接続さ
れた信頼性の高い液晶表示装置を提供することを目的と
する。An object of the present invention is to solve the above problems and to provide a highly reliable liquid crystal display device in which a terminal portion of a tape carrier side lead pattern and a terminal portion of a counterpart circuit side are securely connected.

［課題を解決するための手段］ 上記課題を解決するために本発明においては、LSIに
接続したテープキャリアのリードパターンを他の回路と
接続する作業工程において、この接続作業対応個所のテ
ープに設けた接続作業用の孔の両側に、テープを残存さ
せた状態で接続作業することにした。[Means for Solving the Problems] In order to solve the above problems, according to the present invention, in a work process of connecting a lead pattern of a tape carrier connected to an LSI to another circuit, the lead pattern is provided on a tape corresponding to the connection work. The connection operation was performed with the tape remaining on both sides of the connection operation hole.

［作用］ 上記のような手段を採れば、接続作業対応個所のテー
プに設けた接続作業用の孔の両側に残存させたテープ
が、加熱用のヒータチップの両端部を支えて沈み込みを
防止するストッパとして作用し、半田が溶解軟化してい
ても、リードパターン側端子部と相手回路側端子部が直
接接触するまで押し下げられ、これら両者間に存在した
半田が全部周囲外部へはみ出してしまうようなことには
ならない。なお、テープキャリアのテープの厚さは、両
端子部それぞれの金属膜厚の３倍程度あるから、両端子
間に端子の金属膜厚程度の半田層が確保されることにな
る。このようにして、テープキャリア側の端子と相手た
とえばプリント基板側回路の端子とを電気的に確実に接
続することが出来る。[Operation] By adopting the above-described means, the tape left on both sides of the connection work hole provided in the tape corresponding to the connection work supports both ends of the heating heater chip to prevent sinking. Even if the solder is melted and softened, it is pushed down until the lead pattern side terminal and the mating circuit side terminal come into direct contact, so that all the solder present between them protrudes to the surrounding outside. It doesn't matter. Since the thickness of the tape of the tape carrier is about three times the thickness of the metal of each terminal portion, a solder layer having a thickness of about the thickness of the metal of the terminal is secured between both terminals. In this manner, the terminal on the tape carrier side and the terminal on the other side, for example, the circuit on the printed circuit board side can be electrically reliably connected.

［実施例］ 第１図は本発明一実施例の要部平面図、第２図は同実
施例の要部側断面図を示す。これらの図中で、1aは接続
作業対応個所のテープに設けた接続作業用の孔の両側に
残存させた本発明に係るテープで、その他の符号は第３
図、第４図の場合と同様である。これらの図から、テー
プキャリア側リードパターンの端子部と相手側回路の端
子部とを一括半田付けする作業に使用するヒータチップ
６の沈み込みが、接続作業用の孔の両側に残存させたテ
ープ1aにより防止されて、テープキャリア側の端子部３
と相手側回路の端子部5aの間に半田４が層状に残留保持
され、電気的に確実な接続が得られる。FIG. 1 is a plan view of a main part of an embodiment of the present invention, and FIG. 2 is a side sectional view of the main part of the embodiment. In these figures, reference numeral 1a denotes a tape according to the present invention which is left on both sides of a connection work hole provided in a tape corresponding to a connection work, and the other reference numerals are 3rd.
FIG. 4 is the same as FIG. From these figures, it can be seen that the sinking of the heater chip 6 used for the operation of batch-soldering the terminal portion of the tape carrier-side lead pattern and the terminal portion of the mating circuit was left on both sides of the connection operation hole. 1a, the terminal 3 on the tape carrier side
The solder 4 is retained in a layered state between the terminal portion 5a of the counterpart circuit and the terminal portion 5a, and an electrically reliable connection is obtained.

［発明の効果］ 以上説明したように本発明によれば、テープキャリア
側リードパターンの端子部と相手側回路の端子部とが電
気的に確実に接続されるようになり、信頼性の高い液晶
表示装置が得られる。[Effects of the Invention] As described above, according to the present invention, a terminal portion of a tape carrier-side lead pattern and a terminal portion of a mating circuit can be electrically reliably connected, and a highly reliable liquid crystal can be obtained. A display device is obtained.

