JPS6319894A - Method of printing picture onto printed board - Google Patents
Method of printing picture onto printed boardInfo
- Publication number
- JPS6319894A JPS6319894A JP61163760A JP16376086A JPS6319894A JP S6319894 A JPS6319894 A JP S6319894A JP 61163760 A JP61163760 A JP 61163760A JP 16376086 A JP16376086 A JP 16376086A JP S6319894 A JPS6319894 A JP S6319894A
- Authority
- JP
- Japan
- Prior art keywords
- film
- water
- printing
- pattern
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 20
- 238000007639 printing Methods 0.000 title claims description 14
- 239000007788 liquid Substances 0.000 claims description 7
- 239000002826 coolant Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000004020 conductor Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000013505 freshwater Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 210000000496 pancreas Anatomy 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Projection-Type Copiers In General (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電子機器等に用いられるプリント配線板の製
造方法、特に、その導体張積層板の回路パターン形成用
エッチング工程に先立フて行われる写真焼付方法に関す
るものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for manufacturing printed wiring boards used in electronic devices, etc. The invention relates to a photographic printing method.
（従来の技術）
従来、この種のプリント配線板の回路パターン形成は、
周知のように、エポキシ、フェノール等の熱硬化性樹脂
と、紙、ガラス布などの補強材との組合せにより構成さ
れた基板の片面（片面形プリント配線板の場合について
説明する）に、銅等の導体はくを弓にった導体張積層板
の、導体はく面を４Ｉ ＹＨして洗浄したのち、スクリ
ーンに印刷法もしくは写真法によって配線パターンを記
録し、エツチングに程によって導体はくの所定パターン
を作成し、その１に、ソルダ・レジストやマークを印刷
したのち、穴加工／外形加工等を行い、フラックスを塗
布して完成するという工程により行われていた。(Prior art) Conventionally, circuit pattern formation for this type of printed wiring board was
As is well known, one side of the board (we will explain the case of a single-sided printed wiring board), which is made of a combination of thermosetting resin such as epoxy or phenol and reinforcing material such as paper or glass cloth, is coated with copper, etc. After cleaning the conductor surface of a conductor-clad laminate with a conductor foil on it using 4I YH, the wiring pattern is recorded on a screen by printing or photography, and the conductor foil is etched according to the etching process. The process involved creating a predetermined pattern, printing solder resist and marks on the pattern, drilling holes/shaping, and completing the process by applying flux.
Ｆ記、スクリーン印刷法による回路パターンの記録は、
プリント配線板が多袖少星生産で、かつ、パターン密度
も余り細かくない場合に限定されるので、ここでは、大
量生産、かつ、近年の高密度形パターン傾向の場合に使
用される写真法の場合について説明する。Note F: Recording of circuit patterns by screen printing method:
This is limited to cases in which the printed circuit board is manufactured in multi-sleeved, small-scale production and the pattern density is not very fine, so here we will discuss the photographic method used in cases of mass production and the recent trend of high-density patterns. Let me explain the case.
この種の写呉法においては、ｎη記研磨されて洗浄され
た導体はく而に、感光剤の被覆を施し、乾燥したのち、
別の直接または間接写真法によって作成された原板であ
るポリエスデルヘース等のパターン・マスク・フィルム
（高密度品には、ガラス乾板か用いられることもある）
により、紫外線で露光／焼付けを行って現像し、次のエ
ツチング１程に供給するようになっていた。In this type of copying method, the polished and cleaned conductor is coated with a photosensitive agent, dried, and then
A pattern mask film, such as polyester haze, which is a master plate created by another direct or indirect photographic method (for high-density products, a glass plate may also be used)
Accordingly, the film was developed by exposure/baking with ultraviolet rays, and then supplied to the next etching step.
第２図は、この焼付時における要部構成の説明図である
。FIG. 2 is an explanatory diagram of the main part configuration at the time of this printing.
Ｓは、基板Ｓ。と導体である銅はくＣとより成るプリン
ト基板であるＭＡ張積層板で、銅はく表面はｍｌ記研磨
／洗浄を完了して感光レジストＲ皮膜を施した状態のも
のである。Ｆは、回路パターン・マスク・フィルム、Ｂ
は、これら全体を密封的にパックするための透明フィル
ムバッグを示す。S is the substrate S. This is an MA-clad laminate which is a printed circuit board consisting of a copper foil C which is a conductor and a copper foil C which is a conductor, and the surface of the copper foil has been polished/cleaned and coated with a photoresist R film. F is circuit pattern mask film, B
shows a transparent film bag for hermetically packing the whole thing.
