JPS63205817A - Magnetic disk substrate - Google Patents
Magnetic disk substrateInfo
- Publication number
- JPS63205817A JPS63205817A JP3860687A JP3860687A JPS63205817A JP S63205817 A JPS63205817 A JP S63205817A JP 3860687 A JP3860687 A JP 3860687A JP 3860687 A JP3860687 A JP 3860687A JP S63205817 A JPS63205817 A JP S63205817A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- layer
- substrate
- plastic
- magnetic disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 45
- 239000004033 plastic Substances 0.000 claims abstract description 24
- 229920003023 plastic Polymers 0.000 claims abstract description 24
- 239000000919 ceramic Substances 0.000 abstract description 25
- 239000000463 material Substances 0.000 abstract description 10
- 239000004697 Polyetherimide Substances 0.000 abstract description 4
- 239000011162 core material Substances 0.000 abstract description 4
- 229920001601 polyetherimide Polymers 0.000 abstract description 4
- 238000009499 grossing Methods 0.000 abstract description 3
- 238000001746 injection moulding Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical class [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003779 heat-resistant material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Magnetic Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、磁気ディスク完成品となる手前の磁性層未
形成状態の磁気ディスク基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a magnetic disk substrate in a state where no magnetic layer is formed before it becomes a finished magnetic disk product.
現在主流となっている磁気ディスク基板は、アルミ合金
製の基板であり、非常に純度を高めたボアーの少ない高
グレードのものである。このアルミ基板を鏡面旋盤によ
る鏡面切削加工で表面平滑性を高めている。このように
加工した磁気ディスク基板に下地処理および磁性層コー
ト形成をして完成品としている。しかし、鏡面切削加工
のために、かなりのコスト高となっている。The currently mainstream magnetic disk substrate is a substrate made of aluminum alloy, and is a high-grade substrate with extremely high purity and few bores. This aluminum substrate is mirror-cut using a mirror lathe to improve its surface smoothness. The thus processed magnetic disk substrate is subjected to undercoat treatment and magnetic layer coating to produce a finished product. However, because of the mirror cutting process, the cost is considerably high.
また、最近、セラミック基板（セラミック板をラフピン
グ・ポリシングし、表面をガラスコートしたもの）や、
ガラス基板も登場している。しかし、表面平滑性を得る
ために、表面を砥粒加工したり、外・内径を研削加工し
たりする必要があり、これもかなりのコスト高となる。In addition, recently, ceramic substrates (ceramic boards rough-finished and polished, and the surface coated with glass),
Glass substrates are also appearing. However, in order to obtain surface smoothness, it is necessary to process the surface with abrasive grains or grind the outer and inner diameters, which also increases the cost considerably.
樹脂単独で射出成形すれば生産性も高く、コスト低下が
図れる。しかし、下地層や磁性層の形成時に加わる化学
処理や加熱処理によって、熱変形や吸湿による変形が生
じるという問題点がある。Injection molding using resin alone increases productivity and reduces costs. However, there is a problem in that chemical treatment and heat treatment applied during formation of the underlayer and magnetic layer cause deformation due to thermal deformation and moisture absorption.
この発明の目的は′、生産性がよく、かつ表面平滑性に
優れ、下地層や磁性層の形成時に変形することがなく、
さらに軽量化が図れる磁気ディスク基板を提供すること
である。The purpose of this invention is to provide high productivity, excellent surface smoothness, and no deformation during formation of the underlayer or magnetic layer.
Another object of the present invention is to provide a magnetic disk substrate that can be further reduced in weight.
この発明の磁気ディスク基板は、セラミック基板の表面
を耐熱性のプラスチック層で覆ったものである。The magnetic disk substrate of the present invention is a ceramic substrate whose surface is covered with a heat-resistant plastic layer.
この構成によると、プラスチック層で覆っているので、
金型表面を平滑にすることにより表面平滑度が十分に得
られ、鏡面切削加工や砥粒加工等の加工が不要となって
生産性が向上する。また、プラスチック層に耐熱性の材
料を用い、かつセラミック基板を心材として用いている
ので、下地層や磁性層の形成時に変形することがない。According to this configuration, since it is covered with a plastic layer,
By making the mold surface smooth, sufficient surface smoothness can be obtained, and processes such as mirror cutting and abrasive processing are no longer necessary, improving productivity. Furthermore, since a heat-resistant material is used for the plastic layer and a ceramic substrate is used as the core material, there is no deformation during formation of the underlayer or magnetic layer.
