JPS63197365U - - Google Patents
Info
- Publication number
- JPS63197365U JPS63197365U JP1987088782U JP8878287U JPS63197365U JP S63197365 U JPS63197365 U JP S63197365U JP 1987088782 U JP1987088782 U JP 1987088782U JP 8878287 U JP8878287 U JP 8878287U JP S63197365 U JPS63197365 U JP S63197365U
- Authority
- JP
- Japan
- Prior art keywords
- infrared
- photointerrupter
- phototransistor
- led chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088782U JPS63197365U (enExample) | 1987-06-08 | 1987-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088782U JPS63197365U (enExample) | 1987-06-08 | 1987-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197365U true JPS63197365U (enExample) | 1988-12-19 |
Family
ID=30947186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987088782U Pending JPS63197365U (enExample) | 1987-06-08 | 1987-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197365U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009130022A (ja) * | 2007-11-21 | 2009-06-11 | Toshiba Corp | インタラプタ |
-
1987
- 1987-06-08 JP JP1987088782U patent/JPS63197365U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009130022A (ja) * | 2007-11-21 | 2009-06-11 | Toshiba Corp | インタラプタ |