図には、Ｐ−さか微小な銅は〈Ｃ、パターン・マスク・
フィルムＦ、Ｆ！！、光レジスト皮膜Ｒ、バック用フィ
ルムバッグＢ等は、厚さを誇張して示す。In the figure, P-inverted minute copper is <C, pattern/mask/
Film F, F! ! , photoresist film R, backing film bag B, etc. are shown with their thicknesses exaggerated.
パターン・マスク・フィルムＦを、銅はく表面ＣＦに密
着させ、第３図に示１−ように、透明フィルムバックＢ
の−ＱＨＢ ａから真空Ｖ ｆ、、−’９人して内部の
空気を吸引（油気）すると、パターン・マスク・フィル
ムＦは、完全に銅はく表面Ｃ上に密着してパックされる
。このようなバック状態Ｐで水銀灯等の九Ｂしにより、
所定の露光／焼イ・１が行われていた。The pattern mask film F is brought into close contact with the copper foil surface CF, and the transparent film back B is attached as shown in FIG.
-QHB a to vacuum V f, -'9 When the internal air is sucked (oil), the pattern mask film F is completely packed tightly onto the copper foil surface C. . In such a back state P, by using a mercury lamp or the like,
A predetermined exposure/baking step 1 was being performed.
しかしなから、以ｌ−のような従来の写真焼付方法にあ
っては、この種の感光レジストＲの感光度は、微あ“１
Ｆ特性や処理作業−Ｌ等の理由から、極めて低く設定さ
れているため、紫外線露光は、比較的大電力の光源、例
えば３〜５にＷの水銀灯しにより約１ｍの近距離から長
時間（例えば０．５〜１分間）露光を行う必要があった
。However, in the conventional photographic printing method as described below, the photosensitivity of this type of photosensitive resist R is only slightly "1".
Because the F characteristic and processing work-L are set extremely low, UV exposure is carried out from a short distance of approximately 1 m for a long time ( For example, it was necessary to perform exposure for 0.5 to 1 minute).
このため、パターンフィルムＦは温度がト昇しく例えば
約６０℃）大量生産に対する繰返しによって温度が蓄積
され、フィルムＦを劣化させる傾向があった。また、熱
によりフィルムＦに収縮や変形を生ずるとパターンの幾
何学的精度を損うので、使用し得るＡｆ命も極めて短く
、コストが大きいという欠点があった。また、多量生産
時の一定品質確保に最も基本的な同一条件が、ｆＡ度変
化によって確保できなくなるので、写真品質の均一性を
維持することが困難であった。For this reason, the temperature of the patterned film F has increased (for example, about 60° C.), and the temperature has accumulated due to repeated mass production, which has a tendency to deteriorate the film F. Further, if the film F shrinks or deforms due to heat, the geometrical precision of the pattern is impaired, so that the usable Af life is extremely short and the cost is high. In addition, it has been difficult to maintain uniformity in photographic quality because the most basic conditions for ensuring constant quality during mass production cannot be maintained due to changes in fA degree.
本発明は、以Ｆのような従来の写真焼付方法の問題点に
かんかみてなされたもので、パターンマスク焼付時のフ
ィルムの温度を実質的に低温に保つことができる焼付／
露先方法の提供を目的としている。The present invention has been made in view of the problems of the conventional photographic printing method as described below.
The purpose is to provide a method of exposure.
このため、本発明においては、前記透明フィルムにより
真空密着パックされたパターンマスクフィルムと導体張
４１層板（プリント基板）とを、液体冷媒中で焼付／露
光を行う方法により、前記目的を達成しようとするもの
である。Therefore, in the present invention, the above object is achieved by a method in which a patterned mask film and a conductor-covered 41-layer board (printed circuit board), which are vacuum-tightly packed with the transparent film, are printed/exposed in a liquid refrigerant. That is.
以トのような焼付方法により、パターン・マスク・フィ
ルムは冷却されて、温度上昇か防１トされ、変形による
才青度低ドや寿命の短縮等を招くことがなくなる。By the above-described baking method, the pattern mask film is cooled and prevented from rising in temperature, thereby preventing deformation from causing poor quality or shortening of life.