さらにセラミック基板とプラスチック層からなるので、
従来のガラスやセラミック単独の基板に比べて軽量化が
図れる。Furthermore, since it consists of a ceramic substrate and a plastic layer,
It is lighter in weight than conventional glass or ceramic substrates.
実施例
この発明の一実施例を第１図ないし第４図に基づいて説
明する。第１図のｒ−ｒ線断面を示す。Embodiment An embodiment of the present invention will be described with reference to FIGS. 1 to 4. A cross section taken along line rr in FIG. 1 is shown.
この磁気ディスク基板は、セラミック基板１の表面を耐
熱性のプラスチック層２で覆ったものある。This magnetic disk substrate includes a ceramic substrate 1 whose surface is covered with a heat-resistant plastic layer 2.
セラミック基板１は第３図のように肉抜き穴１ａを有す
る車輪状に形成したものである。例えば、生材（グリー
ンシート）の状態でプレス機により打ち抜（。これを金
型内にセットした後、プラスチック層２を射出成形によ
りインサート成形しく第４図）、中心穴３を打ち抜いて
ゲー）２ａを除くことにより、磁気ディスク基板が得ら
れる。The ceramic substrate 1 is formed into a wheel shape having a hollow hole 1a as shown in FIG. For example, a raw material (green sheet) is punched out using a press machine (after setting it in a mold, the plastic layer 2 is insert molded by injection molding (Fig. 4), a center hole 3 is punched out and a gate is formed. ) By removing 2a, a magnetic disk substrate is obtained.
中心穴３の形成は、金型内での打ち抜きでも、また別工
程での打ち抜きでもよく、あるいは二次切削加工で行っ
てもよい。４は基板支持孔であり、フロー用ビンにより
形成される。すなわち、セラミック基板１を金型に配置
するとき、磁気ディスク基板の中心と一敗するようにフ
ローさせる必要がある。そこで、磁気ディスク基板の特
性に影響のない内周縁および外周縁にフロー用ビンを介
してセラミック基板ｌの位置決めを行う。なお、他の方
法で位置決めを行ってもよい。The center hole 3 may be formed by punching within a mold, by punching in a separate process, or by secondary cutting. 4 is a substrate support hole, which is formed by a flow bottle. That is, when placing the ceramic substrate 1 in a mold, it is necessary to flow it so that it meets the center of the magnetic disk substrate. Therefore, the ceramic substrate l is positioned via flow bins at the inner and outer peripheral edges that do not affect the characteristics of the magnetic disk substrate. Note that positioning may be performed using other methods.
セラミック基板１は、例えばアルミナ材であり、比較的
低グレードのものでよく、表面の平滑性は砥粒加工が必
要なほどには要求されない。例えば汎用電子回路などで
使用している程度で可能である。プラスチック基板１の
表面は、プラスチックＷＩ２との密着性が最大限となる
ような表面粗さとすることが望ましい。セラミック基板
１の厚みは、磁気ディスク基板全体厚さの５０〜９０％
程度とする。外径１３ＯＮの大きさの磁気ディスク基板
では全体厚さが１．９鰭となるが、プラスチック基板１
は０．９５〜１．７１程度に相当する。The ceramic substrate 1 may be made of, for example, an alumina material of a relatively low grade, and the surface is not required to be so smooth that abrasive processing is required. For example, this is possible to the extent that it is used in general-purpose electronic circuits. It is desirable that the surface of the plastic substrate 1 has a surface roughness that maximizes adhesion to the plastic WI2. The thickness of the ceramic substrate 1 is 50 to 90% of the total thickness of the magnetic disk substrate.
degree. A magnetic disk substrate with an outer diameter of 13ON has an overall thickness of 1.9 fins, but the plastic substrate 1
corresponds to about 0.95 to 1.71.
プラスチック層２は、耐熱性で吸水性に強く、表面平滑
性にも優れる材料が好ましい。このような材料としては
、耐熱性エンジニアリングプラスチ・７り材料の中、例
えばＰＥＩ樹脂（ポリエーテルイミド樹脂）などがある
。ＰＥＩ樹脂の融点は２００℃以上である。プラスチッ
ク２は平滑性向上のため、補強材は充填しないほうがよ
い。The plastic layer 2 is preferably made of a material that is heat resistant, resistant to water absorption, and has excellent surface smoothness. Such materials include, for example, PEI resin (polyetherimide resin) among heat-resistant engineering plastic materials. The melting point of PEI resin is 200°C or higher. In order to improve the smoothness of the plastic 2, it is better not to fill it with reinforcing material.