【図面の簡単な説明】[Brief description of the drawings]

第１図は本発明一実施例の要部平面図、第２図は同実施
例の要部側断面図、第３図はテープキャリア上のリード
パターンを他の回路と接続する部分の従来の場合の平面
図、第４図は同じ場合の側断面図を示す。 １……テープキャリアのテープ、1a……接続作業用の孔
の両側に残存させた本発明に係るテープ、２……液晶表
示素子駆動用LSIチップ、３……テープキャリア側リー
ドパターンの端子部、４……端子部接続用の半田、5a…
…相手側回路の端子部、６……端子部を加熱する作業機
のヒータチップ。FIG. 1 is a plan view of a main part of an embodiment of the present invention, FIG. 2 is a side sectional view of the main part of the embodiment, and FIG. 3 is a conventional part of a part connecting a lead pattern on a tape carrier to another circuit. FIG. 4 is a side sectional view of the same case. 1 ... Tape of tape carrier, 1a ... Tape of the present invention left on both sides of connection hole, 2 ... LSI chip for driving liquid crystal display element, 3 ... Terminal part of lead pattern on tape carrier side , 4 ... Solder for connecting terminal parts, 5a ...
... Terminal part of counterpart circuit, 6... Heater chip of working machine for heating terminal part.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−240278（ＪＰ，Ａ) 特開 昭61−177795（ＪＰ，Ａ) 特開 昭63−296022（ＪＰ，Ａ) ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-61-240278 (JP, A) JP-A-61-177795 (JP, A) JP-A-63-296022 (JP, A)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】駆動用LSIチップをテープキャリア方式で
装着し、テープキャリアと他の回路基板とが接続される
液晶表示装置の製造方法において、テープ上に予め設け
られた、上記駆動用LSIチップと、上記駆動用LSIチップ
の一辺に対し垂直な方向に延在しかつ平行な方向に複数
本並んで形成されたリードパターンと、該リードパター
ンを上記回路基板に接続する接続作業用の孔とを残存す
るように上記テープキャリアを、上記テープから切り離
す工程と、上記接続作業用の孔の上記リードパターンと
ほぼ平行な辺に、上記リードパターンとほぼ平行な形状
にテープを残存させた状態で、上記回路基板と上記テー
プキャリアとを接続する工程よりなることを特徴とする
液晶表示装置の製造方法。1. A method of manufacturing a liquid crystal display device in which a driving LSI chip is mounted in a tape carrier system and a tape carrier and another circuit board are connected, wherein the driving LSI chip is provided in advance on a tape. And a lead pattern extending in a direction perpendicular to one side of the driving LSI chip and formed in parallel in a plurality of lines, and a connection hole for connecting the lead pattern to the circuit board; A step of separating the tape carrier from the tape so as to remain, and in a state where the tape is left in a shape substantially parallel to the lead pattern, on a side of the connection work hole substantially parallel to the lead pattern. Connecting the circuit board and the tape carrier to each other.
JP63053498A 1988-03-09 1988-03-09 Manufacturing method of liquid crystal display device Expired - Fee Related JP2613243B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63053498A JP2613243B2 (en) 1988-03-09 1988-03-09 Manufacturing method of liquid crystal display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63053498A JP2613243B2 (en) 1988-03-09 1988-03-09 Manufacturing method of liquid crystal display device

Publications (2)

Publication Number Publication Date
JPH01229228A JPH01229228A (en) 1989-09-12
JP2613243B2 true JP2613243B2 (en) 1997-05-21

Family

ID=12944495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63053498A Expired - Fee Related JP2613243B2 (en) 1988-03-09 1988-03-09 Manufacturing method of liquid crystal display device

Country Status (1)

Country Link
JP (1) JP2613243B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0569949A3 (en) * 1992-05-12 1994-06-15 Akira Kitahara Surface mount components and semifinished products thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56148856A (en) * 1980-04-21 1981-11-18 Hitachi Ltd Film carrier
JPH0626153B2 (en) * 1983-04-15 1994-04-06 株式会社日立製作所 Flexible cable solder connection structure
JPH0773154B2 (en) * 1986-04-10 1995-08-02 松下電器産業株式会社 Lead connection method

Also Published As

Publication number Publication date
JPH01229228A (en) 1989-09-12

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