以十に、本発明を実ｈｈ例に基ついて説明する。 Hereinafter, the present invention will be explained based on an actual hh example.
第１図に、本発明によるプリント基板へのパターン・マ
スク・フィルム焼付方法の原理図を示す。FIG. 1 shows a principle diagram of the method of printing a pattern mask film onto a printed circuit board according to the present invention.
（構成）
本実施例は、液体冷媒として清水を使用した例を示した
もので、１は、光源りにより露光すべきプリント基板Ｓ
を含む真空パックＰ（第３図におけると同社構成）を清
水Ｗ中に載置するための容器、１ ａ ／ １ ｂは、
それぞれ水Ｗの人［−１／出Ｌ１．１ｃは、人１コ１ａ
から導入した水Ｗを容器中に゛ト均に分散させるための
仕切板、２は水の供給源となる水タンク、３は水ポンプ
、４は冷却器、５は、冷却器５川のファン、またＴ、、
Ｔ２゜Ｔ３ 、Ｔ、はそれぞれ水パイプである。(Structure) This example shows an example in which fresh water is used as a liquid refrigerant, and 1 is a printed circuit board S to be exposed by a light source.
Containers 1a/1b for placing the vacuum pack P (the company's configuration in Fig. 3) containing the water into fresh water W are:
Each water W person [-1/Out L1.1c is 1 person 1a
2 is a water tank serving as a water supply source; 3 is a water pump; 4 is a cooler; 5 is a fan for the cooler 5; , T again,
T2゜T3 and T are water pipes, respectively.
（動作）
ま１′、パターン・マスク・フィルムＦと、プリント基
板である銅等の導体張積層板Ｓとの真空パックＰを清水
Ｗを満たした容器１中に浅く載置する。容器１の水Ｗは
１人［］１ａおよび仕切板ＩＣを介して、水タンク２か
ら供給される。露光によって膵温した水Ｗは、出口１ｂ
よりパイプＴ２を経て冷却器４を通過し、バイブＴ３
、Ｔ４を軒て、ポンプ３により、水タンク２に５流され
て循環を繰返す。(Operation) Step 1': A vacuum pack P containing a patterned mask film F and a conductor-clad laminate S made of copper or the like as a printed circuit board is placed shallowly in a container 1 filled with fresh water W. Water W in the container 1 is supplied from the water tank 2 via the person [ ] 1a and the partition plate IC. The water W heated to the temperature of the pancreas by exposure to light flows through the outlet 1b.
The pipe T2 passes through the cooler 4, and the vibe T3
, T4, the water is pumped into the water tank 2 by the pump 3, and the circulation is repeated.
以Ｆのように真空パックＰ中のパターン・マスク・フィ
ルム焼付は用の露光は、上部の浅い水Ｗの層を介して行
われるため、従来の空気層のみの場合に比して、その分
たけ若干の透明度の低ｒによる照度の低ドはあるか、こ
わは、侍かの露出時間の延長により十分保証し得る範囲
であり、フィルム温度を実質的に一定の低温度に保つこ
とができる。As shown in F below, the exposure for pattern, mask, and film printing in the vacuum pack P is performed through the shallow layer of water W at the top, so compared to the conventional case where there is only an air layer, the exposure is There is some low illuminance due to low transparency, but the stiffness can be sufficiently guaranteed by extending the exposure time, and the film temperature can be kept at a virtually constant low temperature. .
以上の第１構成には、各部の水の温度検出／制御システ
ム等は省略しである。In the above first configuration, the water temperature detection/control system and the like of each part are omitted.
（池の実施例）
前記実施例における水の循環系は、原理を示すための一
例をボしたもので、ポンプや冷却器を省略した、いわゆ
る“たれ流し式”であってもよいことはもちろんである
。(Pond Example) The water circulation system in the above example is an example for illustrating the principle, and it goes without saying that it may be a so-called "drip type" system that does not include a pump or cooler. be.
また、この実施例においては、冷媒を水とした１を例に
ついて説明したが、要すれば、紫外線透明度の高い他の
適当な冷却液体でも同一の効果が得られる。Further, in this embodiment, an example in which water is used as the refrigerant has been described, but if necessary, the same effect can be obtained with other suitable cooling liquids having high ultraviolet transparency.