この構成によると、プラスチック層２で覆っているので
、金型表面を平滑にすることにより表面平滑度が十分に
得られ、鏡面切削加工や砥粒加工等の加工（表面粗さＲ
□、０．０８ｕｍ以下）が不要となって生産性が向上す
る。また、プラスチック層２に耐熱性のものを用い、か
つセラミック基板１を心材として用いているので、下地
層や磁性層の形成時に変形することがない。さらに、セ
ラミック基板１とプラスチック層２からなるので、従来
のガラスやセラミック単独の基板に比べて軽量化が図れ
る。この実施例のように肉抜き穴１ａを設けた場合は、
アルミ基板と同等またはそれよりも軽くでき、ディスク
ドライブモータの低出力化省エネルギ化が図れる。肉抜
き穴１ａを設けても強度は十分に得られる。According to this configuration, since the mold surface is covered with the plastic layer 2, sufficient surface smoothness can be obtained by smoothing the mold surface, and processing such as mirror cutting and abrasive processing (surface roughness R
□, 0.08 um or less) is no longer necessary, improving productivity. Furthermore, since the plastic layer 2 is made of a heat-resistant material and the ceramic substrate 1 is used as the core material, there is no deformation during formation of the underlayer or magnetic layer. Furthermore, since it is composed of the ceramic substrate 1 and the plastic layer 2, it can be made lighter than conventional substrates made of glass or ceramic alone. When the lightening hole 1a is provided as in this example,
It can be made as light as or even lighter than aluminum substrates, allowing for lower output power and energy savings for disk drive motors. Even if the hollow hole 1a is provided, sufficient strength can be obtained.
この発明によれば、プラスチック材料で覆っているので
、金型表面を平滑にすることにより表面平滑度が十分に
得られ、鏡面切削加工や砥粒加工等の加工が不要となっ
て生産性が向上する。また、プラスチック材料に耐熱性
のものを用い、かつセラミック基板を心材として用いて
いるので、下地層や磁性層の形成時に変形することがな
い。さらに、セラミック基板とプラスチック材料からな
るので、従来のガラスやセラミック単独の基板に比べて
軽量化が図れるという効果がある。According to this invention, since the mold is covered with a plastic material, sufficient surface smoothness can be obtained by smoothing the mold surface, and processes such as mirror cutting and abrasive processing are not required, increasing productivity. improves. Furthermore, since a heat-resistant plastic material is used and a ceramic substrate is used as the core material, there is no deformation during formation of the underlayer or magnetic layer. Furthermore, since it is made of a ceramic substrate and a plastic material, it has the effect of being lighter in weight than conventional substrates made of glass or ceramic alone.
第１図はこの発明の一実施例の断面図、第２図はその斜
視図、第３図は同じくそのセラミック基板の斜視図、第
４図は同しくその製造途中の断面図である。
１・・・セラミックａｔ反、２・・・プラスチック層、
３・・・中心穴FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a perspective view thereof, FIG. 3 is a perspective view of the ceramic substrate, and FIG. 4 is a sectional view of the ceramic substrate in the middle of manufacture. 1... Ceramic at anti, 2... Plastic layer,
3...Center hole
Claims (1)
た磁気ディスク基板。A magnetic disk substrate whose surface is covered with a heat-resistant plastic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3860687A JPS63205817A (en) | 1987-02-20 | 1987-02-20 | Magnetic disk substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3860687A JPS63205817A (en) | 1987-02-20 | 1987-02-20 | Magnetic disk substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63205817A true JPS63205817A (en) | 1988-08-25 |
Family
ID=12529926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3860687A Pending JPS63205817A (en) | 1987-02-20 | 1987-02-20 | Magnetic disk substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63205817A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6715200B2 (en) | 1999-02-12 | 2004-04-06 | General Electric Company | Methods for making data storage media |
-
1987
- 1987-02-20 JP JP3860687A patent/JPS63205817A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6715200B2 (en) | 1999-02-12 | 2004-04-06 | General Electric Company | Methods for making data storage media |
| US6752952B2 (en) | 1999-02-12 | 2004-06-22 | General Electric Company | Embossing methods |
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