JPS6273562U - - Google Patents

Info

Publication number
JPS6273562U
JPS6273562U JP1985166290U JP16629085U JPS6273562U JP S6273562 U JPS6273562 U JP S6273562U JP 1985166290 U JP1985166290 U JP 1985166290U JP 16629085 U JP16629085 U JP 16629085U JP S6273562 U JPS6273562 U JP S6273562U
Authority
JP
Japan
Prior art keywords
light emitting
head
emitting element
translucent resin
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985166290U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985166290U priority Critical patent/JPS6273562U/ja
Publication of JPS6273562U publication Critical patent/JPS6273562U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1985166290U 1985-10-28 1985-10-28 Pending JPS6273562U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985166290U JPS6273562U (enExample) 1985-10-28 1985-10-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985166290U JPS6273562U (enExample) 1985-10-28 1985-10-28

Publications (1)

Publication Number Publication Date
JPS6273562U true JPS6273562U (enExample) 1987-05-11

Family

ID=31097122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985166290U Pending JPS6273562U (enExample) 1985-10-28 1985-10-28

Country Status (1)

Country Link
JP (1) JPS6273562U (enExample)

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