JPS63197365U - - Google Patents
Info
- Publication number
- JPS63197365U JPS63197365U JP8878287U JP8878287U JPS63197365U JP S63197365 U JPS63197365 U JP S63197365U JP 8878287 U JP8878287 U JP 8878287U JP 8878287 U JP8878287 U JP 8878287U JP S63197365 U JPS63197365 U JP S63197365U
- Authority
- JP
- Japan
- Prior art keywords
- infrared
- photointerrupter
- phototransistor
- led chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案の一実施例の概略図、第2図は
従来の樹脂一体成形のホトインタラプタの一例の
概略図、第3図は本考案の実施例2の概略図であ
る。
1……赤外LEDチツプ、2……発光側赤外光
透過性黒色樹脂、3……レンズ、4……受光側赤
外光透過性黒色樹脂、5……レンズ、6……ホト
トランジスタチツプ、7……ダミーピン、8……
アノード、9……カソード、10……エミツタ、
11……コレクタ、12……赤外LEDチツプ、
13……赤外光透過性黒色樹脂、14……発光側
レンズ、15……受光側レンズ、16……ホトト
ランジスタチツプ、17……アノード、18……
カソード、19……エミツタ、20……コレクタ
、21……ダミーピン、22……タイバー、23
……発光側赤外光透過性黒色樹脂、24……受光
側赤外光透過性黒色樹脂、25……赤外LEDチ
ツプ、26……ホトトランジスタ・チツプ、27
……アノード、28……カソード、29……エミ
ツタ、30……コレクタ。
FIG. 1 is a schematic diagram of an embodiment of the present invention, FIG. 2 is a schematic diagram of an example of a conventional resin integrally molded photointerrupter, and FIG. 3 is a schematic diagram of a second embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Infrared LED chip, 2... Infrared light transparent black resin on the light emitting side, 3... Lens, 4... Infrared light transparent black resin on the light receiving side, 5... Lens, 6... Phototransistor chip , 7... dummy pin, 8...
Anode, 9...Cathode, 10...Emitsuta,
11...Collector, 12...Infrared LED chip,
13... Infrared light transmitting black resin, 14... Light emitting side lens, 15... Light receiving side lens, 16... Phototransistor chip, 17... Anode, 18...
Cathode, 19... Emitter, 20... Collector, 21... Dummy pin, 22... Tie bar, 23
... Infrared light transmitting black resin on the light emitting side, 24 ... Infrared light transmitting black resin on the light receiving side, 25 ... Infrared LED chip, 26 ... Phototransistor chip, 27
... Anode, 28 ... Cathode, 29 ... Emitter, 30 ... Collector.
Claims (1)
を用い、赤外光透過性の樹脂により成形するホト
インタラプタにおいて、赤外LEDチツプ側と、
ホトトランジスタ・チツプ側を分離成型し、かつ
金属片により接続したことを特徴とするホトイン
タラプタ。 In a photointerrupter that uses an infrared LED chip and a phototransistor chip and is molded from an infrared transparent resin, the infrared LED chip side,
A photointerrupter characterized in that the phototransistor chip side is separately molded and connected with a metal piece.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8878287U JPS63197365U (en) | 1987-06-08 | 1987-06-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8878287U JPS63197365U (en) | 1987-06-08 | 1987-06-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63197365U true JPS63197365U (en) | 1988-12-19 |
Family
ID=30947186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8878287U Pending JPS63197365U (en) | 1987-06-08 | 1987-06-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63197365U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009130022A (en) * | 2007-11-21 | 2009-06-11 | Toshiba Corp | Interrupter |
-
1987
- 1987-06-08 JP JP8878287U patent/JPS63197365U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009130022A (en) * | 2007-11-21 | 2009-06-11 | Toshiba Corp | Interrupter |
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