また、前記実施例には清水を使用した事例を示したが、
要すれば、こわらの液体冷媒には例えば、紫外線のｉａ
通道率向ヒさせるための添加剤等を禽イｆしてｂよいこ
とはもちろんである。In addition, although the example above shows an example using fresh water,
If necessary, the stiff liquid refrigerant may contain, for example, ultraviolet ia
Of course, additives and the like may be added to improve the passage rate.
（発明の効果）
以上、説明してきたように、本発明によりば、プリント
基板を焼付け／露光するとき、液体の冷媒中で行われる
ので、パターン・マスク・フィルム等の温度を実Ｔ１的
に一定値の低温度に保つことができるようにしたため、
パターン・マスク・フィルムの精度や寿命の低下か防止
され、かつ経済性／品質を向上させることかできた。(Effects of the Invention) As explained above, according to the present invention, when printing/exposing a printed circuit board, it is carried out in a liquid coolant, so the temperature of the pattern, mask, film, etc. is kept constant in terms of actual T1. Because the value can be kept at a low temperature,
It was possible to prevent deterioration in the precision and life of patterned masks and films, and to improve economic efficiency and quality.
第１図は、本発明によるプリント基板へのパターン・マ
スク・フィルム焼付方法の涼埋図、第２図および第３図
は、従来の焼付時におけるそわぞれ要部構成と焼付方法
説明図である。
Ｆ −−−−−−パターン・マスク・フィルム（原板）
Ｗ・・・・・・水（液体冷媒）
第２図
第３図Fig. 1 is a diagram showing the method of printing a pattern, mask, and film on a printed circuit board according to the present invention, and Figs. 2 and 3 are diagrams showing the configuration of the main parts and the method of printing in the conventional printing process, respectively. be. F -------Pattern mask film (original plate)
W...Water (liquid refrigerant) Fig. 2 Fig. 3
Claims (1)
を行うとき、液体冷媒体中において焼付け露光を行うこ
とを特徴とするプリント基板写真焼付方法。A printed circuit board photoprinting method characterized in that when photoprinting a conductor-clad laminate using a pattern mask original plate, the printing exposure is performed in a liquid cooling medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61163760A JPS6319894A (en) | 1986-07-14 | 1986-07-14 | Method of printing picture onto printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61163760A JPS6319894A (en) | 1986-07-14 | 1986-07-14 | Method of printing picture onto printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6319894A true JPS6319894A (en) | 1988-01-27 |
| JPH0225272B2 JPH0225272B2 (en) | 1990-06-01 |
Family
ID=15780181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61163760A Granted JPS6319894A (en) | 1986-07-14 | 1986-07-14 | Method of printing picture onto printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6319894A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02294730A (en) * | 1989-04-17 | 1990-12-05 | Internatl Business Mach Corp <Ibm> | Floating point arithmetic processor |
| JPH0365722A (en) * | 1989-08-04 | 1991-03-20 | Matsushita Electric Ind Co Ltd | Floating-point arithmetic unit |
| JPH0458757U (en) * | 1990-09-27 | 1992-05-20 | ||
| JPH096010A (en) * | 1995-06-21 | 1997-01-10 | Noda Screen:Kk | Exposure method for photosetting type resin and its exposure device |
| US6165544A (en) * | 1998-01-09 | 2000-12-26 | Noda Screen Co., Ltd. | Method of exposure of photo-curing resin applied to printed circuit board |
-
1986
- 1986-07-14 JP JP61163760A patent/JPS6319894A/en active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02294730A (en) * | 1989-04-17 | 1990-12-05 | Internatl Business Mach Corp <Ibm> | Floating point arithmetic processor |
| JPH0365722A (en) * | 1989-08-04 | 1991-03-20 | Matsushita Electric Ind Co Ltd | Floating-point arithmetic unit |
| JPH0458757U (en) * | 1990-09-27 | 1992-05-20 | ||
| JPH096010A (en) * | 1995-06-21 | 1997-01-10 | Noda Screen:Kk | Exposure method for photosetting type resin and its exposure device |
| US6165544A (en) * | 1998-01-09 | 2000-12-26 | Noda Screen Co., Ltd. | Method of exposure of photo-curing resin applied to printed circuit board |
| US6583849B1 (en) | 1998-01-09 | 2003-06-24 | Noda Screen Co., Ltd. | Apparatus for exposure of photo-curing resin applied to printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0225272B2 (en) | 1990-06-01 |
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